CN112551483B

CN112551483B - Manufacturing method of acoustic sensor packaging structure and acoustic sensor packaging structure

Info

Publication number: CN112551483B
Application number: CN202110190863.XA
Authority: CN
Inventors: 孙成富; 李利; 何正鸿
Original assignee: Forehope Electronic Ningbo Co Ltd
Current assignee: Forehope Electronic Ningbo Co Ltd
Priority date: 2021-02-20
Filing date: 2021-02-20
Publication date: 2021-05-07
Anticipated expiration: 2041-02-20
Also published as: CN112551483A

Abstract

The embodiment of the application provides a manufacturing method of a packaging structure of a sound-sensitive sensor and the packaging structure of the sound-sensitive sensor, which relate to the technical field of semiconductor manufacturing, and the manufacturing method of the packaging structure of the sound-sensitive sensor comprises the following steps: one side of the substrate is provided with an acoustic sensor chip; placing a cover body on one side of the substrate where the acoustic sensor chip is located, wherein the cover body comprises a sound inlet hole, the cover body is used for protecting the acoustic sensor chip, and the sound inlet hole is used for transmitting sound to the acoustic sensor chip; attaching a radio frequency chip to one side of the cover body far away from the side where the acoustic sensor chip is attached; selectively encapsulating the radio frequency chip to form a plastic package body, wherein the plastic package body does not cover the sound inlet hole; and manufacturing an antenna on the surface of the plastic package body to form a sound-sensitive sensor packaging structure, wherein the plastic package body can be used for realizing a stable sound-sensitive sensor packaging structure, and the radio frequency chip is used for realizing the diversification of the functions of the sound-sensitive sensor packaging structure.

Description

Manufacturing method of acoustic sensor packaging structure and acoustic sensor packaging structure

Technical Field

The application relates to the technical field of semiconductor manufacturing, in particular to a manufacturing method of a sound-sensitive sensor packaging structure and the sound-sensitive sensor packaging structure.

Background

The existing silicon wheat product utilizes the sound-sensitive sensor chip sensitive to sound pressure change to realize related functions, utilizes external sound pressure to directly contact with the sound-sensitive sensor chip, and can cause the sound-sensitive sensor chip to be broken under the condition that the intensity of the sound pressure change exceeds a certain threshold value. Moreover, the product manufactured by the sound-sensitive sensor chip and having only a single function of sound sensing cannot meet the increasing demands of users.

In view of the above, it is necessary for those skilled in the art to provide a manufacturing scheme for an acoustic sensor package structure with diversified functions and structural problems.

Disclosure of Invention

The application provides a manufacturing method of a sound-sensitive sensor packaging structure and the sound-sensitive sensor packaging structure.

The embodiment of the application can be realized as follows:

in a first aspect, the present application provides a method for manufacturing a package structure of an acoustic sensor, including:

one side of the substrate is provided with an acoustic sensor chip;

placing a cover body on one side of the substrate where the acoustic sensor chip is located, wherein the cover body comprises a sound inlet hole, the cover body is used for protecting the acoustic sensor chip, and the sound inlet hole is used for transmitting sound to the acoustic sensor chip;

attaching the radio frequency chip to one side of the cover body far away from the side where the acoustic sensor chip is attached;

selectively encapsulating the radio frequency chip to form a plastic package body, wherein the plastic package body does not cover the sound inlet hole;

and manufacturing an antenna on the surface of the plastic package body to form a packaging structure of the acoustic sensor.

In an alternative embodiment, an acoustic sensor chip is attached to one side of a substrate, comprising:

mounting an acoustic sensor chip and an integrated circuit chip on one side of a substrate;

arranging a first routing, wherein one end of the first routing is connected with the sound-sensitive sensor chip, and the other end of the first routing is connected with the integrated circuit chip, so that the sound-sensitive sensor chip and the integrated circuit chip are electrically connected;

and arranging a second routing, wherein one end of the second routing is connected with the acoustic sensor chip, and the other end of the second routing is connected with the substrate, so that the acoustic sensor chip and the substrate are electrically connected.

In an alternative embodiment, before attaching the rf chip to the side of the cover away from the side to which the acoustic sensor chip is attached, the method further comprises:

arranging a first bonding pad and a second bonding pad on one side of the substrate where the acoustic sensor chip is located, wherein the first bonding pad and the second bonding pad are not in the coverage range of the cover body;

paste the radio frequency chip dress to the lid and keep away from one side of dress subsides acoustic sensor chip, include:

arranging a signal feeder, wherein one end of the signal feeder is connected with the radio frequency chip, and the other end of the signal feeder is connected with the first bonding pad;

and a functional signal wire is arranged, one end of the functional signal wire is connected with the radio frequency chip, and the other end of the functional signal wire is connected with the second bonding pad.

