CN112965183A - Silicon optical module - Google Patents
Silicon optical module Download PDFInfo
- Publication number
- CN112965183A CN112965183A CN202110264668.7A CN202110264668A CN112965183A CN 112965183 A CN112965183 A CN 112965183A CN 202110264668 A CN202110264668 A CN 202110264668A CN 112965183 A CN112965183 A CN 112965183A
- Authority
- CN
- China
- Prior art keywords
- optical
- laser
- silicon
- assembly
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 240
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 108
- 239000010703 silicon Substances 0.000 title claims abstract description 108
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 107
- 239000013307 optical fiber Substances 0.000 claims abstract description 66
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 238000012545 processing Methods 0.000 claims abstract description 6
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 7
- 238000004891 communication Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000011161 development Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G02B6/425—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the field of optical communication, in particular to a silicon optical module. The method comprises the following steps: the laser components are arranged on the circuit board component and emit a plurality of lasers with the same wavelength; the silicon optical chip is connected with the laser component and used for receiving laser and carrying out shunt modulation processing to generate a plurality of paths of modulated optical signals; the optical fiber assembly is arranged outside the circuit board assembly and is used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal outside the silicon optical module; and the optical detector assembly is connected with the optical fiber assembly and used for receiving the external optical signal, performing photoelectric conversion and generating a corresponding external electrical signal. The technical scheme of the invention has the beneficial effects that: the silicon optical module not only can shorten the development period and reduce the economic cost based on the mature process design and is easy for mass production, but also can separate the layout of heating devices based on the decentralized layout thought, and is more favorable for the heat dissipation of the whole module.
Description
Technical Field
The invention relates to the field of optical communication, in particular to a silicon optical module.
Background
With the development of optical communication, the speed and the integration level of an optical module are higher and higher, and accordingly, the heat dissipation requirement of the optical module is also higher and higher. The silicon light has the characteristics of low power consumption and high integration, and the scale commercialization of the silicon light can greatly reduce the cost of an integrated circuit. The adoption of silicon optical chips to realize the photoelectric conversion function has become a mainstream scheme adopted by high-speed optical modules.
In the silicon optical module, a silicon optical chip is arranged on the surface of a circuit board assembly and is electrically connected with the circuit board assembly through routing; the silicon optical chip is provided with an optical port on the surface thereof, and is connected with an optical interface of the optical module through an optical fiber ribbon to realize that an optical signal enters and exits the silicon optical chip.
However, in the existing optical module, the laser box is disposed on the surface of the silicon optical chip, the optical fiber ribbon is coupled with the surface of the silicon optical chip, the laser box and the silicon optical chip are disposed with poor heat dissipation from top to bottom, the optical fiber ribbon needs to adopt 90 ° FA, the manufacturing process is too complex, and the economic cost is also increased.
Disclosure of Invention
To solve the problems in the prior art, there is provided a silicon optical module, including:
the laser components are arranged on the circuit board component and used for emitting a plurality of laser with the same wavelength;
the silicon optical chip is arranged on the circuit board assembly, connected with the laser assembly and used for receiving laser and carrying out shunt modulation processing to generate a plurality of paths of modulated optical signals;
the optical fiber assembly is arranged on the circuit board assembly, is respectively connected with the silicon optical chip and the laser assembly, and is used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal outside the silicon optical module;
and the optical detector assembly is arranged on the circuit board assembly, is connected with the optical fiber assembly, and is used for receiving the external optical signal, performing photoelectric conversion and generating a corresponding external electric signal.
Preferably, each of the laser assemblies includes:
a laser for emitting laser light;
the lens is used for receiving and converging the laser emitted by the laser;
and the isolator is used for receiving the laser converged by the lens and inputting the laser into the silicon optical chip.
Preferably, the lasers in each of the laser assemblies emit laser light of the same wavelength.
Preferably, the silicon optical chip includes:
a plurality of input optical ports for receiving the laser light output by the laser assembly;
the optical splitter is connected with the input optical port and is used for splitting the laser;
the modulator is connected with the optical splitter and used for receiving the laser split by the optical splitter and carrying out modulation processing to generate a plurality of paths of modulated optical signals;
and the output optical port group is connected with the modulator and is used for outputting the multi-path modulated optical signals to the optical fiber assembly.
Preferably, the plurality of input light ports are respectively arranged on two sides of the output light port group.
