CN112770060A

CN112770060A - Optical element driving mechanism

Info

Publication number: CN112770060A
Application number: CN202110245712.XA
Authority: CN
Inventors: 彭坤; 林聪�; 刘富泉; 吕新科; 其他发明人请求不公开姓名
Original assignee: Henan Hozel Electronics Co Ltd
Current assignee: Henan Haoze Electronics Co ltd Kunshan Branch
Priority date: 2021-03-05
Filing date: 2021-03-05
Publication date: 2021-05-07

Abstract

The invention discloses an optical element driving mechanism which comprises an upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, a ball, a bottom circuit board and a base, wherein the upper reed movably connects the carrier and the upper cover, the lower reed movably connects the carrier and the base, the bottom circuit board is arranged on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the ball, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly arranged on the upper cover and matched with the first group of coils to drive the carrier to move and matched with the second group of coils to drive the base to move. The invention realizes optical zooming and optical anti-shake through different component movements, and solves the problem of blurred pictures caused by hand shake in the shooting process.

Description

Optical element driving mechanism

Technical Field

The invention relates to the field of optical drive, in particular to an optical element driving mechanism.

Background

With the development of technology, many electronic devices (such as smart phones or digital cameras) have a function of taking pictures or recording videos. The use of these electronic devices is becoming more common and the design direction of these electronic devices is being developed to be more convenient and thinner to provide more choices for users. However, sometimes the photos shot in the current mobile phone shooting process are blurred, that is, the shot pictures are not clear enough, and even ghost images or blur occur. These causes, in addition to occasional defocus (i.e., the camera fails to focus properly), are largely due to slight jitter that occurs when the photographic scene is exposed.

Generally, such a slight shake often occurs in a handheld condition, and thus a lens deviation of the image pickup apparatus is caused, so that the quality of an image captured by the image sensor is deteriorated. Therefore, in recent years, the demand for developing the anti-shake function is relatively large.

However, most of the prior art implements the optical zoom and the optical anti-shake functions through the movement of the same component (carrier), and the movement range of the carrier is limited by weight, volume and the like, so that the trouble of taking blurred pictures due to hand shake in the shooting process cannot be effectively solved.

Disclosure of Invention

The invention aims to provide an optical element driving mechanism, which is used for realizing optical zooming and optical anti-shake through different component movements, so as to solve the problem of blurred photos caused by hand shake in the shooting process.

In order to solve the above-mentioned problems, according to an aspect of the present invention, there is provided an optical element driving mechanism, the optical element driving mechanism comprises an upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, a ball, a bottom circuit board and a base, the upper reed movably connects the carrier with the upper cover, the lower reed movably connects the carrier with the base, the bottom circuit board is arranged on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the ball, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly installed on the upper cover and matched with the first group of coils to drive the carrier to move and the second group of coils to drive the base to move.

In one embodiment, the upper cover is further provided with an upper cover embedded metal sheet, the middle of the upper cover is provided with an upper cover central opening to be matched with the optical element, a magnet installation part is arranged around the upper cover central opening, the magnet group is installed on the magnet installation part, the upper cover embedded metal sheet comprises a magnet matching part, and the magnet matching part is arranged on the magnet installation part and is arranged above the magnet group.

In one embodiment, the upper cover embedded metal sheet further includes a sensor connection portion, a circuit introduction portion, and an external circuit connection portion, the external circuit connection portion and the circuit introduction portion being electrically connected to the sensor connection portion.

In one embodiment, the upper cover is provided with a magnet metal sheet, the magnet metal sheet is fixedly connected with the upper cover, and the magnet group is installed on the side surface of the magnet metal sheet.

In one embodiment, the upper cover is provided with four magnet metal sheets which are fixedly arranged on the inner walls of four side parts of the upper cover respectively, and the magnet groups comprise four magnets which are fixedly arranged on the side surfaces of the four magnet metal sheets respectively.

In one embodiment, the magnet metal sheet comprises a main body plate-shaped part, a buckling part and an embedded part, wherein the buckling part is formed by extending from the top of the main body plate-shaped part to one side, the embedded part is formed by extending from the top of the main body plate-shaped part to the other side, the embedded part is embedded into an upper cover to fixedly connect the magnet metal sheet with the upper cover, and the buckling part is used for clamping the magnet group.

In one embodiment, the base is provided with a base-embedded metal sheet and a ball mounting groove, the ball being mounted in the ball mounting groove, the base-embedded metal sheet being disposed in the base and provided with a ball coupling portion, the ball coupling portion being disposed in the ball mounting groove of the base and being in contact with the ball.

In one embodiment, the carrier is provided with a damping rubber groove, the inner side of the ball joint part of the metal sheet embedded in the base is provided with an avoiding hole, a protruding sheet extending upwards is arranged close to the avoiding hole, and the protruding sheet is matched with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to buffer the movement of the carrier.

In one embodiment, the metal sheet embedded in the base is provided with four protruding sheets, and the carrier is provided with four damping rubber grooves, and one protruding sheet is arranged in each damping rubber groove.

