CN113207235A - Nanometer particle deposition method based on Leidenfrost phenomenon - Google Patents
Nanometer particle deposition method based on Leidenfrost phenomenon Download PDFInfo
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- CN113207235A CN113207235A CN202110467941.6A CN202110467941A CN113207235A CN 113207235 A CN113207235 A CN 113207235A CN 202110467941 A CN202110467941 A CN 202110467941A CN 113207235 A CN113207235 A CN 113207235A
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- 238000000151 deposition Methods 0.000 title claims abstract description 62
- 239000002245 particle Substances 0.000 title abstract description 8
- 239000002105 nanoparticle Substances 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000008021 deposition Effects 0.000 claims abstract description 46
- 238000007639 printing Methods 0.000 claims abstract description 26
- 238000007641 inkjet printing Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229910001006 Constantan Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000005245 sintering Methods 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001540 jet deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a nanometer particle deposition method based on a Leidenfrost phenomenon, belonging to the technical field of nanometer particle deposition. The method comprises the following steps: the method comprises the following steps: heating the substrate above a Leidenfrost temperature; step two: setting the printing speed and the dot spacing of the ink-jet printing equipment, inputting a deposition pattern, and carrying out ink-jet printing on the nano-particle ink to obtain a layer of deposition pattern on the surface of the substrate; step three: and repeating the operation of the second step, increasing the thickness of the deposition pattern through multi-layer printing, and realizing high-resolution control of the thickness of the inkjet printing deposition pattern. The method can improve the accuracy of inkjet printing deposition patterns through Leidenfrost printing, and control the deposition thickness of nano-particle droplets through multilayer printing.
Description
Technical Field
The invention belongs to the technical field of nanoparticle deposition, and particularly relates to a nanoparticle deposition method based on a Leidenfrost phenomenon.
Background
The ink-jet printing system can deposit the functional nanoparticle ink on the surface of the substrate, and the rapid processing of the nanoparticle conductive circuit is realized. The factors affecting the accuracy of the deposited pattern of ink-jet printing are more, such as: ink stability, substrate hydrophilicity and hydrophobicity, surface roughness, and the like. The precision of the ink-jet printing deposition pattern is improved, and the conducting circuit can be better processed and controlled. Therefore, how to improve printing accuracy or control deposition patterns has been an important field of research. The Leidenfrost phenomenon means that when the temperature of a substrate is high, liquid drops are deposited on the surface of the substrate and locally contact with the substrate and are gasified into a gas film, and heat transfer between the liquid drops and the substrate is hindered. Thus, the Leidenfrost phenomenon is a potential method of controlling inkjet-printed deposition by controlling the amount of inkjet-printed nanoparticle deposition through local boiling.
Surface wettability and roughness of the substrate are key factors that affect the quality of the deposited pattern. In engineering applications, the original surface needs to be modified if the surface wettability and roughness needs to be changed. Many engineering problems do not exist or do not allow direct modification of their surfaces, and it is therefore necessary to provide a method for improving the accuracy of nanoparticle deposition patterns without modifying the surface.
Disclosure of Invention
The invention aims to provide a method for depositing nanoparticles based on a Leidenfrost phenomenon, which realizes a Leidenfrost boiling state by heating a substrate and enabling nanoparticles liquid drops to impact the surface of the substrate. In the Leidenfrost state, only part of nanoparticles in the nanoparticle liquid drop are deposited on the surface of the substrate, so that the control of the nanoparticle deposition pattern is realized, and the accuracy of the deposition pattern is improved.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a method for nanoparticle deposition based on the Leidenfrost phenomenon, the method comprising:
the method comprises the following steps: heating the substrate above a Leidenfrost temperature;
step two: setting the printing speed and the dot spacing of the ink-jet printing equipment, inputting a deposition pattern, and carrying out ink-jet printing on the nano-particle ink to obtain a layer of deposition pattern on the surface of the substrate;
step three: and repeating the operation of the second step, increasing the thickness of the deposition pattern through multi-layer printing, and realizing high-resolution control of the thickness of the inkjet printing deposition pattern.
Preferably, the substrate is a plane or a curved surface.