Preferably, the method further comprises the following steps:
and the other end of the connecting optical fiber is coupled with an input port of the silicon optical chip and used for transmitting the laser output by the laser component to the silicon optical chip.
Preferably, the optical fiber assembly includes:
the first optical fiber group is connected with the silicon optical chip and used for receiving a plurality of paths of modulated optical signals;
the optical fiber head is connected with the first optical fiber group and used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal outside the silicon optical module;
and the second optical fiber group is connected with the optical fiber head and used for receiving the external optical signal and outputting the external optical signal to the optical detector assembly.
Preferably, the photodetector assembly includes:
and the photodetectors are used for performing photoelectric conversion on the external optical signals to obtain the external electrical signals corresponding to the external optical signals.
Preferably, the circuit board assembly includes thereon:
and the silicon optical chip and the laser component are arranged on the heat sink, and the heat sink is used for dissipating heat of the silicon optical chip and the laser component.
Preferably, the device further comprises an upper shell and a lower shell;
the upper shell and the lower shell are mutually clamped and used for covering the circuit board assembly, the silicon optical chip arranged on the circuit board assembly, the laser assembly, the optical detector assembly and the optical fiber assembly.
The technical scheme of the invention has the beneficial effects that: the invention provides a silicon optical module which can be designed based on a mature process, shortens the development period, reduces the economic cost, is easy for mass production, can be separately arranged based on a decentralized arrangement thought, and is more favorable for heat dissipation of the whole module.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a silicon optical module according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a silicon optical chip according to a preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a silicon optical module with the housing removed according to a preferred embodiment of the present invention;
fig. 4 is a schematic structural diagram of a silicon optical module with a housing removed according to another preferred embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The silicon optical module suitable for the 400G DR4 optical module provided by the invention can comprise, as shown in FIG. 1: a housing 10, a silicon optical chip 20, two laser assemblies 30, an optical fiber assembly 40, a light detector assembly 50, and a circuit board assembly 60.
The signal transmission and position distribution among the silicon optical chip 20, the two laser assemblies 30, the optical fiber assembly 40, and the optical detector assembly 50 can be as follows:
two laser assemblies 30 disposed on the circuit board assembly 60 for emitting a plurality of laser lights of the same wavelength;
a silicon optical chip 20, disposed on the circuit board assembly 60 and connected to the laser assembly 30, for receiving the laser and performing a shunting modulation process to generate a plurality of paths of modulated optical signals;
the optical fiber assembly 40 is arranged on the circuit board assembly 60, is respectively connected with the silicon optical chip 20 and the laser assembly 30, and is used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal from the outside of the silicon optical module;
and the optical detector assembly 50 is arranged on the circuit board assembly 60 and connected with the optical fiber assembly 40, and is used for receiving an external optical signal, performing photoelectric conversion and generating a corresponding external electrical signal.
As can be seen in fig. 3, in a preferred embodiment of the present invention, the silicon optical module may include two laser assemblies 30, wherein each laser assembly 30 may include:
a laser 301 for emitting laser light;
a lens 302 for receiving and converging the laser light emitted by the laser 301;
and an isolator 303 for receiving the laser light converged by the lens 302 and inputting the laser light to the silicon optical chip 20.
In a preferred embodiment of the present invention, the lasers 301 in each laser assembly 30 emit laser light at the same wavelength.
That is to say, two lasers 301 in the two laser assemblies 30 in the present invention emit two laser beams with the same wavelength, the laser beams are converged by the lens 302, the converged laser beams pass through the isolator 303, and the converged laser beams can enter the silicon optical chip 20 through the input optical port 201 and the input optical port 202, which are described below. The laser with the same wavelength enters the silicon optical chip 20, and then is branched and modulated to become a multi-path modulated optical signal, and the multi-path modulated optical signal can be output from the output optical port group 203 in the silicon optical chip 20.
Further, the laser assembly 30 further comprises an outer envelope 304, the laser 301, the lens 302 and the isolator 303 are encapsulated inside the outer envelope 304, the outer envelope 304 may be a hermetic encapsulation, which may improve the reliability of the laser assembly 30. The laser assembly 30 may be packaged using conventional TO technology, such as TO56, TO38, or TO33 standard packages. The laser assembly 30 is in electrical communication with the circuit board assembly 60 by conductors.
It should be noted that the laser assembly 30 may further include a coupling lens, a backlight detector, and other devices according to actual requirements.
