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CN113252080B - Structure deformation temperature synchronous monitoring sensor and system based on combined patch antenna - Google Patents

Structure deformation temperature synchronous monitoring sensor and system based on combined patch antenna Download PDF

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Publication number
CN113252080B
CN113252080B CN202110426847.6A CN202110426847A CN113252080B CN 113252080 B CN113252080 B CN 113252080B CN 202110426847 A CN202110426847 A CN 202110426847A CN 113252080 B CN113252080 B CN 113252080B
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radiation patch
patch antenna
combined
patch
synchronous monitoring
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CN113252080A (en
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谢丽宇
李宪之
薛松涛
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Tongji University
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Tongji University
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass

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  • General Physics & Mathematics (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The invention relates to a structure deformation temperature synchronous monitoring sensor based on a combined patch antenna, which comprises a connecting plate component, a fixed substrate, a first lower radiation patch arranged on the lower surface of the fixed substrate, an upper radiation patch, a radio frequency identification chip and a microstrip line which are respectively arranged on the upper surface of the substrate, a movable substrate arranged on the upper surface of the fixed substrate and a second lower radiation patch arranged on the lower surface of the movable substrate, wherein the connecting plate component is rigidly connected with the movable substrate, the second lower radiation patch and the upper radiation patch are partially overlapped and attached to form a short circuit, the combined patch antenna is jointly formed, the second lower radiation patch can relatively displace with the upper radiation patch, the radio frequency identification chip is connected with the upper radiation patch through the microstrip line, and the point connected with the upper radiation patch is arranged at a position deviating from the central line of the upper radiation patch.

Description

Structure deformation temperature synchronous monitoring sensor and system based on combined patch antenna
Technical Field
The invention relates to the field of structural health monitoring, in particular to a structural deformation temperature synchronous monitoring sensor and system based on a combined patch antenna.
Background
In the long-term use process of the civil engineering structure, due to the effects of external environment, load and other factors, certain degradation often occurs, stress deformation, cracking and the like are generated, hidden danger is buried for safe and reliable operation of the structure, and even the structure is damaged and fails when serious. Therefore, in the whole life cycle of the structure, physical quantities (displacement, strain, acceleration and the like) related to the state of the structure, environmental changes (temperature, humidity) and the like are required to be monitored so as to know the service state of the structure in time and ensure the safe and reliable use of the structure.
Currently, sensing technologies and sensors for structural health monitoring are rapidly developed, such as sensors of different forms based on piezoelectric impedance, acoustic emission, optical fiber, etc. sensing technologies. These sensors generally have the advantages of high resolution, good stability, etc., but most still require continuous power supply, and the transmission of the collected signals is performed in a wired manner, which leads to complex wiring, time and effort consumption in installation, high cost, and difficult maintenance of the monitoring system. In addition, conventional sensors typically monitor only for certain specific physical quantity changes, and simultaneous monitoring of multiple variables by a single sensor is difficult to achieve, which also limits the application of these sensors in structural health monitoring.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a structure deformation temperature synchronous monitoring sensor and a system based on a combined patch antenna, which solve the problem that the traditional sensor needs to perform signal transmission and energy supply in a wired way and realize synchronous monitoring of a single sensor on various physical quantity changes.
