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CN1131406C - Semiconductor refrigerator with composite wood casing - Google Patents

Semiconductor refrigerator with composite wood casing Download PDF

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Publication number
CN1131406C
CN1131406C CN00100479A CN00100479A CN1131406C CN 1131406 C CN1131406 C CN 1131406C CN 00100479 A CN00100479 A CN 00100479A CN 00100479 A CN00100479 A CN 00100479A CN 1131406 C CN1131406 C CN 1131406C
Authority
CN
China
Prior art keywords
composite wood
casing
layer
conductor
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN00100479A
Other languages
Chinese (zh)
Other versions
CN1307215A (en
Inventor
郭琛
高俊岭
张爱民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hebei Australia electronic refrigerator Co.,Ltd.
Luquan Jiwei Electrical Appliance Co.,Ltd.
Original Assignee
HEBEI ENERGY-SAVING INVESTMENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEBEI ENERGY-SAVING INVESTMENT Co Ltd filed Critical HEBEI ENERGY-SAVING INVESTMENT Co Ltd
Priority to CN00100479A priority Critical patent/CN1131406C/en
Publication of CN1307215A publication Critical patent/CN1307215A/en
Application granted granted Critical
Publication of CN1131406C publication Critical patent/CN1131406C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023Mounting details thereof

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  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Refrigerator Housings (AREA)

Abstract

The present invention relates to a semiconductor refrigerator with a composite wood casing. The cross section of the casing is in a layered structure and is composed of three layers at least, wherein the three layers are a decorating protective layer, a wood casing layer and a heat insulating layer from the outside to the inside in sequence. A semiconductor refrigeration assembly is arranged in a wall hole on one side of an NOT gate of the casing, the hot end of the semiconductor refrigeration assembly is arranged outside the refrigerator, the cold end is arranged in the refrigerator, and both the hot end and the cold end are provided with heat radiation assemblies. The present invention has the advantages of good heat insulating performance, power saving and no noise and no fluorine during work. The semiconductor refrigerator can be combined with furniture and other fields.

