CN112490222A - Packaging structure of millimeter wave antenna module and mobile device - Google Patents
Packaging structure of millimeter wave antenna module and mobile device Download PDFInfo
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- CN112490222A CN112490222A CN202011253954.5A CN202011253954A CN112490222A CN 112490222 A CN112490222 A CN 112490222A CN 202011253954 A CN202011253954 A CN 202011253954A CN 112490222 A CN112490222 A CN 112490222A
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- circuit board
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000002955 isolation Methods 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
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Abstract
The invention discloses a packaging structure of a millimeter wave antenna module and mobile equipment, wherein the packaging structure comprises a multilayer circuit board and a chip, the multilayer circuit board comprises a first circuit board layer and a second circuit board layer which are arranged in a stacked mode, and the chip is arranged between the first circuit board layer and the second circuit board layer; the number of the chips is more than two, and an electromagnetic band gap is arranged between every two adjacent chips. The invention can reduce the section thickness of the millimeter wave module and simultaneously can improve the isolation between chips.
Description
Technical Field
The invention relates to the technical field of antenna module packaging, in particular to a millimeter wave antenna module packaging structure and mobile equipment.
Background
With the improvement of the technological level of integrated circuits, monolithic microwave integrated circuits are more and more widely applied, in particular to the popularization of 5G millimeter waves, millimeter wave power amplifiers, low-noise amplifiers, shifters, mixers and other radio frequency chips are applied to handheld mobile terminals and base stations in a large scale, and in addition, power management (analog chips) and FPGA, single chip and other digital chips are applied for controlling electromagnetic wave beams. In order to stably work various chips without interference, the problem to be solved is to improve the isolation of the chips.
Meanwhile, for the mobile terminal 5G millimeter wave module, the industry chooses to combine the rf chip and the substrate antenna into an AIP (package antenna) to reduce the rf system loss, and thus the integration level is higher and the performance is more excellent. The AIP structure of the millimeter wave module is shown in fig. 1, and the multi-layer PCB antenna is connected to a digital chip 22, an analog chip 23 and a radio frequency chip 21 through BGA (Ball Grid Array) solder balls 3. However, since the BGA solder balls are large, the millimeter wave module has a thick profile. And because the equipment of the mobile terminal is thin, the mobile terminal is difficult to be directly placed into a terminal such as a mobile phone. Therefore, it is desirable to reduce the thickness of the module.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides a packaging structure and mobile device of millimeter wave antenna module, can reduce the section thickness of millimeter wave module, can promote the isolation between the chip simultaneously.
In order to solve the technical problems, the invention adopts the technical scheme that: a packaging structure of a millimeter wave antenna module comprises a multilayer circuit board and a chip, wherein the multilayer circuit board comprises a first circuit board layer and a second circuit board layer which are arranged in a stacked mode, and the chip is arranged between the first circuit board layer and the second circuit board layer; the number of the chips is more than two, and an electromagnetic band gap is arranged between every two adjacent chips.
The invention further provides mobile equipment comprising the packaging structure of the millimeter wave antenna module.
The invention has the beneficial effects that: the chip is embedded into the multilayer circuit board, so that the chip is not required to be arranged on the circuit board through the BGA welding balls, the thickness of the BGA can be omitted, and the thickness of the module is reduced; each chip is isolated through EBG (electromagnetic band gap), so that the isolation between the chips is improved, and the stable work of each chip is ensured. The invention reduces the section thickness of the millimeter wave antenna module, so that the millimeter wave antenna module can be placed in thinner mobile equipment (such as a mobile phone), and simultaneously improves the isolation between chips and ensures that each chip can work stably.
Drawings
FIG. 1 is a schematic cross-sectional view of a millimeter wave module package structure in the prior art;
fig. 2 is a schematic cross-sectional view of a package structure of a millimeter wave antenna module according to an embodiment of the invention.
Description of reference numerals:
1. a multilayer circuit board; 2. a chip; 3. BGA solder balls; 4. an electromagnetic bandgap; 5. an antenna radiator; 6. a feed line; 7. a matching network; 8. a circuit layer;
11. a first circuit board layer; 12. a second circuit board layer;
21. a radio frequency chip; 22. a digital chip; 23. and simulating the chip.
Detailed Description
In order to explain technical contents, objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 2, a package structure of a millimeter wave antenna module includes a multilayer circuit board and a chip, where the multilayer circuit board includes a first circuit board layer and a second circuit board layer that are stacked, and the chip is disposed between the first circuit board layer and the second circuit board layer; the number of the chips is more than two, and an electromagnetic band gap is arranged between every two adjacent chips.