In a preferred embodiment of the present invention, as shown in fig. 2, the silicon optical chip 20 may include two input optical ports 201 and 202, one output optical port group 203, an optical splitter 204, and four modulators 205.
The connection relationship, the signal transmission relationship and the corresponding functions between the two input optical ports 201 and 202, the one output optical port group 203, the optical splitter 204 and the modulator 205 may be as follows:
two input optical ports 201 and 202 for receiving laser light output by the laser assembly 30;
two optical splitters 204 connected to the input optical ports 201 and 202 for splitting the laser light;
four modulators 205 connected to the optical splitter 204 for receiving the laser split by the optical splitter and performing modulation processing to generate multiple paths of modulated optical signals;
an output optical port set 203 is connected to the modulator 205 for outputting the plurality of modulated optical signals to the optical fiber assembly 40.
Further, two input optical ports 201 and 202 may be disposed on two sides of the output optical port group 203, respectively.
Specifically, the input optical port 201 and the input optical port 202 may respectively receive optical signals input to the silicon optical chip 20 by the two laser components 30, the two optical splitters 204 may be both one-to-two optical splitters, and split the laser with the same wavelength received by the input optical ports 201 and 202, the four modulators 205 may all modulate the split laser to generate four modulated optical signals, and accordingly, the output optical port group 203 may include four output optical ports to transmit the modulated optical signals to the optical fiber component 40. Based on the above, the silicon optical chip 20 in the present invention may adopt a silicon optical modulator with a Mach-Zehnder structure.
Further, the silicon optical chip 20 adopted in the present invention may be rectangular, or may be in other shapes, in an actual design, when the silicon optical chip 20 is rectangular, the input optical port 201, the input optical port 202, and the output optical port group 203 may all be disposed on one side surface of the silicon optical chip 20, a plurality of chip electrical ports 206 may be disposed on the other three sides of the silicon optical chip 20, and the chip electrical ports 206 are communicated with the circuit board assembly 60 through conductors, so as to implement mutual transmission, energization, and grounding of data signals.
As can be seen in fig. 2 and 3, in a preferred embodiment of the present invention, a first fiber set 402 is coupled to the set of output optical ports 203 in the silicon photonics chip 20; and/or
The second fiber group 403 is coupled to the light detector assembly 50.
In a preferred embodiment of the present invention, as shown in fig. 3, the fiber optic assembly 40 may include a fiber optic head 401, a first fiber optic group 402, and a second fiber optic group 403. The connection relationship, the signal transmission relationship and the corresponding functions among the optical fiber head 401, the first optical fiber group 402 and the second optical fiber group 403 may be as follows:
a first optical fiber group 402 connected to the silicon optical chip 20 for receiving multiple channels of modulated optical signals;
the optical fiber head 401 is connected with the first optical fiber group 402 and is used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal from the outside of the silicon optical module;
and a second optical fiber group 403 connected to the optical fiber head 401 for receiving the external optical signal and outputting the external optical signal to the optical detector assembly 50.
Specifically, the optical fiber head 401 is an optical interface for external communication of the silicon optical module, and realizes output and input of optical signals in butt joint with external devices. The optical fiber assembly 40 is provided with a first optical fiber group 402, the output optical port group 203 of the silicon optical chip 20 is coupled with the first optical fiber group 402, the multi-path modulated optical signal is output from the output optical port group 203 of the silicon optical chip 20, the multi-path modulated optical signal is output from the optical port group 203 and enters the first optical fiber group 402, and the multi-path modulated optical signal is further output to an external device through an optical fiber head 401. The fiber optic assembly 40 is also provided with a second fiber optic group 403. Optical signals of external devices are input to the optical fiber assembly 40 through the head 401.
It should be noted that the fiber optic assembly 40 of the present invention may be employed with MPO fiber optic assemblies.
In a preferred embodiment of the present invention, the light detector assembly 50 includes:
and the plurality of light detectors are used for performing photoelectric conversion on the external optical signals to obtain external electric signals corresponding to the external optical signals.
