CN113720878B - Combined piezoelectric intelligent interlayer and connecting device thereof - Google Patents
Combined piezoelectric intelligent interlayer and connecting device thereof Download PDFInfo
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- CN113720878B CN113720878B CN202110938051.9A CN202110938051A CN113720878B CN 113720878 B CN113720878 B CN 113720878B CN 202110938051 A CN202110938051 A CN 202110938051A CN 113720878 B CN113720878 B CN 113720878B
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- 239000011229 interlayer Substances 0.000 title claims abstract description 110
- 230000004888 barrier function Effects 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011159 matrix material Substances 0.000 claims description 9
- 230000000903 blocking effect Effects 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 230000036541 health Effects 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 description 16
- 238000000926 separation method Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
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- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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Abstract
The application relates to the technical field of aviation structure health detection, in particular to a combined piezoelectric intelligent interlayer and a connecting device thereof, which comprises at least one group of piezoelectric interlayer modules and connecting modules; the piezoelectric interlayer modules are arranged between structures surrounded by adjacent barrier structures, at least one group of piezoelectric sensors are arranged in the piezoelectric interlayer modules, and each piezoelectric interlayer module is provided with an interlayer plug electrically connected with each piezoelectric sensor; the connecting module comprises a split plug, a connecting flat cable and a main plug, wherein at least one group of split plugs and connecting flat cables are arranged, each split plug is respectively connected with each interlayer plug, and two ends of the connecting flat cables are respectively connected with the main plug and the split plugs. The piezoelectric intelligent interlayer structure has the technical effect of being capable of stably installing the piezoelectric intelligent interlayer of the non-communicated structure.
Description
Technical Field
The application belongs to the technical field of aviation structure health detection, and particularly relates to a combined piezoelectric intelligent interlayer and a connecting device thereof.
Background
The damage monitoring sensor based on the piezoelectric guided wave is applied to structural health monitoring of an airplane due to the advantages of high sensitivity, high reliability, low cost and the like. For the health monitoring of the piezoelectric guided wave structure in any area, a plurality of piezoelectric guided wave sensors are required to be adhered at the same time to perform qualitative analysis and quantitative calculation of damage, and due to the factors of poor integrity of the bare chip type piezoelectric guided wave sensor, low installation efficiency, large additional weight of a signal transmission wire and the like, common solutions in engineering are to package all the sensors in a whole flexible printed circuit interlayer to form an integral intelligent interlayer structure. The intelligent interlayer has good integrity, light weight and good anti-interference performance, and effectively solves the problems of low die mounting efficiency, unstable process, need of external wires and the like.
However, the traditional integral piezoelectric intelligent interlayer is only suitable for a communicated plane or curved surface structure, the real aircraft structure is complex, and the traditional integral piezoelectric intelligent interlayer has more connection blocking structures such as ribs, stringers, band plates and bulkhead frames, so that the connectivity of the plane or curved surface of a monitoring area is difficult to ensure, and the integral piezoelectric intelligent interlayer cannot be applied at the moment. And once the phenomena such as sensor damage and the like occur in the integral piezoelectric intelligent interlayer, the monitoring effect of the whole sensor is affected, and the integral replacement is needed.
Therefore, how to design a piezoelectric intelligent interlayer that can be used for a non-communication structure is a problem to be solved.
Disclosure of Invention
The application aims to provide a combined piezoelectric intelligent interlayer and a connecting device thereof, which are used for solving the problem that the piezoelectric intelligent interlayer is difficult to install on a non-communicated structure.
The technical scheme of the application is as follows: a combined piezoelectric intelligent interlayer and a connecting device thereof comprise at least one group of piezoelectric interlayer modules and connecting modules; the piezoelectric interlayer modules are arranged between structures surrounded by adjacent barrier structures, at least one group of piezoelectric sensors are arranged in the piezoelectric interlayer modules, and each piezoelectric interlayer module is provided with an interlayer plug electrically connected with each piezoelectric sensor; the connecting module comprises a split plug, a connecting flat cable and a main plug, wherein at least one group of split plugs and connecting flat cables are arranged, each split plug is respectively connected with each interlayer plug, and two ends of the connecting flat cables are respectively connected with the main plug and the split plugs.
