CN113362724B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN113362724B CN113362724B CN202110726783.1A CN202110726783A CN113362724B CN 113362724 B CN113362724 B CN 113362724B CN 202110726783 A CN202110726783 A CN 202110726783A CN 113362724 B CN113362724 B CN 113362724B
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- display panel
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- circuit board
- adhesive layer
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- 239000010410 layer Substances 0.000 claims abstract description 110
- 239000012790 adhesive layer Substances 0.000 claims abstract description 78
- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 238000005452 bending Methods 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 12
- 239000006260 foam Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 55
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display module and a display device, relates to the technical field of display, and aims to solve the problem that a display panel in the related art is green. The display module assembly includes a display panel, a back film, a first adhesive layer, a heat dissipation layer and a conductive portion. The back film is arranged on the back side of the display panel; the first bonding layer is arranged on one side of the back film far away from the display panel, and is bonded with the back film; the first adhesive layer is provided with at least one connecting hole penetrating through the first adhesive layer; the heat dissipation layer is arranged on one side of the first bonding layer far away from the display panel and is grounded; the conductive part is arranged in the connecting hole and is electrically connected with the heat dissipation layer and the back film. The invention is used for manufacturing the display device.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display module and a display device.
Background
In the use process of the display module, static electricity may be generated on the surface of the cover glass, for example, static electricity may be generated on the surface of the cover glass when the cover glass rubs with clothes and the like. The electrostatic charges are conducted to the back film on the back side of the display panel along the packaging adhesive between the cover plate glass and the display panel, so that an electric field is generated inside the display module, threshold voltage drift of the thin film transistor is caused, characteristics of the thin film transistor are changed, and the display panel is green, and display effect is affected.
Disclosure of Invention
The disclosure provides a display module and a display device, which are used for solving the problem of green emission of a display panel in the related art.
In order to achieve the above purpose, the present disclosure adopts the following technical scheme:
in one aspect, a display module is provided. The display module assembly comprises a display panel, a back film, a first bonding layer, a heat dissipation layer and a conductive part. Wherein the back film is arranged on the back side of the display panel; the first bonding layer is arranged on one side of the back film far away from the display panel, and the first bonding layer is bonded with the back film; at least one connecting hole penetrating through the first adhesive layer is formed in the first adhesive layer; the heat dissipation layer is arranged on one side, far away from the display panel, of the first bonding layer, and the heat dissipation layer is grounded; the conductive part is arranged in the connecting hole and is connected with the heat dissipation layer and the back film.
In some embodiments, the first adhesive layer is provided with a plurality of connection holes penetrating at least the first adhesive layer, and the plurality of connection holes are arranged at intervals along at least part of the boundary of the first adhesive layer.
In some embodiments, the front projection of the first adhesive layer on the display panel is a polygon, and the plurality of connection holes are spaced along at least one side of the polygon; or, the orthographic projection of the first adhesive layer on the display panel is approximately circular or elliptical, and the plurality of connecting holes are arranged at intervals along at least part of the boundary of the circular or elliptical shape.
In some embodiments, the material of the conductive portion includes conductive glue and/or conductive foam.
In some embodiments, there is a gap between the conductive portion and at least a portion of the side wall of the connection hole.
In some embodiments, the display module further includes a first buffer layer disposed between the heat dissipation layer and the first adhesive layer, and the connection hole further penetrates through the first buffer layer.
In some embodiments, the display module further includes a second buffer layer, the second buffer layer is disposed between the first buffer layer and the heat dissipation layer, and the connection hole further penetrates through the second buffer layer.