In one embodiment, the base is integrally formed into a rectangular structure and comprises a bottom plate and side parts integrally and upwards extending from the periphery of the bottom plate, the middle part of the bottom plate is provided with a base center hole for matching with a lens, and four corners of the bottom plate are provided with bulges which are matched with the upper cover; the inboard of lateral part is equipped with the magnetite and dodges the hole, the magnetite dodge the hole with second group coil in the bottom circuit board with the lower surface of magnetite group corresponds the cooperation, makes the lower surface of magnetite group directly faces in the circuit board second group coil.

According to another aspect of the present invention, there is also provided an upper cover of an optical element driving mechanism, the optical element driving mechanism including the upper cover, an upper spring, a magnet group, a carrier, a lower spring, a pedestal, balls, a bottom circuit board, and a base,

the upper reed is used for connecting the carrier with the upper cover in a movable manner, the lower reed is used for connecting the carrier with the base in a movable manner, the bottom circuit board is arranged on the base and fixedly connected with the base, the base is used for installing a chip and is movably connected with the base through the rolling balls, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, the magnet group is fixedly arranged on the upper cover and is matched with the first group of coils to drive the carrier to move and is matched with the second group of coils to drive the base to move, and the upper cover is further provided with an upper cover embedded metal sheet.

In one embodiment, the middle part of the upper cover is provided with an upper cover central opening to be matched with the optical element, a magnet installation part is arranged around the upper cover central opening, the magnet group is installed on the magnet installation part, the metal sheet embedded in the upper cover comprises a magnet matching part, and the magnet matching part is arranged on the magnet installation part and is arranged above the magnet group.

In one embodiment, the magnet fitting portion is independent of the sensor connecting portion, the circuit introducing portion, and the external circuit connecting portion.

In one embodiment, one end of the circuit introduction part is electrically connected to the sensor connection part, and the other end of the circuit introduction part is electrically connected to the upper spring.

In one embodiment, the circuit lead-in part is lower than the middle body part of the circuit lead-in part in a height direction, at an end where the upper spring plate is connected and at an end where the sensor connection part is connected.

In one embodiment, the metal sheet embedded in the upper cover comprises four magnet matching parts, and the magnet group comprises four magnets, and the four magnet matching parts are respectively positioned above the four magnets.

In one embodiment, the upper cover embedded metal sheet includes two circuit lead-in parts which are arranged at diagonal positions and electrically connected with two circuit access parts of the upper spring sheet, respectively.

In one embodiment, the external circuit connecting part is bent by 180 degrees to be connected with the sensor connecting part, and one magnet matching part is arranged in an area surrounded by the bent external circuit connecting part.

In one embodiment, the inner surface of the upper cover is provided with an upper spring fixing part, and the circuit leading-in part of the base embedded with the metal sheet is positioned in the upper spring fixing part.

the upper reed is used for connecting the carrier with the upper cover in a movable manner, the lower reed is used for connecting the carrier with the base in a movable manner, the bottom circuit board is arranged on the base and fixedly connected with the base, the base is used for mounting a chip and is movably connected with the base through the rolling balls, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, the magnet group is fixedly arranged on the upper cover and is matched with the first group of coils to drive the carrier to move and is matched with the second group of coils to drive the base to move, and the magnet group is fixedly arranged on the upper cover and is matched with the first group of coils

The upper cover is provided with a magnet metal sheet, the magnet metal sheet is fixedly connected with the upper cover, and the magnet group is arranged on the side surface of the magnet metal sheet.

In one embodiment, the top of the plate-like portion of the main body is integrally formed with two catching portions, and the embedded portion is formed to protrude from a position between the two catching portions to the other side.

In one embodiment, the fastening portion and the embedding portion extend upwards from the top of the main plate-shaped portion for a certain distance and then extend towards two sides respectively, wherein the upwards protruding height of the fastening portion is lower than the upwards protruding height of the embedding portion.

In one embodiment, the insertion portion extends vertically upward a first distance d1 and then extends in a first direction, and the locking portion extends vertically upward a second distance d2 and then extends in a second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction.

In one embodiment, the height of the main plate-like portion of the magnet metal piece is smaller than the height of the magnet, and a portion of the bottom of the magnet extends out of the magnet metal piece when the magnet is mounted on the magnet metal piece.

In one embodiment, the middle part of the upper cover is provided with an upper cover central opening to be matched with the optical element, a magnet mounting part is arranged around the upper cover central opening, and the magnet group is mounted on the magnet mounting part.

In one embodiment, the upper cover is further provided with an upper cover embedded metal sheet, and the upper cover embedded metal sheet comprises a magnet matching portion, and the magnet matching portion is arranged on the magnet mounting portion and arranged above the magnet group.

In one embodiment, the inner surface of the upper cover is provided with an upper spring fixing part, and the upper cover embedded metal sheet comprises a circuit lead-in part which is arranged in the upper spring fixing part.

