CN113834360B - Method and device for adjusting heat exchange system and heat exchange system - Google Patents
Method and device for adjusting heat exchange system and heat exchange system Download PDFInfo
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- CN113834360B CN113834360B CN202010577493.0A CN202010577493A CN113834360B CN 113834360 B CN113834360 B CN 113834360B CN 202010577493 A CN202010577493 A CN 202010577493A CN 113834360 B CN113834360 B CN 113834360B
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000005338 heat storage Methods 0.000 claims abstract description 83
- 230000001105 regulatory effect Effects 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 12
- 238000012546 transfer Methods 0.000 abstract description 5
- 230000006870 function Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000003750 conditioning effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004590 computer program Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000002918 waste heat Substances 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011232 storage material Substances 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/0034—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using liquid heat storage material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Air Conditioning Control Device (AREA)
Abstract
The application relates to the technical field of smart families, and discloses a method for adjusting a heat exchange system, which comprises the following steps: taking the heat release device with the actual temperature higher than the preset temperature as a target heat release device; in the case that the target heat release devices are plural, determining a target heat release device which can absorb heat as a first heat release device according to the temperature difference between the plurality of target heat release devices and the distance between the plurality of target heat release devices and the heat storage tank; and opening the valve on the branch pipe corresponding to the first heat release device so as to transfer the heat of the first heat release device to the heat storage box body. According to the temperature difference between the target heat release devices and the distance between the target heat release devices and the heat storage box body, a first heat release device suitable for heat exchange with the heat storage box body is selected, and therefore the heat exchange effect of the heat exchange system is improved. The application also discloses a device for adjusting the heat exchange system and the heat exchange system.
Description
Technical Field
The application relates to the technical field of smart families, in particular to a method and a device for adjusting a heat exchange system and the heat exchange system.
Background
Unused waste heat is often generated due to the use of various appliances in the home. This part of the heat is usually lost in the surrounding environment and is very wasteful. For appliances that are capable of generating waste heat, they may be referred to as exothermic devices. At present, some schemes design a heat exchange system, and can absorb the waste heat of the heat release device to supply heat for other devices needing heat.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: when there are a plurality of heat release devices in the home system, the heat exchange effect of the heat exchange system needs to be improved.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides a method and a device for adjusting a heat exchange system and the heat exchange system, so as to solve the technical problem that the heat exchange efficiency of the heat exchange system needs to be improved.
In some embodiments, a heat exchange system includes a heat collecting pipe, a heat accumulating box, and a heat releasing pipe in communication, the heat collecting pipe including a plurality of branch pipes and valves disposed on the branch pipes, the plurality of branch pipes being capable of absorbing heat of a plurality of heat releasing devices, the method for adjusting the heat exchange system including: taking the heat release device with the actual temperature higher than the preset temperature as a target heat release device; in the case that the target heat release devices are plural, determining a target heat release device which can absorb heat as a first heat release device according to the temperature difference between the plurality of target heat release devices and the distance between the plurality of target heat release devices and the heat storage tank; and opening the valve on the branch pipe corresponding to the first heat release device so as to transfer the heat of the first heat release device to the heat storage box body.
In some embodiments, an apparatus for adjusting a heat exchange system includes a processor and a memory storing program instructions, the processor being configured, when executing the program instructions, to perform a method for adjusting a heat exchange system as provided by the previous embodiments.
In some embodiments, the heat exchange system comprises a device for adjusting the heat exchange system as provided in the previous embodiments.