The aim of the invention can be achieved by the following technical scheme:
the structure deformation temperature synchronous monitoring sensor based on the combined patch antenna comprises a connecting plate assembly, a fixed substrate, a first lower radiation patch arranged on the lower surface of the fixed substrate, an upper radiation patch, a radio frequency identification chip and a microstrip line which are respectively arranged on the upper surface of the fixed substrate, a movable substrate arranged on the upper surface of the fixed substrate and a second lower radiation patch arranged on the lower surface of the movable substrate, wherein the connecting plate assembly is rigidly connected with the movable substrate, the second lower radiation patch and the upper radiation patch are partially overlapped and attached to form a short circuit, the combined patch antenna is formed together, the second lower radiation patch can relatively displace with the upper radiation patch, the radio frequency identification chip is connected with the upper radiation patch through the microstrip line, and the point connected with the upper radiation patch is arranged at a position deviating from the central line of the upper radiation patch;
when in use, the connecting plate component and the fixed base plate are adhered to the surface of the structure;
when the surface of the structure is deformed, the second lower radiation patch and the upper radiation patch are relatively displaced, so that the whole length of the combined patch antenna is changed, and the longitudinal resonant frequency of the combined patch antenna is changed; when the environment temperature changes, the dielectric constants of the fixed substrate and the movable substrate change, the length and the width of the second lower radiation patch and the upper radiation patch change, the whole length and the whole width of the combined patch antenna are changed, the longitudinal resonance frequency and the transverse resonance frequency of the combined patch antenna are changed, and the synchronous acquisition of structural deformation and temperature is realized.
Further, the second lower radiation patch and the upper radiation patch have the same width.
Further, the connecting plate assembly comprises a connecting plate and a connecting wire, wherein two ends of the connecting wire are respectively and rigidly connected with the movable substrate and the connecting plate, and when the connecting plate is used, the connecting plate is adhered to the surface of the structure.
Further, the first lower radiation patch completely covers the lower surface of the fixed substrate.
Preferably, the first lower radiation patch and the upper radiation patch are respectively attached to the fixed substrate through electroplating, the second lower radiation patch is attached to the movable substrate through electroplating, and the radio frequency identification chip is arranged on the fixed substrate through welding and is connected with the microstrip line through conductive adhesive or welding.
Preferably, the first lower radiation patch, the upper radiation patch and the second lower radiation patch are made of copper, and the fixed substrate and the movable substrate are RT5880 dielectric plates.
The structure deformation temperature synchronous monitoring system based on the combined patch antenna comprises a sensor and a reader which are in communication connection with each other, wherein the sensor is the structure deformation temperature synchronous monitoring sensor based on the combined patch antenna;
when the system works, the reader emits electromagnetic wave signals to activate the radio frequency identification chip of the sensor, and the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna are respectively detected, so that the deformation of the surface of the structure and the change of the environmental temperature are obtained, and the synchronous monitoring of the deformation and the temperature of the structure is realized.
Further, the reader comprises a wireless transceiver module, a control module, a modem module and a digital processing module which are connected with each other, wherein the wireless transceiver module and the modem module are used for transmitting electromagnetic wave signals and detecting transverse resonance frequency and longitudinal resonance frequency of the combined patch antenna, and the digital processing module is used for determining offset of the transverse resonance frequency and the longitudinal resonance frequency and calculating surface shape variable of the structure and environmental temperature change according to the preset relation between the resonance frequency and surface deformation of the structure and environmental temperature change.
Further, when the reader detects the transverse resonant frequency and the longitudinal resonant frequency, firstly, modulating electromagnetic wave signals with different frequencies are transmitted to activate the radio frequency identification chip, and the frequency of the modulating electromagnetic wave signals transmitted by the reader when the signal transmitting power reaches the minimum value under the condition that the radio frequency identification chip can be activated is searched, so that the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna are finally determined.
Further, after the radio frequency identification chip is activated, the combined patch antenna generates current and emits electromagnetic wave signals containing tag numbers and position information, and the reader receives and processes the electromagnetic wave signals to acquire the position location of the sensor.
