CN113009783B - Device capable of preparing multi-stage microstructure - Google Patents
Device capable of preparing multi-stage microstructure Download PDFInfo
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- CN113009783B CN113009783B CN202110249538.6A CN202110249538A CN113009783B CN 113009783 B CN113009783 B CN 113009783B CN 202110249538 A CN202110249538 A CN 202110249538A CN 113009783 B CN113009783 B CN 113009783B
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000006073 displacement reaction Methods 0.000 claims abstract description 32
- 230000008878 coupling Effects 0.000 claims description 54
- 238000010168 coupling process Methods 0.000 claims description 54
- 238000005859 coupling reaction Methods 0.000 claims description 54
- 238000004049 embossing Methods 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 8
- 239000002356 single layer Substances 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 28
- 229910052763 palladium Inorganic materials 0.000 description 21
- -1 benzyl palladium Chemical compound 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 5
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical compound SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 241001489698 Gerridae Species 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 230000003075 superhydrophobic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The invention relates to a device capable of preparing a multi-stage microstructure, and belongs to the field of nanoimprint. The first liftable platform is fixed on the left side plate of the frame, the second liftable platform is fixed on the right side plate of the frame, the first fine adjusting device is fixed on the first liftable platform through a screw, the second fine adjusting device is fixed on the second liftable platform through a screw, the left side of the fixing frame is connected with the first liftable platform through a screw, the right side of the fixing frame is connected with the second liftable platform through a screw, the imprinting device is in sliding contact with the fixing frame through a cylindrical buckle, the supporting table is fixed on the XY displacement platform through a screw, and the XY displacement platform is fixed on the bottom plate of the frame through a screw. The method has the advantages that the stacking precision is high, so that the microstructure on the smooth roll is in better linear contact with the planar substrate, and the stacking precision is improved; facilitate multi-layer stacking: the single-layer microstructure stamped on the smooth roll can be stacked on a planar substrate with different layers, so that the preparation of the multi-stage microstructure is not limited by the device.
Description
Technical Field
The invention relates to the field of nanoimprint, in particular to a device capable of preparing a multi-stage microstructure.
Background
It is well known that animals and plants can adapt and survive in a variety of environments due to their own unique properties. For example, water striders are able to crawl over the water because of the presence of micro-structured fluff on the foot; gecko can climb on the wall because of the presence of hair-like bristles at the foot plate; lotus leaves have a self-cleaning effect because of the multi-stage structure on the surface, and so on. The functions of various organisms are due to the multi-stage structures at different parts of the organisms. At present, the multilevel structure prepared based on bionics has practicability compared with a single-level structure, and can be widely applied to the aspects of optics, micro-nano fluid systems and the like.
Heretofore, the preparation methods of the multi-stage microstructure mainly comprise electrochemical etching, photoetching, capillary force transfer, laser assisted etching and the like, however, the methods require complex process parameters for control, processing equipment is expensive, and the large-scale manufacture and production of the multi-stage microstructure are limited. Compared with other nano-scale technologies, the nano-imprinting technology has small control requirement on technological parameters, the processing process is simple and convenient, meanwhile, the nano-imprinting technology also has good environmental effect, the nano-imprinting technology avoids the use of a large amount of developing solution in the traditional photoetching technology, and the environmental pollution is reduced.
Although multi-level microstructures have better characteristics than single-level microstructures, they suffer from the problems of high stacking difficulty, high cost, low alignment accuracy, and the like. In the utility model of a nano imprinting device capable of preparing a super-hydrophobic microstructure, disclosed by the publication No. CN 209879250U, a double-layer stacked structure can be manufactured at one time by utilizing roll-to-roll imprinting and adopting a method of combining chemistry and nano imprinting, the processing process is simple and convenient, and the preparation time is saved. However, the device has some defects, namely, small angle inclination exists in the vertical direction of the substrate in the stacking process and the angle deviation is caused when the microstructure is stacked due to errors caused by the rotation of the roll shaft deviating from the central axis, and the position of the roll of the device cannot be adjusted, so that the prepared multi-stage microstructure is only limited to two layers, cannot prepare the multi-stage microstructure, and has certain limitation.
Disclosure of Invention
The invention provides a device capable of preparing a multi-level microstructure, which solves the problem that the multi-level microstructure cannot be prepared at present.