The method and the device for adjusting the heat exchange system, and the heat exchange system provided by the embodiment of the disclosure can realize the following technical effects: and taking the heat release device with the actual temperature higher than the preset temperature as a target heat release device, and selecting a first heat release device suitable for heat exchange with the heat storage box body according to the temperature difference condition between the target heat release devices and the distance between the target heat release devices and the heat storage box body under the condition that the target heat release devices are multiple, so that the heat exchange effect of the heat exchange system is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
FIG. 1 is a schematic illustration of a method for regulating a heat exchange system provided by an embodiment of the present disclosure;
FIG. 2 is a schematic illustration of an apparatus for conditioning a heat exchange system provided in an embodiment of the present disclosure;
FIG. 3 is a schematic illustration of another apparatus for conditioning a heat exchange system provided by an embodiment of the present disclosure;
Fig. 4 is a schematic view of another apparatus for conditioning a heat exchange system provided by an embodiment of the present disclosure.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
Referring to fig. 1, an embodiment of the disclosure provides a method for adjusting a heat exchange system, the heat exchange system including a heat collecting pipe, a heat storage tank, and a heat release pipe, the heat collecting pipe including a plurality of branch pipes and valves disposed on the branch pipes, the plurality of branch pipes being capable of absorbing heat of a plurality of heat release devices, the method for adjusting a heat exchange system including:
s10, taking an exothermic device with the actual temperature higher than a preset temperature as a target exothermic device;
S20, in the case that a plurality of target heat release devices are provided, determining the target heat release device capable of absorbing heat as a first heat release device according to the temperature difference condition among the plurality of target heat release devices and the distance between the plurality of target heat release devices and the heat storage box body;
S30, opening valves on the branch pipes corresponding to the first heat release devices so that heat of the first heat release devices is transferred to the heat storage box body.
The heat storage box body stores heat exchange medium, and the heat collection pipeline and the heat release pipeline are internally communicated with the heat exchange medium. The heat collecting pipeline is arranged close to the heat release device, and when the heat exchange medium flows to the heat collecting pipeline, the heat released by the heat release device is absorbed; when the heat exchange medium flows into the heat storage box body, heat is stored in the heat storage box body; when the heat exchange medium flows to the heat release pipeline, heat is released. The heat release pipeline is arranged close to the device needing heat supply. Alternatively, the cold is water. The heat exchange is carried out through water flow, so that the heat of the heat release device is absorbed, stored and utilized.
The heat release device is a device capable of releasing heat in the working process, and the part of heat is usually released in the external environment naturally, so that the heat is wasted. There are various heat release devices in the home environment, such as range hoods, gas cookers, built-in ovens, computer cabinets, and the like. When a user cooks in a kitchen, the temperature of the range hood and the gas stove can be increased, and part of heat can be utilized. The embedded oven is an oven embedded in a wall, the temperature is very high after the roasting is finished, and the heat of the embedded oven can be utilized. When the computer runs, the CPU of the computer is easy to generate heat, so that the temperature at the computer case is higher, and part of heat can be utilized. In practical applications, the heat collecting pipe may be extended to the vicinity of the heat generating device to absorb heat generated by the heat generating device. In addition, there is also some heat release from the drain lines of the sink in the home. This is because some water taps are provided with heating devices, which can generate hot water, so that heat is stored in the water discharge pipeline, and the heat collecting pipeline can be extended to the vicinity of the water discharge pipeline to absorb heat.
When the number of the heat release devices is multiple, the heat collection pipeline is divided into a plurality of branch pipes, so that each heat release device can collect heat through the corresponding branch pipe. The branch pipes are provided with valves, and whether heat of the heat release devices corresponding to the branch pipes is collected can be regulated by regulating the opening and closing of the valves. The heat exchange medium flows to the heat storage tank body, and can store heat in the heat storage tank body. Optionally, the outer shell of the heat storage tank is provided with a heat insulating layer. In this way, heat dissipation through the housing of the heat storage tank can be avoided. Optionally, the housing of the thermal storage tank is provided with a thermal storage material. The heat is stored for a longer time by the heat storage material.
The temperature sensor can be arranged on or near the heat release device to detect the actual temperature of the heat release device and timely master the temperature condition of the heat release device. The exothermic assembly does not require any degree of heat to be collected while exothermic. Therefore, the preset temperature is set, and in the case where the actual temperature of the heat releasing device is higher than the preset temperature, the heat releasing device is regarded as the target heat releasing device. When the actual temperature of the heat release device is higher than the preset temperature, the heat released by the heat release device can be collected and utilized, and the heat release device is taken as a target heat release device. Alternatively, the preset temperature is 15 ℃. When the heat release device is higher than 15 ℃, the heat release device can be used as a target heat release device.