In some embodiments, the display panel includes a main body portion, a bending portion and a circuit board connection portion connected in sequence, where the bending portion is located at one side of the main body portion, and the circuit board connection portion is located at one side of the bending portion away from the main body portion; the bending part can bend towards the back side of the main body part, so that the circuit board connecting part is bent to the back side of the main body part. The back film comprises a first sub back film and a second sub back film, the first sub back film is at least partially overlapped with the main body part along the thickness direction of the display panel, the second sub back film is at least partially overlapped with the circuit board connecting part, and the second sub back film can be bent to the back side of the main body part along with the circuit board connecting part. The first adhesive layer and the heat dissipation layer at least partially overlap with the main body portion along a thickness direction of the display panel.
In some embodiments, the display module further includes a flexible circuit board, a protective layer, and a conductive adhesive layer. The flexible circuit board comprises a grounding metal area, a binding area and a wiring area, wherein the binding area is electrically connected with the circuit board connecting part of the display panel and can be bent to the back side of the main body part of the display panel along with the circuit board connecting part. The protective layer is arranged on one side of the flexible circuit board, which is used for being electrically connected with the display panel, covers the wiring area and exposes at least part of the grounding metal area. The conductive adhesive layer is arranged on one side, far away from the flexible circuit board, of the protective layer, is electrically connected with at least part of the grounding metal area exposed by the protective layer, and is configured to be adhered with the heat dissipation layer.
In some embodiments, the connection hole further penetrates through the heat dissipation layer, and the conductive portion is electrically connected with the conductive adhesive layer.
In some embodiments, the main body portion includes a main display area and curved display areas located on opposite sides of the main display area, the curved display areas being curved toward a back side of the display panel to form a curved surface.
In some embodiments, the at least one connection hole is disposed at the main display area.
In some embodiments, the display module further includes a protective film disposed on a side of the display panel away from the back film, and the protective film at least covers the bending portion of the display panel.
In some embodiments, the display module further includes an adhesive strip disposed on a side of the heat dissipation layer away from the display panel, the adhesive strip configured to adhere to a circuit board connection portion of the display panel.
The embodiment of the disclosure provides a display module, is equipped with the connecting hole that runs through first adhesive linkage on the first adhesive linkage, and conductive part sets up in the connecting hole and connects notacoria and heat dissipation layer electricity. In this way, the electrostatic charges on the back film can be transferred to the heat dissipation layer through the conductive part and is grounded and conducted away through the heat dissipation layer, so that the electrostatic charges are prevented from accumulating on the back film and generating an electric field inside the display module, the problem of green emission of the display panel is solved, and the risk of electrostatic discharge (Electro STATIC DISCHARGE, short for ESD) of the display module is reduced.
On the other hand, a display device is further provided, which comprises the display module set in any embodiment.
The display device provided in the embodiment of the present disclosure has the same beneficial effects as the display module provided in the above technical solution, and will not be described herein.
Drawings
In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.
FIG. 1 is a block diagram of a display device according to some embodiments;
FIG. 2 is a cross-sectional view of the display device shown in FIG. 1, taken along section line A-A;
FIG. 3 is a block diagram of a display module according to some embodiments;
FIG. 4 is a top view of a first adhesive layer according to some embodiments;
FIG. 5 is a top view of another first adhesive layer according to some embodiments;
FIG. 6 is a block diagram of a first adhesive layer according to some embodiments;
FIG. 7 is a cross-sectional view of the first adhesive layer shown in FIG. 6, taken along section line B-B;
FIG. 8 is a block diagram of another display module according to some embodiments;
FIG. 9 is a block diagram of yet another display module according to some embodiments;
FIG. 10 is a block diagram of yet another display module according to some embodiments;
Fig. 11 is a block diagram of still another display module according to some embodiments.
Detailed Description
The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.
Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the present specification, the terms "some embodiments (some embodiments)", "examples (examples)", or "some examples (some examples)", etc. are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.
In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.
As used herein, the term "if" is optionally interpreted to mean "when … …" or "when … …" depending on the context.
Exemplary embodiments are described herein with reference to cross-sectional and/or plan views as idealized exemplary figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Thus, variations from the shape of the drawings due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.
As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).
As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.