According to another aspect of the present invention, there is also provided a mount of an optical element driving mechanism, the optical element driving mechanism including an upper cover, an upper spring, a magnet group, a carrier, a lower spring, the mount, balls, a bottom circuit board, and a base,

The base is equipped with embedded sheetmetal of base and ball mounting groove, the ball install in the ball mounting groove, the embedded sheetmetal of base set up in the base and be equipped with the ball joint portion, the ball joint portion arrange in the ball mounting groove of base and with the ball contact.

In one embodiment, each corner of the lower surface of the base is provided with one ball mounting groove, and the base insert metal sheet is provided with one ball coupling portion at a position corresponding to each of the ball mounting grooves.

In one embodiment, the inner side of the ball joint part of the metal sheet embedded in the base is provided with an avoiding hole, a protruding sheet extending upwards is arranged close to the avoiding hole, and the protruding sheet is matched with a damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to buffer the movement of the carrier.

In one embodiment, the ball joint is provided as a rectangular sheet having a length and a width equal to or greater than a diameter of the ball.

In one embodiment, the ball joint is provided as a circular sheet having a diameter equal to or greater than the diameter of the ball.

In one embodiment, the base is formed in a rectangular structure integrally and comprises a bottom plate and side parts integrally and upwards extending from the periphery of the bottom plate, a central base hole is formed in the middle of the bottom plate to be matched with the lens, and protruding parts are formed at four corners of the bottom plate and are matched with the upper cover.

In one embodiment, the inner side of the protruding part is provided with a lower spring fixing column integrally and upwards extending from the bottom plate, and the lower spring fixing column is fixedly connected with the lower spring.

In one embodiment, the inboard of lateral part is equipped with the magnetite and dodges the hole, the magnetite dodge the hole with the second group coil in the bottom circuit board with the lower surface of magnetite group corresponds the cooperation, makes the lower surface of magnetite group directly faces the second group coil in the circuit board.

In one embodiment, the magnet group comprises four magnets, and the base is provided with four magnet avoiding holes around the central hole of the base.

According to another aspect of the present invention, there is also provided a carrier of an optical element driving mechanism, the optical element driving mechanism including an upper cover, an upper spring, a magnet group, the carrier, a lower spring, a pedestal, balls, a bottom circuit board, and a base,

The base is provided with a base embedded metal sheet, the carrier is provided with a damping glue groove, the base embedded metal sheet is provided with a protruding sheet, and the protruding sheet is installed in the damping glue groove.

In one embodiment, a plurality of carrier damping rubber grooves are formed in the bottom of the carrier, and are uniformly arranged around the central opening of the carrier.

In one embodiment, the carrier is provided with a lens mounting hole for mounting a lens, four carrier side parts and four carrier corners are formed around the lens mounting hole, the upper surface of the carrier is movably connected with the upper cover through an upper spring, and the lower surface of the carrier is movably connected with the base through a lower spring.

In one embodiment, the upper surface of the carrier is provided with an upper reed connecting column, and an upper reed carrier fixing part of the upper reed is fixedly connected to the upper reed connecting column.

In one embodiment, a coil mounting groove is arranged around the carrier, a first group of coils is arranged in the coil mounting groove, and the first group of coils is correspondingly matched with the magnet group so as to drive the carrier to move along the optical axis direction when the first group of coils is electrified.

In one embodiment, the upper surface of the carrier is further provided with an integral upper carrier stopper protruding upward to prevent the upper carrier surface from directly colliding with the upper cover during movement.

In one embodiment, the side portion of the carrier is further provided with a side sensor magnet mounting groove for mounting a side sensor magnet and cooperating with a side sensor to detect displacement of the carrier in the optical axis direction.

In one embodiment, the side of the carrier is further provided with a winding post, and the end of the first group of coils is arranged on the winding post.

In one embodiment, the carrier damping rubber groove is arranged at the bottom of the carrier and extends upwards for a certain distance, and the width of the carrier damping rubber groove is larger than that of the protruding piece of the embedded metal piece of the base.

In one embodiment, the lower surface of the carrier is further provided with an integral lower carrier stopper extending downward to prevent the lower carrier surface from directly colliding with the base during movement.

The utility model provides an optical element actuating mechanism drives the chip motion through the base and realizes optics anti-shake, and creatively utilize the ball to move in the chip scheme, owing to connect base and base through the ball, can strengthen the intensity of whole component, and through set up sheetmetal and gasket in the ball mounting groove and the ball installation department at the installation ball, make the ball not direct and base contact, but with sheetmetal and gasket contact, the wearing and tearing of base and base have been reduced, the life of mechanism has been prolonged.

Drawings

Fig. 1 is a perspective view of an optical element driving mechanism according to an embodiment of the present invention.

Fig. 2 is a perspective view of the base of fig. 1.

Fig. 3 is a bottom view of the base of fig. 1.

Fig. 4 is a perspective view of the metal sheet embedded in the base of fig. 1.

