CN112866874A - System and method for realizing temperature protection of loudspeaker - Google Patents
System and method for realizing temperature protection of loudspeaker Download PDFInfo
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- CN112866874A CN112866874A CN202110047176.2A CN202110047176A CN112866874A CN 112866874 A CN112866874 A CN 112866874A CN 202110047176 A CN202110047176 A CN 202110047176A CN 112866874 A CN112866874 A CN 112866874A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
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Abstract
The invention relates to a system and a method for realizing speaker temperature protection, wherein the system comprises: the device comprises a CODEC chip, a signal receiving module connected with the CODEC chip through an analog interface, a gain controller module connected with the output end of the signal receiving module, a temperature detection signal generating module, an analog signal adder fusing an output signal of the gain controller module and an output signal of the temperature detection signal generating module, a power amplifier connected with the output end of the analog signal adder, a loudspeaker connected with the output end of the power amplifier, a signal converter connected with the output end of the power amplifier, a signal processing module connected with the output end of the signal converter and a temperature control algorithm module connected with the output end of the signal processing module. The invention is suitable for all platforms and can realize the temperature protection of the loudspeaker, thereby obtaining the sound effect with higher quality and being suitable for the development of miniaturization and flattening; the invention greatly reduces the cost of the audio power amplifier with temperature protection and improves the popularization rate.
Description
Technical Field
The invention relates to the technical field of loudspeaker manufacturing, in particular to a system and a method for realizing loudspeaker temperature protection.
Background
With the development of miniaturization and flattening of mobile devices, the volume of the speaker is compressed, and at the same time, the volume and the sound quality are required to be higher, so that precise control of the temperature of the speaker becomes a necessary condition. Therefore, an intelligent audio power amplifier with a digital interface is produced, and the intelligent audio power amplifier is widely used in middle and high-end equipment in the years, and the technology and the products are very mature. However, the intelligent audio power amplifier needs to be a digital interface, and the platform is provided with a built-in ADSP module to extract temperature data of the loudspeaker and adjust audio signals.
As shown in fig. 1, fig. 1 is a flowchart of a conventional apparatus for implementing speaker temperature protection. The existing equipment consists of three parts, wherein the first part is a platform SOC (ADSP-SOC for short) with built-in ADSP, the second part is an intelligent audio power amplifier (D-PA for short) with a digital interface I2S, and the third part is a loudspeaker (SPK for short). The ADSP-SOC and the D-PA are connected through a digital interface I2S, an audio signal stream is output from the ADSP-SOC and enters the D-PA through the digital interface, the D-PA is decoded and then is subjected to signal processing, a temperature detection signal is added, the temperature detection signal is converted into an analog signal through a DAC, and finally the analog signal is amplified through an amplifier of the Dig-PA to drive the loudspeaker. After being sampled by two paths of ADC, the voltage V and the current I output by the amplifier are processed by a signal processing module and then are transmitted back to ADSP-SOC through an I2S digital interface. The DSP built in the ADSP-SOC performs extraction temperature calculation on the feedback voltage and current signal V/I, and then realizes signal processing and control by combining an effective algorithm according to the calculated value of the temperature, thereby achieving the purpose of protecting the temperature of the loudspeaker.
Compared with an analog interface audio amplifier, the audio amplifier of the digital interface has higher cost; the platform SOC with the ADSP built in is owned by a single supplier, so that it is difficult to control the temperature of the speaker due to cost consideration or use of the device without the ADSP built in, resulting in failure to obtain a better sound effect.
Therefore, it is necessary to provide a system and a method for protecting the temperature of a speaker, so as to solve the problem that the speaker in the prior art cannot simultaneously satisfy the requirements of small size, temperature control and low cost.
Disclosure of Invention
The invention aims to provide a system and a method for realizing speaker temperature protection, which aim to solve the problem that a speaker in the prior art cannot simultaneously meet the requirements of small volume, temperature control and low cost.
In order to solve the problems in the prior art, the invention provides a system for realizing the temperature protection of a loudspeaker, which comprises:
the system comprises a CODEC chip, a signal receiving module connected with the CODEC chip through an analog interface, a gain controller module connected with the output end of the signal receiving module, a temperature detection signal generating module, an analog signal adder fusing an output signal of the gain controller module and an output signal of the temperature detection signal generating module, a power amplifier connected with the output end of the analog signal adder, a loudspeaker connected with the output end of the power amplifier, a signal converter connected with the output end of the power amplifier, a signal processing module connected with the output end of the signal converter and a temperature control algorithm module connected with the output end of the signal processing module;
wherein, the CODEC chip sends out analog audio signals;
the signal receiving module receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module;
the gain controller module adjusts the amplitude or power of the received analog audio signal according to the control information and outputs the adjusted analog audio signal;
the analog signal adder fuses the analog audio signal output by the gain controller module and the analog detection signal output by the temperature detection signal generation module to form a fused signal and outputs the fused signal to the power amplifier;
the power amplifier drives the loudspeaker and outputs a current signal and a voltage signal;
the signal converter converts the current signal and the voltage signal into digital signals;
the signal processing module calculates the temperature information of the loudspeaker according to the digital signal and transmits the temperature information to the temperature control algorithm module;
and the temperature control algorithm module sends control information to the gain controller module according to the temperature information so as to control the analog audio signal output by the gain controller module.