Preferably, the piezoelectric interlayer module further comprises an interlayer substrate, electrode etching wires and common etching wires; the electrode etching wires and the common etching wires are arranged on the interlayer substrate, at least one group of electrode etching wires is arranged, each group of electrode etching wires is connected between one piezoelectric sensor and the interlayer plug, and the common etching wires are connected with the piezoelectric sensors and grounded.
Preferably, the shape of the sandwich substrate can be adapted according to the structure enclosed by the barrier structure.
Preferably, the piezoelectric sensor is arranged below the interlayer substrate, and an adhesive layer is arranged between the lower surface of the interlayer substrate and the piezoelectric sensor.
Preferably, the interlayer substrate is made of polyimide material.
Preferably, the electrode etching wire and the common etching wire are both arranged on the lower surface of the interlayer substrate, and the interlayer plug is arranged on the upper surface of the interlayer substrate.
Preferably, the upper surface of the interlayer substrate is coated with a protective layer.
Preferably, the lower surface of the interlayer substrate is coated with an insulating layer.
Preferably, the connection flat cable adopts an FPC flat cable.
The application relates to a combined piezoelectric intelligent interlayer and a connecting device thereof, wherein the piezoelectric intelligent interlayer is divided into a plurality of piezoelectric interlayer modules, each piezoelectric interlayer module is arranged between structures surrounded by a barrier structure, and the piezoelectric interlayer modules and piezoelectric monitoring equipment are connected through the connecting modules, so that the piezoelectric interlayer modules do not need to cross the barrier structure, and stable structural health monitoring can be realized.
Preferably, the shape of the interlayer matrix can be matched with the shape of each blocking module, so that stable installation and efficient measurement can be realized.
Drawings
In order to more clearly illustrate the technical solution provided by the present application, the following description will briefly refer to the accompanying drawings. It will be apparent that the figures described below are merely some embodiments of the application.
FIG. 1 is a schematic diagram of a connection structure of two piezoelectric sandwich modules and a connection module according to the present application;
the projection 2 is a structural schematic diagram of the connecting module of the application;
FIG. 3 is a top view of a piezoelectric interlayer module according to the present application;
fig. 4 is a side view of a piezoelectric interlayer module of the present application.
1. An interlayer substrate; 2. etching the lead by the electrode; 3. a common etching wire; 4. a piezoelectric sensor; 5. a mezzanine plug; 6. an adhesive layer; 7. the upper surface of the interlayer; 8. the lower surface of the interlayer; 9. a plug; 10. connecting a flat cable; 11. a main plug.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application become more apparent, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the embodiments of the present application.
In order to realize effective measurement, the application adopts a structure that a measurement area of a real airplane structure is divided into a plurality of modules, a part enclosed between any adjacent barrier structures is used as a barrier module, the whole piezoelectric intelligent interlayer is divided into a plurality of monitoring modules, each detection module is arranged in one barrier module and is used for independent measurement, and then signals of each detection module are collected and transmitted into piezoelectric monitoring equipment through a total connecting component.
By employing this "split-total" mode, the barrier structure of the aircraft can be bypassed so that accurate measurements can be made for each part of the aircraft to be monitored.
As shown in fig. 1 and 2, at least one group of piezoelectric interlayer modules and connection modules are included. The piezoelectric interlayer modules are arranged between structures surrounded by adjacent barrier structures, the number of piezoelectric sensors 4 in the piezoelectric modules can be changed according to actual conditions, and each piezoelectric interlayer module is provided with an interlayer plug 5 which is electrically connected with the piezoelectric sensor 4.
The connection module comprises a sub-plug 9, a connection flat cable 10 and a main plug 11, wherein the sub-plug 9 and the connection flat cable 10 are provided with at least one group, each sub-plug 9 is respectively connected with each interlayer plug 5, and two ends of the connection flat cable 10 are respectively connected with the main plug 11 and the sub-plugs 9.