Fig. 5 is a bottom view of the circuit board of fig. 1.

Fig. 6 is a perspective view of the base of fig. 1.

Fig. 7 is a top view of the assembly formed by the circuit board of fig. 1 mounted on a base.

Fig. 8 is a perspective view of the carrier of fig. 1.

Fig. 9 is a top view of the assembly formed by the mounting of the upper spring to the carrier.

Fig. 10A is a bottom view of the upper cover with the upper cover insert sheet metal installed.

Fig. 10B is a perspective view of the upper cover with the metal sheet embedded therein.

Fig. 11 is a bottom view of the lens driving mechanism of one embodiment of the present invention, in which the chassis, the base, and the circuit board are not mounted.

Fig. 12 is a plan view of a lens driving mechanism according to an embodiment of the present invention.

Fig. 13 is a sectional view of the lens driving mechanism of fig. 12 taken along line a-a.

Fig. 14 is a sectional view of the lens driving mechanism of fig. 12 taken along the line C-C.

Fig. 15 is a top view of the carrier of fig. 1 mated with a base.

Fig. 16 is a cross-sectional view of the assembly of fig. 15 taken along line B-B.

Fig. 17 to 18 are perspective views of a magnet metal piece with a magnet attached thereto from different angles according to an embodiment of the present invention.

FIG. 19 is a perspective view of a magnet metal piece without a magnet attached thereto according to an embodiment of the present invention. .

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the invention can be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are merely intended to illustrate the spirit of the technical solution of the present invention.

In the following description, for the purposes of illustrating various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details. In other instances, well-known devices, structures and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the following description, for the purposes of clearly illustrating the structure and operation of the present invention, directional terms will be used, but terms such as "front", "rear", "left", "right", "outer", "inner", "outer", "inward", "upper", "lower", etc. should be construed as words of convenience and should not be construed as limiting terms.

The present disclosure relates generally to an optical element driving mechanism, which can be used in a terminal product such as a mobile phone and a tablet computer to cooperate with a lens to achieve functions of taking pictures and recording videos. The optical element driving mechanism can comprise an upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, a ball, a bottom circuit board and a base, wherein the upper reed can movably connect the carrier and the upper cover, the lower reed can movably connect the carrier and the base, the bottom circuit board is arranged on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the ball, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, the magnet group is fixedly arranged on the upper cover and matched with the first group of coils to drive the carrier to move, for example, the magnet group moves along the direction of an optical axis to realize an optical zooming function, and the magnet group is matched with the second group of coils to drive the base to move, for example, the magnet group moves on a plane perpendicular to the direction of the optical axis or. Some embodiments of the present invention will now be described in detail with reference to the accompanying drawings, it being understood that these embodiments are exemplary and are intended to provide an understanding of the invention therethrough.

Fig. 1 is a perspective view of an optical element driving mechanism 100 according to an embodiment of the present invention. As shown in fig. 1, the optical element driving mechanism 100 includes an upper cover 10, an upper cover embedded metal sheet 11, an upper spring sheet 20, a magnet group 30, an electronic element 31, a carrier 40, a lower spring sheet 50, a base 60, a base embedded metal sheet 61, balls 70, a spacer 71, a circuit board 80, and a base 90. An upper cover embedded metal sheet 11 is arranged in an upper cover 10, a base embedded metal sheet 61 is arranged in a base 60, an electronic element 31 is arranged on the inner surface of the upper cover 10 and is electrically connected with the upper cover embedded metal sheet 11, a carrier 40 is used for bearing an optical element such as a camera and is movably arranged on the base 60, a circuit board is fixedly arranged on a base 90, wherein the carrier 40 is provided with a first group of coils, a second group of coils is arranged in the circuit board 80, the base 90 is used for installing an imaging chip and is movably connected with the base 60 through a ball 70, the base 90 is movably connected with the carrier 40 through a lower spring 50, the upper cover 10 is movably connected with the carrier 40 through an upper spring 20, a magnet group 30 is arranged on the base 60 and is matched with the first group of coils to drive the carrier 40 to move along the direction of an optical axis to realize functions such as automatic focusing and is matched with the second group of coils to drive the base 90 to move on a plane perpendicular to the optical axis The wire is rotated to realize the optical anti-shake function.

The application's optical element drive arrangement's motion mode is different from conventional optical element drive arrangement, and conventional optical element drive arrangement realizes optics through the motion of drive carrier along the optical axis direction and zooms, realizes optics anti-shake through the motion of drive carrier on the plane of perpendicular to optical axis, and this application then realizes optics through the motion of drive carrier along the optical axis direction and zooms, drives the chip on the base through the drive base and moves on the plane of perpendicular to optical axis and realize optics anti-shake. The chip mainly refers to an imaging chip, and because a zooming moving part is different from an optical anti-shake moving part, the movement in a wider range can be realized, and more excellent zooming and anti-shake effects can be realized, so that better imaging quality can be obtained.