In an alternative embodiment, the selective encapsulation of the rf chip to form a plastic package includes:

and selectively encapsulating one side of the cover body where the signal feeder line and the functional signal line are positioned to form a plastic package body, wherein the plastic package body is used for protecting the signal feeder line and the functional signal line.

In an alternative embodiment, the manufacturing of the antenna on the surface of the plastic package body includes:

forming an antenna pattern on the surface of the plastic package body by utilizing a laser grooving process;

forming a through hole to the substrate on one side of the plastic package body far away from the substrate by using a laser grooving process, wherein one side of the through hole far away from the substrate is in contact with the antenna pattern, and the through hole cuts off the signal feeder line;

filling a conductive material into the through hole so that the signal feeder line is restored to be conductive based on the conductive material;

and coating a conductive material on the antenna pattern to obtain the antenna.

In a second aspect, the present application provides a package structure of a sound sensor, including a substrate, a sound sensor chip, a cover, a radio frequency chip, a plastic package, and an antenna;

the acoustic sensor chip is positioned on one side of the substrate;

the cover body is positioned on one side of the substrate where the acoustic sensor is positioned and used for protecting the acoustic sensor chip, and the cover body comprises a sound inlet hole which is used for transmitting sound to the acoustic sensor chip;

the radio frequency chip is positioned on one side of the cover body far away from the acoustic sensor;

the plastic package body is selectively packaged on the surface of the cover body and is not covered with the sound inlet hole, and the plastic package body is used for protecting the radio frequency chip;

the antenna is positioned on the surface of the plastic package body.

In an optional embodiment, the acoustic sensor package structure further includes an integrated circuit chip, a first wire bonding and a second wire bonding;

the integrated circuit chip and the sound-sensitive sensor are positioned on the same side of the substrate, and the cover body is also used for protecting the integrated circuit chip;

one end of the first routing is connected with the integrated circuit chip, and the other end of the first routing is connected with the acoustic sensor chip, so that the acoustic sensor chip and the integrated circuit chip are electrically connected;

one end of the second routing is connected with the acoustic sensor chip, and the other end of the second routing is connected with the substrate, so that the acoustic sensor chip is electrically connected with the substrate.

In an alternative embodiment, the acoustic sensor package structure further includes a first pad, a second pad, a signal feed line, and a functional signal line;

the first bonding pad, the second bonding pad and the acoustic sensor are positioned on the same side of the substrate, and the first bonding pad and the second bonding pad are not in the coverage range of the cover body;

one end of the signal feeder line is connected with the radio frequency chip, and the other end of the signal feeder line is connected with the first bonding pad;

one end of the functional signal wire is connected with the radio frequency chip, and the other end of the functional signal wire is connected with the second bonding pad.

In an alternative embodiment, the plastic package body is selectively arranged on one side of the cover body and is also used for protecting the signal feeder line and the functional signal line.

In an optional embodiment, the plastic package body is provided with a through hole, and the acoustic sensor packaging structure further comprises a conductive material;

the through hole penetrates through the plastic package body until the through hole contacts the substrate;

one side of the through hole, which is far away from the substrate, is contacted with the antenna;

the conductive material is filled in the through hole.

The beneficial effects of the embodiment of the application include, for example: by adopting the manufacturing method of the acoustic sensor packaging structure and the acoustic sensor packaging structure provided by the embodiment of the application, the acoustic sensor chip is attached to one side of the substrate; a cover body is further arranged on one side, where the acoustic sensor chip is located, of the substrate, the cover body comprises a sound inlet hole, the cover body is used for protecting the acoustic sensor chip, and the sound inlet hole is used for transmitting sound to the acoustic sensor chip; then, the radio frequency chip is attached to one side of the cover body, which is far away from the side where the acoustic sensor chip is attached; selectively encapsulating the radio frequency chip to form a plastic package body, wherein the plastic package body does not cover the sound inlet hole; finally, the antenna is manufactured on the surface of the plastic package body to form the acoustic sensor packaging structure, the plastic package body is ingeniously utilized to protect the substrate and the cover body, and meanwhile, the radio frequency chip is arranged, so that the acoustic sensor packaging structure with stable structure and diversified functions is provided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic flow chart illustrating steps of a method for manufacturing a package structure of an acoustic sensor according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of an acoustic sensor package structure provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of an acoustic sensor package according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of an acoustic sensor package according to an embodiment of the present disclosure;