The piezoelectric interlayer module is arranged in the separation module, the piezoelectric sensor 4 in the piezoelectric interlayer module carries out structural health monitoring on the separation module, a monitoring result is transmitted into the interlayer plug 5, then the monitoring result is transmitted into the main plug 11 through the sub-plug 9 and the connection flat cable 10, the main plug 11 transmits monitoring data into the piezoelectric monitoring equipment, monitoring is realized, when encountering separation structures such as ribs, stringers, band plates, process holes and separation frames, the connection flat cable 10 is only required to be installed on the separation structure in a crossing mode, the piezoelectric intelligent module does not need to pass through the separation structure, the defect that the integral piezoelectric intelligent interlayer cannot cross the separation structure is overcome, and the structural adaptation is good. Because each sub-module of each piezoelectric interlayer module is in a connectivity plane or a curved surface structure, the performance of the piezoelectric intelligent interlayer can be fully exerted.
And when the piezoelectric sensor 4 is damaged, only the piezoelectric interlayer module corresponding to the sensor is required to be replaced, and all interlayers are not required to be replaced, so that maintenance can be conveniently carried out.
As shown in fig. 3 and 4, the piezoelectric interlayer module preferably further includes an interlayer base 1, an electrode etching wire 2, and a common etching wire 3. The interlayer matrix 1 is laid at the monitoring position, the electrode etching wires 2 and the common etching wires 3 are all arranged on the interlayer matrix 1, the electrode etching wires 2 are at least one group, each group of electrode etching wires 2 is connected between one piezoelectric sensor 4 and the interlayer plug 5, and the common etching wires are connected with the piezoelectric sensors 4 and grounded.
The piezoelectric sensor 4 realizes basic functions through the cooperation of the electrode etching wire 2 and the common etching wire 3, and the interlayer matrix 1 supports the piezoelectric sensor 4, the electrode etching wire 2 and the common etching wire 3, so that the structure is simple and stable.
Preferably, the shape of the interlayer matrix 1 can be adapted according to the structure enclosed by the blocking structure, namely, when the blocking module is in a shape of a long strip, L shape, C shape and the like, the interlayer matrix 1 can be correspondingly designed into the shape of the long strip, L shape, C shape and the like so as to be arranged in the corresponding blocking module, and therefore, the split combination can be freely carried out according to the shape of the blocking module, and the split combination is convenient, flexible and stable in installation.
Preferably, the piezoelectric sensor 4 is arranged below the interlayer substrate 1, and an adhesive layer 6 is arranged between the lower surface of the interlayer substrate 1 and the piezoelectric sensor 4. The adhesive layer 6 on the one hand stabilizes the piezoelectric sensor 4 and on the other hand provides an effective insulation between the piezoelectric sensor 4 and the sandwich substrate 1.
Preferably, the interlayer substrate 1 is made of polyimide material, and has the characteristics of good heat resistance, mechanical property and dielectric property, so as to ensure a stable working environment of the piezoelectric sensor 4.
Preferably, both the motor etched conductor and the common etched conductor 3 are provided on the interlayer lower surface 8 of the interlayer base 1, and the interlayer plug 5 is provided on the interlayer upper surface 7 of the interlayer base 1. The arrangement of the electrode etching wires 2 and the common etching wires 3 enables easy installation, and the arrangement of the interlayer plug 5 enables easy installation of the connection flat cable 10.
Preferably, the upper surface of the interlayer substrate 1 is coated with a protective layer, which protects the entire interlayer; the lower surface of the interlayer substrate 1 is coated with an insulating layer to keep the electrode-etched conductive line 2 and the common-etched conductive line 3 insulated.