The technical scheme includes that the device comprises a lifting platform I, a lifting platform II, a fine adjustment device I, a fine adjustment device II, a fixing frame, an embossing device, a supporting table, an XY displacement platform and a frame, wherein the lifting platform I is fixed on a left side plate of the frame through a screw, the lifting platform II is fixed on a right side plate of the frame through a screw, the fine adjustment device I is fixed on the lifting platform I through a screw, the fine adjustment device II is fixed on the lifting platform II through a screw, the left side of the fixing frame is connected with the lifting platform I through a screw, the right side of the fixing frame is connected with the lifting platform II through a screw, the embossing device is in sliding contact with the fixing frame through a cylindrical buckle, the supporting table is fixed on the XY displacement platform through a screw, and the XY displacement platform is fixed on a bottom plate of the frame through a screw.
The first lifting platform and the second lifting platform have the same structure, and the first lifting platform comprises a first stepping motor, a first coupling, a first ball screw, a first sliding table, a first guide rail and a first screw support seat, wherein the first stepping motor is fixed on the first screw support seat through screws, the first stepping motor is connected with the first coupling, the first ball screw is connected with the first coupling after passing through a through hole of the first screw support seat, the first sliding table is connected with the first ball screw through threads, and the first sliding table is in sliding connection with the first guide rail.
The first fine adjusting device and the second fine adjusting device are identical in structure, the first fine adjusting device comprises a first fixed frame, a first fixed block, a first straight beam type flexible hinge, a second straight beam type flexible hinge, a third straight beam type flexible hinge, a fourth straight beam type flexible hinge, a fifth straight beam type flexible hinge, a sixth straight beam type flexible hinge, a seventh straight beam type flexible hinge and a first piezoelectric ceramic, wherein the first fixed frame is fixed on a sliding table of a liftable platform through screws, the first straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, the second straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, the third straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, the fourth straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, the fifth straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, the sixth straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, the seventh straight beam type flexible hinge is fixedly connected between the first fixed frame and the first piezoelectric ceramic, the second straight beam type flexible hinge is fixedly connected between the first fixed frame and the first fixed block, and the first piezoelectric ceramic is fixedly connected between the first fixed frame and the first fixed frame.
The fixing frame comprises a fixing plate I, a fixing plate II, a stepping motor III and a coupling III, wherein the left side of the fixing plate I is fixed on a fixing block I on the micro-adjusting device I through a screw, the fixing plate II is connected with the fixing plate I through a screw, the stepping motor III is fixed on the fixing plate I through a screw, and one end of the coupling III is connected with the stepping motor III.
The embossing device comprises a rotating shaft, a fixing plate III, a cylindrical buckle I, a cylindrical buckle II, a fixing plate IV, a fixing plate V, a stepping motor IV, a coupling IV, a CCD camera, an embossing roller, a gluing device, a glue removing device, a gear I, a gear II, a light roller and a curing lamp, wherein the rotating shaft is fixed at the center of the fixing plate III, the cylindrical buckle I is fixedly connected with a groove on the right side of the fixing plate III, the cylindrical buckle II is fixedly connected with the groove on the right side of the fixing plate III, the fixing plate IV is vertically and fixedly connected with the fixing plate III, the fixing plate V is vertically and fixedly connected with the fixing plate III, the stepping motor IV is fixedly arranged on the fixing plate V through screws, one end of the coupling IV is connected with the stepping motor IV, the other end of the coupling is connected with the embossing roller, the CCD camera is fixedly arranged in the groove on the fixing plate III, the left end of the embossing roller passes through a through hole on the fixing plate V and is connected with the gear I, the right end of the fixing plate IV passes through a through hole on the fixing plate IV and is fixedly connected with the coupling IV, the left end of the fixing roller is fixedly arranged on the fixing plate V, the fixing plate V is fixedly connected with the light roller V, and fixedly arranged on the fixing roller V is fixedly and fixedly connected with the fixing roller V.
The supporting table comprises a heat treatment device, a planar substrate, a first cutting knife and a second cutting knife, wherein the heat treatment device is fixed under the groove of the supporting table, the planar substrate is placed in the groove of the supporting table, the first cutting knife is placed in the groove on the left side of the planar substrate, and the second cutting knife is placed in the groove in front of the planar substrate.
The XY displacement platform comprises a stepping motor five, a stepping motor six, a shaft coupling five, a shaft coupling six, a ball screw three, a ball screw four, a sliding table three, a sliding table four, a guide rail three, a guide rail four, a screw support seat three and a screw support seat four, wherein the stepping motor five is fixed on the screw support seat three through screws, the stepping motor five is connected with the shaft coupling five, the ball screw three passes through a through hole of the screw support seat three and then is connected with the shaft coupling five, the sliding table three is connected with the ball screw three through screws, the sliding table three is connected with the guide rail three in a sliding manner, the guide rail three is fixed on the sliding table four through screws, the stepping motor six is connected with the shaft coupling six through screws and then is connected with the shaft coupling six, the sliding table four is connected with the ball screw four through screws, and the guide rail four is fixed on a bottom plate of the frame through screws.