Specifically, as shown in fig. 3, 4 optical detectors are disposed on the optical detector assembly 50, the optical detectors can convert optical signals into electrical signals, a second optical fiber group 403 is disposed in the optical fiber assembly 40, and the second optical fiber group 403 is coupled to the optical detector assembly 50. An optical signal of the external device is input to the optical fiber assembly 40 through the optical fiber head 401, the optical signal further passes through the second optical fiber group 403, the optical signal is output from the second optical fiber group 403 to the optical detector assembly 50, the optical detector assembly 50 receives the optical signal output from the second optical fiber group 403, and the optical detector assembly 50 converts the received optical signal into an electrical signal and inputs the electrical signal to the circuit board assembly 60.
In a preferred embodiment of the present invention, the circuit board assembly 60 includes thereon:
and the silicon optical chip 20 and the laser assembly 30 are arranged on the heat sink, and the heat sink is used for dissipating heat of the silicon optical chip 20 and the laser assembly 30.
Specifically, in practical design, the heat sink 601 is preferably a material with high thermal conductivity and low expansion coefficient, such as tungsten copper or aluminum nitride. The heat sink 601 is fixed to the circuit board assembly 60 by bonding or soldering. The silicon optical chip 20 and the laser assembly 30 are fixed on the heat sink 601, heat generated by the silicon optical chip 20 and the laser assembly 30 is dissipated through the heat sink 601, and the reverse side of the heat sink 601 is in contact with the shell 10 to further conduct the heat out.
In a preferred embodiment of the present invention, the circuit board assembly 60 further includes:
and the module electrical port is used for being electrically connected with equipment outside the silicon optical module so as to transmit data.
Further, circuit board assembly 60 still is provided with Driver, TIA, DSP, MCU isoelectrical chip and golden finger, and the golden finger is the module electric mouth of silicon optical module, and the module electric mouth can realize circuit connection with external equipment, realizes the function of data signal biography each other, circular telegram and ground connection.
As shown in fig. 1, in the preferred embodiment of the present invention, the housing 10 may include an upper housing 101 and a lower housing 102;
the upper housing 101 and the lower housing 102 are engaged with each other to house the circuit board assembly 60, the silicon photonic chip 20 disposed on the circuit board assembly 60, the laser assembly 30, the photo-detector assembly 50, and the optical fiber assembly 40.
As shown in fig. 4, in a preferred embodiment of the present invention, the method further includes:
and the plurality of connecting optical fibers 70, one end of each connecting optical fiber 70 is coupled with the laser component 30, and the other end of each connecting optical fiber 70 is coupled with the input ports 201 and 202 of the silicon optical chip 20, and is used for transmitting the laser output by the laser component 30 to the silicon optical chip 20.
That is to say, the silicon optical module of the present invention may include a housing 10, a silicon optical chip 20, two laser assemblies 30, an optical fiber assembly 40, an optical detector assembly 50, a circuit board assembly 60, and two connecting optical fibers 70, where the two laser assemblies 30 are respectively coupled to one ends of the two connecting optical fibers 70, and the other ends of the two connecting optical fibers 70 are respectively coupled to an input optical port 201 and an input optical port 202 of the silicon optical chip 20. The two lasers 301 emit laser with the same wavelength, the laser is converged by the lens 302, the converged laser passes through the isolator 303, the converged laser is input to the connecting optical fiber 70, and the laser enters the silicon optical chip 20 from the input port 201 and the input port 202 through the connecting optical fiber 70. The laser with the same wavelength enters the silicon optical chip 20, and then is branched and modulated to become a multi-path modulated optical signal, and the multi-path modulated optical signal is output from the output optical port group 203 of the silicon optical chip 20.
Based on the above, the invention can provide a silicon optical module, and the silicon optical chip adopts a mature process design, has a short development period and is easy for mass production. The laser assembly, the circuit board and the related photoelectric assembly can be designed and selected in a domestic supply chain, and the cost of the whole module is greatly reduced. The silicon optical module structure design provided by the invention adopts a decentralized layout thought, so that heating devices are separately arranged, and the whole module is more favorable for heat dissipation. The silicon optical module provided by the invention is suitable for a 400GDR4 optical module.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A silicon light module, comprising:
the laser components are arranged on the circuit board component and used for emitting a plurality of laser with the same wavelength;
the silicon optical chip is arranged on the circuit board assembly, connected with the laser assembly and used for receiving laser and carrying out shunt modulation processing to generate a plurality of paths of modulated optical signals;
the optical fiber assembly is arranged on the circuit board assembly, is respectively connected with the silicon optical chip and the laser assembly, and is used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal outside the silicon optical module;
and the optical detector assembly is arranged on the circuit board assembly, is connected with the optical fiber assembly, and is used for receiving the external optical signal, performing photoelectric conversion and generating a corresponding external electric signal.
