CN113560714A - Laser selective processing method, forming process and device for transparent material surface coating - Google Patents
Laser selective processing method, forming process and device for transparent material surface coating Download PDFInfo
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- CN113560714A CN113560714A CN202110896659.XA CN202110896659A CN113560714A CN 113560714 A CN113560714 A CN 113560714A CN 202110896659 A CN202110896659 A CN 202110896659A CN 113560714 A CN113560714 A CN 113560714A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The invention belongs to the technical field of intelligent manufacturing, and particularly relates to a laser selective processing method, a forming process and a device for a transparent material surface coating, wherein the laser selective processing method for the transparent material surface coating comprises the following steps: immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be contacted with the liquid, wherein the opposite side of the target area of the workpiece is not coated; and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece. The processing method provided by the invention reduces the relative refractive index between the transparent material and the external medium by placing the opposite side of the processed area in the liquid, thereby weakening or preventing the reflection phenomenon of laser on the interface of the opposite side of the processed area of the transparent material and preventing the damage of the reflected laser to the coating.
Description
Technical Field
The invention belongs to the technical field of intelligent manufacturing, and particularly relates to a laser selective processing method, a forming process and a device for a transparent material surface coating.
Background
The laser is a beam with high heat and high quantity, which is generated by the excitation of a laser light source, and has the characteristics of high speed, high positioning accuracy and high brightness.
The processing of objects by using the characteristics of high energy and high heat of laser is an important aspect in laser application, including laser cutting, laser etching, laser engraving, and the like. Selective removal of the coating on a planar or profiled surface is also an important application of the laser, among others.
However, when the plating layer is removed by using laser, if the material is transparent or semitransparent, the laser is refracted into the material, reflected on the opposite side of the processed surface of the material, and irradiated onto the processed surface again, thereby damaging the non-target area of the plating layer on the processed surface and causing damage to the plating layer.
Disclosure of Invention
The embodiment of the invention aims to provide a laser selective processing method of a transparent material surface coating, aiming at solving the problems in the background technology.
The embodiment of the invention is realized in such a way that the laser selective processing method of the transparent material surface coating comprises the following steps:
immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be contacted with the liquid, wherein the opposite side of the target area of the workpiece is not coated;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
Another object of an embodiment of the present invention is to provide a method for selectively processing a surface coating of a transparent material by using laser, the method comprising the following steps:
clinging the opposite side of the current target area of the workpiece to a guide material, wherein the opposite side of the target area of the workpiece is not coated, and the guide material and a base material of the workpiece have the same or similar refractive index;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
Another objective of an embodiment of the present invention is to provide a forming process of a transparent material surface coating, where the forming process of the transparent material surface coating includes the following steps:
manufacturing or selecting a transparent base material;
preparing a coating on at least part of one surface of the transparent substrate to obtain a workpiece to be processed;
immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be in contact with the liquid or to be attached to a guide material, wherein the opposite side of the target area of the workpiece is not coated, and the guide material and a base material of the workpiece have the same or similar refractive index;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
Another object of an embodiment of the present invention is to provide an apparatus for forming a surface coating of a transparent material, including:
the containing device is used for containing liquid or guide materials with the same or similar refractive index as that of the base material to be processed; the opposite side of the current target area of the workpiece to be processed is immersed in liquid or is tightly attached to the guide material; and
a laser module for generating laser to remove a plating on a workpiece.
The processing method provided by the invention reduces the relative refractive index between the transparent material and the external medium by placing the opposite side of the processed area in the liquid, thereby weakening or preventing the reflection phenomenon of laser on the interface of the opposite side of the processed area of the transparent material and preventing the damage of the reflected laser to the coating.