There may be multiple target heat release devices in the multiple heat release devices, i.e., there are multiple heat release devices whose temperatures meet the heat exchange requirements. Although there are a plurality of target heat release devices, if all the branch pipes are connected to perform heat exchange, the flow rate of the heat exchange medium of each branch pipe is small, and efficient heat exchange cannot be performed. Therefore, in this case, those which can absorb heat are determined as the first heat releasing means from among the plurality of target heat releasing means according to the temperature difference conditions between the plurality of target heat releasing means and the distances between the plurality of target heat releasing means and the heat storage tank. The first heat release means the heat release means most suitable for heat exchange among the target heat release means.
The temperature difference between the target heat release devices can reflect the temperature difference between the target heat release devices, and there may be a case where the temperatures of the target heat release devices are close to each other, or there may be a case where the temperatures of the target heat release devices are different more from each other. According to the temperature difference, a suitable target heat release device is selected. In addition to the temperature differential, the distance between the target heat release device and the thermal storage tank is also a consideration. If the distance between the target heat release device and the heat storage box body is longer, the heat collection pipeline is longer, the transmission distance of the heat exchange medium is longer, and heat dissipation loss can also exist in the transmission process. Therefore, a target heat release device capable of absorbing heat is determined as a first heat release device according to the temperature difference condition and the distance factor.
After the first heat release device is determined, a valve on a branch pipe corresponding to the first heat release device is opened, so that heat exchange medium can flow to the first heat release device to absorb heat, the warmed heat exchange medium flows back to the heat storage box body, and heat is stored in the heat storage box body.
Optionally, the heat collecting pipe and the heat releasing pipe are provided with pump means. The pump device can drive the heat exchange medium to flow, and heat loss caused by too low flow rate is reduced. Optionally, the heat exchange system further comprises a solar panel, the solar panel being connected with the pump device. The solar panel provides electric energy for the pump device, so that the energy is saved and the environment is protected.
The heat release pipeline can be arranged close to a device requiring heat, for example, the heat release pipeline is extended to an outdoor heat exchanger of an air conditioner, so that the heat release pipeline can transfer heat to the outdoor heat exchanger, frosting of the outdoor heat exchanger in winter can be prevented, the evaporation temperature of the outdoor heat exchanger can be increased, and therefore the power of an air conditioning system is reduced, and the energy efficiency is improved. Thus, the operating temperature range of the air conditioner in winter is also expanded downwards.
In some embodiments, determining a first heat release device that can absorb heat based on a temperature difference between the target heat release devices and a distance between the plurality of target heat release devices and the thermal storage tank comprises: determining a temperature difference between the highest temperature and the lowest temperature target exothermic device; taking the target heat release device with the highest temperature as a first heat release device under the condition that the temperature difference is larger than or equal to a preset value; determining a first heat release device capable of absorbing heat according to the distances between the plurality of target heat release devices and the heat storage box body under the condition that the temperature difference is smaller than a preset value; wherein, the temperature difference takes absolute value.
Under the condition of not considering distance factors, the target heat release device with the highest temperature releases the most heat, and has the best heat exchange effect with the heat exchange medium, and the target heat release device with the lowest temperature has poorer effect. And calculating the temperature difference between the target heat release devices with the highest temperature and the lowest temperature, and judging the temperature difference degree between the target heat release devices according to the temperature difference. Setting a preset value, and indicating that two target heat release devices with larger difference exist among the target heat release devices under the condition that the temperature difference is larger than or equal to the preset value. At this time, the target heat release device with the highest temperature is directly used as the first heat release device to exchange heat without considering the distance factor. And when the temperature difference is smaller than the preset value, the temperature of the plurality of target heat release devices is indicated to be relatively close, and at the moment, the first heat release device capable of absorbing heat is determined according to the distance between the plurality of target heat release devices and the heat storage box body. Thus, the selected first heat release device has better heat exchange effect with the heat storage box body.
Optionally, the preset value is 15. When the temperature difference between the highest and lowest target exothermic devices is greater than or equal to 15, it is indicated that the temperature difference is greater. The temperature of the target heat release device with the lowest temperature is 20 ℃, the temperature of the target heat release device with the highest temperature is 40 ℃, the temperature difference between the target heat release device and the target heat release device is 20, at this time, the target heat release device with the temperature of 40 ℃ is taken as the first heat release device, a valve on a branch of the first heat release device is opened for heat collection, and the heat exchange effect is good.