As shown in fig. 1, some embodiments of the present disclosure provide a display device 1000, where the display device 1000 may be any product or component having a display function, such as a television, a display, a notebook, a tablet, a mobile phone, a navigator, and the like.
The display device 1000 may be any one of a curved display device, a foldable display device, and a rollable display device. For example, referring to fig. 1, the display device 1000 may be a display device having curved surfaces on both sides, which includes a main display area 211 and a curved display area 212.
Taking the display device 1000 with a substantially rectangular boundary as an example, the curved display area 212 may be located on either the left or right side of the main display area 211 or on the lower side of the main display area 211, which is not particularly limited herein. Illustratively, referring to FIG. 1, curved display areas 212 are located on the left and right sides of main display area 211.
The "substantially rectangular" means that the shape of the boundary of the display device 1000 is rectangular in shape as a whole, but is not limited to a standard rectangle. That is, the "rectangular" herein includes not only a substantially rectangular shape but also a shape similar to a rectangle in consideration of process conditions. For example, the long and short sides of the rectangle are curved at each intersection (i.e., corner), i.e., the corners are smooth, such that the boundary of the display device 1000 is rounded rectangle in plan view.
Referring to fig. 2, the display device 1000 includes a display module 100 and a housing 200.
Some embodiments of the present disclosure provide a display module 100, referring to fig. 3, the display module 100 includes a display panel 20, a back film 11, a first adhesive layer 12, a heat dissipation layer 13, and a conductive portion 14. The display panel 20 has a light emitting side 20A and a back side 20B, wherein the light emitting side 20A refers to a light emitting surface of the display panel 20 for displaying an image, and the back side 20B refers to a side of the display panel 20 facing away from the light emitting surface.
Referring to fig. 3, the display panel 20 and the back film 11 are stacked, and the back film 11 is located on the back side 20B of the display panel 20. The first adhesive layer 12 is arranged on one side of the back film 11 away from the display panel 20, and the first adhesive layer 12 is adhered to the back film 11; the heat dissipation layer 13 is disposed on a side of the first adhesive layer 12 away from the display panel 20, and the heat dissipation layer 13 is grounded.
The first adhesive layer 12 is provided with at least one connection hole 120 penetrating at least the first adhesive layer 12, the conductive portion 14 is disposed in the connection hole 120, and the conductive portion 14 is connected with the heat dissipation layer 13 and the back film 11. Here, the conductive portion 14 is electrically connected to the heat dissipation layer 13, and the conductive portion 14 is capable of conducting the electrostatic charge on the back film 11 to the heat dissipation layer 13.
As can be seen from the above description, in the display module 100 provided in some embodiments of the present disclosure, the first adhesive layer 12 is provided with the connection hole 120 penetrating the first adhesive layer 12, and the conductive portion 14 is disposed in the connection hole 120 and electrically connects the back film 11 and the heat dissipation layer 13. In this way, the electrostatic charges on the back film 11 can be transferred to the heat dissipation layer 13 through the conductive portion 14 and be conducted away through the heat dissipation layer 13, so as to prevent the electrostatic charges from accumulating on the back film 11 and prevent the display module 100 from generating an electric field, thereby solving the problem of green emission of the display panel 20 and reducing the risk of electrostatic discharge of the display module 100.
It should be noted that, the heat dissipation layer 13 may be electrically connected to the housing 200 (see fig. 2) of the display device 1000 to implement grounding of the heat dissipation layer 13. Wherein the heat dissipation layer 13 may be made of metal, for example, the heat dissipation layer 13 is made of at least one of copper, silver, and steel.
In some embodiments, referring to fig. 1, 4 and 5, the first adhesive layer 12 is provided with a plurality of connection holes 120 penetrating the first adhesive layer 12, and the plurality of connection holes 120 are spaced apart along at least a portion of the boundary of the first adhesive layer 12. In this way, the electrostatic charges transferred to the back film 11 along the edge of the outer contour of the display panel 20 can be quickly transferred to the heat dissipation layer 13 through the conductive portion 14 and be grounded through the heat dissipation layer 13.