In addition, be connected through the ball between the base of this application and the base, in other words, the base passes through the ball and supports on the base, consequently, the base can realize wider motion for base and the carrier of being connected with the base, realizes better anti-shake function. In addition, through ball connection base and the carrier of being connected with the base, can avoid taking place the hysteresis phenomenon, have the stable, the fast advantage of formation of image time of formation of image. The balls may be made of ceramic or rigid material, for example.

Fig. 2 is a perspective view of the base 60 of fig. 1, and fig. 3 is a bottom view of the base 60 of fig. 1. As shown in fig. 2 to 3, the base 60 is formed in a rectangular shape as a whole and includes a bottom plate 62 and side portions 63 integrally extending upward from the periphery of the bottom plate 62, a base center hole 621 is formed in the middle of the bottom plate 62 to be fitted with the lens, base protrusions 622 are formed at four corners of the bottom plate 62, lower spring fixing posts 623 integrally extending upward from the bottom plate 62 are provided on the inner side of the base protrusions 622, and the lower spring fixing posts 623 are used for being fixedly connected with the lower spring. The inner side of the side portion 63 is provided with a magnet avoiding hole 631, and the magnet avoiding hole 631 is correspondingly matched with the second group of coils in the circuit board 80 and the lower surface of the magnet group 50, so that the lower surface of the magnet group 50 directly faces the second group of coils in the circuit board to provide a larger anti-shake driving force.

Referring to fig. 3, each corner of the lower surface of the base 60 is provided with a ball mounting groove 632, and the ball 70 is mounted in the ball mounting groove 632. As shown in fig. 1-3, in the present embodiment, the magnet assembly 50 includes four magnets, and correspondingly, the base 60 is provided with four magnet avoiding holes 631 surrounding the base center hole 621, however, it will be understood by those skilled in the art that in other embodiments, the magnet assembly 50 may include two magnets, three magnets, etc., and correspondingly, three or four magnet avoiding holes may be provided on the base 60. That is, the number of magnets and the number of magnet avoiding holes included in the magnet group 50 are not limited, and an appropriate number of magnets and magnet avoiding holes may be selected according to the specific situation.

Fig. 4 is a perspective view of a base insert sheet 61 according to one embodiment of the present application. As shown in fig. 4, the base insert-metal sheet 61 is provided in the base 60 and provided with ball coupling parts 611 at four corners, the ball coupling parts 611 being disposed in the ball mounting grooves 632 of the base 60 and contacting the balls 70. Alternatively, the ball bonding part 611 is provided in a rectangular shape having a length and width substantially equal to or slightly larger than the diameter of the ball, or the ball bonding part 611 is provided in a circular shape having a diameter substantially equal to or larger than the diameter of the ball. The inner side of the ball joint part 611 is provided with a material reducing hole 612, a protruding piece 613 extending upwards is arranged close to the material reducing hole 612, and the protruding piece 613 is matched with the damping rubber groove at the bottom of the carrier 40 and extends into the damping rubber groove to play a role in buffering the movement of the carrier 40.

Fig. 5 is a bottom view of the circuit board 80, the circuit board 80 is mounted on the base 90 and integrally forms a rectangular structure, notches 83 are formed at four corners of the rectangular structure to avoid the ball mounting portion of the base 60, a circuit board center hole 81 is formed at a middle portion of the circuit board 80, and the circuit board center hole 81 is engaged with a base center hole 621 of the base 60 and is provided with a plurality of circuit conduction portions 82 along a peripheral portion. One surface of the circuit board 80 may further be provided with one or more electronic components 31 (see fig. 1), the electronic components 31 may be electrically connected to the circuit vias 82, for example, and the circuit board 80 is further provided with base positioning holes 85, and the base positioning holes 85 are matched with circuit board positioning columns on the base 90, so as to fix the circuit board 80 to the upper surface of the base 90.

Fig. 6 is a perspective view of a base 90 of one embodiment of the present application. As shown in fig. 6, the base 90 is formed in a rectangular structure as a whole and is provided with a chip mounting hole 91 at the center to mount a chip, which mainly refers to an imaging chip, an image is generated on the chip by light entering through an optical element, ball mounting parts 92 are provided at four corners of the base 90, the ball mounting parts 92 are fitted with ball mounting grooves 632 on the base 60 to mount the balls 70, and the balls 70 are disposed in the ball mounting grooves 632 and the ball mounting parts 92. It should be noted that the ball mounting portion 92 is merely a term used for convenience of description, and may be embodied in the form of a recess, a depressed portion, a circular hole, or the like. A spacer 71 is provided in each of the ball mounting portions 92, and the spacer 71 may be made of the same material as the base insert metal piece 61, for example.

Fig. 7 is a top view of the assembly formed by the circuit board 80 mounted on the base 90. As shown in fig. 7, the four notches 83 of the circuit board 80 are recessed from the ball mounting portion 92 of the base 90, and the positioning holes 85 of the circuit board 80 are engaged with the positioning posts 93 on the base 90, so that the circuit board 80 is fixedly mounted on the base 90.