Compared with the prior art, the invention has the following advantages:
1) In the combined patch antenna designed by the invention, an upper radiation patch, a second lower radiation patch, a substrate dielectric medium and the like form a resonance system, the upper radiation patch and the second lower radiation patch form a combined patch antenna capable of relatively moving, meanwhile, a radio frequency identification chip is connected with the combined patch antenna through a microstrip line, the microstrip line is not positioned at the central line of the radiation patch, an eccentric feed mode is adopted, resonance modes in two directions of the radiation patch are excited, the transverse resonance frequency and the longitudinal resonance frequency of the antenna are used as parameters to represent structural deformation and temperature change, the offset of the resonance frequency of the sensor and a monitoring variable have a relatively clear relation in a fixed range, synchronous monitoring of a plurality of variables by a single sensor can be realized, and the combined patch antenna has relatively strong applicability;
2) The method decouples the influence of the structural deformation and the temperature change on the transverse and longitudinal resonant frequencies of the combined patch antenna, and realizes synchronous monitoring of the structural deformation and the temperature by representing the structural deformation and the temperature change through the offset of the transverse and longitudinal resonant frequencies of the combined patch antenna;
3) The reader is matched with the radio frequency identification chip, the resonance frequency of the sensor can be measured in a wireless mode, information transmission is carried out through electromagnetic waves, a cable is not needed, the sensor is activated through the electromagnetic waves to work, an additional power supply is not needed to provide energy for a sensing system, passive wireless monitoring of the sensor is realized, the sensing system is simpler, the arrangement is more flexible, the sensor is not easy to fail under natural disasters, and the labor force for installing the sensor and the cost of the sensing system are greatly reduced;
4) The antenna of the combined patch antenna sensor is not influenced by stress, so that the influence of shear hysteresis and strain transmission efficiency in the structural deformation monitoring process can be avoided, the measurement result is more accurate, and meanwhile, the chip connected with the sensor can store simple information such as ID, position and the like of the combined patch antenna, so that the sensor can be rapidly positioned.
Drawings
FIG. 1 is a schematic diagram of a sensor structure according to the present invention;
FIG. 2 is a schematic view of a stationary substrate assembly;
FIG. 3 is a schematic diagram of a moving substrate assembly;
FIG. 4 is a schematic view of a connection plate assembly;
FIG. 5 is a schematic diagram of the system of the present invention.
1. Fixed base plate, 2, first radiation paster, 3, last radiation paster, 4, radio frequency identification chip, 5, microstrip line, 6, mobile substrate, 7, second radiation paster, 8, connecting wire, 9, connecting plate down.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Examples
As shown in fig. 5, the invention discloses a structure deformation temperature synchronous monitoring system based on a combined patch antenna, which can reduce structure deformation and temperature monitoring cost, realize passive wireless monitoring of structure deformation and temperature, and comprises a sensor and a reader 10 which are in communication connection with each other, wherein the sensor is a structure deformation temperature synchronous monitoring sensor based on the combined patch antenna, and comprises a fixed substrate assembly, a movable substrate assembly and a connecting plate assembly as shown in fig. 1-4.
The fixed substrate assembly comprises a fixed substrate 1, a first lower radiation patch 2 arranged on the lower surface of the fixed substrate 1, an upper radiation patch 3 respectively arranged on the upper surface of the fixed substrate 1, a radio frequency identification chip 4 and a microstrip line 5; the movable substrate assembly comprises a movable substrate 6 arranged on the upper surface of the fixed substrate 1 and a second lower radiation patch 7 arranged on the lower surface of the movable substrate 6; the connecting plate assembly comprises a connecting plate 9 and connecting wires 8 with two ends rigidly connected with the movable substrate 6 and the connecting plate 9 respectively.
The widths of the second lower radiation patch 7 and the upper radiation patch 3 are equal, the second lower radiation patch 7 and the upper radiation patch 3 are partially overlapped and attached to form a short circuit, a combined patch antenna is formed together, the second lower radiation patch 7 and the upper radiation patch 3 can relatively displace, the radio frequency identification chip 4 is connected with the upper radiation patch 3 through the microstrip line 5, the point connected with the upper radiation patch 3 is arranged at a position deviated from the central line of the upper radiation patch 3, and the first lower radiation patch 2 completely covers the lower surface of the fixed substrate 1; in use, the fixed base plate 1 and the connecting plate 9 are adhered to the surface of the structure. The microstrip line 5 is not located at the center line of the upper radiation patch 3 but is offset by a distance to excite the resonant modes of the upper radiation patch 3 in both directions.