Illustratively, the front projection of the first adhesive layer 12 on the display panel 20 is substantially polygonal, and the plurality of connection holes 120 are spaced apart along at least one side of the polygon. For example, as shown in fig. 4, the front projection of the first adhesive layer 12 on the display panel 20 is substantially rectangular, and the plurality of connection holes 120 are uniformly distributed along two opposite long sides of the rectangle.
The term "substantially polygonal" means that the shape of the front projection of the first adhesive layer 12 on the display panel 20 is polygonal as a whole, but is not limited to a standard polygon. That is, the "polygon" herein includes not only a shape of a basic polygon but also a shape similar to a polygon in consideration of process conditions.
Similarly, "substantially rectangular" means that the shape of the front projection of the first adhesive layer 12 on the display panel 20 is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangular" herein includes not only a substantially rectangular shape but also a shape similar to a rectangle in consideration of process conditions.
Illustratively, the front projection of the first adhesive layer 12 on the display panel 20 is generally circular or elliptical, and the plurality of connection holes 120 are spaced apart along at least a portion of the boundary of the circular or elliptical shape. For example, as shown in fig. 5, the front projection of the first adhesive layer 12 on the display panel 20 is substantially circular, and the plurality of connection holes 120 are uniformly distributed along the entire boundary of the circular shape.
The term "substantially circular or elliptical" means that the shape of the front projection of the first adhesive layer 12 on the display panel 20 is circular or elliptical in shape as a whole, but is not limited to a standard circular or elliptical shape. That is, the "circular or elliptical" herein includes not only a substantially circular or elliptical shape but also a shape similar to a circular or elliptical shape in consideration of process conditions.
The radial cross-sectional shape of the connection hole 120 is generally circular, rectangular, or other shapes, which are not particularly limited herein. For example, as shown in fig. 4, the radial cross-sectional shape of the connection hole 120 is substantially rectangular; for example, as shown in fig. 5, the radial cross-sectional shape of the connection hole 120 is substantially circular.
The material of the conductive portion 14 includes conductive adhesive and/or conductive foam, and the conductive adhesive and/or conductive foam has better flexibility, i.e. the conductive adhesive and/or conductive foam is easy to deform under the force. Therefore, the conductive portion 14 is made of conductive adhesive and/or conductive foam, and the conductive portion 14 can deform along with the deformation of the connection hole 120, so that the extrusion generated between the conductive portion 14 and the connection hole 120 is reduced, and the risk of cracking or breaking the film layer in the connection hole 120 is reduced. Of course, the material of the conductive portion 14 may be other materials having good conductivity, such as metal, and the disclosure is not limited thereto.
In some embodiments, referring to fig. 3, a gap is provided between the conductive portion 14 and at least a portion of the sidewall of the connection hole 120. That is, after the conductive portion 14 is aligned with the connection hole 120, the radial dimension of the connection hole 120 is larger than the radial dimension of the conductive portion 14. The arrangement is beneficial to arranging the conductive part 14 in the connecting hole 120 in a aligned manner, so that the assembly efficiency of the display module 100 is improved.
In some embodiments, referring to fig. 3, the display module 100 further includes a first buffer layer 15, the first buffer layer 15 is disposed between the heat dissipation layer 13 and the first adhesive layer 12, and the connection hole 120 further penetrates through the first buffer layer 15. The first buffer layer 15 mainly plays a role of buffering and anti-vibration so as to improve the shock resistance of the display module 100. Here, the material of the first buffer layer 15 includes, for example, foam.
In some embodiments, referring to fig. 7, the first adhesive layer 12 includes a first sub-adhesive layer 121, a support layer 122, and a second sub-adhesive layer 123.