The frame include bottom plate, left side board, right side board, floor first, floor second and back beam, wherein the bottom plate level is placed subaerial, one side of left side board links firmly with the bottom plate, the opposite side links firmly with the back beam, one side of right side board links firmly with the bottom plate, the opposite side links firmly with the back beam, floor first links firmly on the left side board, floor second links firmly on the right side board.
The invention has the following advantages:
1. stacking accuracy is high: after the smooth roller is aligned with the planar substrate on the supporting table through X, Y displacement of the displacement platform, the stacking angle is adjusted through adjusting the fine adjusting device, so that the microstructure on the smooth roller is in better linear contact with the planar substrate, and the stacking precision is improved;
2. Facilitate multi-layer stacking: the height position of the light roller is changed by lifting or descending the two liftable platforms, so that the single-layer microstructure stamped on the light roller can be stacked on the plane substrate in different layers, the preparation of the multi-stage microstructure is not limited by the device, and the preparation is more flexible.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top view of the first liftable platform of the present utility model;
FIG. 3 is a schematic view of a micro-adjusting device according to the present utility model;
FIG. 4 is a schematic view of the structure of the fixing frame of the present utility model;
FIG. 5 is a schematic view of the structure of the imprinting apparatus of the present utility model;
FIG. 6 is a partial cross-sectional view of an imprinting apparatus of the present utility model;
FIG. 7 is a schematic view of the structure of the support frame of the present utility model;
FIG. 8 is a partial cross-sectional view of an XY displacement stage of the present utility model;
fig. 9 is a schematic view of the structure of the frame of the present utility model.
Detailed Description
As shown in fig. 1, the device comprises a liftable platform 1, a liftable platform 2, a fine adjustment device 3, a fine adjustment device 4, a fixing frame 5, an embossing device 6, a supporting platform 7, X, Y, a displacement platform 8 and a frame 9, wherein the liftable platform 1 is fixed on a left side plate 902 of the frame 9 through screws, the liftable platform 2 is fixed on a right side plate 903 of the frame 9 through screws, the fine adjustment device 3 is fixed on the liftable platform 1 through screws, the fine adjustment device 4 is fixed on the liftable platform 2 through screws, the left side of the fixing frame 5 is connected with the liftable platform 1 through screws, the right side of the fixing frame 5 is connected with the liftable platform 2 through screws, the embossing device 6 is in sliding contact with the fixing frame 5 through a cylindrical buckle, the supporting platform 7 is fixed on the X, Y displacement platform 8 through screws, the X, Y displacement platform 8 is fixed on a bottom plate 901 of the frame 9 through screws, and the frame 9 is horizontally placed on the ground.
As shown in fig. 2, the liftable platform 1 has the same structure as the liftable platform 2, and the liftable platform 1 comprises a first stepping motor 101, a first coupling 102, a first ball screw 103, a first sliding table 104, a first guide rail 105 and a first screw support seat 106, wherein the first stepping motor 101 is fixed on the first screw support seat 106 through screws, the first stepping motor 101 is connected with the first coupling 102, the first ball screw 103 passes through a through hole of the first screw support seat 106 and then is connected with the first coupling 102, the first sliding table 104 is connected with the first ball screw 103 through threads, and the first sliding table 104 is in sliding connection with the first guide rail 105.
As shown in fig. 3, the fine adjustment device one 3 and the fine adjustment device two 4 have the same structure, and the fine adjustment device one 3 comprises a first fixed frame 301, a first fixed block 302, a second straight beam type flexible hinge 303, a second straight beam type flexible hinge 304, a third straight beam type flexible hinge 305, a fourth straight beam type flexible hinge 306, a fifth straight beam type flexible hinge 307, a sixth straight beam type flexible hinge 308, a seventh straight beam type flexible hinge 309, an eighth straight beam type flexible hinge 310 and a first piezoelectric ceramic 311, wherein the first fixed frame 301 is fixed on the first sliding table 104 of the liftable platform one 1 through screws, the first straight beam type flexible hinge 303 is fixedly connected between the first fixed frame 301 and the first fixed block 302 at the common position, the second straight beam type flexible hinge 304 is fixedly connected between the first fixed frame 301 and the first fixed block 302, the third straight beam type flexible hinge 305 is fixedly connected between the first fixed frame 301 and the first fixed block 302, the fourth straight beam type flexible hinge 306 is fixedly connected between the first fixed frame 301 and the first fixed block 302, the fifth straight beam type flexible hinge 307 is fixedly connected between the first fixed frame 301 and the second straight beam type flexible hinge 302 and the first fixed block 302, the first flexible hinge is fixedly connected between the first straight beam type flexible hinge 302 and the second flexible hinge 302 is fixedly connected between the first fixed frame 302 and the fixed between the first fixed frame 302 and the first flexible hinge 302 and the fixed frame and the fixed between the first flexible hinge 302.
