CN113115569A - Display panel, display device and buffering heat radiation structure - Google Patents
Display panel, display device and buffering heat radiation structure Download PDFInfo
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- CN113115569A CN113115569A CN202110375271.5A CN202110375271A CN113115569A CN 113115569 A CN113115569 A CN 113115569A CN 202110375271 A CN202110375271 A CN 202110375271A CN 113115569 A CN113115569 A CN 113115569A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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Abstract
The application discloses display panel, display device and buffering heat radiation structure, display panel include display substrates and be located the buffering heat radiation structure on the display substrates, and buffering heat radiation structure comprises first heat-conducting piece, second heat-conducting piece, bolster and connecting piece, first heat-conducting piece and display substrates contact, and the second heat-conducting piece contacts with first heat-conducting piece and connecting piece respectively, and the second heat-conducting piece is the special-shaped structure. This application is through the special-shaped structure who utilizes the second heat-conducting piece, and first heat-conducting piece and connecting piece form accommodation space between the two at least one, and fill the bolster in this accommodation space, thereby utilize the second heat-conducting piece to provide the accommodation space and hold the mechanical force that the bolster produced in order to cushion the external world, dispel the heat with first heat-conducting piece from the absorptive heat of display substrates heating element along not equidirectional heat simultaneously, improved the radiating effect.
Description
Technical Field
The application relates to the technical field of display heat dissipation, in particular to a display panel, a display device and a buffering heat dissipation structure.
Background
Organic light-Emitting diodes (OLEDs) are widely used in display screens of various electronic products, and components included in the electronic products emit a large amount of heat during the working process, which may cause problems such as too fast degradation and uneven image display of the OLED display screen if not radiating heat in time.
Disclosure of Invention
The application provides a display panel, display device and buffering heat radiation structure to improve display device's radiating effect.
In a first aspect, an embodiment of the present application provides a display panel, including:
a display substrate; and
the buffer heat dissipation structure is positioned on the display substrate and positioned on one side of the display substrate, which is far away from the display surface, and comprises a first heat conduction piece, a second heat conduction piece and a buffer piece;
the first heat conducting piece is positioned on one side of the display substrate far away from the display surface;
the second heat conducting piece is positioned on one side of the first heat conducting piece far away from the display substrate, is in contact with the first heat conducting piece and is used for conducting heat on the display substrate to the second heat conducting piece by the first heat conducting piece;
the second heat conducting piece is of a special-shaped structure, and an accommodating space for filling the buffer piece is formed between the second heat conducting piece and the first heat conducting piece.
The buffer heat dissipation structure also comprises a connecting piece, wherein the connecting piece is positioned on one side of the second heat conduction piece, which is far away from the first heat conduction piece; an accommodating space for filling the buffer piece is formed between the second heat-conducting piece and the connecting piece.
In one possible embodiment of the first aspect, the second heat-conducting member includes a first heat-radiating portion in contact with the first heat-conducting member, second and third heat-radiating portions extending from both ends of the first heat-radiating portion toward the connecting member, respectively, and fourth and fifth heat-radiating portions extending in opposite directions from ends of the second and third heat-radiating portions away from the first heat-radiating portion, respectively;
a first accommodating space is formed between the first radiating part and the connecting piece, a second accommodating space is formed between the fourth radiating part and the first heat-conducting piece, a third accommodating space is formed between the fifth radiating part and the first heat-conducting piece, and buffering pieces are filled in the first accommodating space, the second accommodating space and the third accommodating space.
In one possible embodiment of the first aspect, the second heat-conducting member includes a first heat-radiating portion in contact with the connecting member, second and third heat-radiating portions extending from both ends of the first heat-radiating portion toward the first heat-conducting member, respectively, and fourth and fifth heat-radiating portions extending from ends of the second and third heat-radiating portions away from the first heat-radiating portion in opposite directions, respectively;
a first accommodating space is formed between the first heat radiating part and the first heat conducting element, a second accommodating space is formed between the fourth heat radiating part and the connecting element, a third accommodating space is formed between the fifth heat radiating part and the connecting element, and buffering elements are filled in the first accommodating space, the second accommodating space and the third accommodating space.
In a second aspect, an embodiment of the present application provides a display device, which includes a middle frame heat dissipation structure and the display panel of the first aspect;
the display substrate comprises a bending part and a component positioned at the bending part, the bending part is positioned between the buffer heat dissipation structure and the middle frame heat dissipation structure, and the bending part is contacted with one part of the connecting piece;
the middle frame heat dissipation structure is used for dissipating heat generated by the components.