Referring to fig. 6 and 7, the first sub-adhesive layer 121 is adhered to the back film 11, and the front projection of the first sub-adhesive layer 121 on the display panel 20 is in a grid shape. The supporting layer 122 is disposed on a side of the first sub-adhesive layer 121 away from the display panel 20, and the supporting layer 122 is adhered to the first sub-adhesive layer 121, and the orthographic projection of the supporting layer 122 on the display panel 20 is in a grid shape to support the first sub-adhesive layer 121. The second sub-adhesive layer 123 is disposed on a side of the supporting layer 122 away from the first sub-adhesive layer 121, and the second sub-adhesive layer 123 is adhered to the supporting layer 122, so that the supporting layer 122 is adhered and fixed to the adjacent other film layer (the first buffer layer 15).
At this time, the first sub adhesive layer 121 and the support layer 122 are formed in a grid-like structure, so that air bubbles can be prevented from being generated during the adhesion between the first adhesive layer 12 and the back film 11, and defects such as swelling of the back film 11 can be avoided.
On this basis, the materials of the first sub-adhesive layer 121, the supporting layer 122 and the second sub-adhesive layer 123 may also be conductive materials, for example, the materials of the first sub-adhesive layer 121 and the second sub-adhesive layer 122 are conductive adhesives, and the material of the supporting layer 123 is conductive cloth. In this case, referring to fig. 8, the connection hole 120 may not penetrate the first adhesive layer 12.
In some embodiments, referring to fig. 9, the display panel 20 includes a main body portion 210, a bending portion 220, and a circuit board connection portion 230 connected in sequence. Wherein the main body part 210 may be configured as a portion of the display panel 20 for displaying an image, and the circuit board connection part 230 may be configured as a binding connection with the flexible circuit board 17 to receive data signals required for displaying a picture provided by the flexible circuit board 17.
Referring to fig. 9, the bending portion 220 is located at a side of the main body 210, and the circuit board connection portion 230 is located at a side of the bending portion 220 away from the main body 210. As shown in fig. 10, the bending portion 220 may be bent toward the back side 20B of the main body portion 210 by a bending process, so that the circuit board connection portion 230 is bent to the back side 20B of the main body portion 210, thereby reducing the frame width of the display device 1000.
Referring to fig. 9, the back film 11 includes a first sub back film 111 and a second sub back film 112. The first sub-back film 111 at least partially overlaps the main body portion 210 in the thickness direction of the display panel 20; the second sub-film 112 at least partially overlaps the circuit board connection part 230. Referring to fig. 10, the second sub-back film 112 may be bent to the back side 20B of the main body 210 along with the circuit board connection portion 230.
In this case, the back film 11 exposes the bending portion 220 of the display panel 20, so as to reduce the bending resistance of the bending portion 220 of the display panel 20, and change the position of the stressed neutral layer of the bending portion 220 of the display panel 20 during bending, so as to avoid damage to the display panel 20.
As shown in fig. 9 and 10, the boundary of the main body 210 of the display panel 20 is located in the front projection of the boundary of the first sub-back film 111 on the display panel 20, and the side of the first sub-back film 111 near the second sub-back film 112 extends to the bending portion 220; the border of the circuit board connection portion 230 of the display panel 20 or the border of the second sub-back film 112 is located in the front projection of the display panel 20, and one side of the second sub-back film 112, which is close to the first sub-back film 111, extends to the bending portion 220.
In this case, stress concentration at the interface between the body portion 210 and the bending portion 220 and at the interface between the bending portion 220 and the circuit board connection portion 230 during bending of the display panel 20 can be avoided, and the risk of cracking or breaking of the display panel 20 at the interface between the body portion 210, the bending portion 220 and the circuit board connection portion 230 can be reduced.
With continued reference to fig. 9 and 10, along the thickness direction of the display panel 20, the first adhesive layer 12 and the heat dissipation layer 13 at least partially overlap the main body 210. Illustratively, the orthographic projection of the boundary of the first adhesive layer 12 and the heat dissipation layer 13 on the display panel 20 approximately coincides with the boundary of the main body portion 210 of the display panel 20.