In some embodiments, determining a first heat release device that can absorb heat based on a distance between a plurality of target heat release devices and a thermal storage tank includes: and comparing the distances between the target heat release devices and the heat storage box body, and taking the target heat release device closest to the heat storage box body as a first heat release device.
The target heat release device closest to the heat storage box body has the shortest transmission distance of the heat exchange medium after collecting heat, and the heat dissipated on the heat collection pipe is relatively less. In the case where the temperature difference between the plurality of target heat release devices is not large, the target heat release device closest to the target heat release device may be used as the first heat release device to achieve the optimal heat exchange effect. How to determine the distance between the heat release device and the heat storage box body can be measured or estimated when the heat exchange system is installed, and the distance is recorded into a controller of the heat exchange system in advance so as to be timely called. The length of the branch pipe from the heat storage tank to the heat release device can also be measured at the time of installation and recorded in the controller of the heat exchange system.
In some embodiments, after opening the valve on the branch pipe corresponding to the first heat release device, the method further comprises: selecting one of the remaining target heat release devices as a second heat release device in the case where the temperature decrease rate of the first heat release device is greater than or equal to the first value; and opening a valve on the branch pipe corresponding to the second heat release device.
During the heat exchange of the branch pipe with the first heat release device, the first heat release device may have a temperature drop, which is caused by the fact that the heat release device stops running, so that the temperature gradually drops. For an exothermic assembly that is shut down, it can be determined by calculating the rate of temperature decrease. When the temperature drop rate is greater than or equal to the first value, the temperature drop rate is too fast, which can be considered as stopping the operation of the heat release device or the temperature is about to not meet the heat exchange requirement. At this time, one of the remaining heat release devices is selected as the second heat release device, so that the heat collecting pipe collects heat of the second heat release device. Therefore, when the first heat release device is insufficient in heat, the second heat release device can be started in time to perform heat exchange, so that the heat storage box can continuously store heat.
Optionally, in the case where the rate of temperature decrease of the first heat release device is greater than or equal to the first value, closing of the valve on the branch of the first heat release device is delayed. For the valve on the branch of the first heat release device, the vertical horse is not closed, but is delayed to be closed, so as to fully collect the available heat remained on the first heat release device. Alternatively, the higher the first exothermic assembly temperature, the longer the delay time. The higher the temperature of the first exothermic assembly, the longer the time it takes for the temperature to drop below the preset temperature, which may result in a slightly longer delay time. Optionally, the valve on the branch pipe of the first heat release device is closed after time delay of 1-3 min. Optionally, the temperature drop rate is 3 ℃/min to 10 ℃/min. When the temperature drop rate is within this range, it is determined that the first exothermic device is out of service or the temperature is about to not meet the heat exchange requirements.
In some embodiments, selecting one of the remaining targeted heat release devices as the second heat release device comprises: selecting the second heat release device which is closest to the heat storage box from the rest target heat release devices under the condition that the difference between the target temperature and the actual temperature of the heat storage box is smaller than a second value; and selecting the second heat release device closest to the temperature of the first heat release device when the difference between the target temperature and the actual temperature of the heat storage tank is greater than or equal to the second value.
The target temperature of the heat storage box is a temperature at which the heat storage box can meet the heat release of the heat release pipeline, and if the difference between the actual temperature of the heat storage box and the target temperature is smaller than a second value, the actual temperature of the heat storage box is close to the target temperature. At this time, the target heat release device closest to the heat storage tank is selected as the second heat release device, so that the heat exchange medium can rapidly circulate between the heat storage tank and the second heat release, and the temperature of the heat storage tank reaches the target temperature as soon as possible. Optionally, the target temperature of the heat storage tank is 20-40 ℃. The value may be taken in this range as the target temperature of the heat storage tank. Optionally, the second value is 5. When the difference between the actual temperature of the heat storage tank and the target temperature is less than 5, the actual temperature of the heat storage tank is considered to be close to the target temperature.