From the above description, the beneficial effects of the present invention are: the section thickness of the millimeter wave module can be reduced, and the isolation between chips can be improved.
Further, the first circuit board layer and the second circuit board layer each include at least one layer of circuit board.
Furthermore, the chip comprises a radio frequency chip, a digital chip and an analog chip, and the radio frequency chip is electrically connected with the digital chip and the analog chip respectively.
As can be seen from the above description, the rf chip is used to provide signals for the antenna; the digital chip is a digital integrated circuit chip and is used for controlling the amplitude and the phase of a signal of the radio frequency chip; the analog chip is a power chip and is used for providing power for the radio frequency chip.
Further, still include antenna radiator and feeder, the antenna radiator set up in first circuit board layer is kept away from on the one side of second circuit board layer, the one end of feeder with the antenna radiator is connected, the other end of feeder through running through the through-hole of first circuit board layer with the radio frequency chip is connected.
As can be seen from the above description, the rf chip provides the rf signal, which is fed to the antenna radiator through the feeder line.
Further, the matching network is arranged on one surface, close to the second circuit board layer, of the first circuit board layer, and the feeder line is connected with the radio frequency chip through the matching network.
Furthermore, a circuit layer is arranged on one surface, far away from the first circuit board layer, of the second circuit board layer, and the radio frequency chip, the digital chip and the analog chip are electrically connected with the circuit layer respectively.
As can be seen from the above description, the connection of the chip to an external circuit is facilitated.
The invention further provides mobile equipment comprising the packaging structure of the millimeter wave antenna module.
Example one
Referring to fig. 2, a first embodiment of the present invention is: a packaging structure of a millimeter wave antenna module is suitable for a scene of millimeter wave module multi-chips of a 5G millimeter wave communication system.
As shown in fig. 2, the multilayer circuit board 1 and the chip 2 are included, the multilayer circuit board 1 includes a first circuit board layer 11 and a second circuit board layer 12 which are arranged in a stacked manner, and the chip 2 is arranged between the first circuit board layer 11 and the second circuit board layer 12; the number of the chips 2 is more than two, and an electromagnetic band gap 4 is arranged between every two adjacent chips 2.
The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connections between them are usually made through plated-through holes in the cross-section of the circuit board.
In this embodiment, the multi-layer circuit board is divided into a first circuit board layer and a second circuit board layer, where the first circuit board layer and the second circuit board layer each include at least one layer of circuit board, i.e., at least one dielectric layer and at least one routing layer.
Further, the chip 2 includes a radio frequency chip 21, a digital chip 22 and an analog chip 23, and the radio frequency chip 21 is electrically connected to the digital chip 22 and the analog chip 23, respectively.
The radio frequency chip is used for providing signals for the antenna; the radio frequency chip comprises elements such as a phase shifter and an amplifier, wherein the phase shifter is used for providing phase difference among the antenna units to realize the beam scanning capability, and the amplifier is used for compensating the loss of the phase shifter. The digital chip is a digital integrated circuit chip, is used for controlling the amplitude and the phase of a signal of the radio frequency chip, and is equivalent to a digital switch of circuits such as an amplifier, a low-noise amplifier and the like in the radio frequency chip. The analog chip is a power chip and is used for providing power for the radio frequency chip.
Preferably, the radio frequency chip 21 is arranged between the digital chip 22 and the analog chip 23, the electromagnetic band gap 4 is arranged between the radio frequency chip 21 and the digital chip 22, and the electromagnetic band gap 4 is arranged between the radio frequency chip 21 and the analog chip 23.
Further, still include antenna radiator 5 and feeder 6, antenna radiator 5 set up in first circuit board layer 11 is kept away from on the one side of second circuit board layer 12, feeder 6's one end with antenna radiator 5 is connected, feeder 6's the other end through running through first circuit board layer 11 the through-hole with radio frequency chip 21 connects.
Further, the matching network 7 is further included, and the matching network 7 is disposed on a surface of the first circuit board layer 11 close to the second circuit board layer 12, or may also be disposed on a routing layer of the first circuit board layer 11 relatively close to the second circuit board layer 12; the other end of the feeder line 6 is connected with the matching network 7, and the matching network 7 is connected with the radio frequency chip 21.
Further, a circuit layer 8, namely a peripheral circuit, is disposed on a surface of the second circuit board layer 12 away from the first circuit board layer 11, and the radio frequency chip 21, the digital chip 22 and the analog chip 23 are electrically connected to the circuit layer 8, respectively. Preferably, the three chips may be electrically connected to the circuit layer through plated-through holes on the second circuit board layer, respectively.