After bending the bending portion 220 toward the back side 20B of the main body portion 210 and bending the circuit board connection portion 230 to the back side 20B of the main body portion 210, in order to fix the bent circuit board connection portion 230 to the back side 20B of the main body portion 210, in some embodiments, as shown in fig. 9 and 10, the display module further 11 includes an adhesive strip 18, where the adhesive strip 18 is disposed on a side of the heat dissipation layer 13 away from the display panel 20, and the adhesive strip 18 is configured to adhere to the circuit board connection portion 230 of the display panel 20 so that the circuit board connection portion 230 is fixed to the back side 20B of the main body portion 210.
In some embodiments, the display module 100 further includes a flexible circuit board 17, a protective layer 19, and a conductive adhesive layer 21.
Referring to fig. 9 and 10, the flexible circuit board 17 includes a grounding metal region 171, a binding region 172 and a routing region 173. The ground metal region 171 is configured to provide a ground metal pattern 174, the ground metal pattern 174 being configured to transmit a ground signal; binding area 172 is configured to be in binding electrical connection with display panel 20; the trace area 173 is configured to set a trace transmitting a control signal of the display panel 20.
Referring to fig. 9 and 10, the flexible circuit board 17 is electrically connected with the circuit board connection part 230 of the display panel 20 at the binding region 172, and may be bent to the back side 20B of the main body part 210 of the display panel 20 along with the circuit board connection part 230. The flexible circuit board 17 is configured to supply data signals necessary for displaying a picture to the display panel 20. In this way, after the flexible circuit board 17 is electrically connected to the display panel 20, the flexible circuit board 17 is located on the back side 20B of the main body 210, so as to reduce the frame width of the display device 1000.
As shown in fig. 9 and 10, the protective layer 19 is provided on the binding side of the flexible circuit board 17, which means the side of the flexible circuit board 17 for electrical connection with the display panel 20. The protective layer 19 covers the trace region 173 of the flexible circuit board 17 to shield electromagnetic interference and reduce the risk of a trace short of the trace region 173 of the flexible circuit board 17, and the protective layer 19 exposes at least a portion of the ground metal region 171 of the flexible circuit board 17 so that the conductive pattern 174 of the ground metal region 171 is grounded.
Referring to fig. 9 and 10, a conductive adhesive layer 21 is disposed on a side of the protective layer 19 away from the flexible circuit board 17, the conductive adhesive layer 21 is electrically connected to at least a portion of the grounding metal region 171 of the exposed flexible circuit board 17, the conductive adhesive layer 21 is configured to adhere to the heat dissipation layer 13 to fix the flexible circuit board 17, and the grounding metal region 171 of the flexible circuit board 17 is electrically connected to the heat dissipation layer 13, so as to achieve grounding of the conductive pattern 174 of the grounding metal region 171.
In some embodiments, referring to fig. 9 and 10, the connection hole 120 further penetrates through the heat dissipation layer 13, and the conductive portion 14 is electrically connected to the conductive adhesive layer 21. In this way, the conductive portion 14 may be electrically connected to the conductive pattern 174 of the ground metal region 171 and the heat dissipation layer 13 through the conductive paste layer 21.
At this time, the electrostatic charges may be transferred to the heat dissipation layer 13 through a plurality of paths and be conducted away through the heat dissipation layer 13 to the ground. For example, the electrostatic charge is directly transferred to the heat dissipation layer 13 through the conductive portion 14 and the conductive adhesive layer 21, and is conducted away through the heat dissipation layer 13 to the ground; for another example, the electrostatic charges are transferred to the ground metal pattern 174 of the ground metal region 171 through the conductive portion 14 and the conductive adhesive layer 21, transferred to the heat dissipation layer 13 through the conductive adhesive layer 21, and conducted away through the ground of the heat dissipation layer 13. This allows more rapid conduction of the electrostatic charge away from the backing film 11 through various conduction paths.