When the surface of the structure is deformed, the second lower radiation patch 7 and the upper radiation patch 3 are relatively displaced, so that the whole length of the combined patch antenna is changed, and the longitudinal resonant frequency of the combined patch antenna is changed; when the environment temperature changes, the dielectric constants of the fixed substrate 1 and the movable substrate 6 change, the lengths and the widths of the second lower radiation patch 7 and the upper radiation patch 3 change, the integral length and the integral width of the combined patch antenna are changed, the longitudinal resonant frequency and the transverse resonant frequency of the combined patch antenna are changed, and the synchronous acquisition of structural deformation and temperature is realized.
Specifically:
in the structural deformation monitoring, the connecting wire 8 and the connecting plate 9 play a role of a sensing unit, when the structure is deformed, the connecting plate assembly is fixed on the contact point of the surface of the structure and generates relative displacement with the fixed point of the fixed substrate assembly, and the relative displacement is transmitted to the movable substrate 6 and the second lower radiation patch 7 through the connecting plate 9 and the connecting wire 8, so that relative dislocation occurs between the movable substrate 6 and the upper radiation patch 3 of the fixed substrate assembly.
The second lower radiation patch 7 is tightly attached to the upper radiation patch 3 to form a combined patch antenna, the longitudinal resonance frequency of the combined patch antenna is related to the superposition length between the two radiation patches, and when the superposition length is increased, the longitudinal resonance frequency is reduced; as the overlap length decreases, the longitudinal resonant frequency increases.
In ambient temperature monitoring, a change in temperature causes a change in the dielectric constants of the fixed substrate 1 and the movable substrate 6. And the fixed substrate 1, the radiation patch 3, the movable substrate 6 and the second lower radiation patch 7 are cooperatively deformed under the influence of temperature change, so that the size of the combined patch antenna is changed. Wherein a change in the lateral dimension of the combined patch antenna causes a change in the lateral resonant frequency and a change in the longitudinal dimension causes a change in the longitudinal resonant frequency.
In this embodiment, the first lower radiation patch 2 and the upper radiation patch 3 are respectively attached to the fixed substrate 1 through electroplating, the second lower radiation patch 7 is attached to the movable substrate 6 through electroplating, the radio frequency identification chip 4 is disposed on the fixed substrate 1 through welding and is connected with the microstrip line 5 through conductive adhesive or welding, the materials of the first lower radiation patch 2, the upper radiation patch 3 and the second lower radiation patch 7 are copper, the fixed substrate 1 and the movable substrate 6 are RT5880 dielectric plates, the connecting wire 8 and the connecting plate 9 are rigid materials with dielectric constants close to 1, so as to reduce the influence on the antenna electromagnetic field formed by the fixed substrate component and the movable substrate component.
When the system works, the reader 10 emits electromagnetic wave signals to activate the radio frequency identification chip 4 of the sensor, and the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna are respectively detected, so that the deformation of the surface of the structure and the change of the environmental temperature are obtained, and the synchronous monitoring of the deformation and the temperature of the structure is realized.
The reader 10 can wirelessly measure the transverse and longitudinal resonant frequencies of the combined patch antenna sensor, and includes a wireless transceiver module, a control module, a modem module and a digital processing module which are connected with each other, wherein the wireless transceiver module and the modem module are all commonly known in the art, and are not innovation points of the present application.
The wireless transceiver module and the modem module are used for transmitting electromagnetic wave signals and detecting the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna, the digital processing module is used for determining the offset of the transverse resonant frequency and the longitudinal resonant frequency, and calculating the surface shape variable of the structure and the change of the environmental temperature according to the relation between the preset resonant frequency and the surface deformation of the structure and the change of the environmental temperature. The control module is used for controlling the monitoring sensing system reader and transmitting modulated electromagnetic wave signals with different frequencies to the sensor. Through wireless transceiver module, modem module, the reader 10 can detect the resonance frequency skew based on combination formula patch antenna sensor, provides control module, digital processing module after modem module demodulation, and digital processing module calculates structure deformation state and temperature change according to the corresponding relation in the setting module, and then realizes the synchronous monitoring to structure deformation and temperature. The sensor is connected with the radio frequency identification chip 4 through the microstrip line 5, and when the signal power received by the sensor reaches a threshold value, the radio frequency identification chip 4 can be activated to work.