Drawings
FIG. 1 is a flow chart of a method for laser selective processing of a surface coating of a transparent material according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the present invention;
fig. 3 is a plan view of a containing device provided by the embodiment of the invention;
fig. 4 is a half sectional view of a containing apparatus provided in an embodiment of the present invention;
FIG. 5 is a block diagram of one implementation of a shift module, according to an embodiment;
FIG. 6 is a block diagram of another implementation of a shift module according to an embodiment;
fig. 7 is a front view of fig. 6.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
The first embodiment is as follows:
as shown in fig. 1, a flowchart of a method for laser selective processing of a transparent material surface coating according to an embodiment of the present invention is provided, where the method for laser selective processing of a transparent material surface coating includes the following steps:
immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be contacted with the liquid, wherein the opposite side of the target area of the workpiece is not coated;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
In this embodiment, the basic principle of reducing the reflection of laser light by means of a liquid is shown in fig. 2. In fig. 2, the lower surface of the transparent material is immersed in the liquid, and when the refractive index of the liquid is the same as that of the transparent material, the reflection of the laser on the lower surface of the transparent material is weakened or disappeared, so that the problem that the coating of the non-target area is damaged due to the fact that the laser reflected inside the transparent material is irradiated on the coating of the upper surface is avoided. It will be appreciated that the refractive index of the liquid need not be the same as that of the transparent material, and that the refractive index of the liquid is generally closer to that of the transparent material than to that of the vacuum, and thus the reflection can be reduced, but only to a different extent. Further, it should be understood that the transparent material in the present invention is not limited strictly, and may be all transparent or translucent, such as glass, quartz glass, gem, transparent ceramic, etc., and it is determined by the principle of the present invention that the transparent material in the present invention refers to any material that can be penetrated by light, so as to determine whether reflection is possible at the inner interface.
In this embodiment, the liquid is preferably a transparent liquid, which can reduce the loss of the laser in the liquid and facilitate the laser to enter the liquid.
The current target area refers to an area of a coating layer needing to be moved, and during processing, the opposite side of the current target area needs to be immersed into liquid firstly, so that the liquid is in full contact with the lower surface of the workpiece, and the contact surface does not have a gap, a bubble and the like. When the laser is used for irradiating the target area, part of the laser enters the transparent material, is transmitted in the transparent material along a straight line, finally irradiates the other side boundary of the transparent material, and is reflected and refracted on the boundary. It will be appreciated that when the laser light impinges perpendicularly on the underlying interface within the transparent material, the reflection disappears, but this is difficult to achieve and there is no guarantee that the laser light will always be perpendicular to its exit interface, which is of value to the present invention.
The processing method provided by the invention reduces the relative refractive index between the transparent material and the external medium by placing the opposite side of the processed area in the liquid, thereby weakening or preventing the reflection phenomenon of laser on the interface of the opposite side of the processed area of the transparent material and preventing the damage of the reflected laser to the coating.
Preferably, in one embodiment of the present invention, the method further comprises:
determining the refractive index of the workpiece material;
the liquid is selected or formulated according to the refractive index of the workpiece material.
In this embodiment, the determination method for the refractive index of the workpiece material at least includes two methods of searching physical property data of the corresponding material or measuring the refractive index on site, and the measurement method for the refractive index of the material can be implemented by referring to the prior art, which is not described herein again.
In this embodiment, the liquid is selected according to the refractive index of the workpiece material, and the closer the refractive index of the selected liquid and the refractive index of the material is, the better, and of course, non-technical factors such as cost, environmental protection, and the number of times of repeated use can be considered, which is not in the scope of the present invention. The prepared liquid is the liquid meeting the requirements according to the refractive index of the material, and the prepared liquid can be the existing liquid or not.
Preferably, in an embodiment of the present invention, the preparing the liquid according to the refractive index of the workpiece material specifically includes the following steps:
selecting a solvent;
adding a regulator into the selected solvent;
and checking whether the difference value between the refractive index of the modulated liquid and the refractive index of the workpiece material meets a preset range, and if so, finishing the blending.