2. A silicon optical module as defined in claim 1 wherein each laser assembly comprises:
a laser for emitting laser light;
the lens is used for receiving and converging the laser emitted by the laser;
and the isolator is used for receiving the laser converged by the lens and inputting the laser into the silicon optical chip.
3. A silicon optical module as defined in claim 1 wherein the lasers in each of the laser assemblies lase at the same wavelength.
4. A silicon photonics module according to claim 1 wherein the silicon photonics chip includes:
a plurality of input optical ports for receiving the laser light output by the laser assembly;
the optical splitter is connected with the input optical port and is used for splitting the laser;
the modulator is connected with the optical splitter and used for receiving the laser split by the optical splitter and carrying out modulation processing to generate a plurality of paths of modulated optical signals;
and the output optical port group is connected with the modulator and is used for outputting the multi-path modulated optical signals to the optical fiber assembly.
5. The silicon optical module as claimed in claim 4, wherein the plurality of input optical ports are respectively disposed at two sides of the output optical port group.
6. A silicon light module as defined in claim 1, further comprising:
and the other end of the connecting optical fiber is coupled with an input port of the silicon optical chip and used for transmitting the laser output by the laser component to the silicon optical chip.
7. A silicon optical module as defined in claim 1, wherein the optical fiber assembly comprises:
the first optical fiber group is connected with the silicon optical chip and used for receiving a plurality of paths of modulated optical signals;
the optical fiber head is connected with the first optical fiber group and used for outputting the modulated optical signal to the outside of the silicon optical module and receiving an external optical signal outside the silicon optical module;
and the second optical fiber group is connected with the optical fiber head and used for receiving the external optical signal and outputting the external optical signal to the optical detector assembly.
8. A silicon light module as defined in claim 1 wherein the light detector assembly comprises:
and the photodetectors are used for performing photoelectric conversion on the external optical signals to obtain the external electrical signals corresponding to the external optical signals.
9. A silicon optical module as defined in claim 1, wherein the circuit board assembly includes thereon:
and the silicon optical chip and the laser component are arranged on the heat sink, and the heat sink is used for dissipating heat of the silicon optical chip and the laser component.
10. A silicon optical module as defined in claim 1, further comprising an upper housing and a lower housing;
the upper shell and the lower shell are mutually clamped and used for covering the circuit board assembly, the silicon optical chip arranged on the circuit board assembly, the laser assembly, the optical detector assembly and the optical fiber assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110264668.7A CN112965183A (en) | 2021-03-11 | 2021-03-11 | Silicon optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110264668.7A CN112965183A (en) | 2021-03-11 | 2021-03-11 | Silicon optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112965183A true CN112965183A (en) | 2021-06-15 |
Family
ID=76277355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110264668.7A Pending CN112965183A (en) | 2021-03-11 | 2021-03-11 | Silicon optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112965183A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805270A (en) * | 2021-09-17 | 2021-12-17 | 希烽光电科技(南京)有限公司 | High-integration silicon optical chip |
| CN114866140A (en) * | 2022-06-17 | 2022-08-05 | 苏州熹联光芯微电子科技有限公司 | Optical module, electronic equipment and control method of optical module |
| CN115327711A (en) * | 2022-06-30 | 2022-11-11 | 武汉华工正源光子技术有限公司 | ONT optical module based on COB packaging |
| WO2022262551A1 (en) * | 2021-06-17 | 2022-12-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN116047680A (en) * | 2023-04-03 | 2023-05-02 | 众瑞速联（武汉）科技有限公司 | Miniaturized silicon optical chip, silicon optical component and COB component thereof |
| CN116148992A (en) * | 2023-04-20 | 2023-05-23 | 众瑞速联（武汉）科技有限公司 | Coupling method of silicon optical device, silicon optical device and optical chip device |