Fig. 8 is a perspective view of the carrier 40. As shown in fig. 8, the carrier 40 is provided with lens mounting holes 41 to mount lenses, and four carrier sides and four carrier corners are formed around the lens mounting holes 41. The surface of the carrier 40 facing the housing is defined as an upper surface, and the surface facing the base is defined as a lower surface, the upper surface of the carrier 40 is movably connected with the upper cover 10 through the upper spring 20, the lower surface of the carrier 40 is movably connected with the base 60 through the lower spring 50, specifically, the upper surface of the carrier 40 is provided with an upper spring connecting column 42, and the upper spring carrier fixing part 22 of the upper spring 20 is fixedly connected with the upper spring connecting column 42.

A coil mounting groove 47 (refer to fig. 16) is provided around the carrier 40, a first group of coils 46 (refer to fig. 13) is provided in the coil mounting groove 47, and the first group of coils 46 is correspondingly fitted with the magnet group 50 to drive the carrier 40 to move in the optical axis direction when the first group of coils 46 is energized. The upper surface of the carrier 40 is further provided with an integral upper carrier stopper 43, and the carrier 40 is prevented from directly colliding with the upper cover 10 during movement by the upper carrier stopper 43. The side of the carrier 40 is also provided with a side sensor magnet mounting groove 44, and the sensor magnet mounting groove 44 is used for mounting a side sensor magnet and cooperates with a side sensor to detect displacement of the carrier 40 in the optical axis direction. The lower surface of the carrier 40 is further provided with a damping rubber groove 45 with an opening facing the base and extending upwards along the optical axis direction, and damping rubber is mounted in the damping rubber groove 45 and accommodates the protruding piece 613 on the base embedded metal sheet 61. The protruding piece 613 of the embedded metal sheet 61 of the base is creatively matched with the damping rubber groove 45, so that the carrier movement can be well buffered.

Fig. 9 is a plan view of an assembly formed by mounting the upper spring plate 20 on the carrier 40. As shown in fig. 9, the upper leaf spring 20 has an upper cover fixing portion 21 and an upper leaf spring carrier fixing portion 22, the upper cover fixing portion 21 and the upper leaf spring carrier fixing portion 22 are movably connected by an upper leaf spring portion 23, the upper cover fixing portion 21 is fixedly connected to the upper cover 10, and the upper leaf spring carrier fixing portion 22 is fixedly connected to an upper leaf connecting post 42 of the carrier 40. The upper spring 20 is further provided with a coil connecting portion 24, the coil connecting portion 24 is electrically connected to the first group of coils on the carrier 40, and the upper cover connecting portion 21 is electrically connected to the upper cover embedded metal sheet 20, so that the current of the upper cover embedded metal sheet is conducted to the first group of coils on the carrier through the upper spring 20 to drive the carrier 40 to move in the optical axis direction.

Fig. 10A is a bottom view of the upper cover 10 with the upper cover insert metal piece 11 mounted. As shown in fig. 10A, the upper cover fitting metal piece 11 is provided in the upper cover 10, the upper spring piece fixing portions 13 are provided at four corners of the upper cover 10, and the upper cover fixing portions 21 of the upper spring piece 20 are fixed to the upper spring piece fixing portions 13. The upper-cover-embedded metal sheet 11 is provided with a circuit introduction portion 111, and the circuit introduction portion 111 is disposed in the upper-spring-fixing portion 13 of the upper cover 10 and electrically connected to the upper spring 20, thereby introducing the current of the upper-cover-embedded metal sheet 11 to the upper spring 20. The upper cover embedded metal sheet 11 is further provided with an external circuit connecting portion 112, the external circuit connecting portion 112 extending outside the outer periphery of the upper cover 11 and being used for connecting an external circuit, the external circuit connecting portion 112 being electrically connected to the circuit introducing portion 111 so as to introduce an external current to the upper spring plate 20 through the upper cover embedded metal sheet 11.

Fig. 10B is a perspective view of the upper cover insert-in metal piece 11. As shown in fig. 10B, the upper cover embedded metal sheet 11 is embedded in the upper cover 10 to increase the strength of the upper cover 10 as a whole, the upper cover embedded metal sheet 11 includes a magnet matching portion 113, a sensor connecting portion 114, a circuit introducing portion 111, and an external circuit connecting portion 112 as a whole, the four magnet matching portions 113 are arranged above the magnet group 30 and are independent of the sensor connecting portion 114, the circuit introducing portion 111, and the external circuit connecting portion 112, the sensor connecting portion 114 is electrically connected to the sensor, and the external circuit connecting portion 112 and the circuit introducing portion 111 are electrically connected to the sensor connecting portion 114. Wherein one end of the circuit introduction part 111 is connected to the sensor connection part 114 and the other end is electrically connected to the upper spring 20, preferably, one end of the circuit introduction part 111 connected to the upper spring 20 and one end connected to the sensor connection part 114 are lower than a middle body portion of the circuit introduction part 111 in a height direction, that is, both ends of the circuit introduction part 111 are sunk with respect to the entire upper cover insert metal sheet 11 to be electrically connected to the upper spring 20 and the sensor connection part 114.