In this embodiment, the solvent may be selected from water, oil, etc., and depending on the chemical properties of the material, an organic or inorganic solvent, preferably a transparent solvent, may be selected. The refractive index of the liquid can be adjusted by adding a modifier to the solvent, where the modifier is any solute that can adjust the refractive index of the liquid, including but not limited to various salts, sugars, other liquids with different refractive indices from the solvent, and the like. In the blending process, it is also required to check whether the refractive index of the blended liquid meets the requirement, and the criterion for judgment is whether the difference between the refractive index of the blended liquid and the refractive index of the transparent material meets the requirement, for example, the deviation from the refractive index of the transparent material is 10% to 50%, and the specific range depends on the specific requirement of processing. For the determination of the refractive index of the liquid, the prior art can be referred to for implementation, and the present invention is not described herein again.
Preferably, in an embodiment of the present invention, the irradiating the current target area of the workpiece with the laser to remove the plating on the current target area of the workpiece specifically includes the following steps:
continuously or discontinuously irradiating the coating on the current target area of the workpiece by using laser;
meanwhile, the workpiece is moved and/or rotated according to the movement of the laser irradiation area on the processed surface of the workpiece, so that the opposite side of the current laser irradiation area of the workpiece is always immersed in the liquid.
In this embodiment, the irradiation with the laser light may be continuous or intermittent. Further, it should be understood that the current target area herein refers to an area being processed or to be processed, and may be a portion of the entire area to be processed on the workpiece.
In this embodiment, the laser irradiation is used while the workpiece is moved or rotated so that the opposite side of the region currently irradiated with the laser is always immersed in the liquid, which enables continuous processing without immersing the non-processing surface of the workpiece in the liquid. The mode can reduce the size of the liquid containing device, is suitable for workpieces with curved surfaces on the processed surfaces, and can avoid the contact of the liquid and the coating.
Preferably, in an embodiment of the present invention, the opposite side of the currently irradiated region of the workpiece refers to an irradiated region, which is formed on the opposite side of the processed surface of the workpiece after the laser is irradiated on the processed surface of the workpiece through refraction.
In this embodiment, it should be noted that the opposite side of the current laser-irradiated area of the workpiece is not necessarily the right opposite side of the laser-irradiated area of the workpiece, and is not the right opposite side in general, because the laser is refracted when being incident into the transparent material, so that the light spots on the two sides of the transparent material are not right opposite in any case, and the opposite side mainly refers to the light spot areas on the two sides in the present invention.
Example two:
the invention also provides a laser selective processing method of the transparent material surface coating, which comprises the following steps:
clinging the opposite side of the current target area of the workpiece to a guide material, wherein the opposite side of the target area of the workpiece is not coated, and the guide material and a base material of the workpiece have the same or similar refractive index;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
In this embodiment, it can be understood that the present embodiment is different from the first embodiment only in that a solid guiding material, instead of a liquid, is used, and the solid guiding material is tightly attached to the laser emitting surface of the transparent material of the workpiece, where the solid guiding material and the laser emitting surface are tightly attached, and the solid guiding material and the laser emitting surface can be tightly attached by two smooth bonding surfaces which are tightly attached together; the two can also be connected by using a transparent medium (here, the connection does not refer to structural connection, but refers to connection on an optical path), and the transparent medium can be transparent glue or any liquid, gel, etc. with the same or similar refractive index as the transparent material or the guiding material. It should be noted that any limitation in the preferred embodiment in the first embodiment may be combined with the present embodiment without violating the natural law, so that the limitation in the first embodiment and the corresponding modifications thereof may be used to limit the present embodiment.