Optionally, in the system for implementing speaker temperature protection, the temperature detection signal generation module includes an OSC sub-module, a DDS sub-module, and a DAC sub-module.
Optionally, in the system for implementing speaker temperature protection, the OSC sub-module is an internal frequency generator, and is configured to generate a clock signal; the DDS submodule is a frequency synthesizer and generates a digital signal for temperature detection; the DAC submodule is a digital-to-analog conversion circuit and is used for converting a digital signal into an analog detection signal.
Optionally, in the system for implementing speaker temperature protection, the signal converter is an ADC, and is configured to convert the current signal and the voltage signal into digital signals.
Optionally, in the system for implementing speaker temperature protection, the power amplifier outputs two paths of current signals and voltage signals, and two ADCs are provided to convert the current signals and the voltage signals of the respective paths respectively.
Optionally, in the system for implementing speaker temperature protection, the signal receiving module, the gain controller module, the temperature detecting signal generating module, the analog signal adder, the power amplifier, the signal converter, the signal processing module, and the temperature control algorithm module all belong to an internal structure of an analog audio power amplifier in the system.
Optionally, in the system for implementing speaker temperature protection, the CODEC chip is configured to convert an audio data stream into an analog audio signal.
Optionally, in the system for implementing speaker temperature protection, the system can integrate software and/or hardware for improving sound effect.
The invention also provides a method for realizing the temperature protection of the loudspeaker, and the system comprises the following steps:
the CODEC chip sends out an analog audio signal;
the signal receiving module receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module;
the gain controller module adjusts the amplitude or power of the received analog audio signal according to the control information and outputs the adjusted analog audio signal;
the analog signal adder fuses the analog audio signal output by the gain controller module and the analog detection signal output by the temperature detection signal generation module to form a fused signal and outputs the fused signal to the power amplifier;
the power amplifier drives the loudspeaker and outputs a current signal and a voltage signal;
the signal converter converts the current signal and the voltage signal into digital signals;
the signal processing module calculates the temperature information of the loudspeaker according to the digital signal and transmits the temperature information to the temperature control algorithm module;
and the temperature control algorithm module sends control information to the gain controller module according to the temperature information so as to control the analog audio signal output by the gain controller module.
Compared with the prior art, the invention has the following advantages:
(1) the invention is suitable for all platforms, including SOC platforms with or without ADSP, and can realize the temperature protection of the loudspeaker, thereby obtaining the sound effect with higher quality and adapting to the development of miniaturization and flattening.
(2) The invention greatly reduces the cost of the audio power amplifier with temperature protection and improves the popularization rate.
Drawings
FIG. 1 is a flow chart of the operation of a prior art device to implement speaker temperature protection;
fig. 2 is a flowchart of a work flow for implementing speaker temperature protection according to an embodiment of the present invention.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Hereinafter, if the method described herein comprises a series of steps, the order of such steps presented herein is not necessarily the only order in which such steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method.
Compared with the analog interface audio amplifier, the digital interface audio amplifier in the prior art has higher cost; the platform SOC with the ADSP built in is owned by a single supplier, so that it is difficult to control the temperature of the speaker due to cost consideration or use of the device without the ADSP built in, resulting in failure to obtain a better sound effect.