FIG. 5 is a schematic partial structure diagram of an acoustic sensor package structure provided in an embodiment of the present application;

FIG. 6 is a schematic structural diagram of another acoustic sensor package structure provided in an embodiment of the present application;

fig. 7 is a schematic view of a cutting process of the acoustic sensor package module according to the embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which the present invention product is usually put into use, it is only for convenience of describing the present application and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present application.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

It should be noted that the features of the embodiments of the present application may be combined with each other without conflict.

At present, silicon wheat products are widely applied to various scenes related to sound receiving as sound sensitive equipment with better effect. However, the chip of the acoustic sensor included in the existing silicon-microphone product is in direct contact with external sound pressure, and the chip of the acoustic sensor may be broken when the intensity of the change of the sound pressure exceeds a certain threshold, and meanwhile, when a cutting process is involved in the manufacturing process, the substrate for mounting the chip of the acoustic sensor is easily warped, and then the substrate and the cover for protecting the chip of the acoustic sensor are cracked. Moreover, the existing silicon wheat products have relatively single functions and can not meet the requirements of users gradually.

Accordingly, referring to fig. 1 in the drawings, the present embodiment provides a method for manufacturing a package structure of an acoustic sensor.

Step S201, an acoustic sensor chip is attached to one side of a substrate.

Step S202, a cover body is placed on the side where the acoustic sensor chip is located on the substrate.

The cover body comprises a sound inlet hole, the cover body is used for protecting the sound-sensitive sensor chip, and the sound inlet hole is used for transmitting sound to the sound-sensitive sensor chip.

And S203, attaching the radio frequency chip to one side of the cover body far away from the side where the acoustic sensor chip is attached.

Step S204, selectively encapsulating the radio frequency chip to form a plastic package body.

Wherein, the plastic package body does not cover the sound inlet hole.

Step S205, manufacturing an antenna on the surface of the plastic package body to form a packaging structure of the acoustic sensor.

The acoustic sensor chip provided in the embodiment of the present application may be a Micro Electro Mechanical System (MEMS) chip, and the radio frequency chip may be an integrated Circuit (ic) radio frequency chip. Through the steps, the plastic package body which is selectively packaged can be provided, the substrate is protected on the basis that the sound inlet hole is not influenced, and the problem that in the prior art, when a cutting process is involved in the process of manufacturing the packaging structure of the acoustic sensor, damage occurs between the substrate and the cover body due to substrate warping can be solved. In the embodiment of the application, the position of the sound inlet hole on the cover body can be predetermined, the plastic package body can be prepared by using a plastic package mold, and the plastic package mold is provided with a convex block or a groove (according to the difference of the plastic package mold) at the position corresponding to the sound inlet hole, so that the sound inlet hole can be exposed and not blocked when the plastic package is carried out selectively.

In addition, the plastic package body can be provided with a radio frequency chip on the cover body on the basis of providing protection of the cover body, the cover body is used as a part for protecting the acoustic sensor, and the cover body can be made of a metal material, so that the acoustic sensor chip and the radio frequency chip cannot be influenced mutually, and electromagnetic shielding can be realized. The radio frequency chip is arranged on the cover body made of the metal material, so that the radio frequency chip not only can have a stable supporting structure, but also can be protected by a plastic package body by the way, and further a multifunctional packaging structure is realized. In other embodiments of the present application, the cover may also be a ceramic material, which is not limited herein.

On this basis, in order to be able to more clearly describe the scheme provided by the present application, the foregoing step S201 may be implemented by the following example.

In substep S201-1, an acoustic sensor chip and an integrated circuit chip are mounted on one side of a substrate.

And a substep S201-2, arranging a first routing, wherein one end of the first routing is connected with the sound-sensitive sensor chip, and the other end of the first routing is connected with the integrated circuit chip, so that the sound-sensitive sensor chip and the integrated circuit chip are electrically connected.

And a substep S201-3, arranging a second routing, wherein one end of the second routing is connected with the sound-sensitive sensor chip, and the other end of the second routing is connected with the substrate, so that the sound-sensitive sensor chip is electrically connected with the substrate.