Preferably, the connection flat cable 10 is an FPC flat cable that can be bent to a certain extent so that the blocking structure can be efficiently bypassed to connect the main plug 11 with the mezzanine plug 5.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (4)
1. A combined piezoelectric intelligent interlayer and a connecting device thereof are characterized in that: comprises at least one group of piezoelectric interlayer modules and a connecting module;
the piezoelectric interlayer modules are arranged between structures surrounded by adjacent barrier structures, at least one group of piezoelectric sensors (4) are arranged in the piezoelectric interlayer modules, and each piezoelectric interlayer module is provided with an interlayer plug (5) electrically connected with each piezoelectric sensor (4);
The connecting module comprises a sub-plug (9), a connecting flat cable (10) and a main plug (11), wherein at least one group of sub-plugs (9) and connecting flat cables (10) are arranged, each sub-plug (9) is respectively connected with each interlayer plug (5), and two ends of the connecting flat cable (10) are respectively connected with the main plug (11) and the sub-plugs (9);
The piezoelectric interlayer module further comprises an interlayer substrate (1), electrode etching wires (2) and a common etching wire (3); the electrode etching wires (2) and the common etching wires (3) are arranged on the interlayer substrate (1), at least one group of electrode etching wires (2) are arranged, each group of electrode etching wires (2) is connected between one piezoelectric sensor (4) and an interlayer plug (5), and the common etching wires (3) are connected with the piezoelectric sensors (4) and grounded;
The shape of the interlayer matrix (1) can be adapted according to the structure enclosed by the blocking structure;
The piezoelectric sensor (4) is arranged below the interlayer substrate (1), and an adhesive layer (6) is arranged between the lower surface of the interlayer substrate (1) and the piezoelectric sensor (4);
The interlayer matrix (1) is made of polyimide material;
The electrode etching lead (2) and the common etching lead (3) are both arranged on the lower surface (8) of the interlayer base body (1), and the interlayer plug (5) is arranged on the upper surface (7) of the interlayer base body (1).
2. The combination piezoelectric intelligent interlayer and the connecting device thereof according to claim 1, wherein: the upper surface of the interlayer matrix (1) is coated with a protective layer.
3. The combination piezoelectric intelligent interlayer and the connecting device thereof according to claim 1, wherein: the lower surface of the interlayer substrate (1) is coated with an insulating layer.
4. The combination piezoelectric intelligent interlayer and the connecting device thereof according to claim 1, wherein: the connecting flat cable (10) adopts an FPC flat cable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110938051.9A CN113720878B (en) | 2021-08-16 | 2021-08-16 | Combined piezoelectric intelligent interlayer and connecting device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110938051.9A CN113720878B (en) | 2021-08-16 | 2021-08-16 | Combined piezoelectric intelligent interlayer and connecting device thereof |
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| Publication Number | Publication Date |
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| CN113720878A CN113720878A (en) | 2021-11-30 |
| CN113720878B true CN113720878B (en) | 2024-08-13 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108146615A (en) * | 2017-12-07 | 2018-06-12 | 南京航空航天大学 | Aircraft electromechanical integration large area flexible Impact monitoring smart skins system |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4469091A (en) * | 1980-08-28 | 1984-09-04 | Slanetz Jr Charles A | Tactile control device for a remote sensing device |
| JP4997439B2 (en) * | 2006-02-10 | 2012-08-08 | 独立行政法人産業技術総合研究所 | Piezoelectric element and method for manufacturing MEMS device |
| CN102288346B (en) * | 2011-07-11 | 2013-07-03 | 南京航空航天大学 | Miniaturized digital large-scale sensor array impact monitoring system |
| CN104567944B (en) * | 2014-12-24 | 2017-02-22 | 南京航空航天大学 | Integrated large-area flexible piezoelectric interlayer sensor network |
| CN104819859B (en) * | 2015-04-16 | 2017-04-19 | 南京航空航天大学 | Surface mount solidification method for coupling large-area complex-configuration piezoelectric intelligent interlayer and structure |
| CN107561123B (en) * | 2017-09-29 | 2024-04-12 | 长安大学 | Concrete beam damage monitoring system and monitoring method |
| CN108169037B (en) * | 2017-12-15 | 2019-03-29 | 南京航空航天大学 | Continuous heterogeneous large area Impact monitoring network and shock zone localization method |
| US10953608B2 (en) * | 2018-08-09 | 2021-03-23 | The Boeing Company | Structural health monitoring of curved composite structures using ultrasonic guided waves |
| CN110729395A (en) * | 2019-10-31 | 2020-01-24 | 华东交通大学 | Flexible sensing device and method for active flaw detection of train bogie |
| CN111487326A (en) * | 2020-05-13 | 2020-08-04 | 中国飞机强度研究所 | Repairable formula piezoelectric sensor flexible interlayer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108146615A (en) * | 2017-12-07 | 2018-06-12 | 南京航空航天大学 | Aircraft electromechanical integration large area flexible Impact monitoring smart skins system |
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