As shown in fig. 4, the fixing frame 5 includes a first fixing plate 501, a second fixing plate 502, a third stepper motor 503 and a third coupling 504, where the left side of the first fixing plate 501 is fixed on the first fixing block 302 on the first micro-adjusting device 3 by a screw, the second fixing plate 502 is connected with the first fixing plate 501 by a screw, the third stepper motor 503 is fixed on the first fixing plate 501 by a screw, and one end of the third coupling 504 is connected with the third stepper motor 503.
As shown in fig. 5 and 6, the embossing device 6 includes a rotating shaft 601, a third fixing plate 602, a first cylindrical buckle 60201, a second cylindrical buckle 60202, a fourth fixing plate 603, a fifth fixing plate 604, a sixth fixing plate 605, a seventh fixing plate 606, a fourth stepper motor 607, a fourth coupling 608, a CCD camera 609, an embossing roller 610, a glue coating device 611, a glue removing device 612, a first gear 613, a second gear 614, a light roller 615 and a curing lamp 61501, wherein the rotating shaft 601 is fixed at the center of the third fixing plate 602, the rotating shaft 601 is connected with a third coupling 504 of the fixing frame 5, the first cylindrical buckle 60201 is fixedly connected to a groove on the right side of the third fixing plate 602, the second cylindrical buckle 60202 is fixedly connected to a groove on the right side of the third fixing plate 602, the fourth fixing plate 603 is vertically fixedly connected to the fourth fixing plate 602, the fifth fixing plate 604 is vertically fixedly connected to the third fixing plate 602, the seventh fixing plate 606 is vertically fixedly connected to the third fixing plate 602, the fourth stepper motor 607 is fixedly connected to the third fixing plate 602, one end of the fourth coupling 607 is fixedly connected to the fourth coupling 607 to the fourth fixing plate 604, one end of the fourth stepper motor 608 is fixedly connected to the fourth gear 605, the fourth gear 605 is fixedly connected to the fourth gear 605, the first gear 605 is fixedly connected to the fourth gear 605 and the first gear 605 is fixedly to the fourth coupling 605, the first end of the fourth coupling is fixedly 614 is fixedly connected to the fourth coupling roll 614 is fixedly arranged in the first coupling end of the fifth coupling 605 is fixedly through the left end of the first coupling 605 and has a groove 605 is, and is fixedly connected to the first coupling is fixedly to the first coupling is 610 and has a second coupling is fixedly connected to the first coupling is.
As shown in fig. 7, the support table 7 includes a heat treatment device 701, a planar substrate 702, a first cutting blade 703 and a second cutting blade 704, wherein the heat treatment device 701 is fixed under a groove of the support table, the planar substrate 702 is placed in the groove of the support table, the first cutting blade 703 is placed in a groove on the left side of the planar substrate 702, and the second cutting blade 704 is placed in a groove in front of the planar substrate 702.
As shown in fig. 8, the X, Y displacement platform 8 includes a stepper motor five 801, a stepper motor six 802, a coupling five 803, a coupling six 804, a ball screw three 805, a ball screw four 806, a slipway three 807, a slipway four 808, a guide rail three 809, a guide rail four 810, a screw support three 811 and a screw support four 812, wherein the stepper motor five 801 is fixed on the screw support three 811 by screws, the stepper motor five 801 is connected with the coupling five 803, the ball screw three 805 passes through the through hole of the screw support three 811 and then is connected with the coupling five 803, the slipway three 807 is connected with the ball screw three 805 by screws, the slipway three 807 is in sliding connection with the guide rail three 809, the guide rail three 809 is fixed on the slipway four 808 by screws, the stepper motor six 802 is fixed on the screw support four 812 by screws, the stepper motor six 802 is connected with the coupling six 804 by screws, the ball screw four 806 passes through the through hole of the screw support four 812 and then is connected with the slipway six 804, the four 808 is in sliding connection with the guide rail four 810, and the guide rail four 808 is in sliding connection with the guide rail four 810 by screws, and the guide rail four is fixed on the chassis 810 by the chassis 9.
