CN112462105B - Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure - Google Patents
Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure Download PDFInfo
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- CN112462105B CN112462105B CN202011365952.5A CN202011365952A CN112462105B CN 112462105 B CN112462105 B CN 112462105B CN 202011365952 A CN202011365952 A CN 202011365952A CN 112462105 B CN112462105 B CN 112462105B
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- 239000000523 sample Substances 0.000 title claims abstract description 241
- 238000012360 testing method Methods 0.000 title claims abstract description 91
- 230000001360 synchronised effect Effects 0.000 title claims abstract description 57
- 238000005452 bending Methods 0.000 claims description 38
- 238000012546 transfer Methods 0.000 claims description 26
- 238000009827 uniform distribution Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 24
- 230000002441 reversible effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- 244000309464 bull Species 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention relates to a probe adapter and a socket structure for synchronous or quasi-synchronous testing and a key structure, belonging to the technical field of semiconductor testing; the invention discloses a probe adapter and a socket structure which are matched with each other, provides the specific structural characteristics of the probe adapter and the socket structure, and further discloses a flat cable limiting plate probe combination structure on the basis; under the structure, the invention not only can reduce the alignment difficulty of the switching probe and the socket, is not easy to damage the switching probe, realizes reversible disassembly and assembly process, is beneficial to carrying out repeatability test, but also can solve the problem of short circuit caused by discharge between the switching probes under large current.
Description
Technical Field
The invention relates to a probe adapter and a socket structure for synchronous or quasi-synchronous testing and a key structure, belonging to the technical field of semiconductor testing.
Background
With the development of semiconductor technology and MEMS technology, the integrated circuit chip structure is becoming more and more complex. In order to ensure the electrical quality of the integrated circuit, testing is required prior to chip packaging. During the test, the probe can be inserted into the socket for testing. However, as the size of the probe is gradually reduced, the alignment between the probe and the socket becomes difficult at the micron or even submicron size, and if the probe is inserted hard (the socket is not adjusted and fixed with the probe), the probe is easily damaged, and meanwhile, the probe is bent due to the insertion, so that the distance between two adjacent probes is too short, and during the high-power chip testing process, the problem of short circuit caused by the discharge between the probes is easily caused due to too large current.
Meanwhile, the precision measurement technology tells us that the repeated test of the probe is very important if the test result has a larger confidence interval, namely the test result is more reliable and reliable, and multiple measurements are needed, and the repeated test of the probe and the socket is very difficult to assemble and disassemble under the micron-scale or even submicron-scale size without damaging the probe.
The invention patent 'Probe device of vertical Probe card' with application No. 201711115635.6 relates to a method for mounting probes, which makes probes bend in the same direction by moving an intermediate guide plate, and although the problem of 'difficult capping' is solved, the technical scheme can successfully limit the distance between the probes, thereby solving the problem of short circuit caused by discharge between the probes under high current. However, this method lacks a structure for precisely positioning the intermediate guide plate, so that when the intermediate guide plate is moved, the bending degree of the probe easily exceeds the elastic deformation range, the probe is not recoverable, and the probe mounting and dismounting are not reversible, so that the repeated test of mounting and dismounting the uniform probe cannot be performed.
In the two patents, the triangular base and the mechanism of the uniform frame are arranged, and the steps of inserting, aligning and contacting are matched, so that the alignment difficulty of the probe and the socket is reduced, the probe is not easy to damage, the reversible disassembly and assembly process is realized, the repeatability test is facilitated, the distance between the probes can be limited, and the problem of short circuit caused by discharge between the probes under large current is solved.
However, the two patents have a problem that it is impossible to perform a repeated test on a certain chip in sequence, which wastes time, and the probe and socket structure has poor compatibility with the chip, which makes it impossible to perform a synchronous test on different chips.
Disclosure of Invention
The application is further improved on the basis of the invention patents of a probe and socket structure and a probe and socket matching method of the company, and discloses a probe adapter, a socket structure and a key structure for synchronous or quasi-synchronous testing, so that synchronous or quasi-synchronous testing can be performed on the same chip, or quasi-synchronous testing can be performed on different chips.
The purpose of the invention is realized as follows:
the probe adaptor and socket structure for synchronous or quasi-synchronous testing comprises a probe adaptor and a socket structure which are matched with each other;
the probe adaptor comprises four replaceable adaptor sockets, each adaptor socket is connected with an adaptor probe through a flat cable, holes in the adaptor sockets are distributed in a matrix mode, needles on the adaptor probes are distributed in a vector mode, the adaptor probes penetrate through the limiting plate and can rotate around the limiting plate, gears are arranged on the parts, above the limiting plate, of the adaptor probes, the radiuses of four groups of gears corresponding to the four groups of adaptor probes form an equal-difference array with the same initial item and the same tolerance, a rack frame is arranged on the same plane with the gears and consists of a plurality of parallel stepped racks, the racks are meshed with the gears, a bending structure is arranged below the adaptor probes, and the bending structures of all the adaptor probes bend in the same direction at the initial positions;
the socket structure comprises a substrate, a triangular base capable of sliding on the substrate and an even distribution frame capable of moving up and down; a notch is formed in one side of the triangular base, a conducting layer is arranged on the inner side face of the notch, the width of the conducting layer is smaller than 2rsin (pi/8), and r is the radius of a bending structure below the switching probe; the conducting layer passes through the base plate through the wire from triangle body base below and connects the outside, the opposite side of triangle body base is provided with the insulation board, the equipartition frame comprises a plurality of parallel and the same insulating post of interval, the direction of insulating post is perpendicular with the direction of rack.