When the sound-sensitive sensor chip is arranged, an Integrated Circuit chip can be arranged, the Integrated Circuit chip can be an Application Specific Integrated Circuit (ASIC) chip, the sound-sensitive sensor chip and the Integrated Circuit chip can be connected through a first routing, electric connection is achieved, the Integrated Circuit chip and the substrate can be connected through a second routing, electric connection among the substrate, the Integrated Circuit chip and the sound-sensitive sensor chip is achieved, and the sound-sensitive sensor chip and the Integrated Circuit chip can be mutually matched to achieve the function of receiving external sound.

It should be understood that, because the integrated circuit chip is added for control and the selectively encapsulated plastic package body is provided for reinforcement, the number of sound inlet holes provided on the cover body can be multiple, and the arrangement position is not limited, for example, the sound inlet holes can be provided on the side surface of the cover body, and the firmness of the whole structure is not affected.

In order to more clearly describe the scheme provided by the present application, before the foregoing step S203, the embodiments of the present application further provide the following detailed description.

Step S310, arranging a first bonding pad and a second bonding pad on the side where the acoustic sensor chip is located on the substrate.

Wherein the first pad and the second pad are not within the coverage of the cover.

In the embodiment of the present application, the first pad and the second pad may be disposed before the foregoing step S203, or before the step S201, and it should be understood that the first pad and the second pad may be disposed as close as possible in order to consider the size of the subsequent device, as long as the first pad and the second pad are not within the coverage range of the cover body, which is not particularly limited.

Accordingly, the foregoing step S203 may be implemented by the following step S.

And a substep S203-1, attaching the radio frequency chip to one side of the cover body far away from the side where the acoustic sensor chip is attached.

And substep S203-2, setting a signal feeder.

One end of the signal feeder is connected with the radio frequency chip, and the other end of the signal feeder is connected with the first bonding pad.

In substep S203-3, a functional signal line is set.

In the embodiment of the present application, the signal feeder may be a ground line for grounding the rf chip, and the functional signal line may be used for implementing a function related to the rf chip.

On the basis of the foregoing, as an alternative embodiment, the foregoing step S204 may be implemented by the following embodiment.

And a substep S204-1, selectively encapsulating the side of the cover body where the signal feeder line and the functional signal line are positioned to form a plastic package body.

The plastic package body is used for protecting the signal feeder line and the functional signal line.

On the basis of the foregoing, as an alternative specific embodiment, the foregoing step S205 may be implemented in the following manner.

In the substep S205-1, an antenna pattern is formed on the surface of the plastic package body by a laser grooving process.

And a substep S205-2, forming a through hole to the substrate on one side of the plastic package body far away from the substrate by using a laser grooving process.

One side of the through hole, which is far away from the substrate, is in contact with the antenna pattern, and the through hole cuts the signal feeder line.

And a sub-step S205-3 of filling the via with a conductive material to restore conduction of the signal feed line based on the conductive material.

And a substep S205-4 of coating a conductive material to the antenna pattern to obtain the antenna.

It should be understood that, in order to realize the function of the rf chip, an antenna may be provided, and the antenna may be provided in a manner that an antenna pattern is drawn on the surface of the plastic package body as described above, and then a conductive material is coated or printed on the antenna pattern, where the conductive material is required to satisfy the requirements of transmitting or receiving applications, and has characteristics of low resistivity, stable signal, and the like. For example: conductive ink, aluminum paste, copper paste, silver paste, and the like.

It is worth to be noted that when the antenna pattern layer is drawn and the through hole is opened by using the laser grooving technology, the drawing and the opening of the through hole can be performed simultaneously, the manufacturing of the through hole by two processes as in the prior art is not needed, a large amount of time can be saved, moreover, when the through hole is opened, the opened through hole can cut off the signal feeder line firstly, after the conductive material is filled, the cut-off two ends are connected based on the conductive material again, the signal feeder line is restored to be conducted, and through the arrangement, the transmission effect of the signal feeder line can be improved. In the embodiment of the present application, the third pad may be preset as a reference point for forming the through hole, and the third pad may be a signal line pad of a conductive via (through hole) substrate, which can further enhance the transmission effect of the signal line.

Referring to fig. 2, the package structure 1 of the acoustic sensor includes a substrate 10, an acoustic sensor chip 20, a cover 30, a radio frequency chip 40, a plastic package 50, and an antenna 60.

The acoustic sensor chip 20 is located on one side of the substrate 10.