In the embodiment, the chip is embedded into the multilayer circuit board, so that the chip is not required to be arranged on the circuit board through the BGA solder balls, the thickness of the BGA is saved, the thickness of the module is reduced, and the millimeter wave antenna module can be placed in thinner mobile equipment; each chip is isolated through EBG (electromagnetic band gap), so that the isolation between the chips is improved, and the stable work of each chip is ensured.
In summary, the packaging structure of the millimeter wave antenna module and the mobile device provided by the invention reduce the section thickness of the millimeter wave antenna module, so that the millimeter wave antenna module can be placed in a thinner mobile device, and simultaneously, the isolation between chips is improved, and each chip can be ensured to work stably.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (7)
1. The packaging structure of the millimeter wave antenna module is characterized by comprising a multilayer circuit board and a chip, wherein the multilayer circuit board comprises a first circuit board layer and a second circuit board layer which are arranged in a stacked mode, and the chip is arranged between the first circuit board layer and the second circuit board layer; the number of the chips is more than two, and an electromagnetic band gap is arranged between every two adjacent chips.
2. The package structure of millimeter wave antenna module of claim 1, wherein the first and second circuit board layers each comprise at least one layer of circuit board.
3. The package structure of the millimeter wave antenna module according to claim 1, wherein the chip comprises a radio frequency chip, a digital chip and an analog chip, and the radio frequency chip is electrically connected to the digital chip and the analog chip respectively.
4. The package structure of the millimeter wave antenna module according to claim 3, further comprising an antenna radiator and a feeder line, wherein the antenna radiator is disposed on a surface of the first circuit board layer away from the second circuit board layer, one end of the feeder line is connected to the antenna radiator, and the other end of the feeder line is connected to the radio frequency chip through a through hole penetrating through the first circuit board layer.
5. The package structure of the millimeter wave antenna module according to claim 4, further comprising a matching network, wherein the matching network is disposed on a surface of the first circuit board layer close to the second circuit board layer, and the feeder line is connected to the radio frequency chip through the matching network.
6. The package structure of a millimeter wave antenna module according to claim 3, wherein a circuit layer is disposed on a surface of the second circuit board layer away from the first circuit board layer, and the radio frequency chip, the digital chip and the analog chip are electrically connected to the circuit layer respectively.
7. A mobile device, characterized by a packaging structure comprising a millimeter wave antenna module according to any of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011253954.5A CN112490222A (en) | 2020-11-11 | 2020-11-11 | Packaging structure of millimeter wave antenna module and mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011253954.5A CN112490222A (en) | 2020-11-11 | 2020-11-11 | Packaging structure of millimeter wave antenna module and mobile device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112490222A true CN112490222A (en) | 2021-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011253954.5A Pending CN112490222A (en) | 2020-11-11 | 2020-11-11 | Packaging structure of millimeter wave antenna module and mobile device |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070289771A1 (en) * | 2006-06-02 | 2007-12-20 | Hideki Osaka | Semiconductor device |
| CN105762138A (en) * | 2014-12-15 | 2016-07-13 | 财团法人工业技术研究院 | Integrated millimeter wave chip package structure |
| CN105789847A (en) * | 2014-12-15 | 2016-07-20 | 财团法人工业技术研究院 | Antenna integrated package structure and fabrication method thereof |
| CN111276787A (en) * | 2019-12-31 | 2020-06-12 | 中国电子科技集团公司第五十五研究所 | Three-dimensional integrated millimeter wave AiP phased array element |
| CN111864362A (en) * | 2019-04-30 | 2020-10-30 | Oppo广东移动通信有限公司 | Antenna module and electronic equipment |
-
2020
- 2020-11-11 CN CN202011253954.5A patent/CN112490222A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070289771A1 (en) * | 2006-06-02 | 2007-12-20 | Hideki Osaka | Semiconductor device |
| CN105762138A (en) * | 2014-12-15 | 2016-07-13 | 财团法人工业技术研究院 | Integrated millimeter wave chip package structure |
| CN105789847A (en) * | 2014-12-15 | 2016-07-20 | 财团法人工业技术研究院 | Antenna integrated package structure and fabrication method thereof |
| CN111864362A (en) * | 2019-04-30 | 2020-10-30 | Oppo广东移动通信有限公司 | Antenna module and electronic equipment |
| CN111276787A (en) * | 2019-12-31 | 2020-06-12 | 中国电子科技集团公司第五十五研究所 | Three-dimensional integrated millimeter wave AiP phased array element |
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