When the reader 10 detects the transverse resonant frequency and the longitudinal resonant frequency, firstly, the modulated electromagnetic wave signals with different frequencies are transmitted to activate the radio frequency identification chip 4, and the frequency of the modulated electromagnetic wave signal transmitted by the reader 10 when the signal transmitting power reaches the minimum value under the condition that the radio frequency identification chip 4 can be activated is searched, and finally, the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna are determined.
When the radio frequency identification chip 4 is activated, the combined patch antenna generates current and emits electromagnetic wave signals containing label numbers and position information, the reader 10 receives and processes the electromagnetic wave signals, acquires the position information of the sensor and the like, so that the position positioning of the sensor is realized, the radio frequency identification chip 4 carries the coding information of the sensor, the reader 10 emits modulated electromagnetic wave signals to the sensor, the coding of the sensor can be identified, and when a plurality of sensors are arranged in the scanning range of the reader, the reader can mark the deformation value and the temperature of the surface of each structure according to the coding of each sensor.
When the reader transmits signals at the transverse and longitudinal resonance frequencies of the combined patch antenna, the transmission power required for activating the sensor chip is obviously reduced, and the transverse and longitudinal resonance frequencies of the combined patch antenna sensor can be determined by searching the transmission frequency which enables the threshold transmission power to reach the minimum value.
The digital processing module can determine the transverse resonant frequency and the longitudinal resonant frequency of the antenna in the combined patch antenna sensor by searching the electromagnetic wave transmitting frequency of the reader, which enables the signal transmitting power to reach the minimum value when the sensor chip is activated.
When the surface of the structure is deformed or the ambient temperature is changed, the radiation patch size and the dielectric constant of the substrate of the whole antenna of the combined patch antenna sensor are both changed, so that the transverse resonance frequency and the longitudinal resonance frequency of the combined patch antenna sensor are shifted. The transverse and longitudinal resonant frequency offset can be determined through the monitoring and sensing system, so that the change of the deformation of the surface of the structure and the ambient temperature can be obtained, and the synchronous monitoring of the deformation and the temperature of the structure can be realized.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions may be made without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims (10)

1. The structure deformation temperature synchronous monitoring sensor based on the combined patch antenna is characterized by comprising a connecting plate assembly, a fixed substrate (1), a first lower radiation patch (2) arranged on the lower surface of the fixed substrate (1), an upper radiation patch (3), a radio frequency identification chip (4) and a microstrip line (5) which are respectively arranged on the upper surface of the fixed substrate (1), a movable substrate (6) arranged on the upper surface of the fixed substrate (1) and a second lower radiation patch (7) arranged on the lower surface of the movable substrate (6), wherein the connecting plate assembly is rigidly connected with the movable substrate (6), the second lower radiation patch (7) and the upper radiation patch (3) are partially overlapped and attached to form a short circuit, the combined patch antenna is formed together, the second lower radiation patch (7) and the upper radiation patch (3) can generate relative displacement, the radio frequency identification chip (4) is connected with the upper radiation patch (3) through the microstrip line (5), and the point connected with the upper radiation patch (3) is arranged at a position deviating from the central line of the upper radiation patch (3).
When in use, the connecting plate component and the fixed substrate (1) are adhered to the surface of the structure;
when the surface of the structure is deformed, the second lower radiation patch (7) and the upper radiation patch (3) are relatively displaced, so that the whole length of the combined patch antenna is changed, and the longitudinal resonant frequency of the combined patch antenna is changed; when the environment temperature changes, the dielectric constants of the fixed substrate (1) and the movable substrate (6) change, the lengths and the widths of the second lower radiation patch (7) and the upper radiation patch (3) change, the integral length and the integral width of the combined patch antenna are changed, the longitudinal resonant frequency and the transverse resonant frequency of the combined patch antenna are caused to change, the influence of structural deformation and temperature change on the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna is decoupled, and the structural deformation and the temperature change are represented through the offset of the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna, so that the synchronous monitoring of the structural deformation and the temperature is realized.