Example three:
the embodiment of the invention also provides a forming process of the transparent material surface coating, which comprises the following steps:
manufacturing or selecting a transparent base material;
preparing a coating on at least part of one surface of the transparent substrate to obtain a workpiece to be processed;
immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be in contact with the liquid or to be attached to a guide material, wherein the opposite side of the target area of the workpiece is not coated, and the guide material and a base material of the workpiece have the same or similar refractive index;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
In this embodiment, the contents of the first and second embodiments of the present invention may be referred to in the third and fourth steps, and the details of this embodiment are not repeated herein. The third embodiment is a specific application in the production of the present invention, so any scheme obtained by combining the first embodiment and the second embodiment can be used for limiting the present embodiment.
Example four:
the embodiment of the invention also provides a forming device of the transparent material surface coating, which comprises:
the containing device is used for containing liquid or guide materials with the same or similar refractive index as that of the base material to be processed; the opposite side of the current target area of the workpiece to be processed is immersed in liquid or is tightly attached to the guide material; and
a laser module for generating laser to remove a plating on a workpiece.
In this embodiment, the molding device is combined with the first and second embodiments, so the related limitations in the first and second embodiments can be applied to this embodiment; in the third embodiment, regarding the content of the process aspect, all or part of the steps may be specifically implemented by the forming apparatus provided in this embodiment. The laser module belongs to a common module in the existing laser processing, and the embodiment of the invention does not specifically describe the common module.
Preferably, a placing position for placing the workpiece is arranged in the placing device, and the highest point of the placing position, which is in contact with the workpiece, is lower than the highest level of the liquid in the placing device.
In this embodiment, as shown in fig. 3 and 4, a specific implementation manner of the containing device provided by the embodiment of the present invention is provided. In the implementation mode, the containing device is provided with a cross-shaped groove, and the middle part of the groove is provided with an annular or annular array of supporting structures; one side of the cross-shaped groove is communicated with the liquid storage tank, and liquid in the liquid storage tank can enter the cross-shaped groove. The positioning device is used for placing a workpiece on a supporting structure, and the edges of part of the workpiece are abutted with four transition parts of a cross shape with round corners, so that the positioning of the workpiece is realized; and filling liquid to ensure that the liquid is fully contacted with the lower surface of the workpiece but is not diffused into the upper surface of the workpiece, and processing the upper surface coating of the workpiece from the upper part by utilizing laser.
As a further preference, the inner side surface of the containing means is attached or coated with a light absorbing material to prevent secondary reflection.
Preferably, the device for forming the transparent material surface coating further comprises a shifting module, and the workpiece is clamped on the shifting module; the displacement module is used for changing the position and/or the orientation of the workpiece according to the movement of the laser irradiation area on the processed surface of the workpiece, so that the opposite side of the current laser irradiation area of the workpiece is always immersed in the liquid.
In this embodiment, as shown in fig. 5, for one implementation of the shifting module provided by the present invention, it is configured as a mechanical arm, and has several sections of movably connected joints, and the joints can be controlled to move relatively, and the end of the mechanical arm is provided with a clamping member for clamping a workpiece. When the device is used, the mechanical arm is used for clamping a workpiece to move, so that the opposite side of a laser irradiation area of the workpiece is always immersed in liquid. The structure is particularly suitable for workpieces with complex machined surfaces. Further, the mechanical arm can be provided with a plurality of mechanical arms, and the mechanical arms are matched with each other to adjust the position and/or the orientation of the workpiece, so that the mechanical arm is suitable for large workpieces. In this embodiment, a computer device may be further included for controlling the motion of the robot arm, the computer device being connected to the robot arm by a wire.
In this embodiment, as shown in fig. 6 and 7, another implementation form of the displacement module provided by the present invention is configured to have three telescopic supports, which are located in the above-mentioned containing device, and the end of each support is connected with or abutted against the workpiece, and the adjustment of the position and/or orientation of the workpiece is implemented by controlling the telescopic lengths and/or orientations of the three supports. Fig. 6 and 7 only show the height adjustable mode, in which a motor drives a screw rod to rotate so as to enable a screw sleeve to ascend or descend, and in addition, the height adjustable mode can also be realized by using an air cylinder or a hydraulic cylinder and the like. Of course, the three supporting members may be disposed on the bracket to suspend the work in the liquid.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A laser selective processing method of a transparent material surface coating is characterized by comprising the following steps:
immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be contacted with the liquid, wherein the opposite side of the target area of the workpiece is not coated;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
2. The method for laser selective machining of a surface coating of a transparent material according to claim 1, further comprising:
determining the refractive index of the workpiece material;
the liquid is selected or formulated according to the refractive index of the workpiece material.