Preferably, when the substrate is a plane, the substrate is placed on a heating plate for heating; when the substrate is curved, a heating film is attached to the back surface of the substrate and heated.
Preferably, the step is to control the substrate temperature by PID.
Preferably, the nanoparticle ink is silver nanoparticle ink, copper nanoparticle ink, constantan nanoparticle ink or gold nanoparticle ink.
Preferably, the thickness of the deposition pattern obtained in the second step is 1 micron.
The invention has the advantages of
The invention provides a nanoparticle deposition method based on Leidenfrost phenomenon, which is compared with the prior art and comprises the following steps:
1. the invention can improve the printing precision on the premise of not modifying the surface of the substrate.
2. The invention can improve the accuracy of the inkjet printing deposition pattern through Leidenfrost printing.
3. The invention can control the deposition thickness of the nanometer particle liquid drop through multilayer printing.
4. Nanoparticle deposition based on the Leidenfrost phenomenon can be used as a coating method, for example: the silver plating layer can be applied to decoration, the reduction of the resistance of metal parts, the improvement of the welding capacity of metal and other functions.
5. The printed electronic technology is to prepare different nano materials into printing ink and form the printing ink on a substrate in an ink-jet printing mode. Displays, solar cells, and the like all require inkjet printing technology to process conductive circuits. Through the Leidenfrost ink-jet deposition technology, the thickness of a deposited line can be accurately controlled, the accuracy of the line can be improved, and a more complex ink-jet printing product can be manufactured.
6. Thermocouple materials are made into nanoparticles, nanoparticle ink is prepared, and a thin thermocouple line can be obtained through Leidenfrost printing. The high resolution can improve the space density of the thermocouple and obtain more temperature measuring point data.
Drawings
FIG. 1 is a graph showing the effect of the method for depositing nanoparticles based on the Leidenfrost phenomenon in example 2 of the present invention.
Detailed Description
A nanometer particle deposition method based on Leidenfrost phenomenon comprises the following three steps of heating a substrate, single-layer printing and multi-layer deposition:
the method comprises the following steps: heating the substrate above a Leidenfrost temperature; the method specifically comprises the following steps:
1) firstly, preparing nanoparticle ink and a substrate to be deposited and an ink-jet printing device, and if the substrate is a plane, placing the substrate on a horizontal heating platform; if the substrate is a curved surface, a heating film is attached to the back of the deposition surface, and the substrate is preferably a ceramic substrate.
2) And (3) carrying out a preliminary experiment, obtaining Leidenfrost temperature of the nanometer particle liquid drop impacting the substrate, wherein the Leidenfrost temperature is influenced by physical properties of the nanometer particle liquid drop and the substrate, gradually increasing the temperature of the substrate, observing the form of the ink-jet printing liquid drop, observing that the liquid drop impacts the substrate, partially depositing and rolling the substrate to obtain the Leidenfrost temperature, heating the substrate to be higher than the Leidenfrost temperature, and controlling the temperature stability of the substrate through PID.
Step two: setting the printing speed and the dot spacing of an ink-jet printing device, wherein the printing speed is preferably 5m/s, the dot spacing is preferably 0.15mm, inputting a deposition pattern, and carrying out ink-jet printing on the nanoparticle ink to obtain a layer of deposition pattern on the surface of the substrate; the source of the nanoparticle ink is commercially available, and the nanoparticle ink is preferably silver nanoparticle ink, copper nanoparticle ink, constantan nanoparticle ink or gold nanoparticle ink; in order to obtain a compact thin film, the obtained deposition pattern is preferably subjected to sintering treatment, wherein the sintering temperature is preferably 250-1000 ℃, more preferably 300-800 ℃, and the time is preferably 5-2 h, more preferably 30-60 min;
according to the invention, because the temperature of the substrate is higher than the Leidenfrost temperature, liquid drops impact on the surface of the substrate and cannot be directly deposited on the surface of the substrate, but are partially boiled and deposited to form a thinner deposition layer. The resulting deposition pattern thickness is preferably 1 micron, 1/100-1/1000 the thickness of a conventional evaporative deposition pattern. The deposited liquid drops can roll off the substrate, so a matched liquid drop recycling device is needed to prevent the waste and the pollution of the ink.