Therefore, it is necessary to provide a system for implementing speaker temperature protection, as shown in fig. 2, fig. 2 is a flowchart of a work flow for implementing speaker temperature protection according to an embodiment of the present invention, where the system includes:
the system comprises a CODEC chip, a signal receiving module connected with the CODEC chip through an analog interface, a gain controller module connected with the output end of the signal receiving module, a temperature detection signal generating module, an analog signal adder fusing an output signal of the gain controller module and an output signal of the temperature detection signal generating module, a power amplifier connected with the output end of the analog signal adder, a loudspeaker connected with the output end of the power amplifier, a signal converter connected with the output end of the power amplifier, a signal processing module connected with the output end of the signal converter and a temperature control algorithm module connected with the output end of the signal processing module;
wherein, the CODEC chip sends out analog audio signals;
the signal receiving module receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module;
the gain controller module adjusts the amplitude or power of the received analog audio signal according to the control information and outputs the adjusted analog audio signal;
the analog signal adder fuses the analog audio signal output by the gain controller module and the analog detection signal output by the temperature detection signal generation module to form a fused signal and outputs the fused signal to the power amplifier;
the power amplifier drives the loudspeaker and outputs a current signal and a voltage signal;
the signal converter converts the current signal and the voltage signal into digital signals;
the signal processing module calculates the temperature information of the loudspeaker according to the digital signal and transmits the temperature information to the temperature control algorithm module;
the temperature control algorithm module sends control information to the gain controller module according to the temperature information so as to control the analog audio signal output by the gain controller module, wherein the control information is a gain control code.
The invention integrates a temperature control algorithm module in the loudspeaker, outputs a gain control code by detecting the real-time coil temperature of the loudspeaker and the predicted safe working temperature range of the loudspeaker, controls a gain controller module, and adjusts the amplitude or power of an analog audio signal under the condition of need, thereby finally ensuring that the loudspeaker works in a safe temperature environment and achieving the optimal sound effect.
Optionally, in the system for implementing speaker temperature protection, the temperature detection signal generation module includes an OSC sub-module, a DDS sub-module, and a DAC sub-module.
Furthermore, the OSC sub-module is a built-in frequency generator for generating a clock signal with high precision; the DDS submodule is a frequency synthesizer and generates a digital signal for temperature detection, and the digital signal has higher precision and stability; the DAC submodule is a digital-to-analog conversion circuit and is used for converting a digital signal into an analog detection signal.
Optionally, in the system for implementing speaker temperature protection, the signal converter is an ADC, and is configured to convert the current signal and the voltage signal into digital signals.
Preferably, the power amplifier outputs two paths of current signals and voltage signals, and two ADCs are arranged to collect and convert the current signals and the voltage signals of the respective paths respectively.
Optionally, in the system for implementing speaker temperature protection, the signal receiving module, the gain controller module, the temperature detecting signal generating module, the analog signal adder, the power amplifier, the signal converter, the signal processing module, and the temperature control algorithm module all belong to an internal structure of an analog audio power amplifier in the system. Because each module for temperature protection is embedded in the analog audio power amplifier, the invention does not need to be supported by a platform with built-in ADSP, and has advantages in use range and cost. In addition, the analog audio power amplifier adopts the analog interface to be connected with the CODEC chip, so that the analog audio power amplifier is simpler in production process and lower in cost.
Preferably, the CODEC chip is used for converting the audio data stream into an analog audio signal and is connected with an analog audio power amplifier through an analog interface; because the CODEC chip is a standard product, the system can be universally used by any platform, and the applicability of the system is improved.
Furthermore, a signal receiving module in the analog audio power amplifier receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module. The gain controller module is used for adjusting the gain of the analog audio signal, and is controlled by the temperature control algorithm module after the temperature of the temperature information feedback loudspeaker exceeds a set threshold value, and the gain controller module smoothly controls the output signal so as to ensure that the loudspeaker works in a safe environment.
Preferably, the system can also integrate software and/or hardware for enhancing sound effects, and other related software and hardware can be integrated into the system.
The present invention further provides a method for implementing speaker temperature protection, which adopts the above system, please continue to refer to fig. 2, and the method includes the following steps:
the CODEC chip sends out an analog audio signal;
the signal receiving module receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module;
the gain controller module adjusts the amplitude or power of the received analog audio signal according to the control information and outputs the adjusted analog audio signal;
the analog signal adder fuses the analog audio signal output by the gain controller module and the analog detection signal output by the temperature detection signal generation module to form a fused signal and outputs the fused signal to the power amplifier;
the power amplifier drives the loudspeaker and outputs a current signal and a voltage signal;
the signal converter converts the current signal and the voltage signal into digital signals;
the signal processing module calculates the temperature information of the loudspeaker according to the digital signal and transmits the temperature information to the temperature control algorithm module;
and the temperature control algorithm module sends control information to the gain controller module according to the temperature information so as to control the analog audio signal output by the gain controller module.
Compared with the prior art, the invention has the following advantages:
(1) the invention is suitable for all platforms, including SOC platforms with or without ADSP, and can realize the temperature protection of the loudspeaker, thereby obtaining the sound effect with higher quality and adapting to the development of miniaturization and flattening.
(2) The invention greatly reduces the cost of the audio power amplifier with temperature protection and improves the popularization rate.