Description

The refrigerating box of the conductor refrigeration of composite wood casing
Technical field
The present invention relates to conductor refrigeration equipment, concrete is a kind of refrigerating box that the conductor refrigeration of composite wood casing is arranged.
Background technology
In the technical field that modern refrigerator is produced, adopt the refrigeration of iron sheet outer casing compressor formula more.Development along with market, people's desired level improves constantly, the refrigerator of this iron sheet outer casing employing compressor formula refrigeration because noise pollution is arranged, uses iron sheet outer casing that defectives such as corrosion are arranged for a long time, thereby does not obviously satisfy market each side requirement in its course of work.
Summary of the invention
The present invention seeks to overcome above-mentioned deficiency, a kind of refrigerating box that the conductor refrigeration of composite wood casing is arranged is provided, good heat insulating, using electricity wisely, noiselessness, free-floride, profile can combine with furniture and other fields in the work,
The object of the present invention is achieved like this:
A kind of refrigerating box of conductor refrigeration of composite wood casing, its seal box shell are provided with the door of band handle;
The cross section of a. described case shell is a layer structure, forms by three layers at least, is followed successively by from outside to inside: 1. decorate protective layer; 2. wooden shell; 3. heat-insulation layer;
B. semiconductor refrigerating assembly is contained in the wall hole of case shell not gate one side, its hot junction outside case, cold junction in case, the hot junction, cold junction respectively is equipped with radiating subassembly.
Purpose of the present invention can also realize by following measure:
Described case shell inwall also has one deck inner bag formation four case shell of shape structure layer by layer.
The case shell of layered structure, its material of decorating protective layer can be metal, plastics; The material of its wooden shell can be log plate, wooden hard board; The material of its heat-insulation layer can be expanded material; The material of its inner bag is a kind of in plastics, the metal.
The radiating subassembly in described semiconductor refrigerating assembly hot junction can for inner loop nature water-cooled, outer loop Forced water cooling, round needle shape loose, heat conductor, infiltration die mould heat radiation conductor, the multi beam metal tube connects or the finned tube combination in any; The radiating subassembly of described semiconductor refrigerating assembly cold junction is a kind of in the rib.
The present invention has following actively useful effect:
The present invention adopts the composite wood cabinet shell, the inner refrigerating box that adopts semiconductor refrigerating assembly, the cool and heat ends and the semiconductor refrigerating assembly of conductor refrigeration, cooling system are installed, for whole box body provides high efficiency refrigeration, heat dispersion on the inside and outside rational position of wooden casing; Shell is the layer structure that contains wood materials, and crust is furnished with the decoration protective layer, and is rational in infrastructure, and technology is reliable, and cost is low, and is practical, can extensively combine with furniture and other fields.Aspect mechanism because wood materials be hot non-conductor, so can play good heat-insulating property, avoid the influence of external environment to refrigerating box as far as possible, save electricity as far as possible in the process of refrigerating box work like this, cut down the consumption of energy, and noiselessness, free-floride in the work, expanded the general attitude product of environment-friendly type.
Description of drawings
Fig. 1 is the structural representation of one embodiment of the invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the side view of Fig. 1, (wherein 1/2 is from interior look-out partial view);
The same Fig. 1 of Fig. 4 is another embodiment;
The same Fig. 1 of Fig. 5 is another embodiment;
The same Fig. 1 of Fig. 6 is another embodiment;
The same Fig. 1 of Fig. 7 is another embodiment;
Fig. 8 is the side view of Fig. 7;
The same Fig. 1 of Fig. 9 is another embodiment;
Figure 10 is the side view of Fig. 9.
The specific embodiment
Accompanying drawing number:
1. case shell 101. is decorated protective layer 102. wooden shells
103. 105. of heat-insulation layer 104. bladder layer
106. catch
2. semiconductor refrigerating assembly
3. hot junction 301. inner loop natures water-cooled
302. outer loop Forced water cooling 303. round needle shapes heat radiation conductor
304. infiltration die mould heat radiation conductor 305. permeable membranes 306. liquid
4. cold junction
401. rib shape radiator 402. round needle shape radiators
403. 404. hot pressing of large-area metal conductive plate propel the price of moulding heat radiation conductive plate
5. wire
Please refer to Fig. 1, Fig. 2, Fig. 3, the refrigerating box of the conductor refrigeration of composite wood casing of the present invention, its seal box shell 1 are provided with the door 105 of band handle 106,
The cross section of described case shell is a layer structure, forms by three layers at least, is followed successively by from outside to inside: decorate protective layer 101, wooden shell 102, heat-insulation layer 103;
Semiconductor refrigerating assembly 2 is contained in the wall hole of case shell 1 not gate one side, its hot junction 3 outside case, cold junction 4 in case, the hot junction, cold junction respectively is equipped with radiating subassembly.
Fig. 4, Fig. 5, embodiment illustrated in fig. 6 in, described case shell inwall also has one deck inner bag 104 to constitute by 101,102,103,104 totally four case shells 1 of shape structure layer by layer.
During enforcement, the case shell of layered structure, its material of decorating protective layer 101 can be metal, plastics; The material of its wooden shell 102 can be log plate, wooden hard board; The material of its heat-insulation layer 103 can be expanded material; The material of its inner bag 104 can be plastics, metal.
The radiating subassembly in described semiconductor refrigerating assembly 2 hot junctions 3 can see Fig. 4, outer loop Forced water cooling 302 for inner loop nature water-cooled 301 and see that Fig. 6, round needle shape heat radiation conductor 303 see that Fig. 5, infiltration die mould heat radiation conductor 304 see Fig. 7, Fig. 8, and the multi beam metal tube connects or the finned tube combination in any;
The radiating subassembly of described semiconductor refrigerating assembly 2 cold junctions 4 can be seen Fig. 4, round needle shape radiator 402 for finned radiator 401 and see that Fig. 6, large-area metal conductive plate 403 see that Fig. 5, Fig. 7, hot pressing propel the price of moulding heat radiation conductive plate 404 and sees among Fig. 9, Figure 10 any.
Also can be provided with wire 5 sees Figure 10 on radiating subassembly.
Operation principle of the present invention is:
The semiconductor refrigerating assembly cold junction provides cold for refrigerating box in the conductor refrigeration system, by the hot junction conducting tube and the external environment generation heat exchange in semiconductor refrigerating assembly hot junction, release heat.Wooden casing is installed conductor refrigeration, cooling system as box bracket, plays insulation effect simultaneously.
Implementation method of the present invention:
At first determine conductor refrigeration, cooling system, the hot pressing that cold junction can adopt the large-area metal plate or fill working medium propels the price of the metallic plate of moulding; The hot junction can adopt the multi beam metal tube to connect or the finned tube combination, and semiconductor refrigerating assembly is installed in box body wall.Choose high-quality timber then and make cabinet shell, the decoration that arbitrary form can be fitted in the outside plays effect attractive in appearance, generous, elegant.Afterwards conductor refrigeration, cooling system are installed on the casing rational position, promptly constitute full content of the present invention as Fig. 1.
This design feature is that conductor refrigeration, cooling system are installed in the box height middle part, can make whole refrigerating box realize high performance refrigeration heat radiation simultaneously, again can the better controlled box height, make it to combine well with furniture.
The present invention can have multiple combination, and it is as follows now to enumerate embodiment:
Embodiment 1: cold junction adopts 401 conduction of rib shape radiator; The hot junction adopts the refrigerating box of the composite wood casing of inner loop nature water-cooled 301 to see Fig. 4.
Embodiment 2: cold junction adopts 402 conduction of round needle shape radiator; The hot junction adopts the refrigerating box of the composite wood casing of outer loop Forced water cooling 302 to see Fig. 6.
Embodiment 3: cold junction adopts 403 conduction of large-area metal plate; The hot junction adopts the refrigerating box of the composite wood casing of round needle shape heat radiation conductor 303 to see Fig. 5.
Embodiment 4: cold junction adopts hot pressing to propel the price of moulding heat radiation conductive plate 404; The hot junction adopts the refrigerating box of the composite wood casing of infiltration die mould heat radiation conductor 304 to see Fig. 7.
During enforcement, the semiconductor of installing on the described case shell wall changes cold assembly 2 and can have only to see a Fig. 1, also can be provided with 2 groups and see Fig. 7.

Claims (5)

1. the refrigerating box of the conductor refrigeration of a composite wood casing, its seal case are provided with the door of band handle, it is characterized in that:
The cross section of a. described case shell is a layer structure, forms by three layers at least, is followed successively by from outside to inside: 1. decorate protective layer; 2. wooden shell; 3. heat-insulation layer;
B. semiconductor refrigerating assembly is contained in the wall hole of case shell not gate one side, its hot junction outside case, cold junction in case, the hot junction, cold junction respectively is equipped with radiating subassembly.
2. the refrigerating box of the conductor refrigeration of composite wood casing as claimed in claim 1 is characterized in that: described case shell inwall also has one deck inner bag to constitute the four case shells of shape structure layer by layer.
3. the refrigerating box of the conductor refrigeration of composite wood casing as claimed in claim 1 is characterized in that: the case shell of layered structure, and its material of decorating protective layer can be metal, plastics; The material of its wooden shell can be log plate, wooden hard board; The material of its heat-insulation layer can be expanded material.
4. the refrigerating box of the conductor refrigeration of composite wood casing as claimed in claim 2 is characterized in that: the material of described inner bag is a kind of in plastics, the metal.
5. the refrigerating box of the conductor refrigeration of composite wood casing as claimed in claim 1 is characterized in that: the radiating subassembly in described semiconductor refrigerating assembly hot junction can for inner loop nature water-cooled, outer loop Forced water cooling, round needle shape loose, heat conductor, infiltration die mould heat radiation conductor, the multi beam metal tube connects or the finned tube combination in a kind of; The radiating subassembly of described semiconductor refrigerating assembly cold junction is that finned radiator, round needle shape radiator, large-area metal conductive plate, hot pressing propel the price of a kind of in the moulding heat radiation conductive plate.
CN00100479A 2000-02-01 2000-02-01 Semiconductor refrigerator with composite wood casing Expired - Fee Related CN1131406C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN00100479A CN1131406C (en) 2000-02-01 2000-02-01 Semiconductor refrigerator with composite wood casing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN00100479A CN1131406C (en) 2000-02-01 2000-02-01 Semiconductor refrigerator with composite wood casing

Publications (2)

Publication Number Publication Date
CN1307215A CN1307215A (en) 2001-08-08
CN1131406C true CN1131406C (en) 2003-12-17

Family

ID=4575483

Family Applications (1)

Application Number Title Priority Date Filing Date
CN00100479A Expired - Fee Related CN1131406C (en) 2000-02-01 2000-02-01 Semiconductor refrigerator with composite wood casing

Country Status (1)

Country Link
CN (1) CN1131406C (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015006583A1 (en) * 2014-06-16 2015-12-17 Liebherr-Hausgeräte Lienz Gmbh Temperate container

Also Published As

Publication number Publication date
CN1307215A (en) 2001-08-08

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According to article 9 of the patent law and article 13 of the detailed rules for the implementation of the patent law: 100479.4 of the invention patents in this issue as a notice of authorization, and at the same time corresponding to the 201488.2 utility model patent to be given up, and in the 19 volume of the 51 issue of the new type of communique on the patent right to abandon the announcement.

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Owner name: LUQUAN JIWEI ELECTRICAL CO., LTD.

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Effective date: 20080509

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Owner name: HEBEI AOKELAI ELECTRONIC REFRIGERATOR CO., LTD.

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Address after: No. 1, Xiangyang South Avenue, Hebei, Luquan

Patentee after: Hebei Australia electronic refrigerator Co.,Ltd.

Address before: Jinshi Industrial Park, No. 368 Hebei province Shijiazhuang City Xinshi North Road, No. 2 building of Hebei energy investment limited liability company

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