The cover 30 is located at one side of the substrate 10 where the acoustic sensor is located, the cover 30 is used for protecting the acoustic sensor chip 20, the cover 30 includes a sound inlet hole 301, and the sound inlet hole 301 is used for transmitting sound to the acoustic sensor chip 20.

The radio frequency chip 40 is located on the side of the cover 30 away from the acoustic sensor.

The plastic package body 50 is selectively packaged on the surface of the cover body 30 and is not covered with the sound inlet hole 301, so as to protect the rf chip 40.

The antenna 60 is located on the surface of the plastic package body 50.

Through the arrangement of the structure, the plastic package body 50 is skillfully utilized to reinforce and protect the space between the cover body 30 and the substrate 10, so that the substrate 10 and the cover body 30 cannot be broken due to the warping of the substrate 10 when the acoustic sensor packaging structure 1 is prepared, and meanwhile, the plastic package body 50, the protected radio frequency chip 40 and the support for manufacturing the antenna 60 are reused.

On the basis, please refer to fig. 3, the package structure 1 of the acoustic sensor further includes an integrated circuit chip 70, a first wire bond 71 and a second wire bond 72.

The integrated circuit chip 70 and the acoustic sensor are located on the same side of the substrate 10, and the cover 30 is also used to protect the integrated circuit chip 70.

One end of the first bonding wire 71 is connected to the integrated circuit chip 70, and the other end is connected to the acoustic sensor chip 20, so that the acoustic sensor chip 20 and the integrated circuit chip 70 are electrically connected to each other.

One end of the second wire 72 is connected to the chip 20, and the other end is connected to the substrate 10, so that the chip 20 and the substrate 10 are electrically connected to each other.

To be able to more clearly describe the solution provided by the present application, please refer to fig. 4 and 5 in combination. The acoustic sensor package 1 further comprises a first pad 81, a second pad 82, a signal feed line 41 and a functional signal line 42.

The first pads 81, the second pads 82 and the acoustic sensor are located on the same side of the substrate 10, and the first pads 81 and the second pads 82 are not within the coverage of the cover 30.

One end of the signal feeder 41 is connected to the rf chip 40, and the other end is connected to the first pad 81.

One end of the functional signal line 42 is connected to the rf chip 40, and the other end is connected to the second pad 82.

On this basis, the embodiments of the present application also provide the following embodiments. The plastic package body 50 is selectively disposed on one side of the cover body 30 for protecting the signal feed line 41 and the functional signal line 42.

In order to more clearly describe the solution provided by the present application, please refer to fig. 6 in combination with the above description, the plastic package body 50 is provided with a through hole 90, and the acoustic sensor package structure 1 further includes a conductive material.

The through hole 90 penetrates through the plastic package body 50 until contacting the substrate 10.

The side of the through hole 90 remote from the substrate 10 is in contact with the antenna 60.

In the embodiment of the present application, a third pad may be further included, where the third pad may be pre-disposed on the substrate 10 as a mark for forming the through hole 90, that is, a side of the through hole 90 away from the antenna 60 is in contact with the third pad, and the third pad may be a signal line pad of the substrate 10 with a conductive via (through hole 90), which may further enhance a transmission effect of the signal line.

The conductive material is filled in the via hole 90.

It should be noted that in the actual production process, the single package structure is not produced, but mass production is performed, and reference is made to fig. 7. The cutting path can be located between every two package structures included in the acoustic sensor package module, so that it can be clearly known that, due to the plastic package body 50, when the acoustic sensor package structure 1 which is a group is used for cutting, the situation that the cover body 30 and the substrate 10 are broken due to the fact that the substrate 10 is warped possibly in the prior art can be avoided.

In summary, the embodiment of the present application provides a method for manufacturing a package structure of a sound sensor and a package structure of a sound sensor, in which a chip of a sound sensor is attached to one side of a substrate; a cover body is further arranged on one side, where the acoustic sensor chip is located, of the substrate, the cover body comprises a sound inlet hole, the cover body is used for protecting the acoustic sensor chip, and the sound inlet hole is used for transmitting sound to the acoustic sensor chip; then, the radio frequency chip is attached to one side of the cover body, which is far away from the side where the acoustic sensor chip is attached; selectively encapsulating the radio frequency chip to form a plastic package body, wherein the plastic package body does not cover the sound inlet hole; finally, the antenna is manufactured on the surface of the plastic package body to form the acoustic sensor packaging structure, the plastic package body is ingeniously utilized to protect the substrate and the cover body, and meanwhile, the radio frequency chip is arranged, so that the acoustic sensor packaging structure with stable structure and diversified functions is provided.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A manufacturing method of a packaging structure of a sound-sensitive sensor is characterized by comprising the following steps:

one side of the substrate is provided with an acoustic sensor chip;

attaching a radio frequency chip to one side of the cover body far away from the side where the acoustic sensor chip is attached;

selectively encapsulating the radio frequency chip to form a plastic package body, wherein the plastic package body does not cover the sound inlet hole, covers the substrate, and is used for reinforcing and protecting the cover body and the substrate;

and manufacturing an antenna on the surface of the plastic package body to form a sound-sensitive sensor packaging structure.