When the difference between the target temperature and the actual temperature of the heat storage tank is greater than or equal to the second value, it is indicated that the difference between the actual temperature and the target temperature of the heat storage tank is large, and the heat storage tank is selected as the second heat release device closest to the temperature of the first heat release device. The first heat release device temperature is a temperature before the first heat release device temperature starts to decrease, and when the target heat release device is close to the temperature, the target heat release device is the next highest temperature device in the rest target heat release devices. The heat exchange device is used as a second heat release device to exchange heat with the heat exchange medium in the branch pipe, so that more heat can be provided for the heat storage box body, and the temperature of the heat storage box body can be increased to the target temperature.
In some embodiments, the method for adjusting a heat exchange system further comprises: and determining the flow of the heat exchange medium in the heat release pipeline according to the temperature of the heat storage box body, and regulating the flow of the heat exchange medium in the heat release pipeline. The flow of the heat exchange medium in the heat release pipeline is regulated, so that the heat release degree of the heat release pipeline can be influenced. And determining the flow of the heat exchange medium in the heat release pipeline according to the temperature of the heat storage box body so as to ensure that the heat exchange is relatively uniform.
In some embodiments, the higher the temperature of the heat storage tank, the less the flow of heat exchange medium within the heat release line. The higher the temperature of the heat storage box body is, the smaller the flow of the heat exchange medium in the heat release pipeline is regulated, so that the heat exchange medium fully releases heat in the heat release pipeline, and a device needing heat fully absorbs heat. The lower the temperature of the heat storage box body is, the larger the flow of the heat exchange medium in the heat release pipeline is, so that the heat exchange medium can exchange heat with a device needing heat rapidly.
Optionally, the relationship between the temperature of the thermal storage tank and the flow of the heat exchange medium in the heat release line is as follows:
Q＝k*(T0-t)，
Wherein Q is the flow of a heat exchange medium in the heat release pipeline, T is the actual temperature of the heat storage box, k is a proportional parameter larger than zero, T 0 is the preset temperature of the heat storage box, and T 0 is more than T. When the temperature of the heat storage box body is closer to the preset temperature, the calculated flow of the heat exchange medium is smaller. Through the calculation, the flow of the heat exchange medium in the heat release pipeline can be calculated according to the actual temperature and the preset temperature of the heat storage box.
Alternatively, 0.2.ltoreq.k.ltoreq.1. The flow rate can be calculated to be proper when the flow rate is within the range. Illustratively, k=0.6, T 0 =20 ℃, t=18 ℃, then q=k (T 0-t)＝0.6*(20-18)＝1.2m3/h.
Alternatively, 0.5m 3/h≤Q≤3.5m3/h. When the flow value calculated by the calculation formula is smaller than 0.5m 3/h, taking 0.5m 3/h; when the calculated flow rate value is higher than 3.5m 3/h, 3.5m 3/h is taken. In this way, the flow rate value can be kept within a suitable range.
Optionally, when the temperature of the heat storage box is lower than the set temperature, the pump device on the heat release pipeline is stopped to zero the flow. Alternatively, the temperature is set at 15 ℃. The temperature of the heat storage box body is lower than the set temperature, which indicates that the heat storage box body is not suitable for supplying heat to a device needing heat, and the pump device can be closed to zero the flow and stop heat exchange.
The disclosed embodiments also provide an apparatus for adjusting a heat exchange system, comprising a processor and a memory storing program instructions, the processor being configured to perform the method for adjusting a heat exchange system as provided in any of the previous embodiments when the program instructions are executed.
As shown in connection with fig. 2, an embodiment of the present disclosure provides an apparatus for conditioning a heat exchange system, including a processor (processor) 100 and a memory (memory) 101. Optionally, the apparatus may further comprise a communication interface (Communication Interface) 102 and a bus 103. The processor 100, the communication interface 102, and the memory 101 may communicate with each other via the bus 103. The communication interface 102 may be used for information transfer. Processor 100 may invoke logic instructions in memory 101 to perform the method for adjusting a heat exchange system of the above-described embodiments.
Further, the logic instructions in the memory 101 described above may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a stand alone product.