In some embodiments, as shown in fig. 9 and 11, the main body 210 includes a main display area 211 and a curved display area 212, the curved display area 212 is located at opposite sides of the main display area 211, and the curved display area 212 is curved toward the back side 20B of the display panel 20 to form a curved surface.
Illustratively, the curved display area 212 is located at two opposite sides of the main display area 211 along a first direction X, which is a direction perpendicular to the boundary line between the main body 210 and the bending portion 220; that is, the curved display area 212 is located at the boundary of the main display area 211 and the boundary of the main portion 210 and the bending portion 220.
On the basis, at least one connection hole 120 is disposed in the main display area 211. In this way, the tensile or compressive stress of the film layer applied to the connection hole 120 is small, and the risk of cracking or breaking the film layer in the connection hole 120 is reduced.
In some embodiments, referring to fig. 9 and 11, the display module 100 further includes a second buffer layer 16, the second buffer layer 16 is disposed between the first buffer layer 15 and the heat dissipation layer 13, and the connection hole 120 further penetrates through the second buffer layer 16. The second buffer layer 16 mainly plays a role of releasing stress, so that the second buffer layer 16 can generate a certain deformation after being stressed (tensile stress or compressive stress), and the rebound stress in the second buffer layer 16 is released through the deformation of the second buffer layer 16, so that the possibility of generating film separation in the curved display area 212 of the display module 100 is reduced.
Here, the material of the second buffer layer 16 includes Polyimide (PI) or polyethylene terephthalate (Polyethylene terephthalate, PET) plastics. The second buffer layer 16 may be formed of PET plastic and graphite, and the support frame is formed of PET plastic, for example, and filled with graphite. Thus, the second buffer layer 16 can also function as a heat sink.
In some embodiments, as shown in fig. 9 and 10, the display module 100 further includes a protective film 22 disposed on a side of the display panel 20 away from the back film 11, and the protective film 22 covers at least the bending portion 220 of the display panel 20. The protective film 22 can change the position of the stressed neutral layer of the bending portion 220 of the display panel 20 during the bending process, so as to avoid damage to the display panel 20.
On this basis, one end of the protective film 22 extends to the bending part 220 of the display panel 20, and the other end extends to the circuit board connection part 230 of the display panel 20, so as to reduce the risk of cracking or breaking of the display panel 20 at the interface of the main body part 210, the bending part 220 and the circuit board connection part 230.
In some embodiments, referring to fig. 3, the display module 100 further includes a circular polarizer 33, a second adhesive layer 32, and a cover plate 31. The circular polarizer 33 is disposed on the light-emitting side 20A of the display panel 20, so as to reduce the light reflectivity of the surface of the light-emitting side 20A of the display module 100 and improve the display contrast of the display device 1000. The cover plate 31 is disposed on a side of the circular polarizer 33 away from the display panel 20 for protecting the display panel 20. The second adhesive layer 32 is disposed between the circular polarizer 33 and the cover plate 31, and is used for bonding the circular polarizer 33 and the cover plate 31.
The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (11)
1. A display module, comprising:
A display panel;
a back film disposed on a back side of the display panel;
The first bonding layer is arranged on one side, far away from the display panel, of the back film, and the first bonding layer is bonded with the back film; at least one connecting hole penetrating through the first adhesive layer is formed in the first adhesive layer;
the heat dissipation layer is arranged on one side, far away from the display panel, of the first bonding layer and is grounded;
the conductive part is arranged in the connecting hole and is connected with the heat dissipation layer and the back film; a gap is formed between the conductive part and at least part of the side wall of the connecting hole;
the display panel comprises a main display area and a curved display area, wherein the curved display area is positioned on two opposite sides of the main display area, and the curved display area is bent towards the back side of the display panel to form a curved surface; the at least one connecting hole is arranged in the main display area;
the first adhesive layer is provided with a plurality of connecting holes penetrating through at least the first adhesive layer, and the connecting holes are arranged at intervals along at least part of the boundary of the first adhesive layer.