In one possible embodiment of the second aspect, the middle frame heat dissipation structure includes a middle frame and a heat dissipation unit;
the middle frame forms a space for accommodating the display substrate and the buffering and radiating structure;
the heat dissipation unit is located on one side of the middle frame, which is close to the buffering heat dissipation structure, and corresponds to the position of the component.
In one possible embodiment of the second aspect, the heat dissipating unit includes a metal sheet and an insulating tape;
the metal sheet is wrapped by the insulating tape, and the insulating tape is used for absorbing heat radiated by the buffering heat dissipation structure through heat radiation and conducting the heat to the metal sheet for heat dissipation.
In one possible embodiment of the second aspect, the display device further comprises a cover plate and a back plate;
the cover plate is positioned on one side of the display surface of the display substrate;
the back plate is positioned on one side, away from the cover plate, of the middle frame heat dissipation structure, and the middle frame heat dissipation structure is in contact with the back plate to dissipate heat through the back plate.
In a third aspect, an embodiment of the present application provides a buffering and heat dissipating structure, including a first heat conducting element, a second heat conducting element, a buffer element, and a connecting element;
the second heat conducting part is positioned on one side of the first heat conducting part and is in contact with the first heat conducting part, and the second heat conducting part is used for conducting heat on the display substrate to the second heat conducting part through the first heat conducting part;
the second heat conducting piece is of a special-shaped structure, and an accommodating space for filling the buffer piece is formed between the second heat conducting piece and the first heat conducting piece;
the connecting piece is positioned on one side of the second heat-conducting piece far away from the first heat-conducting piece; an accommodating space for filling the buffer piece is formed between the second heat-conducting piece and the connecting piece.
In one possible embodiment of the third aspect, the second heat-conducting member includes a first heat-radiating portion in contact with the first heat-conducting member, a second heat-radiating portion and a third heat-radiating portion extending from both ends of the first heat-radiating portion toward the connecting member, respectively, and a fourth heat-radiating portion and a fifth heat-radiating portion extending in opposite directions from ends of the second heat-radiating portion and the third heat-radiating portion away from the first heat-radiating portion, respectively, wherein a first accommodating space is formed between the first heat-radiating portion and the connecting member, a second accommodating space is formed between the fourth heat-radiating portion and the first heat-conducting member, a third accommodating space is formed between the fifth heat-radiating portion and the first heat-conducting member, and the first accommodating space, the second accommodating space, and the third accommodating space are filled with a buffer.
In one possible embodiment of the third aspect, the second heat-conducting member includes a first heat-radiating portion in contact with the connecting member, a second heat-radiating portion and a third heat-radiating portion extending from both ends of the first heat-radiating portion toward the first heat-conducting member, respectively, and a fourth heat-radiating portion and a fifth heat-radiating portion extending in opposite directions from ends of the second heat-radiating portion and the third heat-radiating portion away from the first heat-radiating portion, respectively, wherein a first accommodating space is formed between the first heat-radiating portion and the first heat-conducting member, a second accommodating space is formed between the fourth heat-radiating portion and the connecting member, a third accommodating space is formed between the fifth heat-radiating portion and the connecting member, and the first accommodating space, the second accommodating space, and the third accommodating space are filled with the first heat-radiating portion.
Any one of the possible implementation manners of any one of the aspects is adopted, the second heat conducting piece with the special-shaped structure is used for manufacturing the buffering heat dissipation piece to dissipate heat for the display substrate, the accommodating space can be formed between the second heat conducting piece and at least one of the first heat conducting piece and the connecting piece through the special-shaped structure of the second heat conducting piece, the buffer piece is filled in the accommodating space, the accommodating space is provided by the second heat conducting piece to accommodate the buffer piece to buffer mechanical force generated by the outside, meanwhile, the first heat conducting piece dissipates heat absorbed by the heating element of the display substrate along different directions, and the heat dissipation effect is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the application and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure in a front view;
FIG. 3 is a schematic structural diagram of a second heat-conducting member in a front view according to an embodiment of the present application;
FIG. 4 is a schematic top view of a second thermally conductive member according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure in a front view;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure in a front view;
fig. 7 is a schematic structural diagram of a display device provided in an embodiment of the present application in a front view;
fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present disclosure in a side view;
fig. 9 is a schematic structural diagram of a display device in a top view according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present application in a side view;
fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present application in a front view;
fig. 12 is a schematic structural diagram of a display device in a side view according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The following detailed description of embodiments of the present application will be made with reference to the accompanying drawings.