2. The method of claim 1, wherein attaching the acoustic sensor chip to one side of the substrate comprises:

the acoustic sensor chip and the integrated circuit chip are attached to one side of the substrate;

arranging a first routing, wherein one end of the first routing is connected with the sound-sensitive sensor chip, and the other end of the first routing is connected with the integrated circuit chip, so that the sound-sensitive sensor chip is electrically connected with the integrated circuit chip;

and arranging a second routing, wherein one end of the second routing is connected with the acoustic sensor chip, and the other end of the second routing is connected with the substrate, so that the acoustic sensor chip is electrically connected with the substrate.

3. The method of claim 1, wherein prior to said attaching the radio frequency chip to the side of the cover away from the side to which the acoustic sensor chip is attached, the method further comprises:

attaching the radio frequency chip to one side of the cover body far away from the attached acoustic sensor chip comprises:

a signal feeder line is arranged, one end of the signal feeder line is connected with the radio frequency chip, and the other end of the signal feeder line is connected with the first bonding pad;

and arranging a functional signal wire, wherein one end of the functional signal wire is connected with the radio frequency chip, and the other end of the functional signal wire is connected with the second bonding pad.

4. The method of claim 3, wherein the selectively encapsulating the RF chip to form a plastic package comprises:

and selectively encapsulating one side of the cover body where the signal feeder line and the functional signal line are located to form a plastic package body, wherein the plastic package body is used for protecting the signal feeder line and the functional signal line.

5. The method of claim 4, wherein the fabricating the antenna on the surface of the plastic encapsulant comprises:

forming an antenna pattern on the surface of the plastic package by using a laser grooving process;

forming a through hole in one side, far away from the substrate, of the plastic package body to the substrate by using a laser grooving process, wherein one side, far away from the substrate, of the through hole is in contact with the antenna pattern, and the through hole cuts off the signal feeder line;

filling a conductive material into the through hole to make the signal feed line restore conduction based on the conductive material;

and coating the conductive material on the antenna pattern to obtain the antenna.

6. A packaging structure of a sound-sensitive sensor is characterized by comprising a substrate, a sound-sensitive sensor chip, a cover body, a radio frequency chip, a plastic package body and an antenna;

the acoustic sensor chip is positioned on one side of the substrate;

the cover body is positioned on one side of the substrate where the acoustic sensor is positioned, the cover body is used for protecting the acoustic sensor chip, and the cover body comprises a sound inlet hole which is used for transmitting sound to the acoustic sensor chip;

the plastic package body is selectively packaged on the surface of the cover body and does not cover the sound inlet hole, the plastic package body covers the substrate, and the plastic package body is used for reinforcing and protecting the cover body and the substrate and protecting the radio frequency chip;

the antenna is positioned on the surface of the plastic package body.

7. The acoustic sensor package structure of claim 6, wherein the acoustic sensor package structure further comprises an integrated circuit chip, a first wire bond and a second wire bond;

the integrated circuit chip and the acoustic sensor are positioned on the same side of the substrate, and the cover body is also used for protecting the integrated circuit chip;

one end of the first routing is connected with the integrated circuit chip, and the other end of the first routing is connected with the acoustic sensor chip, so that the acoustic sensor chip is electrically connected with the integrated circuit chip;

8. The acoustic sensor package structure of claim 6, wherein the acoustic sensor package structure further comprises a first pad, a second pad, a signal feed line, and a functional signal line;

9. The acoustic sensor package assembly of claim 8, wherein the molding compound is selectively encapsulated on one side of the cover for protecting the signal feed line and the functional signal line.

10. The acoustic sensor package structure according to claim 9, wherein the plastic package body has a through hole, and the acoustic sensor package structure further comprises a conductive material;

one side of the through hole, which is far away from the substrate, is in contact with the antenna;

the conductive material is filled in the through hole.