According to the probe adaptor and the socket structure for synchronous or quasi-synchronous testing, the first bearing is arranged between the adaptor probe and the limiting plate, the outer ring of the first bearing is in interference fit with the limiting plate, the limiting plate is made of an insulating material plate, the inner ring of the first bearing is in interference fit with the adaptor probe, and a gear and a second bearing which are coaxial with the first bearing are sequentially arranged above the first bearing; the flat cable comprises a sheath and a core wire, the sheath is sleeved on the outer ring of the second bearing, the core wire is welded on the outer ring of the second bearing, and the core wire is in short circuit with the switching probe through the outer ring of the second bearing, the rolling body of the second bearing and the inner ring of the second bearing in sequence.
According to the probe adaptor and the socket structure for synchronous or quasi-synchronous testing, in the rack frame, the two ends of a plurality of parallel stepped racks are respectively provided with the synchronous plate, the outer end part of one synchronous plate is provided with the lead screw, the lead screw is provided with the nut capable of rotating around the lead screw, the nut is installed inside the hollow shaft motor, the hollow shaft motor operates to drive the nut to rotate, then the synchronous plate is driven to translate, and finally the adaptor probe is driven to rotate.
Above-mentioned synchronous or probe adaptor and socket structure of class synchronous test, be provided with the slide on the base plate, the triangle body base is sat on the slide to can move on the slide, the slide both ends are provided with spacing portion for inject the orbit of triangle body base, the base plate is provided with the wire guide in the middle of two adjacent slides, the wire stretches out from the wire guide, connects the outside.
The key structure of the probe adapter and the socket structure for synchronous or quasi-synchronous testing is the probe adapter, the probe adaptor comprises four replaceable adaptor sockets, each adaptor socket is connected with an adaptor probe through a flat cable, the holes on the adapter socket are distributed in a matrix, the needles on the adapter probes are distributed in a vector manner, the adapter probes penetrate through the limiting plate, the switching probes can rotate around the switching probes, gears are arranged on the parts of the switching probes above the limiting plate, the radiuses of the four groups of gears corresponding to the four groups of switching probes form an equal difference array with the first term and the same tolerance, a rack frame is arranged on the same plane with the gear and is composed of a plurality of parallel stepped racks, the rack is meshed with the gear, a bending structure is arranged below the switching probe, and the bending structures of all the switching probes bend towards the same direction at the initial position.
The key structure of the probe adaptor and the socket structure for synchronous or quasi-synchronous testing is a socket structure, wherein the socket structure comprises a substrate, a triangular base capable of sliding on the substrate and an even distribution frame capable of moving up and down; a notch is formed in one side of the triangular base, a conducting layer is arranged on the inner side face of the notch, the width of the conducting layer is smaller than 2rsin (pi/8), and r is the radius of a bending structure below the switching probe; the conducting layer passes through the base plate through the wire from triangle body base below and connects the outside, the opposite side of triangle body base is provided with the insulation board, the equipartition frame comprises a plurality of parallel and the same insulating post of interval, the direction of insulating post is perpendicular with the direction of rack.
The key structure of the probe adaptor and socket structure for synchronous or quasi-synchronous testing is a flat cable limiting plate probe combined structure, wherein a first bearing is arranged between the adapting probe and a limiting plate in the flat cable limiting plate probe combined structure, the outer ring of the first bearing is in interference fit with the limiting plate, the limiting plate is an insulating material plate, the inner ring of the first bearing is in interference fit with the adapting probe, and a gear and a second bearing which are coaxial with the first bearing are sequentially arranged above the first bearing; the flat cable comprises a sheath and a core wire, the sheath is sleeved on the outer ring of the second bearing, the core wire is welded on the outer ring of the second bearing, and the core wire is in short circuit with the switching probe through the outer ring of the second bearing, the rolling body of the second bearing and the inner ring of the second bearing in sequence.