The memory 101 is a computer readable storage medium that can be used to store a software program, a computer executable program, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 100 executes the functional applications and data processing by running the program instructions/modules stored in the memory 101, i.e. implements the method for regulating the heat exchange system in the above described embodiments.
The memory 101 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, at least one application program required for a function; the storage data area may store data created according to the use of the terminal device, etc. Further, the memory 101 may include a high-speed random access memory, and may also include a nonvolatile memory.
Embodiments of the present disclosure provide an article (e.g., a computer, a cell phone, etc.) comprising an apparatus for conditioning a heat exchange system as described above.
Embodiments of the present disclosure provide a computer readable storage medium storing computer executable instructions configured to perform the above-described method for adjusting a heat exchange system.
The disclosed embodiments provide a computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the above-described method for adjusting a heat exchange system.
The computer readable storage medium may be a transitory computer readable storage medium or a non-transitory computer readable storage medium.
Embodiments of the present disclosure may be embodied in a software product stored on a storage medium, including one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of a method according to embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium including: a plurality of media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or a transitory storage medium.
As shown in connection with fig. 3, an embodiment of the present disclosure provides an apparatus for adjusting a heat exchange system, including a target heat release device determination module 21, a first heat release device determination module 22, and a valve control module 23. The target heat release device module 21 is configured to take a heat release device having an actual temperature higher than a preset temperature as a target heat release device; the first heat release device determination module 22 is configured to determine, as the first heat release device, a target heat release device that can be absorbed in terms of the temperature difference between the plurality of target heat release devices and the distance between the plurality of target heat release devices and the heat storage tank, in the case where the plurality of target heat release devices are provided; the valve control module 23 is configured to open a valve on a corresponding branch pipe of the first heat release device to transfer heat of the first heat release device to the heat storage tank.
By adopting the device for adjusting the heat exchange system, which is provided by the embodiment of the disclosure, the first heat release device with good heat exchange effect can be selected from the plurality of target heat release devices to exchange heat with the heat storage box body, so that the heat exchange effect between the heat release device of the heat exchange system and the heat storage box body is improved.
As shown in connection with fig. 4, the device for adjusting the heat exchange system optionally further comprises a second exothermic device determination module 24. The second heat release device determination module 24 is configured to select one of the remaining target heat release devices as the second heat release device in the case where the temperature decrease rate of the first heat release device is greater than or equal to the first value; the valve control module 23 is further configured to open a valve on the corresponding branch of the second heat release device.
By adopting the device for adjusting the heat exchange system, which is provided by the embodiment of the disclosure, when the temperature of the first heat release device is about to be unsuitable for heat exchange, the second heat release device suitable for heat exchange can be selected to exchange heat with the heat storage box body, so that the heat storage box body can continuously receive heat.
The embodiment of the disclosure also provides a heat exchange system, which comprises the device for adjusting the heat exchange system provided by the embodiment. The heat exchange system can determine the target heat release device capable of absorbing heat according to the temperature difference condition among the target heat release devices and the distance between the target heat release device and the heat storage box body under the condition that the target heat release devices exist through the device for adjusting the heat exchange system, so that the target heat release device transmits the heat to the heat storage box body, and the heat exchange effect between the heat release device and the heat storage box body is improved.
In some embodiments, the heat exchange system further comprises an air conditioner outdoor unit, wherein a heat exchanger of the air conditioner outdoor unit is close to or in contact with the heat release pipeline to absorb heat released by the heat release pipeline. When the outdoor temperature is lower, the heat release pipeline is controlled to release heat to the air conditioner outdoor unit, so that the outdoor heat exchanger absorbs heat, the influence of frosting of the outdoor heat exchanger on use is avoided, the evaporation temperature of the outdoor heat exchanger can be increased, the power of an air conditioning system is reduced, and the energy efficiency is improved. Thus, the operating temperature range of the air conditioner in winter is also expanded downwards.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. Moreover, the terminology used in the present application is for the purpose of describing embodiments only and is not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a," "an," and "the" (the) are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this disclosure is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, when used in the present disclosure, the terms "comprises," "comprising," and/or variations thereof, mean that the recited features, integers, steps, operations, elements, and/or components are present, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of other like elements in a process, method or apparatus that includes the element. In this context, each embodiment may be described with emphasis on the differences from the other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method sections disclosed in the embodiments, the description of the method sections may be referred to for relevance.