Fig. 11 is a bottom view of the lens driving mechanism of one embodiment of the present invention, in which the chassis, the base, and the circuit board are not mounted. As shown in fig. 11, the lower spring 50 is provided with a base fixing portion 51 and a lower spring carrier fixing portion 52, and the base fixing portion 51 and the lower spring carrier fixing portion 52 are movably connected by a lower spring elastic portion 53. Wherein, the base fixing part 51 is fixedly connected with the base 60, and the lower spring carrier fixing part 52 is fixedly connected with the lower surface of the carrier 40, so that the carrier 40 is movably connected with the base 60 through the lower spring 50. As is apparent from fig. 11, the lower surface of the carrier 40 is provided with a damping rubber groove 45 extending in the optical axis direction, and the damping rubber groove 45 is used for mounting damping rubber and is engaged with the protrusion piece 613 of the base insert metal piece 61, that is, the protrusion piece 613 of the base insert metal piece 61 protrudes into the damping rubber groove 45, wherein the size of the protrusion piece 613 is preferably set smaller than that of the damping rubber groove 45, so that the protrusion piece 613 can move in the damping rubber groove 45.

Fig. 12 is a plan view of the lens driving mechanism 100 according to one embodiment of the present invention. Fig. 13 is a sectional view of the lens driving mechanism of fig. 12 taken along line a-a, fig. 14 is a sectional view of the lens driving mechanism of fig. 12 taken along line C-C, fig. 15 is a plan view of the carrier engaged with the base, and fig. 16 is a sectional view of the assembly of fig. 15 taken along line B-B. As shown in fig. 12 to 16, a first set of coils 46 is disposed on the carrier 40, the magnet assembly 30 is fixedly mounted in the upper cover 10 and is disposed opposite to the first set of coils 46, the upper surface of the carrier 40 is movably connected to the upper cover 10 through the upper spring 20, the lower surface of the carrier 40 is movably connected to the base 60 through the lower spring 50, the circuit board 80 is fixedly mounted on the base 90 and is internally provided with a second set of coils 86, and the second set of coils 86 is disposed below the magnet assembly 30 and is engaged with the magnet assembly 30 to drive the base 90 to move the chip when energized, for example, move on a plane perpendicular to the optical axis or rotate around mutually perpendicular axes on a plane perpendicular to the optical axis, thereby achieving an optical anti-shake function. A bottom sensor 92 is also provided on the base 90, the bottom sensor 92 being located below the second set of coils and the magnet set 50 to detect displacement of the assembly of carrier, cover and base in a direction perpendicular to the optical axis.

Referring to fig. 14, the base 60 is connected to the base 90 by a ball 70. Specifically, the balls 70 are mounted in the ball mounting portion 92 of the base 90 and the ball mounting groove 632 of the base 60, the ball mounting groove 632 and the ball mounting portion 92 cooperate to form a space having a size larger than that of the balls 70, and the balls 70 can freely roll in the ball mounting groove 632 and the ball mounting portion 92. The balls 70 are respectively contacted with the ball combination portion 611 of the base embedded metal sheet 61 in the ball mounting groove 632 and the gasket 71 of the ball mounting portion 92, when the second group of coils 86 in the circuit board 80 are energized, electromagnetic induction is formed with the magnet group 50, and the base 90 is driven to drive the chip (not shown) to move, because the base 90 is connected with the base 60 through the balls 70, the base 60 and the carrier 40 connected with the base 60 move relative to each other through the movement of the balls 70, thereby realizing the optical anti-shake function.

Referring to fig. 13 in conjunction with fig. 16, when the first set of coils 46 is energized, it cooperates with the magnet set 50 and drives the carrier 40 to move in the optical axis direction relative to the base 60 by the action of ampere force, implementing an optical zoom function. Because the protruding piece 63 of the metal sheet embedded in the base extends into the damping rubber groove 45 and is surrounded by the damping rubber (not shown), the movement of the carrier can be better buffered.