(3) The invention realizes the temperature protection of the loudspeaker independent of the platform on the analog audio power amplifier chip with the analog interface.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A system for implementing speaker temperature protection, comprising:
the system comprises a CODEC chip, a signal receiving module connected with the CODEC chip through an analog interface, a gain controller module connected with the output end of the signal receiving module, a temperature detection signal generating module, an analog signal adder fusing an output signal of the gain controller module and an output signal of the temperature detection signal generating module, a power amplifier connected with the output end of the analog signal adder, a loudspeaker connected with the output end of the power amplifier, a signal converter connected with the output end of the power amplifier, a signal processing module connected with the output end of the signal converter and a temperature control algorithm module connected with the output end of the signal processing module;
wherein, the CODEC chip sends out analog audio signals;
the signal receiving module receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module;
the gain controller module adjusts the amplitude or power of the received analog audio signal according to the control information and outputs the adjusted analog audio signal;
the analog signal adder fuses the analog audio signal output by the gain controller module and the analog detection signal output by the temperature detection signal generation module to form a fused signal and outputs the fused signal to the power amplifier;
the power amplifier drives the loudspeaker and outputs a current signal and a voltage signal;
the signal converter converts the current signal and the voltage signal into digital signals;
the signal processing module calculates the temperature information of the loudspeaker according to the digital signal and transmits the temperature information to the temperature control algorithm module;
and the temperature control algorithm module sends control information to the gain controller module according to the temperature information so as to control the analog audio signal output by the gain controller module.
2. The system of claim 1, wherein the temperature detection signal generation module comprises an OSC sub-module, a DDS sub-module, and a DAC sub-module.
3. The system for implementing speaker temperature protection as claimed in claim 2, wherein said OSC sub-module is a built-in frequency generator for generating a clock signal; the DDS submodule is a frequency synthesizer and generates a digital signal for temperature detection; the DAC submodule is a digital-to-analog conversion circuit and is used for converting a digital signal into an analog detection signal.
4. The system for achieving speaker temperature protection according to claim 3, wherein the signal converter is an ADC for converting the current signal and the voltage signal into digital signals.
5. The system of claim 4, wherein the power amplifier outputs two current signals and two voltage signals, and two ADCs are provided to convert the current signals and the voltage signals, respectively.
6. The system of claim 1, wherein the signal receiving module, the gain controller module, the temperature detecting signal generating module, the analog signal adder, the power amplifier, the signal converter, the signal processing module, and the temperature control algorithm module belong to an internal structure of an analog audio power amplifier in the system.
7. The system for implementing speaker temperature protection as recited in claim 1, wherein the CODEC chip is configured to convert an audio data stream to an analog audio signal.
8. The system for implementing speaker temperature protection as recited in claim 1, wherein the system can integrate software and/or hardware for enhancing sound effects.
9. A method for achieving loudspeaker temperature protection, characterized in that, with the system of any one of claims 1 to 8, the following steps are included:
the CODEC chip sends out an analog audio signal;
the signal receiving module receives the analog audio signal through an analog interface and transmits the analog audio signal to the gain controller module;
the gain controller module adjusts the amplitude or power of the received analog audio signal according to the control information and outputs the adjusted analog audio signal;
the analog signal adder fuses the analog audio signal output by the gain controller module and the analog detection signal output by the temperature detection signal generation module to form a fused signal and outputs the fused signal to the power amplifier;
the power amplifier drives the loudspeaker and outputs a current signal and a voltage signal;
the signal converter converts the current signal and the voltage signal into digital signals;
the signal processing module calculates the temperature information of the loudspeaker according to the digital signal and transmits the temperature information to the temperature control algorithm module;
and the temperature control algorithm module sends control information to the gain controller module according to the temperature information so as to control the analog audio signal output by the gain controller module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110047176.2A CN112866874A (en) | 2021-01-14 | 2021-01-14 | System and method for realizing temperature protection of loudspeaker |
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| CN202110047176.2A CN112866874A (en) | 2021-01-14 | 2021-01-14 | System and method for realizing temperature protection of loudspeaker |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002223492A (en) * | 2001-01-29 | 2002-08-09 | Victor Aakusu Kk | Control system for digital/analog conversion power amplifier |
| CN101877807A (en) * | 2010-06-18 | 2010-11-03 | 中兴通讯股份有限公司 | Loudspeaker and method for playing sound source |
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- 2021-01-14 CN CN202110047176.2A patent/CN112866874A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002223492A (en) * | 2001-01-29 | 2002-08-09 | Victor Aakusu Kk | Control system for digital/analog conversion power amplifier |
| CN101877807A (en) * | 2010-06-18 | 2010-11-03 | 中兴通讯股份有限公司 | Loudspeaker and method for playing sound source |
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