2. The display module of claim 1, wherein the front projection of the first adhesive layer on the display panel is substantially polygonal, and the plurality of connection holes are spaced along at least one side of the polygon; or alternatively, the first and second heat exchangers may be,
The orthographic projection of the first adhesive layer on the display panel is approximately circular or elliptical, and the plurality of connecting holes are arranged at intervals along at least part of the boundary of the circular or elliptical shape.
3. The display module assembly of claim 1, wherein the material of the conductive portion comprises conductive glue and/or conductive foam.
4. The display module of claim 1, further comprising:
The first buffer layer is arranged between the heat dissipation layer and the first bonding layer, and the connecting hole also penetrates through the first buffer layer.
5. The display module assembly of claim 4, further comprising:
The second buffer layer is arranged between the first buffer layer and the heat dissipation layer, and the connecting hole also penetrates through the second buffer layer.
6. The display module according to any one of claims 1 to 5, wherein the display panel includes a main body portion, a bending portion and a circuit board connecting portion connected in this order, the bending portion being located at one side of the main body portion, the circuit board connecting portion being located at one side of the bending portion away from the main body portion; the bending part can bend towards the back side of the main body part, so that the circuit board connecting part is bent to the back side of the main body part;
The back film comprises a first sub back film and a second sub back film, the first sub back film is at least partially overlapped with the main body part along the thickness direction of the display panel, the second sub back film is at least partially overlapped with the circuit board connecting part, and the second sub back film can be bent to the back side of the main body part along with the circuit board connecting part;
The first adhesive layer and the heat dissipation layer at least partially overlap with the main body portion along a thickness direction of the display panel.
7. The display module assembly of claim 6, further comprising:
The flexible circuit board comprises a grounding metal area, a binding area and a wiring area, wherein the binding area is electrically connected with a circuit board connecting part of the display panel and can be bent to the back side of a main body part of the display panel along with the circuit board connecting part;
The protective layer is arranged on one side of the flexible circuit board, which is used for being electrically connected with the display panel, covers the wiring area and is exposed at least partially to the grounding metal area;
The conductive adhesive layer is arranged on one side, far away from the flexible circuit board, of the protective layer, is electrically connected with at least part of the grounding metal area exposed by the protective layer, and is configured to be adhered with the heat dissipation layer.
8. The display module of claim 7, wherein the connection hole further penetrates through the heat dissipation layer, and the conductive portion is electrically connected with the conductive adhesive layer.
9. The display module assembly of claim 8, further comprising:
The protective film is arranged on one side, far away from the back film, of the display panel, and at least covers the bending part of the display panel.
10. The display module assembly of claim 6, further comprising:
And the bonding strip is arranged on one side of the heat dissipation layer away from the display panel and is configured to be bonded with the circuit board connecting part of the display panel.
11. A display device, comprising: the display module of any one of claims 1-10.
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| CN202110726783.1A CN113362724B (en) | 2021-06-29 | 2021-06-29 | Display module and display device |
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| CN113903260B (en) * | 2021-09-30 | 2024-01-02 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113963632B (en) * | 2021-10-25 | 2023-09-12 | 武汉天马微电子有限公司 | Display module and display device |
| CN114300638B (en) * | 2021-12-29 | 2023-12-01 | 武汉华星光电半导体显示技术有限公司 | Backboard and display panel |
| CN114530098B (en) * | 2022-03-30 | 2023-12-01 | 京东方科技集团股份有限公司 | Display module, manufacturing method thereof and display device |
| CN116997132A (en) * | 2022-04-26 | 2023-11-03 | 京东方科技集团股份有限公司 | Display module and display device |
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