The magnet metal pieces 32 of the upper cover 10 according to one embodiment of the present application will be described with reference to fig. 17 to 19. Fig. 17 to 18 are perspective views of the magnet metal piece 32 with the magnet attached thereto from different viewing angles, and fig. 19 is a perspective view of the magnet metal piece 32 without the magnet attached thereto. As shown in fig. 17 to 19, the magnet metal pieces 32 are provided outside the magnets 30, the magnet metal pieces 32 are fixedly attached to the inner walls of the four side portions of the upper cover 10, and the magnets 30 are fixedly attached to the inner surfaces of the magnet metal pieces 32. Specifically, the magnet metal sheet 32 includes a main body plate-like portion 321, a locking portion 322 formed to extend from the top of the main body plate-like portion 321 to one side, and an embedding portion 323 formed to extend from the top to the other side, the embedding portion 323 is embedded in the upper cover 10, and the locking portion 322 locks the magnet 30. Wherein, the top of the main body plate-like part 321 is integrally formed with two catching parts 322, and the embedding part 323 is formed to protrude from a position between the two catching parts 322 to the other side. The height of the upward protrusion of the locking portion 322 is lower than the height of the upward protrusion of the embedding portion 323, that is, the embedding portion 323 extends vertically upward for a first distance d1 and then extends toward the first direction, and the locking portion 322 extends vertically upward for a second distance d2 and then extends toward the second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction. By using the magnet metal sheet 32, on one hand, the magnetic field is regulated, and on the other hand, since the magnet is creatively fixedly mounted on the upper cover instead of being mounted on the base as in the conventional manner, the magnet 30 can be better fixed to the upper cover 10 by providing the magnet metal sheet 32.

While the preferred embodiments of the present invention have been illustrated and described in detail, it should be understood that various changes and modifications of the invention can be effected therein by those skilled in the art after reading the above teachings of the invention. Such equivalents are intended to fall within the scope of the claims appended hereto.

Claims

1. The utility model provides an optical element actuating mechanism, its characterized in that, optical element actuating mechanism includes upper cover, last reed, magnet group, carrier, lower reed, base, ball, bottom circuit board and base, it will to go up the reed the carrier with upper cover swing joint, lower reed will the carrier with base swing joint, bottom circuit board install in on the base and with base fixed connection, the base be used for installing the chip and with pass through between the base ball swing joint, wherein, the carrier is equipped with first group coil, the bottom circuit board is equipped with second group coil, magnet group fixed mounting in the upper cover and with first group coil cooperation is in order to drive the carrier motion and with second group coil cooperation is in order to drive the base motion.

2. The optical element driving mechanism according to claim 1, wherein the upper cover is further provided with an upper cover embedded metal sheet, the upper cover is provided with an upper cover central opening at a middle portion thereof for fitting with the optical element, a magnet mounting portion is provided around the upper cover central opening, the magnet group is mounted to the magnet mounting portion, and the upper cover embedded metal sheet includes a magnet fitting portion provided to the magnet mounting portion and arranged above the magnet group.

3. The optical element driving mechanism according to claim 2, wherein the upper cover embedded metal sheet further comprises a sensor connecting portion, a circuit introducing portion, and an external circuit connecting portion, the external circuit connecting portion and the circuit introducing portion being electrically connected to the sensor connecting portion.

4. The optical element driving mechanism according to claim 1, wherein said upper cover is provided with a magnet metal piece, said magnet metal piece is fixedly connected to said upper cover, and said magnet group is attached to a side surface of said magnet metal piece.

5. The optical element driving mechanism according to claim 4, wherein the upper cover is provided with four magnet metal pieces which are fixedly attached to inner walls of four side portions of the upper cover, respectively, and the magnet group includes four magnets which are fixedly attached to side surfaces of the four magnet metal pieces, respectively.

6. The optical element driving mechanism according to claim 4, wherein the magnet metal piece includes a main body plate-like portion and a catching portion formed to extend from a top of the main body plate-like portion to one side and an embedding portion formed to extend from the top of the main body plate-like portion to the other side, the embedding portion is embedded in an upper cover to fixedly connect the magnet metal piece and the upper cover, and the catching portion is used to catch the magnet group.

7. The optical element driving mechanism according to claim 1, wherein the base is provided with a base-embedded metal sheet and a ball mounting groove, the ball being mounted in the ball mounting groove, the base-embedded metal sheet being provided in the base and being provided with a ball engaging portion, the ball engaging portion being arranged in the ball mounting groove of the base and being in contact with the ball.

8. The optical element driving mechanism according to claim 7, wherein the carrier is provided with a damping rubber groove, an avoiding hole is formed in an inner side of the ball joint portion of the metal sheet embedded in the base, a protruding piece extending upward is arranged adjacent to the avoiding hole, and the protruding piece is matched with the damping rubber groove in the bottom of the carrier and extends into the damping rubber groove to buffer the movement of the carrier.

9. An optical element driving mechanism according to claim 8, wherein the base embedded metal sheet is provided with four said projecting pieces, and the carrier is provided with four damping rubber grooves, one said projecting piece being provided in each damping rubber groove.

10. The optical element driving mechanism according to claim 1, wherein said base is formed in a rectangular structure as a whole and includes a bottom plate and side portions integrally extended upward from the periphery of said bottom plate, a central portion of said bottom plate is formed with a base center hole to be fitted with a lens, four corners of said bottom plate are formed with projections to be fitted with said upper cover; the inboard of lateral part is equipped with the magnetite and dodges the hole, the magnetite dodge the hole with second group coil in the bottom circuit board with the lower surface of magnetite group corresponds the cooperation, makes the lower surface of magnetite group directly faces in the circuit board second group coil.