The OLED technology is widely applied to display substrates of various electronic products, an OLED display screen can be generally matched with other components to realize a display function, the related components can generate heat in the operation process, and the problems of over-fast degradation, uneven image display and the like easily occur in the OLED display screen which operates under the environment.
In the related art, a conventional heat dissipation structure may have a buffer layer to counteract mechanical force generated from the outside, and the buffer layer generally has a poor heat conduction effect, and a part of heat may be blocked in a process of absorbing heat by a heat conductive member in the conventional heat dissipation structure and transmitting the heat to a heat dissipation layer through the buffer layer. Similarly, because of the poor heat conduction effect of the buffer layer, the heat transferred to the heat dissipation layer can only be dissipated from the heat dissipation layer and cannot be dissipated in the direction of the buffer layer, and then only one-way heat dissipation (namely from the heat conduction layer to the heat dissipation layer) can be realized.
In order to solve the technical problem in the foregoing background, fig. 1 provides a schematic structural diagram of a display panel 1 provided in an embodiment of the present application, where the display panel 1 may include: the display device comprises a display substrate 10 and a buffer heat dissipation structure 20 located on the display substrate 10, wherein the buffer heat dissipation structure 20 is located on a side of the display substrate 10 away from a display surface.
The buffering heat dissipation structure 20 includes a first heat conduction member 201, a second heat conduction member 202, a buffer member 203, and a connection member 204. The first heat conducting member 201 is located on a side of the display substrate 10 away from the display surface. The second heat conduction member 202 is located on a side of the first heat conduction member 201 away from the display substrate 10 and contacts the first heat conduction member 201. The connecting member 204 is located on a side of the second heat-conducting member 202 away from the first heat-conducting member 201.
The second heat conducting element 202 may be a special-shaped structure, so as to form an accommodating space with at least one of the first heat conducting element 201 and the connecting element 204, the buffer member 203 is filled in the accommodating space, the first heat conducting element 201 is used for conducting heat generated by the heating element on the display substrate 10 to the second heat conducting element 202, and heat dissipation in different directions is achieved through the second heat conducting element 202.
In one possible embodiment, one side of the first heat conducting member 201 of the buffering and heat dissipating structure 20 is in full contact with the display substrate 10, so that the contact surface with the display substrate 10 can be enlarged as much as possible in actual design, thereby more fully absorbing heat generated by the display substrate 10. Since a part of the second heat conduction member 202 can contact with the first heat conduction member 201 and also can contact with the connection member 204, the heat absorbed by the first heat conduction member 201 can be dissipated in multiple directions through the second heat conduction member 202.
Based on the above design, the whole buffering heat dissipation structure 20 can be utilized to dissipate heat through the arrangement of the second heat conduction member 202, and on this basis, the second heat conduction member 202 forms different accommodating spaces with the first heat conduction member 201 and the connection, and the buffering member 203 can be filled for buffering mechanical force generated from the outside. Therefore, compared with the scheme that only one-way heat dissipation can be realized by a traditional heat dissipation structure, the scheme that the buffer member 203 buffers external mechanical force can be ensured, the buffer member 203 can not influence the heat conduction efficiency, heat dissipation in different directions can be realized based on the second heat conduction member 202, the heat dissipation effect of the display substrate 10 is improved, and the service life of the display substrate 10 is prolonged.
In a possible implementation manner, in the present embodiment, the first heat conducting member 201 may be made of a metal material, the second heat conducting member 202 may be made of graphite, the buffer member 203 may be foam, and the connecting member 204 may be mesh glue. It should be understood that, in other possible embodiments, the material for manufacturing the first heat conduction member 201 and the second heat conduction member 202 is not particularly limited, for example, a metal material and graphite can be used as the heat conduction material, and the heat dissipation performance of the mesh adhesive can be further utilized to achieve more efficient heat dissipation by using the mesh adhesive as the connection member 204.