As shown in fig. 9, the rack includes a bottom plate 901, a left side plate 902, a right side plate 903, a first rib plate 904, a second rib plate 905 and a rear beam 906, wherein the bottom plate 901 is horizontally placed on the ground, one side of the left side plate 902 is fixedly connected with the bottom plate 901, the other side is fixedly connected with the rear beam 906, one side of the right side plate 903 is fixedly connected with the bottom plate 901, the other side is fixedly connected with the rear beam 906, the first rib plate 904 is fixedly connected with the left side plate 902, and the second rib plate 905 is fixedly connected with the right side plate 903.
Working principle:
Single layer microstructure stacking: the X, Y displacement platform 8 is controlled to displace so that the axis of the light roller 615 on the embossing device 6 and the rear edge of the plane substrate 702 on the supporting platform 7 are parallel in the same vertical plane, the lengths of the two lines are equal, then the gluing device 611 is started, then the stepping motor four 607 is started to drive the embossing roller 610 to rotate, the gear one 613 at the left end on the embossing roller 610 is meshed with the gear two 614 to drive the light roller 615 to rotate, benzyl palladium mercaptide starts to be evenly coated on the light roller 615, the microstructure on the embossing roller 610 is also embossed on the benzyl palladium mercaptide on the light roller 615, the curing lamp 61501 is started to cure the benzyl palladium mercaptide, the lifting platform one 1 and the lifting platform two 2 are simultaneously lowered so that the microstructure on the light roller 615 is contacted with the plane substrate 702 on the supporting platform 7, at the moment, the light roller 615 just starts to rotate 180 DEG from the contact position of the light roller 615 and the embossing roller 610, starting the micro-adjusting device I3 and the micro-adjusting device II 4 to enable the micro-structure on the light roller 615 to be in contact with the plane substrate 702 on the supporting table 7 more tightly, controlling the X, Y displacement platform 8 to feed backwards, stacking the micro-structure on the light roller 615 onto the plane substrate 702 on the supporting table 7, when the micro-structure is fed to the opposite side of the rear surface of the plane substrate 702, stacking to obtain a single-layer micro-structure, continuing to feed the X, Y displacement platform 8 to enable the cutting knife I703 to be in contact with the light roller 615 so as to cut off benzyl palladium mercaptide, then closing the micro-adjusting device I3 and the micro-adjusting device II 4, closing the gluing device 611, closing the stepping motor IV 607, closing the curing lamp 61501, starting the heat treatment device 701 on the supporting table 7 to perform heat treatment on the plane substrate 702 on the supporting table 7, enabling benzyl palladium mercaptide to be converted into metal palladium, controlling the lifting platform I1 and the lifting platform II 2 to lift, the smooth roll 615 on the embossing device 6 is lifted, the glue removing device 612 is started to remove residual benzyl palladium mercaptide on the smooth roll 615, and the glue removing device 612 is closed after the removal.