2. A combined patch antenna based synchronous monitoring sensor for structural deformation temperature according to claim 1, wherein the second lower radiating patch (7) is equal to the upper radiating patch (3) in width.
3. The synchronous monitoring sensor for structural deformation temperature based on the combined patch antenna according to claim 1, wherein the connecting plate assembly comprises a connecting plate (9) and a connecting wire (8), two ends of the connecting wire (8) are respectively and rigidly connected with the movable substrate (6) and the connecting plate (9), and when the synchronous monitoring sensor is used, the connecting plate (9) is adhered to the surface of a structure.
4. A combined patch antenna based synchronous monitoring sensor for structural deformation temperature according to claim 1, wherein the first lower radiating patch (2) completely covers the lower surface of the fixed substrate (1).
5. The synchronous monitoring sensor for structural deformation temperature based on combined patch antenna according to claim 1, wherein the first lower radiation patch (2) and the upper radiation patch (3) are respectively attached to the fixed substrate (1) through electroplating, the second lower radiation patch (7) is attached to the movable substrate (6) through electroplating, and the radio frequency identification chip (4) is arranged on the fixed substrate (1) through welding and is connected with the microstrip line (5) through conductive adhesive or welding.
6. The synchronous monitoring sensor for structural deformation temperature based on the combined patch antenna according to claim 1, wherein the first lower radiation patch (2), the upper radiation patch (3) and the second lower radiation patch (7) are made of copper, and the fixed substrate (1) and the movable substrate (6) are made of RT5880 dielectric plates.
7. A combined patch antenna based structure deformation temperature synchronous monitoring system, characterized by comprising a sensor and a reader (10) which are in communication connection, wherein the sensor is a combined patch antenna based structure deformation temperature synchronous monitoring sensor as claimed in any one of claims 1-6;
when the system works, the reader (10) emits electromagnetic wave signals to activate the radio frequency identification chip (4) of the sensor, and the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna are respectively detected to obtain the deformation of the surface of the structure and the change of the environmental temperature, so that the synchronous monitoring of the deformation and the temperature of the structure is realized.
8. The synchronous monitoring system for structural deformation temperature based on combined patch antenna according to claim 7, wherein the reader (10) comprises a wireless transceiver module, a control module, a modem module and a digital processing module which are connected with each other, wherein the wireless transceiver module and the modem module are used for transmitting electromagnetic wave signals and detecting transverse resonance frequency and longitudinal resonance frequency of the combined patch antenna, and the digital processing module is used for determining offset of the transverse resonance frequency and the longitudinal resonance frequency and calculating structural surface shape variable and environmental temperature change according to the preset relation between the resonance frequency and structural surface deformation and environmental temperature change.
9. The synchronous monitoring system of structural deformation temperature based on combined patch antenna according to claim 7, wherein when the reader (10) detects the transverse resonant frequency and the longitudinal resonant frequency, firstly, the reader transmits the modulated electromagnetic wave signals with different frequencies to activate the radio frequency identification chip (4), and searches the frequency of the modulated electromagnetic wave signals transmitted by the reader (10) when the signal transmitting power reaches the minimum value under the condition that the radio frequency identification chip (4) can be activated, and finally, the transverse resonant frequency and the longitudinal resonant frequency of the combined patch antenna are determined.
10. The synchronous monitoring system for structural deformation temperature based on combined patch antenna according to claim 7, wherein said combined patch antenna generates current and emits electromagnetic wave signal containing tag number and position information after the radio frequency identification chip (4) is activated, said reader (10) receives and processes said electromagnetic wave signal to obtain the position location of the sensor.
CN202110426847.6A 2021-04-20 2021-04-20 Structure deformation temperature synchronous monitoring sensor and system based on combined patch antenna Active CN113252080B (en)

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