Those of skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. The skilled artisan may use different methods for each particular application to achieve the described functionality, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.
In the embodiments disclosed herein, the disclosed methods, articles of manufacture (including but not limited to devices, apparatuses, etc.) may be practiced in other ways. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of the units may be merely a logical function division, and there may be additional divisions when actually implemented, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. In addition, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form. The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to implement the present embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than that disclosed in the description, and sometimes no specific order exists between different operations or steps. For example, two consecutive operations or steps may actually be performed substantially in parallel, they may sometimes be performed in reverse order, which may be dependent on the functions involved. Each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Claims (10)
1. A method for regulating a heat exchange system comprising a heat collecting pipe, a heat accumulating tank and a heat releasing pipe in communication in sequence, the heat collecting pipe comprising a plurality of branch pipes and valves arranged on the branch pipes, the plurality of branch pipes being capable of absorbing heat of a plurality of heat releasing devices, the method comprising:
Taking the heat release device with the actual temperature higher than the preset temperature as a target heat release device;
in the case that the target heat release devices are plural, determining a target heat release device which can absorb heat as a first heat release device according to the temperature difference conditions among the plurality of target heat release devices and the distances between the plurality of target heat release devices and the heat storage box;
and opening a valve on the branch pipe corresponding to the first heat release device so that heat of the first heat release device is transferred to the heat storage box body.
2. The method of claim 1, wherein determining a first heat release device that can absorb heat based on a temperature differential between the target heat release devices and a plurality of distances between the target heat release devices and the thermal storage tank comprises:
Determining a temperature difference between the highest temperature and the lowest temperature of the target exothermic device;
taking the target heat release device with the highest temperature as a first heat release device under the condition that the temperature difference is larger than or equal to a preset value;
determining a first heat release device capable of absorbing heat according to distances between a plurality of target heat release devices and the heat storage box body under the condition that the temperature difference is smaller than a preset value;
Wherein, the temperature difference takes absolute value.
3. The method according to claim 2, wherein the determining the first heat release device that can absorb heat according to the distances between the plurality of target heat release devices and the heat storage tank includes:
And comparing the distances between the target heat release devices and the heat storage box body, and taking the target heat release device closest to the heat storage box body as a first heat release device.
4. The method of claim 1, wherein after opening the valve on the branch pipe corresponding to the first heat release device, further comprising:
selecting one of the remaining target heat release devices as a second heat release device in the case where the temperature decrease rate of the first heat release device is greater than or equal to a first value;
And opening a valve on the branch pipe corresponding to the second heat release device.
5. The method of claim 4, wherein said selecting one of the remaining target heat release devices as a second heat release device comprises:
Selecting the second heat release device which is closest to the heat storage box from the rest of the target heat release devices under the condition that the difference between the target temperature and the actual temperature of the heat storage box is smaller than a second value;
And selecting the second heat release device closest to the temperature of the first heat release device when the difference between the target temperature and the actual temperature of the heat storage box body is larger than or equal to a second value.
6. The method according to any one of claims 1 to 5, further comprising:
And determining the flow of the heat exchange medium in the heat release pipeline according to the temperature of the heat storage box body, and adjusting the flow of the heat exchange medium in the heat release pipeline.
7. The method of claim 6, wherein the higher the temperature of the heat storage tank, the less the flow of heat exchange medium in the heat release line.
8. An apparatus for regulating a heat exchange system, comprising a processor and a memory storing program instructions, wherein the processor is configured to perform the method for regulating a heat exchange system according to any one of claims 1 to 7 when executing the program instructions.
9. A heat exchange system comprising a device for regulating a heat exchange system according to claim 8.
10. The heat exchange system of claim 9, further comprising an air conditioner outdoor unit, wherein a heat exchanger of the air conditioner outdoor unit is in close proximity to or in contact with the heat release line to absorb heat released from the heat release line.
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| JP6020691B1 (en) * | 2015-09-29 | 2016-11-02 | 株式会社オンダ製作所 | Circulation port device for bathtub |
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