Step three: and repeating the operation of the second step, increasing the thickness of the deposition pattern through multilayer printing, and controlling the deposition thickness to obtain the Leidenfrost deposition pattern with controllable thickness.
The present invention will be described in further detail with reference to specific examples.
Example 1: surface coating
On a horizontal substrate, the substrate was heated to 250 ℃ and the nanoparticle ink was copper nanoparticle ink (a colloidal solution of copper nanoparticles and ethylene glycol). The printing speed was adjusted to 5m/s and the dot pitch was adjusted to 0.15mm, and nanoparticles were deposited on the entire surface to form a 1-micron-thick copper nanoparticle layer. The substrate and the copper nanoparticles are sintered at 600 ℃ for 30min to form a copper film.
Example 2: printed conductive circuit
On a ceramic substrate, heating the substrate to 300 ℃, wherein the nano-particle ink is silver nano-particle ink (diethylene glycol colloidal solution of silver nano-particles), depositing a conductive circuit on the ceramic substrate at 300 ℃, adjusting the printing speed to be 5m/s and the dot spacing to be 0.15mm to form a conductive circuit with the thickness of 1 micron, and sintering the silver nano-particle ink at 300 ℃ for 10min after deposition.
And repeating the printing operation, increasing the thickness of the deposition pattern through multilayer printing, and controlling the deposition thickness to obtain the Leidenfrost deposition pattern with controllable thickness.
FIG. 1 shows that silver nanoparticle ink deposits conductive circuits on a ceramic substrate at 300 ℃, the printing speed is adjusted to be 5m/s, the dot spacing is 0.15mm, the number of printing layers is respectively 1-10 layers from bottom to top, the color of the deposition circuits is gradually deepened, and the thickness of the deposition circuits is continuously thickened.
Example 3: ink-jet printing film thermocouple
On a ceramic horizontal substrate, heating the substrate to 250 ℃, wherein the nano-particle ink is a copper nano-particle glycol solution and a constantan nano-particle solution, the copper nano-particle glycol solution is used as a positive electrode material, the constantan nano-particle solution is used as a negative electrode material, the copper nano-particle glycol solution and the constantan nano-particle solution are respectively deposited on the surface of the ceramic horizontal substrate heated to 250 ℃, the deposition patterns are two connected lines, the printing speed is adjusted to be 5m/s, the dot spacing is 0.15mm, and the thin-film thermocouple with the thickness of 1 micron is formed by high-temperature sintering at 800 ℃ for 1 h.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110467941.6A CN113207235A (en) | 2021-04-28 | 2021-04-28 | Nanometer particle deposition method based on Leidenfrost phenomenon |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110467941.6A CN113207235A (en) | 2021-04-28 | 2021-04-28 | Nanometer particle deposition method based on Leidenfrost phenomenon |
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| CN113207235A true CN113207235A (en) | 2021-08-03 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090269495A1 (en) * | 2005-12-15 | 2009-10-29 | Mady Elbahri | Method for Producing Nanostructures on a Substrate |
| US20100302319A1 (en) * | 2007-12-06 | 2010-12-02 | National Institute Of Advanced Industrial Science And Technology | Pattern drawing method and pattern drawing apparatus |
| US20140314947A1 (en) * | 2012-08-22 | 2014-10-23 | Massachusetts Institute Of Technology | Articles and methods for enhanced boiling heat transfer |
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2021
- 2021-04-28 CN CN202110467941.6A patent/CN113207235A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090269495A1 (en) * | 2005-12-15 | 2009-10-29 | Mady Elbahri | Method for Producing Nanostructures on a Substrate |
| US20100302319A1 (en) * | 2007-12-06 | 2010-12-02 | National Institute Of Advanced Industrial Science And Technology | Pattern drawing method and pattern drawing apparatus |
| US20140314947A1 (en) * | 2012-08-22 | 2014-10-23 | Massachusetts Institute Of Technology | Articles and methods for enhanced boiling heat transfer |
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Application publication date: 20210803 |