| CN117908199A (en) * | 2024-01-17 | 2024-04-19 | 希烽光电科技(南京)有限公司 | Active optical cable of sharing light source |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376688A (en) * | 2019-07-16 | 2019-10-25 | 武汉光迅科技股份有限公司 | A kind of optical module |
| CN209784601U (en) * | 2019-05-31 | 2019-12-13 | 亨通洛克利科技有限公司 | structure suitable for optical module coupling |
| CN111474644A (en) * | 2020-05-13 | 2020-07-31 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111694113A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2020253137A1 (en) * | 2019-06-21 | 2020-12-24 | 武汉光迅科技股份有限公司 | Modulation chip and light emission module |
| CN212649474U (en) * | 2020-08-18 | 2021-03-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2021
- 2021-03-11 CN CN202110264668.7A patent/CN112965183A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111694113A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN209784601U (en) * | 2019-05-31 | 2019-12-13 | 亨通洛克利科技有限公司 | structure suitable for optical module coupling |
| WO2020253137A1 (en) * | 2019-06-21 | 2020-12-24 | 武汉光迅科技股份有限公司 | Modulation chip and light emission module |
| CN110376688A (en) * | 2019-07-16 | 2019-10-25 | 武汉光迅科技股份有限公司 | A kind of optical module |
| CN111474644A (en) * | 2020-05-13 | 2020-07-31 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN212649474U (en) * | 2020-08-18 | 2021-03-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022262551A1 (en) * | 2021-06-17 | 2022-12-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113805270A (en) * | 2021-09-17 | 2021-12-17 | 希烽光电科技(南京)有限公司 | High-integration silicon optical chip |
| CN113805270B (en) * | 2021-09-17 | 2024-04-16 | 希烽光电科技(南京)有限公司 | High-integration silicon optical chip |
| CN114866140A (en) * | 2022-06-17 | 2022-08-05 | 苏州熹联光芯微电子科技有限公司 | Optical module, electronic equipment and control method of optical module |
| CN115327711A (en) * | 2022-06-30 | 2022-11-11 | 武汉华工正源光子技术有限公司 | ONT optical module based on COB packaging |
| CN115327711B (en) * | 2022-06-30 | 2024-07-09 | 武汉华工正源光子技术有限公司 | ONT optical module based on COB encapsulation |
| CN116047680A (en) * | 2023-04-03 | 2023-05-02 | 众瑞速联（武汉）科技有限公司 | Miniaturized silicon optical chip, silicon optical component and COB component thereof |
| CN116148992A (en) * | 2023-04-20 | 2023-05-23 | 众瑞速联（武汉）科技有限公司 | Coupling method of silicon optical device, silicon optical device and optical chip device |
| CN116148992B (en) * | 2023-04-20 | 2023-08-08 | 众瑞速联（武汉）科技有限公司 | Coupling method of silicon optical device, silicon optical device and optical chip device |
| CN117908199A (en) * | 2024-01-17 | 2024-04-19 | 希烽光电科技(南京)有限公司 | Active optical cable of sharing light source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112965183A (en) | Silicon optical module | |
| US12128729B2 (en) | Integrated optical transceiver | |
| CN113759475B (en) | Inner packaging type photoelectric module | |
| CN113759477A (en) | Multi-channel optical engine packaging type small chip and common packaging type photoelectric module | |
| WO2021115129A1 (en) | Optical module | |
| CN113759476A (en) | Integrated heat sink for co-packaged optoelectronic modules | |
| CN113764390A (en) | Packaged light engine | |
| CN104601244A (en) | 400 Gbps hot-plug high-speed optical transceiver module | |
| CN110954999B (en) | Optical transceiver | |
| CN110971304A (en) | Light receiving and transmitting assembly based on silicon light | |
| CN212463216U (en) | Optical module with single-channel transmission rate of 100Gbps | |
| CN113281841B (en) | Silicon optical multichannel parallel optical component and coupling method thereof | |
| CN112904496A (en) | Silicon optical integrated module | |
| CN215264132U (en) | Silicon photonic integrated circuit | |
| WO2024001684A1 (en) | Multi-channel light receiving/transmitting assembly and optical module | |
| CN112904497A (en) | Silicon optical integrated module based on PWB | |
| US20220326456A1 (en) | Optical Module | |
| CN209946462U (en) | Coupling structure and packaging structure of laser and silicon optical chip | |
| CN212543788U (en) | Optical module | |
| CN106877936B (en) | SFP28 optical module | |
| CN112965184B (en) | Novel silicon optical module | |
| CN209514144U (en) | Optical module | |
| CN221225095U (en) | High-power multichannel modulation light emitting module structure | |
| CN219475878U (en) | Optical module | |
| CN220915522U (en) | Optical module circuit board assembly and optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |