CN112923800B - Exploding foil chip based on electric explosion and plasma discharge coupling and preparation method thereof - Google Patents
Exploding foil chip based on electric explosion and plasma discharge coupling and preparation method thereof Download PDFInfo
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- CN112923800B CN112923800B CN202110090142.1A CN202110090142A CN112923800B CN 112923800 B CN112923800 B CN 112923800B CN 202110090142 A CN202110090142 A CN 202110090142A CN 112923800 B CN112923800 B CN 112923800B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/195—Manufacture
- F42B3/198—Manufacture of electric initiator heads e.g., testing, machines
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Abstract
The invention belongs to the field of exploding foil initiators, and particularly relates to an exploding foil chip based on electric explosion and plasma discharge coupling and a preparation method thereof. The device comprises a substrate, a metal layer, a flyer layer, an acceleration chamber and an electrode layer embedded in the acceleration chamber; the electrode layer is connected with the secondary capacitor discharge circuit, when the high-voltage capacitor of the electric explosion circuit discharges and the circuit generates pulse heavy current, the bridge area of the metal layer generates electric explosion, high-temperature and high-voltage plasma generated by the electric explosion moves upwards along the acceleration chamber, when the plasma passes through the electrode layer, the secondary capacitor energy discharges through the plasma, the flyer is subjected to secondary acceleration, and the coupling of the electric explosion and the plasma discharge is realized. The invention innovatively couples the metal foil electric explosion and the plasma discharge, improves the temperature and the pressure of the plasma generated by the foil electric explosion, further improves the flyer speed, and provides a new means for generating high-speed flyers.
Description
Technical Field
The invention belongs to the field of exploding foil initiators, and particularly relates to an exploding foil chip based on electric explosion and plasma discharge coupling and a preparation method thereof.
Background
In order to research the state and performance of the material under high temperature and high pressure, dynamic high pressure loading means such as magnetic isentropic compression, electric guns, strong laser radiation and the like are often required. These methods all rely on high speed flyer impact material to achieve dynamic high pressure loading. The principle of an electric gun is to shear and drive flyer by using plasma generated by electric explosion of metal bridge foil, wherein the most representative is explosion foil initiation technology. The working principle is that the metal bridge foil is subjected to electric explosion under the action of pulse large current due to joule heat, high-temperature and high-pressure plasma generated by the electric explosion cuts and drives the flyer, and the flyer moves along the accelerating chamber and impacts the explosive at a certain speed, so that the flyer is detonated.
For existing electric explosive devices, the maximum velocity of the ejected flyer is limited due to the limitations of flyer material performance and component performance, low electrical energy conversion rate, and the like.
Disclosure of Invention
The invention aims to provide an exploding foil chip based on electric explosion and plasma discharge coupling and a preparation method thereof.
The technical solution for realizing the purpose of the invention is as follows: an exploding foil chip based on coupling of electric explosion and plasma discharge comprises a substrate, a metal layer, a flyer layer, an accelerating chamber and an electrode layer embedded in the accelerating chamber;
the electrode layer is connected with the secondary capacitor discharge circuit, when the high-voltage capacitor of the electric explosion circuit discharges and the circuit generates pulse large current, the bridge area of the metal layer generates electric explosion, high-temperature high-voltage plasma generated by the electric explosion moves upwards along the acceleration chamber, and when the plasma passes through the electrode layer, the secondary capacitor energy discharges through the plasma to secondarily accelerate the flyer, so that the coupling of the electric explosion and the plasma discharge is realized.
Further, it is at least two-layer for superpose in proper order to accelerate the bore, sets up the electrode layer between the adjacent acceleration bore layer, and the electrode layer is equipped with the inside via hole of acceleration bore including discharging region and coupling part with the corresponding region of electrode layer coupling part with the bore layer with higher speed on being located the electrode layer, accelerates the bore top and is equipped with the top layer pad, and the coupling part of electrode layer is connected with secondary capacitance through accelerating the inside via hole of bore and top layer pad with higher speed, forms secondary capacitance discharge circuit.
Or, the chamber is at least three-layer for superpose in proper order with higher speed, sets up the electrode layer between the adjacent chamber layer with higher speed, and the electrode layer is including discharging region and linkage segment, 2 layers are no less than to the quantity of electrode layer, and every layer of electrode layer all is equipped with corresponding pad, and the electrode layer of every layer forms the return circuit that discharges through its pad and the capacitance connection that corresponds, and the high temperature high pressure plasma that the electric explosion produced moves upwards along accelerating the chamber, and plasma passes through a plurality of electrode layers in proper order, and the capacitance energy on corresponding layer discharges through plasma to the realization is accelerated many times to the flyer.
Further, the material of the electrode layer (5) is Cu, Au or Ag, and the thickness of each electrode layer is 5-35 μm.
Furthermore, the substrate is used as a reflecting back plate to restrain the upward movement of plasma generated by electric explosion, the substrate is made of a PCB or ceramic, and the thickness of the substrate is adjusted according to the specific parameters of the designed exploding foil chip; the thickness of the substrate is more than or equal to 1 mm.
Furthermore, the metal layer comprises a bonding pad, a transition region and a bridge region, the bonding pad is used for being connected with the main capacitor discharge circuit, the transition region is a transition region between the bonding pad region and the bridge region, the size, the shape and the material of the bridge region are designed according to specific requirements, and the metal layer is made of Cu, Au, Ag or Al.
The preparation method of the chip is prepared by adopting a PCB process, a PCB-MEMS process or an LTCC process.
A method for preparing the chip comprises the following steps:
step (1): selecting a plurality of layers of green ceramic chip materials, laminating and aligning the layers of green ceramic chip materials layer by layer to form a substrate with certain thickness and strength;
step (2): manufacturing a metal layer on a substrate by using a conductor paste printing process;
and (3): selecting a green ceramic tape as a flyer layer, and slotting the position of the flyer layer corresponding to the metal layer bonding pad;
and (4): selecting a single-layer or multi-layer green porcelain tape, slotting the position, corresponding to the bonding pad, of the green porcelain tape, printing metal slurry on the green porcelain tape in a screen printing mode, and drilling a hole in the center of the green porcelain tape to form a first acceleration chamber and an electrode layer;
and (5): selecting a single-layer or multi-layer green ceramic tape, slotting at a position corresponding to a bonding pad on the green ceramic tape, punching at a position corresponding to a connecting part of an electrode layer on the green ceramic tape, filling metal slurry, namely a metalized through hole, printing the metal slurry on the green ceramic tape, and drilling a hole in the center to form a second layer of acceleration chamber and the electrode layer;
and (6): if the ripening of the acceleration chamber and the electrode layer is more than two layers, preparing other layers according to the step (5);
and (7): printing a top layer bonding pad on the position of the top layer accelerating chamber corresponding to the connecting part of the electrode layer;
and (8): stacking the ceramic substrate, the metal layer, the flying sheet layer and the acceleration chamber in the sequence from bottom to top, aligning the positions, and then laminating;
and (9): sintering at 900 deg.C;
step (10): and the scribing is divided into independent units to form the exploding foil integrated chip based on electric explosion and plasma discharge coupling.
Compared with the prior art, the invention has the remarkable advantages that:
(1) the invention realizes the capacitance C by embedding the metal electrode in the accelerating chamber and introducing the metal electrode in the process of accelerating the flyer by the plasma generated by metal electric explosion2Discharging the plasma, improving the pressure of the plasma, and further realizing the secondary acceleration of the flyer; compared with the prior art only depending on the electric explosion accelerating flyer, the method improves the structure of the electric explosion accelerating device, realizes the coupling of metal electric explosion and plasma discharge, and increases the speed limit of the flyer emitted by the electric explosion accelerating device.
(2) The number of the electrode layers can be single or multiple; when the electrode layers are multiple, the accelerating bores are provided with the through holes inside the accelerating bores, so that the serial connection among the multiple electrode layers is realized, and the same capacitor C is connected through the bonding pad2The method for connecting the multiple layers of electrodes in series can reduce the volume of a chip and improve the capacitance C2The energy utilization efficiency of.
(3) According to the invention, a plurality of electrode layers are connected in parallel, the electrode layers are independent from each other, and a single electrode layer is connected with a single capacitor; therefore, the flyer can realize one-time acceleration when passing through one electrode, thereby realizing multi-stage acceleration and further improving the speed limit of the conventional flyer launching device.
Drawings
Fig. 1 is a perspective view of an exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge according to the present invention.
Fig. 2 is a top view of an exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge according to the present invention.
Fig. 3 is a cross-sectional view of an exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge according to the present invention.
Fig. 4 is a schematic diagram of the metal layer of an exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge according to the present invention.
Fig. 5 is a schematic diagram of the bottom acceleration chamber of an exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge according to the present invention.
Fig. 6 is a schematic diagram of the acceleration chamber outside the bottom layer of the exploding foil integrated chip based on the principle of electric explosion and plasma discharge coupling of the present invention.
Fig. 7 is a schematic diagram of the electrode layers of an exploding foil integrated chip of the present invention based on the principle of electric explosion and plasma discharge coupling.
Fig. 8 is an exploded view of the acceleration chamber of an exploding foil integrated chip of the present invention based on the principles of electrical explosion and plasma discharge coupling.
Fig. 9 is an exploded view of an exploding foil integrated chip based on the principle of electric explosion and plasma discharge coupling according to the present invention.
Fig. 10 is a circuit connection diagram of an application of the exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge according to the present invention.
Fig. 11 is a schematic view of the process for preparing the underlying acceleration chamber and electrode of the present invention.
Fig. 12 is a schematic flow diagram of the process for preparing the acceleration chamber and electrodes of the present invention, outside the bottom layer.
Description of the reference numerals:
1-substrate, 2-metal layer, 3-flyer layer, 4-acceleration chamber, 5-electrode layer, 6-top pad, 7-acceleration chamber internal via hole, 8-drilling, 2-1-pad, 2-2-transition region, 2-3-bridge region, 4-1-first acceleration chamber, 4-2-second acceleration chamber, 4-3-third acceleration chamber, 4-4-fourth acceleration chamber, 5-1-first electrode, 5-2-second electrode, 5-3-third electrode, 5-1-discharge region, 5-1-2-connection part.
Detailed Description
The present invention is described in further detail below with reference to the attached drawing figures.
The traditional electric explosion device only depends on high-temperature and high-pressure plasma generated by electric explosion to drive the flyer, and the invention innovatively couples the metal bridge foil electric explosion and the plasma discharge through improving the structure of the electric explosion loading device, thereby greatly increasing the speed of the flyer. The invention improves the structure of the traditional exploding foil, an electrode layer 5 is arranged in the accelerating chamber 4, and a top layer bonding pad 6 is connected with a secondary capacitance discharge circuit when in use. When the high-voltage capacitor of the electric explosion loop discharges and the loop generates pulse large current, the bridge area 2-3 generates electric explosion, high-temperature high-voltage plasma generated by the electric explosion moves upwards along the acceleration chamber 4, when the plasma passes through the electrode layer 5, the energy of the secondary capacitor discharges through the plasma with certain conductivity, the temperature and the pressure of the plasma are increased again, the flyer is accelerated for the second time, and the coupling of the electric explosion and the secondary discharge of the plasma is realized.
An exploding foil integrated chip based on electric explosion and plasma discharge coupling, the main structure of the chip comprises: substrate 1, metal layer 2, flyer layer 3, acceleration chamber 4, electrode layer 5 and top layer pad 6. The substrate 1 is used as a reflecting back plate and restrains the upward movement of plasma generated by electric explosion; the metal layer 2 comprises a bonding pad 2-1, a transition region 2-2 and a bridge region 2-3, and the current density at the bridge region 2-3 is the maximum, namely the exploding foil; the fly sheet layer 3 can be made of materials such as polyimide, poly-chlorinated p-xylene and ceramic; the acceleration chamber 4 is a channel for accelerating the flyer; the electrode layer 5 comprises a discharge area 5-1-1 and a connecting part 5-1-2, wherein the connecting part 5-1-2 is connected with a top layer bonding pad 6 through a metal through hole 7 and then connected with a secondary discharge capacitor C2. The electrode layer 5 is used for discharging plasma generated by electric explosion of the bridge area 2-3 through electrodes by utilizing external capacitance to supplement energy; the acceleration chamber 4 can be made of a PCB board or a ceramic material through different processes.
The electrode layer 5 is made of metal materials such as Cu, Au and Ag, the thickness of the electrode layer is slightly different according to the process, and the thickness of the electrode layer needs to be adjusted according to specific parameters of the designed exploding foil chip, and is generally between 5 μm and 35 μm.
The substrate 1 can bear shock waves generated by electric explosion and can restrain upward movement of plasmas generated by the electric explosion of the metal layer. The material can be PCB board or ceramic material, the thickness needs to be adjusted according to the specific parameter of the designed exploding foil chip, and is generally more than or equal to 1 mm.
The exploding foil chip can be prepared by utilizing a PCB process, a PCB-MEMS process or an LTCC process. Due to the different process methods and materials of the processes, the respective structural parameters of the exploding foil chip are also different.
A test circuit for a metal electric explosion and plasma discharge coupling accelerating flyer comprises the electric explosion and plasma discharge coupling chip, a main capacitor discharge loop and a secondary capacitor discharge loop. The main capacitor discharge circuit comprises a capacitor C1And a high-voltage switch S, wherein the main capacitor discharge loop is connected with a bonding pad 2-1 of the metal layer 2 and is used for the electrical explosion of the metal. Secondary capacitance C2Connected to the top layer pad 6 and in turn to the built-in electrode layer 5 for secondary discharge of the plasma.
Examples
The embodiment designs the exploding foil integrated chip which is prepared based on the electric explosion and plasma discharge coupling principle and by adopting the LTCC process. The exploding foil integrated chip comprises a ceramic substrate 1, a metal layer 2, a flying chip layer 3, a ceramic acceleration chamber 4, an electrode layer 5 and a top-layer bonding pad 6. The ceramic substrate 1 is used as a substrate in the integrated chip, and the length, width and height of the integrated chip are respectively 13mm multiplied by 7mm multiplied by 1 mm; the metal layer 2 is arranged on the ceramic substrate and comprises a bonding pad 2-1, a transition region 2-2 and a bridge region 2-3, and the size of the bonding pad 2-1 is 4mm multiplied by 3 mm. The chip is connected with the main capacitor discharge loop through a bonding pad 2-1, a transition region 2-2 is a part between the bonding pad 2-1 and a bridge region 2-3, an included angle between the bridge region 2-3 and the transition region 2-2 is 135 degrees, a metal layer is made of Au, the size of the bridge region is 0.4mm multiplied by 0.4mm, and the thickness of the bridge region is 4-6 mu m; the electrode layer 5 is embedded in the acceleration chamber 4, and the thickness of the single-layer electrode layer is 15 μm. The middle drill hole 8 of the acceleration chamber 4 has the size phi 1mm, and the center of the drill hole is aligned with the bridge area 2-3.
The LTCC process of the exploding foil integrated chip based on the electric explosion and plasma discharge coupling principle comprises the following steps of:
in the first step, 10 layers of green ceramic chip materials of about 110-114 μm are laminated and aligned layer by layer to form the substrate 1 of the chip.
Secondly, depositing a metal layer 2 on the substrate 1 by utilizing a conductor paste printing process, wherein the metal layer 2 is made of Au, and depositing Pd-Ag on a position corresponding to the bonding pad 2-1 to improve the weldability of the bonding pad;
thirdly, selecting a raw porcelain band with the thickness of 50 microns as a ceramic flyer layer 3, and slotting the flyer layer 3 at a position corresponding to the bonding pad 2-1;
and fourthly, selecting a single-layer 110-114 mu m green ceramic tape, and slotting at the position on the green ceramic tape corresponding to the bonding pad 2-1. Printing metal slurry with the thickness of 15 mu m on a green ceramic tape by adopting a screen printing mode, and drilling a hole 8 with the diameter of 0.6mm in the center of the green ceramic tape to form a first layer of accelerating chamber 4-1 and a first layer of electrode layer 5-1; and selecting a single-layer 110-114 mu m green ceramic tape, and slotting at the position on the green ceramic tape corresponding to the bonding pad 2-1. And punching a position, corresponding to the first electrode layer 5-1, on the green tape, wherein the diameter of each hole is 0.2mm, and filling metal slurry, namely the metalized via hole 7. Printing metal slurry on the green ceramic tape, and drilling a hole 8 in the center of the green ceramic tape to form a second electrode layer 5-2 and a second accelerating chamber 4-2; similarly, a third acceleration chamber 4-3 and a third electrode layer 5-3 can be prepared; and selecting a single-layer 110-114 mu m green ceramic tape, and slotting at the position on the green ceramic tape corresponding to the bonding pad 2-1. And punching the position, corresponding to the third electrode layer 5-3, on the green ceramic tape, and filling metal slurry, namely the metalized via hole 7. And drilling a hole 8 in the center of the green ceramic tape, and finally printing a top layer bonding pad 6 on the green ceramic tape at a position corresponding to the electrode.
Fifthly, sequentially stacking the ceramic substrate 1, the metal layer 2, the flier layer 3 and the acceleration chamber layer 4 layer by layer, aligning the positions of the layers, and then placing the layers in a static pressure machine for hot pressing;
fifthly, sintering at 900 ℃;
and sixthly, dividing the scribing into independent units.
So far, the fabrication of the exploding foil integrated chip based on the electric explosion and the electrode discharge is finished.
Therefore, the manufacture of the exploding foil integrated chip based on the coupling principle of electric explosion and plasma discharge can be completed. The exploding foil chip was connected to the secondary capacitor discharge circuit for performance testing, as shown in fig. 10, the main pad 2-1 was connected to the main capacitor discharge circuit, and the top pad 6 was connected to the secondary capacitor discharge circuit. Experiments show that after the bridge area 2-3 on the metal layer 2 is subjected to electric explosion, the flying piece is driven by plasma formed by the electric explosion to move upwards along the accelerating chamber 4, after the flying piece moves through the electrode 5, the secondary capacitor discharges the plasma behind the flying piece through the electrode, and the temperature of the plasma is increased through spectrum temperature measurement. Through Doppler flyer speed test, flyer speed is improved.
Claims (5)
1. An exploding foil chip based on coupling of electric explosion and plasma discharge is characterized by comprising a substrate, a metal layer, a flyer layer, an accelerating chamber and an electrode layer embedded in the accelerating chamber;
the electrode layer is connected with the secondary capacitor discharge loop, when the high-voltage capacitor of the electric explosion loop discharges and the loop generates pulse heavy current, the bridge area of the metal layer generates electric explosion, high-temperature and high-voltage plasma generated by the electric explosion moves upwards along the acceleration chamber, when the plasma passes through the electrode layer, the energy of the secondary capacitor discharges through the plasma, the flyer is subjected to secondary acceleration, and the coupling of the electric explosion and the plasma discharge is realized;
the acceleration chambers are at least two layers which are sequentially overlapped, an electrode layer is arranged between every two adjacent acceleration chamber layers and comprises a discharge area and a connection part, an acceleration chamber inner through hole is arranged in an area, corresponding to the electrode layer connection part, of the acceleration chamber layer on the electrode layer, a top layer bonding pad is arranged at the top of the acceleration chamber, and the connection part of the electrode layer is connected with the secondary capacitor through the acceleration chamber inner through hole and the top layer bonding pad to form a secondary capacitor discharge loop;
or, accelerating the chamber for superimposed at least three-layer in proper order, setting up the electrode layer between the adjacent accelerating chamber layer, the electrode layer is including discharging region and coupling part, 2 layers are no less than to the quantity of electrode layer, and every layer of electrode layer all is equipped with corresponding pad, and the electrode layer of every layer is connected with electric capacity through its pad that corresponds and is formed the return circuit that discharges, and the high temperature high pressure plasma that the electric explosion produced is along accelerating chamber upward movement, and plasma passes through a plurality of electrode layers in proper order, and the electric capacity energy that corresponds the layer discharges through plasma to the realization is accelerated many times to the flyer.
2. A chip according to claim 1, characterized in that the material of the electrode layers (5) is Cu, Au or Ag, and the thickness of each electrode layer is 5 μm-35 μm.
3. The chip of claim 2, wherein the substrate acts as a reflective back plate to restrict upward movement of plasma generated by an electric explosion, the substrate is made of PCB or ceramic, and the thickness of the substrate is adjusted according to specific parameters of the designed exploding foil chip; the thickness of the substrate is more than or equal to 1 mm.
4. The chip of claim 3, wherein the metal layer comprises a pad, a transition region and a bridge region, the pad is used for connecting with the main capacitor discharge circuit, the transition region is a transition region between the pad region and the bridge region, the size, shape and material of the bridge region are designed according to specific requirements, and the metal layer is made of Cu, Au, Ag or Al.
5. The method for preparing the chip according to claim 1, wherein the chip is prepared by a PCB process, a PCB-MEMS process or an LTCC process, and comprises the following steps:
step (1): selecting a plurality of layers of green ceramic chip materials, laminating and aligning the green ceramic chip materials layer by layer to form a substrate with certain thickness and strength;
step (2): manufacturing a metal layer on a substrate by using a conductor paste printing process;
and (3): selecting a green ceramic tape as a flyer layer, and slotting the flyer layer at a position corresponding to the metal layer bonding pad;
and (4): selecting a single-layer or multi-layer green ceramic tape, slotting at a position corresponding to a bonding pad on the green ceramic tape, printing metal slurry on the green ceramic tape in a screen printing mode, and drilling a hole in the center to form a first layer of acceleration chamber and an electrode layer;
and (5): selecting a single-layer or multi-layer green porcelain tape, slotting at a position corresponding to a bonding pad on the green porcelain tape, punching at a position corresponding to a connecting part of an electrode layer on the green porcelain tape, filling metal slurry to obtain a metalized through hole, printing the metal slurry on the green porcelain tape, and drilling at the center of the green porcelain tape to form a second layer of acceleration chamber and the electrode layer;
and (6): if the ripening rate of the acceleration chamber and the electrode layer is more than two layers, preparing other layers according to the step (5);
and (7): printing a top layer bonding pad on the acceleration chamber at the topmost layer at a position corresponding to the connection part of the electrode layer;
and (8): stacking the ceramic substrate, the metal layer, the flying sheet layer and the acceleration chamber in the sequence from bottom to top, aligning the positions, and then laminating;
and (9): sintering at 900 ℃;
step (10): and the scribing is divided into independent units to form the exploding foil integrated chip based on electric explosion and plasma discharge coupling.
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