In one possible embodiment, referring to fig. 2, 3 and 4, the second heat-dissipating member 202 may include a first heat-dissipating portion 2021 contacting the first heat-dissipating member 201, a second heat-dissipating portion 2022 and a third heat-dissipating portion 2023 extending from both ends of the first heat-dissipating portion 2021 to the direction of the connecting member 204, and a fourth heat-dissipating portion 2024 and a fifth heat-dissipating portion 2025 extending from ends of the second heat-dissipating portion 2022 and the third heat-dissipating portion 2023 away from the first heat-dissipating portion 2021 in opposite directions.
A first receiving space 301 is formed between the first heat dissipating portion 2021 and the connecting member 204, a second receiving space 302 is formed between the fourth heat dissipating portion 2024 and the first heat conducting member 201, a third receiving space 303 is formed between the fifth heat dissipating portion 2025 and the first heat conducting member 201, and the first receiving space 301, the second receiving space 302, and the third receiving space 303 are filled with the buffer 203.
The second heat conductive member 202 may have a first profile structure including the first heat sink member 2021, the second heat sink member 2022, the third heat sink member 2023, the fourth heat sink member 2024, and the fifth heat sink member 2025. With such an arrangement, the second heat conduction member 202 can be in contact with the first heat conduction member and the connection member 204 more sufficiently, and the buffer member 203 can also damage the structure by mechanical force generated by movement and collision from the outside in the first accommodation space 301, the second accommodation space 302, and the third accommodation space 303. It should be understood that portions extending from the second heat conductive member 202 to both sides, such as both end portions of the fourth heat dissipation portion 2024 and the fifth heat dissipation portion 2025 away from the first heat dissipation portion 2021, can enable heat to be dissipated from the sides of the buffer heat dissipation structure 20.
In another possible embodiment, referring to fig. 5, the second heat-dissipating member 202 includes a first heat-dissipating portion 2021 in contact with the connecting member 204, a second heat-dissipating portion 2022 and a third heat-dissipating portion 2023 extending from both ends of the first heat-dissipating portion 2021 toward the first heat-dissipating member 201, and a fourth heat-dissipating portion 2024 and a fifth heat-dissipating portion 2025 extending from ends of the second heat-dissipating portion 2022 and the third heat-dissipating portion 2023 away from the first heat-dissipating portion 2021 in opposite directions.
A first receiving space 301 is formed between the first heat dissipation portion 2021 and the first heat conduction member 201, a second receiving space 302 is formed between the fourth heat dissipation portion 2024 and the connection member 204, a third receiving space 303 is formed between the fifth heat dissipation portion 2025 and the connection member 204, and the first receiving space 301, the second receiving space 302, and the third receiving space 303 are filled with the buffer 203.
In this embodiment, the second heat conductive member 202 having a modified structure formed of the first heat sink portion 2021, the second heat sink portion 2022, the third heat sink portion 2023, the fourth heat sink portion 2024, and the fifth heat sink portion 2025 may have a second modified structure. With this arrangement, the second heat conduction member 202 can be in contact with the first heat conduction member and the connection member 204 more sufficiently, and the buffer member 203 can play a role of buffering mechanical force generated from the outside in the first accommodation space 301, the second accommodation space 302, and the third accommodation space 303. The ends of the fourth heat sink portion 2024 and the fifth heat sink portion 2025 away from the first heat sink portion 2021 can also allow heat to dissipate from the sides of the buffer heat dissipation structure 20. It is understood that the second profile structure and the first profile structure may be mirror symmetric structures to each other.
It should be noted that, in another possible embodiment, the second heat conducting element 202 may also be designed by using a third irregular structure, for example, please refer to fig. 6, the third irregular structure may include a plurality of protrusions arranged in sequence and recesses corresponding to the protrusions, the recesses form an accommodating space for accommodating the buffer member 203, the third irregular structure may be a combination of the first irregular structure and the second irregular structure, and the operation principle of the third irregular structure is similar to that of the first irregular structure and the second irregular structure, and is not described herein again.
Referring to fig. 7, fig. 8 and fig. 9, the display device 2 may include a middle frame heat dissipation structure 40 and the display panel 1. The display substrate 10 includes a bending portion and a component 50 located at the bending portion, the bending portion is located between the buffer heat dissipation structure 20 and the middle frame heat dissipation structure 40, and the bending portion is in contact with a portion of the connection member 204. The middle frame heat dissipation structure 40 is configured to dissipate heat generated by the component 50.