Double layer microstructure stacking: the displacement of the displacement platform 8 is controlled X, Y to enable the axis of the light roller 615 on the embossing device 6 and the connecting line of the middle point of the left side edge and the right side edge of the plane substrate 702 on the supporting platform 7 to be parallel in the same vertical plane, the lengths of the two lines are equal, the three stepping motors 503 are controlled to enable the embossing device 6 to rotate 90 degrees clockwise, the displacement of the displacement platform 8 is controlled X, Y to enable the axis of the light roller 615 on the embossing device 6 and the right side edge of the plane substrate 702 on the supporting platform 7 to be parallel in the same vertical plane, the lengths of the two lines are equal, then the gluing device 611 is started, then the four stepping motors 607 are started to drive the embossing roller 610 to rotate, the first gear 613 at the left end on the embossing roller 610 is meshed with the second gear 614 to drive the light roller 615 to rotate, benzyl mercaptan palladium on the light roller 615 is evenly coated, the microstructure on the embossing roller 610 is embossed on benzyl mercaptan palladium on the light roller 615, the curing lamp 61501 is turned on to cure the benzyl palladium mercaptide, the liftable platform I and the liftable platform II 2 are simultaneously lowered, at the moment, the smooth roller 615 just starts to rotate 180 degrees from the tangential position of the smooth roller 615 and the embossing roller 610, then the microstructure on the smooth roller 615 is contacted with the single-layer microstructure on the plane substrate 702 on the supporting platform 7, the micro-adjusting device I3 and the micro-adjusting device II 4 are started, the microstructure on the smooth roller 615 is contacted with the single-layer microstructure on the plane substrate 702 on the supporting platform 7 more tightly, the X, Y displacement platform 8 is controlled to feed rightwards, the microstructure on the smooth roller 615 is stacked on the microstructure on the plane substrate 702 on the supporting platform 7, when the microstructure fed to the opposite side of the left side of the plane substrate 702 is completed, a double-layer microstructure is obtained, the X, Y displacement platform 8 is continuously fed to enable the cutting knife II 704 to contact with the smooth roller 615, cutting off the benzyl palladium mercaptide, then closing the micro-adjusting device I3 and the micro-adjusting device II 4, closing the gluing device 611, closing the stepping motor IV 607, closing the curing lamp 61501, starting the heat treatment device 701 on the supporting table 7 to perform high-temperature heat treatment on the planar substrate 702 on the supporting table 7, converting the benzyl palladium mercaptide into metal palladium, controlling the lifting platform I1 and the lifting platform II 2 to lift, lifting the light roller 615 on the imprinting device 6, starting the glue removing device 612 to remove residual benzyl palladium mercaptide on the light roller 615, and closing the glue removing device 612 after the removal is finished.
Three-layer microstructure stack: the displacement of the displacement platform 8 of X, Y is controlled to enable the axis of the light roller 615 on the embossing device 6 and the connecting line of the middle point of the front side and the rear side of the plane substrate 702 on the supporting platform 7 to be parallel in the same vertical plane, the lengths of the two lines are equal, the three stepping motors 503 are controlled to enable the embossing device 7 to rotate 90 degrees clockwise, the displacement of the displacement platform 8 of X, Y is controlled to enable the axis of the light roller 615 on the embossing device 6 and the rear side of the plane substrate 702 on the supporting platform 7 to be parallel in the same vertical plane, the lengths of the two lines are equal, then the gluing device 611 is started, then the four stepping motors 607 are started to drive the embossing roller 610 to rotate, the first gear 613 at the left end on the embossing roller 610 is meshed with the second gear 614 to drive the light roller 615 to uniformly coat benzyl mercaptan palladium on the light roller 615, the microstructure on the embossing roller 610 is also embossed on benzyl mercaptan palladium on the light roller 615, the curing lamp 61501 is turned on to cure the benzyl palladium mercaptide, the liftable platform I and the liftable platform II 2 are simultaneously lowered, at the moment, the smooth roller 615 just starts to rotate 180 DEG from the tangential position of the smooth roller 615 and the embossing roller 610, then the microstructure on the smooth roller 615 is contacted with the double-layer microstructure on the plane substrate 702 on the supporting table 7, the micro-adjusting device I3 and the micro-adjusting device II 4 are started, the microstructure on the smooth roller 615 is contacted with the double-layer microstructure on the plane substrate 702 on the supporting table 7 more tightly, the X, Y displacement platform 8 is controlled to feed backwards, the microstructure on the smooth roller 615 is stacked on the microstructure on the plane substrate 702 on the supporting table 7, when the microstructure is fed to the opposite side of the rear side of the plane substrate 702, the stacking is completed, a three-layer microstructure is obtained, the X, Y displacement platform 8 is continuously fed to enable the cutting knife I703 to be contacted with the smooth roller 615, cutting off the benzyl palladium mercaptide, then closing the micro-adjusting device I3 and the micro-adjusting device II 4, closing the gluing device 611, closing the stepping motor IV 607, closing the curing lamp 61501, starting the heat treatment device 701 on the supporting table 7 to perform high-temperature heat treatment on the planar substrate 702 on the supporting table 7, converting the benzyl palladium mercaptide into metal palladium, controlling the lifting platform I1 and the lifting platform II 2 to lift, lifting the light roller 615 on the imprinting device 6, starting the glue removing device 612 to remove residual benzyl palladium mercaptide on the light roller 615, and closing the glue removing device 612 after the removal is finished.
Preparing a multi-stage microstructure: the desired multi-level microstructure can be obtained by repeating the above-described process.
Claims (6)
1. An apparatus for preparing a multi-level microstructure, comprising: the device comprises a liftable platform I, a liftable platform II, a fine adjustment device I, a fine adjustment device II, a fixing frame, an embossing device, a supporting platform, an XY displacement platform and a frame, wherein the liftable platform I is fixed on a left side plate of the frame through a screw, the liftable platform II is fixed on a right side plate of the frame through a screw, the fine adjustment device I is fixed on the liftable platform I through a screw, the fine adjustment device II is fixed on the liftable platform II through a screw, the left side of the fixing frame is connected with the liftable platform I through a screw, the right side of the fixing frame is connected with the liftable platform II through a screw, the embossing device is in sliding contact with the fixing frame through a cylindrical buckle, the supporting platform is fixed on the XY displacement platform through a screw, and the XY displacement platform is fixed on a bottom plate of the frame through a screw;
The supporting table comprises a heat treatment device, a planar substrate, a first cutting knife and a second cutting knife, wherein the heat treatment device is fixed under the groove of the supporting table, the planar substrate is placed in the groove of the supporting table, the first cutting knife is placed in the groove on the left side of the planar substrate, and the second cutting knife is placed in the groove in front of the planar substrate;
The embossing device comprises a rotating shaft, a fixing plate III, a cylindrical buckle I, a cylindrical buckle II, a fixing plate IV, a fixing plate V, a stepping motor IV, a coupling IV, a CCD camera, an embossing roller, a gluing device, a glue removing device, a gear I, a gear II, a light roller and a curing lamp, wherein the rotating shaft is fixed at the center of the fixing plate III, the cylindrical buckle I is fixedly connected with a groove on the right side of the fixing plate III, the cylindrical buckle II is fixedly connected with the groove on the right side of the fixing plate III, the fixing plate IV is vertically and fixedly connected with the fixing plate III, the fixing plate V is vertically and fixedly connected with the fixing plate III, the stepping motor IV is fixedly arranged on the fixing plate V through screws, one end of the coupling IV is connected with the stepping motor IV, the other end of the coupling is connected with the embossing roller, the CCD camera is fixedly arranged in the groove on the fixing plate III, the left end of the embossing roller passes through a through hole on the fixing plate V and is connected with the gear I, the right end of the fixing plate IV passes through a through hole on the fixing plate IV and is fixedly connected with the coupling IV, the left end of the fixing roller is fixedly arranged on the fixing plate V, the fixing plate V is fixedly connected with the light roller V, and fixedly arranged on the fixing roller V is fixedly and fixedly connected with the fixing roller V.
2. An apparatus for producing a multi-level microstructure according to claim 1, wherein: the first lifting platform and the second lifting platform have the same structure, and the first lifting platform comprises a first stepping motor, a first coupling, a first ball screw, a first sliding table, a first guide rail and a first screw support seat, wherein the first stepping motor is fixed on the first screw support seat through screws, the first stepping motor is connected with the first coupling, the first ball screw is connected with the first coupling after passing through a through hole of the first screw support seat, the first sliding table is connected with the first ball screw through threads, and the first sliding table is in sliding connection with the first guide rail.
3. An apparatus for producing a multi-level microstructure according to claim 1, wherein: the first fine adjusting device and the second fine adjusting device have the same structure, the first fine adjusting device comprises a first fixed frame, a first fixed block, a first straight beam type flexible hinge, a second straight beam type flexible hinge, a third straight beam type flexible hinge, a fourth straight beam type flexible hinge, a fifth straight beam type flexible hinge, a sixth straight beam type flexible hinge, a seventh straight beam type flexible hinge, an eighth straight beam type flexible hinge and a first piezoelectric ceramic, wherein the first fixed frame is fixed on a first sliding table of the liftable platform through screws, and the first straight beam type flexible hinge is fixedly connected
The piezoelectric ceramic composite panel is characterized in that a straight beam type flexible hinge II is fixedly connected between a fixed frame I and a fixed block I, a straight beam type flexible hinge III is fixedly connected between the fixed frame I and the fixed block I, a straight beam type flexible hinge IV is fixedly connected between the fixed frame I and the fixed block I, a straight beam type flexible hinge V is fixedly connected between the fixed frame I and the fixed block I, a straight beam type flexible hinge VI is fixedly connected between the fixed frame I and the fixed block I, a straight beam type flexible hinge seven is fixedly connected between the fixed frame I and the fixed block I, a straight beam type flexible hinge eight is fixedly connected between the fixed frame I and the fixed block I, and piezoelectric ceramic is fixed in a groove on the fixed frame I.
4. An apparatus for producing a multi-level microstructure according to claim 1, wherein: the fixing frame comprises a fixing plate I, a fixing plate II, a stepping motor III and a coupling III, wherein the left side of the fixing plate I is fixed on a fixing block I on the micro-adjusting device I through a screw, the fixing plate II is connected with the fixing plate I through a screw, the stepping motor III is fixed on the fixing plate I through a screw, and one end of the coupling III is connected with the stepping motor III.
5. An apparatus for producing a multi-level microstructure according to claim 1, wherein: the XY displacement platform comprises a stepping motor five, a stepping motor six, a shaft coupling five, a shaft coupling six, a ball screw three, a ball screw four, a sliding table three, a sliding table four, a guide rail three, a guide rail four, a screw support seat three and a screw support seat four, wherein the stepping motor five is fixed on the screw support seat three through screws, the stepping motor five is connected with the shaft coupling five, the ball screw three passes through a through hole of the screw support seat three and then is connected with the shaft coupling five, the sliding table three is connected with the ball screw three through screws, the sliding table three is connected with the guide rail three in a sliding manner, the guide rail three is fixed on the sliding table four through screws, the stepping motor six is connected with the shaft coupling six through screws and then is connected with the shaft coupling six, the sliding table four is connected with the ball screw four through screws, and the guide rail four is fixed on a bottom plate of the frame through screws.
6. An apparatus for producing a multi-level microstructure according to claim 1, wherein: the frame include bottom plate, left side board, right side board, floor first, floor second and back beam, wherein the bottom plate level is placed subaerial, one side of left side board links firmly with the bottom plate, the opposite side links firmly with the back beam, one side of right side board links firmly with the bottom plate, the opposite side links firmly with the back beam, floor first links firmly on the left side board, floor second links firmly on the right side board.
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112213916A (en) * | 2019-07-10 | 2021-01-12 | 长春工业大学 | Vibration-assisted nano rolling device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1526411A1 (en) * | 2003-10-24 | 2005-04-27 | Obducat AB | Apparatus and method for aligning surface |
| JP2005153091A (en) * | 2003-11-27 | 2005-06-16 | Hitachi Ltd | Transfer method and transfer device |
| CN1800975B (en) * | 2005-11-28 | 2011-11-30 | 中国科学院光电技术研究所 | Step-by-step and repeated illumination nano-imprinting device |
| CN100340417C (en) * | 2005-12-02 | 2007-10-03 | 华中科技大学 | Nano marking press |
| US8043085B2 (en) * | 2008-08-19 | 2011-10-25 | Asml Netherlands B.V. | Imprint lithography |
| CN203658727U (en) * | 2013-12-16 | 2014-06-18 | 史晓华 | Novel nanoimprinting equipment with rapid alignment function |
| CN104608370A (en) * | 2015-02-09 | 2015-05-13 | 上海交通大学 | Roll-to-roll based UV cured polymer film surface microstructure processing system and method |
| JP6671010B2 (en) * | 2016-02-16 | 2020-03-25 | パナソニックＩｐマネジメント株式会社 | Imprint method and imprint apparatus |
| CN106444275A (en) * | 2016-09-08 | 2017-02-22 | 深圳先进技术研究院 | Roll-to-roll ultraviolet nano-imprinting device and method for preparing super-hydrophobic surface micro-structure by using roll-to-roll ultraviolet nano-imprinting device |
| CN206601564U (en) * | 2016-11-09 | 2017-10-31 | 长春工业大学 | A kind of roll-to-roll ultraviolet nanometer imprinting apparatus |
| CN107367901B (en) * | 2017-09-17 | 2023-04-07 | 长春工业大学 | Roller-to-plane ultraviolet nanoimprint lithography device and method based on lifting platform |
| CN207337069U (en) * | 2017-11-08 | 2018-05-08 | 长春工业大学 | A kind of roll shape ultraviolet nanometer imprinting apparatus of precise alignment |
| CN207704189U (en) * | 2018-01-10 | 2018-08-07 | 长春工业大学 | A kind of nano-imprinting device preparing hierarchical microarchitecture |
-
2021
- 2021-03-06 CN CN202110249538.6A patent/CN113009783B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112213916A (en) * | 2019-07-10 | 2021-01-12 | 长春工业大学 | Vibration-assisted nano rolling device |
Non-Patent Citations (2)
| Title |
|---|
| 微区微纳米压印技术及设备;申溯;周雷;魏国军;陈林森;;光学精密工程;20090430(第04期);第807-812页 * |
| 纳米压印光刻技术的研究;张鸿海, 胡晓峰, 范细秋, 刘胜;华中科技大学学报(自然科学版);20041231(12);第57-59页 * |
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