3. The method for laser selective processing of a transparent material surface coating according to claim 2, wherein the liquid is formulated according to the refractive index of the workpiece material, comprising the steps of:
selecting a solvent;
adding a regulator into the selected solvent;
and checking whether the difference value between the refractive index of the modulated liquid and the refractive index of the workpiece material meets a preset range, and if so, finishing the blending.
4. The method for laser selective processing of a transparent material surface coating according to claim 1, wherein the step of irradiating the current target area of the workpiece with laser light to remove the coating on the current target area of the workpiece comprises the following steps:
continuously or discontinuously irradiating the coating on the current target area of the workpiece by using laser;
meanwhile, the workpiece is moved and/or rotated according to the movement of the laser irradiation area on the processed surface of the workpiece, so that the opposite side of the current laser irradiation area of the workpiece is always immersed in the liquid.
5. The method of claim 4, wherein the laser irradiation area opposite to the currently irradiated area of the workpiece is an irradiation area formed on the opposite side of the surface of the workpiece to be processed after the laser irradiation is refracted on the surface of the workpiece to be processed.
6. A laser selective processing method of a transparent material surface coating is characterized by comprising the following steps:
clinging the opposite side of the current target area of the workpiece to a guide material, wherein the opposite side of the target area of the workpiece is not coated, and the guide material and a base material of the workpiece have the same or similar refractive index;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
7. A forming process of a transparent material surface coating is characterized by comprising the following steps:
manufacturing or selecting a transparent base material;
preparing a coating on at least part of one surface of the transparent substrate to obtain a workpiece to be processed;
immersing the opposite side of the current target area of the workpiece into liquid to enable the opposite side to be in contact with the liquid or to be close to a guide material, wherein the opposite side of the target area of the workpiece is not coated, and the guide material and a base material of the workpiece have the same or similar refractive index;
and irradiating the current target area of the workpiece by using laser to remove the coating on the current target area of the workpiece.
8. A forming device for surface coating of transparent material is characterized in that the forming device for surface coating of transparent material comprises:
the containing device is used for containing liquid or guide materials with the same or similar refractive index as that of the base material to be processed; the opposite side of the current target area of the workpiece to be processed is immersed in liquid or is tightly attached to the guide material; and
a laser module for generating laser to remove a plating on a workpiece.
9. The apparatus as claimed in claim 8, wherein the holding device is provided with a holding position for holding the workpiece, and the highest point of the holding position contacting with the workpiece is lower than the highest level of the liquid in the holding device.
10. The apparatus for forming a surface coating on a transparent material according to claim 8, wherein the apparatus for forming a surface coating on a transparent material further comprises a shift module, on which the workpiece is clamped; the displacement module is used for changing the position and/or the orientation of the workpiece according to the movement of the laser irradiation area on the processed surface of the workpiece, so that the opposite side of the current laser irradiation area of the workpiece is always immersed in the liquid.
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| CN202110896659.XA CN113560714A (en) | 2021-08-05 | 2021-08-05 | Laser selective processing method, forming process and device for transparent material surface coating |
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| CN202110896659.XA CN113560714A (en) | 2021-08-05 | 2021-08-05 | Laser selective processing method, forming process and device for transparent material surface coating |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114799539A (en) * | 2022-06-27 | 2022-07-29 | 中国华能集团清洁能源技术研究院有限公司 | Laser scribing method |
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