In a practical application scenario, the components 50 in the display substrate 10 are not uniformly distributed in each area of the display substrate 10, but are relatively intensively distributed in a certain area or certain areas, so that the temperature of the portion of the display substrate 10 corresponding to the heat-generating component 50 is higher during use, and the degradation of the display substrate 10 is aggravated when the display substrate is used in an environment with non-uniform temperature for a long time. For example, the component 50 may be disposed on the display substrate 10 and include a bent portion, the bent portion of the display substrate 10 may be located between the buffer heat dissipation structure 20 and the middle frame heat dissipation structure 40, and the bent portion is in contact with a portion of the connection member 204, and the middle frame heat dissipation structure 40 is specifically used for dissipating heat generated by the component 50, in this embodiment, the component 50 may be an IC Chip (Integrated Circuit Chip, or microelectronic Chip for short), or other components 50 working in cooperation with the display substrate 10.
The inventor also finds that, in a research and development process, when the conventional heat dissipation structure dissipates heat to the display substrate 10, because the distribution of the components 50 on the display substrate 10 is uneven, the temperature corresponding to the components 50 is higher than the temperature of the area on the display substrate 10 (for example, the temperature is usually higher by 5 to 7 degrees celsius), by using the buffer heat dissipation structure 20 provided in the embodiment of the present application, due to the cooperation of the first heat conducting member 201 and the second heat conducting member 202, the temperature of the whole display substrate 10 can be made uniform, the temperature difference of each area of the display substrate 10 can be reduced (for example, reduced within 1 degree celsius), and on this basis, the problem of uneven temperature of each area in the display substrate 10 can be better improved by using the middle frame heat dissipation structure 40.
In one possible embodiment, the aforementioned position of the component 50 may be located between the buffer heat dissipation structure 20 and the middle frame heat dissipation structure 40, and the component 50 is integrated on the display substrate 10. For example, the display substrate 10 may include an optical adhesive layer, a polarizer, a panel body and a support film, wherein the polarizer is located on one side of the optical adhesive layer, the panel body is located on one side of the polarizer away from the optical adhesive layer, the support film is located on one side of the panel body away from the polarizer, the support film is in contact with the first heat conducting element 201, and each component 50 is integrated on the panel body to cooperate with the display function of the display substrate 10.
In order to more clearly describe the solution provided by the embodiment of the present application, please refer to fig. 10 in combination, the middle frame heat dissipation structure 40 includes a middle frame 401 and a heat dissipation unit 402.
The middle frame 401 forms a space to accommodate the display substrate 10 and the buffer heat-dissipating structure 20. The heat dissipation unit 402 is located on a side of the middle frame 401 close to the buffer heat dissipation structure 20, and corresponds to the location of the component 50.
In a possible embodiment, the position of the heat dissipation unit 402 included in the middle frame heat dissipation structure 40 is not fixed, and may be set at a corresponding position of the middle frame 401 according to the position of the component 50, and the middle frame 401, besides serving as a carrier of the heat dissipation unit 402, can also provide a space for accommodating the display substrate 10 and the buffer heat dissipation structure 20, so as to protect the display substrate 10 and the buffer heat dissipation structure 20.
In one possible embodiment, the heat dissipating unit 402 includes a metal sheet and an insulating tape. The metal sheet is wrapped by the insulating tape, and the insulating tape is used for absorbing heat radiated by the buffering heat dissipation structure 20 through heat radiation and conducting the heat to the metal sheet for heat dissipation.
In the embodiment of the present application, the heat dissipating unit 402 may be composed of a metal sheet and an insulating tape, and the metal sheet is wrapped in the insulating tape. In one possible embodiment, the insulating tape may be a black insulating tape, the black insulating tape can absorb the heat radiated from the buffering heat dissipation structure 20 by using a good heat radiation absorption effect of the black insulating tape, and the metal sheet can dissipate the heat absorbed by the black insulating tape. In other possible embodiments, the heat dissipation unit 402 may be formed by a graphite sheet and an insulating tape to achieve the same effect.
In one possible implementation manner, please refer to fig. 11 and 12 in combination, in the embodiment of the present application, the display device 2 further includes a cover plate 60 and a back plate 70, and the cover plate 60 is located on the display surface side of the display substrate 10. The back plate 70 is located on a side of the middle frame heat dissipation structure 40 away from the cover plate 60, and the middle frame heat dissipation structure 40 contacts the back plate 70 to dissipate heat through the back plate 70.
In a possible implementation manner, the display device 2 provided in this embodiment of the application may further include a cover plate 60 and a back plate 70, where the cover plate 60 is mainly used to protect the display surface of the display substrate 10, and the back plate 70 may be in contact with the middle frame heat dissipation structure 40 outside an external protection structure of the display device 2 formed by combining with the cover plate 60, so as to better dissipate heat absorbed by the middle frame heat dissipation structure 40, and further improve the heat dissipation effect.
In a possible embodiment, the display device 2 may be an electronic device with a display screen, such as a mobile phone, a tablet computer, and the like, without limitation.
Based on the same inventive concept, another embodiment of the present application further provides a buffering heat dissipation structure 20, which includes a first heat conduction member 201, a second heat conduction member 202, a buffering member 203, and a connection member 204. The second heat conduction member 202 is located at one side of the first heat conduction member 201 and is in contact with the first heat conduction member 201. The connecting member 204 is located on a side of the second heat-conducting member 202 away from the first heat-conducting member 201.
The second heat conducting member 202 is of a special-shaped structure, so as to form an accommodating space with at least one of the first heat conducting member 201 and the connecting member 204, the buffer member 203 is filled in the accommodating space, the first heat conducting member 201 is used for conducting heat generated by the heating element to the second heat conducting member 202, and heat dissipation in different directions is realized through the second heat conducting member 202.
In one possible embodiment, the second heat-conducting member 202 includes a first heat-dissipating portion 2021 in contact with the first heat-conducting member 201, a second heat-dissipating portion 2022 and a third heat-dissipating portion 2023 extending from both ends of the first heat-dissipating portion 2021 toward the connecting member 204, and a fourth heat-dissipating portion 2024 and a fifth heat-dissipating portion 2025 extending from ends of the second heat-dissipating portion 2022 and the third heat-dissipating portion 2023 away from the first heat-dissipating portion 2021 in opposite directions, wherein a first accommodating space 301 is formed between the first heat-dissipating portion 2021 and the connecting member 204, a second accommodating space 302 is formed between the fourth heat-dissipating portion 2024 and the first heat-conducting member 201, a third accommodating space 303 is formed between the fifth heat-dissipating portion 2025 and the first heat-conducting member 201, and the first accommodating space 301, the second accommodating space 302, and the third accommodating space 303 are filled with the buffer 203.
The above embodiment exemplarily provides the second heat conducting element 202 with the first special-shaped structure, such that the second heat conducting element 202 can be in sufficient contact with the first heat conducting element and the connecting element 204, and the buffer member 203 can also realize the damage of the structure caused by the mechanical force generated by the external motion and collision in the first accommodating space 301, the second accommodating space 302, and the third accommodating space 303. It should be understood that the portions of the second heat conduction member 202 extending to both sides, i.e., the ends of the fourth heat dissipation portion 2024 and the fifth heat dissipation portion 2025 away from the first heat dissipation portion 2021, can allow heat to be dissipated from the sides of the buffer heat dissipation structure 20.
In another possible embodiment, the second heat-conducting member 202 includes a first heat-dissipating portion 2021 in contact with the connecting member 204, a second heat-dissipating portion 2022 and a third heat-dissipating portion 2023 extending from both ends of the first heat-dissipating portion 2021 toward the first heat-conducting member 201, and a fourth heat-dissipating portion 2024 and a fifth heat-dissipating portion 2025 extending from ends of the second heat-dissipating portion 2022 and the third heat-dissipating portion 2023 away from the first heat-dissipating portion 2021 in opposite directions, wherein a first receiving space 301 is formed between the first heat-dissipating portion 2021 and the first heat-conducting member 201, a second receiving space 302 is formed between the fourth heat-dissipating portion 2024 and the connecting member 204, a third receiving space 303 is formed between the fifth heat-dissipating portion 2025 and the connecting member 204, and the first receiving space 301, the second receiving space 302, and the third receiving space 303 are filled with the buffer 203.
The above embodiment exemplarily provides another second heat conduction member 202 adopting a second special-shaped structure, and thus, the second heat conduction member 202 can be sufficiently contacted with the first heat conduction member and the connection member 204, and the buffer member 203 can play a role of buffering mechanical force generated from the outside in the first accommodation space 301, the second accommodation space 302, and the third accommodation space 303. The ends of the fourth heat sink portion 2024 and the fifth heat sink portion 2025 away from the first heat sink portion 2021 can also allow heat to dissipate from the sides of the buffer heat dissipation structure 20.
Based on the same inventive concept, the following describes a method for forming the heat buffering and dissipating structure 20 according to the above embodiments, for example, taking the heat buffering and dissipating structure 20 having the second heat conducting member 202 with the first special-shaped structure as an example, the method for forming the heat buffering and dissipating structure 20 according to the embodiments of the present application may include the following steps.
In step S201, a carrier film is provided, and the first heat conducting member 201 is disposed on the carrier film.
Step S202, the two cut buffer members 203 are respectively combined at corresponding positions of the first heat conducting member 201.
In step S203, the second heat-conducting member 202 is combined to the side of the first heat-conducting member 201 where the two buffering members 203 are disposed, so as to form the aforementioned first and second accommodating spaces 301 and 302 and the buffering members 203 in the first and second accommodating spaces 301 and 302.
In step S204, the buffer member 203 is combined to the middle portion of the second heat conduction member 202 away from the first heat conduction member 201.
In step S205, the connecting member 204 is combined to a side of the second heat-conducting member 202 away from the first heat-conducting member 201 to form a third accommodating space 303, so as to dispose the buffer member 203 in the third accommodating space 303.
And step S206, cutting according to a preset shape to obtain the buffering heat dissipation structure 20.
It will be appreciated that the compounding between the various parts involved in the above steps may be achieved using a die cutting process.
In summary, this application has adopted the second heat-conducting piece preparation buffering heat-dissipating piece of special-shaped structure to dispel the heat for the display substrate, can utilize the special-shaped structure of second heat-conducting piece to make the second heat-conducting piece on the basis with first heat-conducting piece and connecting piece simultaneous contact, still with in first heat-conducting piece and the connecting piece between at least one in have accommodation space in order to hold the bolster, can enough improve the radiating effect, also can utilize the mechanical force of the external production of bolster buffering.
The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical applications, to thereby enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to the particular use contemplated. The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical applications, to thereby enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. A display panel, comprising:
a display substrate; and
the buffer heat dissipation structure is positioned on the display substrate and positioned on one side of the display substrate, which is far away from the display surface, wherein the buffer heat dissipation structure comprises a first heat conduction piece, a second heat conduction piece and a buffer piece;
the first heat conducting piece is positioned on one side of the display substrate far away from the display surface;
the second heat conducting part is positioned on one side of the first heat conducting part, which is far away from the display substrate, and is in contact with the first heat conducting part, so that the first heat conducting part is used for conducting heat on the display substrate to the second heat conducting part;
the second heat conducting piece is of a special-shaped structure, and an accommodating space for filling the buffer piece is formed between the second heat conducting piece and the first heat conducting piece;
the buffer heat dissipation structure further comprises a connecting piece, and the connecting piece is positioned on one side of the second heat conduction piece, which is far away from the first heat conduction piece; and an accommodating space for filling the buffer part is formed between the second heat-conducting piece and the connecting piece.
2. The display panel according to claim 1, wherein the second heat-conductive member includes a first heat-dissipating portion in contact with the first heat-conductive member, second and third heat-dissipating portions extending from both ends of the first heat-dissipating portion toward the connector, respectively, and fourth and fifth heat-dissipating portions extending from ends of the second and third heat-dissipating portions away from the first heat-dissipating portion in opposite directions, respectively;
the first heat dissipation part and the connecting part form a first accommodating space therebetween, the fourth heat dissipation part and the first heat conducting part form a second accommodating space therebetween, the fifth heat dissipation part and the first heat conducting part form a third accommodating space therebetween, and the first accommodating space, the second accommodating space and the third accommodating space are filled with the buffer member.
3. The display panel according to claim 1, wherein the second heat-conductive member includes a first heat-dissipating portion in contact with the connection member, second and third heat-dissipating portions extending from both ends of the first heat-dissipating portion toward the first heat-conductive member, respectively, and fourth and fifth heat-dissipating portions extending from ends of the second and third heat-dissipating portions away from the first heat-dissipating portion in opposite directions, respectively;
the heat dissipation device comprises a first heat dissipation part, a second heat dissipation part, a connecting part, a buffer part and a connecting part, wherein a first containing space is formed between the first heat dissipation part and the first heat conduction part, a second containing space is formed between the fourth heat dissipation part and the connecting part, a third containing space is formed between the fifth heat dissipation part and the connecting part, and the buffer part is filled in the first containing space, the second containing space and the third containing space.
4. A display device, characterized in that the display device comprises a middle frame heat dissipation structure and the display panel of any one of claims 1 to 3;
the display substrate comprises a bending part and a component positioned at the bending part, the bending part is positioned between the buffer heat dissipation structure and the middle frame heat dissipation structure, and the bending part is in contact with a part of the connecting piece;
the middle frame heat dissipation structure is used for dissipating heat generated by the components.
5. The display device according to claim 4, wherein the middle frame heat dissipation structure includes a middle frame and a heat dissipation unit;
the middle frame forms a space for accommodating the display substrate and the buffer heat dissipation structure;
the heat dissipation unit is located on one side, close to the buffering heat dissipation structure, of the middle frame and corresponds to the position of the component.
6. The display device according to claim 5, wherein the heat dissipation unit includes a metal sheet and an insulating tape;
the metal sheet is wrapped by the insulating tape, and the insulating tape is used for absorbing heat radiated by the buffering heat dissipation structure through heat radiation and conducting the heat to the metal sheet for heat dissipation.
7. The display device according to any one of claims 4-6, further comprising a cover plate and a back plate;
the cover plate is positioned on one side of the display surface of the display substrate;
the back plate is positioned on one side, far away from the cover plate, of the middle frame heat dissipation structure, and the middle frame heat dissipation structure is in contact with the back plate so as to dissipate heat through the back plate.
8. A buffering heat dissipation structure is characterized by comprising a first heat conduction piece, a second heat conduction piece, a buffer piece and a connecting piece;
the second heat conducting part is positioned on one side of the first heat conducting part and is in contact with the first heat conducting part, and the second heat conducting part is used for conducting heat on the display substrate to the second heat conducting part through the first heat conducting part;
the second heat conducting piece is of a special-shaped structure, and an accommodating space for filling the buffer piece is formed between the second heat conducting piece and the first heat conducting piece;
the connecting piece is positioned on one side of the second heat-conducting piece away from the first heat-conducting piece; and an accommodating space for filling the buffer part is formed between the second heat-conducting piece and the connecting piece.
9. The structure of claim 8, wherein the second heat-transfer member includes a first heat-dissipation portion contacting the first heat-transfer member, second and third heat-dissipation portions extending from both ends of the first heat-dissipation portion toward the connection member, respectively, and fourth and fifth heat-dissipation portions extending from ends of the second and third heat-dissipation portions away from the first heat-dissipation portion in opposite directions, respectively, wherein a first receiving space is formed between the first heat dissipating part and the connecting member, and a second receiving space is formed between the fourth heat dissipating part and the first heat conductive member, and a third accommodating space is formed between the fifth heat radiating part and the first heat conducting element, and the first accommodating space, the second accommodating space and the third accommodating space are filled with the buffer parts.
10. The structure of claim 8, wherein the second heat-dissipating member includes a first heat-dissipating portion in contact with the connecting member, second and third heat-dissipating portions extending from both ends of the first heat-dissipating portion toward the first heat-dissipating member, respectively, and fourth and fifth heat-dissipating portions extending from ends of the second and third heat-dissipating portions away from the first heat-dissipating portion in opposite directions, respectively, wherein a first receiving space is formed between the first heat dissipation part and the first heat conduction member, and a second receiving space is formed between the fourth heat dissipation part and the connection member, and a third accommodating space is formed between the fifth heat radiating part and the connecting piece, and the first accommodating space, the second accommodating space and the third accommodating space are filled with the buffer piece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110375271.5A CN113115569B (en) | 2021-04-08 | 2021-04-08 | Display panel, display device and buffering heat radiation structure |
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| CN202110375271.5A CN113115569B (en) | 2021-04-08 | 2021-04-08 | Display panel, display device and buffering heat radiation structure |
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| WO2023035987A1 (en) * | 2021-09-10 | 2023-03-16 | 荣耀终端有限公司 | Electronic device |
| EP4177707A3 (en) * | 2021-11-04 | 2023-08-02 | Samsung Display Co., Ltd. | Display device |
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| US20200075882A1 (en) * | 2018-08-28 | 2020-03-05 | Boe Technology Group Co., Ltd. | Display substrate and method for preparing the same, and display device |
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| CN113115569B (en) | 2022-05-31 |
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