The probe adaptor and socket matching method for synchronous test or similar synchronous test comprises the following steps:
step a, inserting a chip to be tested into an adapter socket, and inserting an adapter probe of a probe adapter into a socket structure;
b, operating a hollow shaft motor to enable the bending structure below the switching probe to be consistent with the direction of the insulating column in the uniform distribution frame;
c, inserting the adapter probe to a fixed depth towards the direction of the socket structure;
d, testing the first group of transfer probes;
the hollow shaft motor operates to enable the switching probe corresponding to the gear with the smallest radius to rotate around the hollow shaft motor, and the bending structure below the switching probe points to the conducting layer on the inner side surface of the opening in the triangular base;
moving the uniform distribution frame downwards to enable the insulating columns in the uniform distribution frame to be in contact with the insulating plate on the triangular base, and further enabling the bending structure below the switching probe in the step to be in contact with the conductive layer;
testing the switching probe;
moving the equalizing frame upwards to separate the insulating columns in the equalizing frame from the insulating plates on the triangular base;
step e, testing a second group of transfer probes;
the hollow shaft motor operates to enable the switching probe corresponding to the second pinion with the radius to rotate around the hollow shaft motor, and the bending structure below the switching probe points to the conducting layer on the inner side surface of the opening in the triangular base;
moving the uniform distribution frame downwards to enable the insulating columns in the uniform distribution frame to be in contact with the insulating plate on the triangular base, and further enabling the bending structure below the switching probe in the step to be in contact with the conductive layer;
testing the switching probe;
moving the equalizing frame upwards to separate the insulating columns in the equalizing frame from the insulating plates on the triangular base;
f, testing a third group of transfer probes;
the hollow shaft motor operates to enable the transfer probe corresponding to the second gear wheel with the radius to rotate around the hollow shaft motor, and the bending structure below the transfer probe points to the conducting layer on the inner side surface of the opening in the triangular base;
moving the uniform distribution frame downwards to enable the insulating columns in the uniform distribution frame to be in contact with the insulating plate on the triangular base, and further enabling the bending structure below the switching probe in the step to be in contact with the conductive layer;
testing the switching probe;
moving the equalizing frame upwards to separate the insulating columns in the equalizing frame from the insulating plates on the triangular base;
step g, testing a fourth group of transfer probes;
the hollow shaft motor operates to enable the switching probe corresponding to the gear with the largest radius to rotate around the hollow shaft motor, and the bending structure below the switching probe points to the conducting layer on the inner side surface of the opening in the triangular base;
moving the uniform distribution frame downwards to enable the insulating columns in the uniform distribution frame to be in contact with the insulating plate on the triangular base, and further enabling the bending structure below the switching probe in the step to be in contact with the conductive layer;
testing the switching probe;
moving the equalizing frame upwards to separate the insulating columns in the equalizing frame from the insulating plates on the triangular base;
h, operating a hollow shaft motor to enable the transfer probe to rotate around the hollow shaft motor, and enabling the bending structure below the transfer probe to be consistent with the direction of the insulating columns in the uniform distribution frame;
and i, pulling out the probe adapter from the socket structure, and pulling out the chip to be tested from the adapter socket of the probe adapter.
According to the probe adapter and the socket matching method for the synchronous test or the similar synchronous test, if:
only one chip to be tested is inserted into the adapter socket corresponding to the gear with the smallest radius, and the step a, the step b, the step c, the step d, the step h and the step i are executed;
inserting the chips to be tested into the adapter sockets corresponding to the gear with the minimum radius and the second pinion with the minimum radius, and executing the steps a, b, c, d, e, h and i;
inserting the chips to be tested into adapter sockets corresponding to the gear with the minimum radius, the second pinion with the minimum radius and the second bull gear with the minimum radius, and executing the steps a, b, c, d, e, f, h and i;
and (4) inserting the chips to be tested into all the adapter sockets, and executing the steps a, b, c, d, e, f, g, h and i.
Has the advantages that:
first, as in the invention of a probe and socket structure and a probe and socket matching method of the present company, since the triangular bases are provided to slide on the substrate, the transfer probe is only required to fall between the two triangular bases, thereby reducing the alignment difficulty between the transfer probe and the socket structure, and meanwhile, since the transfer probe is not in contact with the triangular bases or is in slight contact with the triangular bases during the insertion process, the hard insertion is avoided, the transfer probe is not easy to damage, and the repeatability test is facilitated.
Secondly, as in the invention of a probe and socket structure and a probe and socket matching method of the company, because the bending structure is arranged below the switching probe, and the bending direction is limited by the rack frame, the bending structure of the tested switching probe is always bent to the same direction, so that the distance between the switching probes can be ensured to be limited, and the discharging distance can not be reached.
Third, like the invention of the probe and socket structure and the invention of the probe and socket matching method of the company, under the synchronous or quasi-synchronous test of the probe adapter and socket structure of the invention, the probe adapter and socket matching method of the invention facing to the synchronous test or quasi-synchronous test are matched at the same time, so that the assembly and disassembly processes of the adapter probe are reciprocal, and in the process of assembling and disassembling the adapter probe, because the bending direction of the bending structure is consistent with the direction of the insulating column in the uniform frame, the bending structure can not interfere with the gap on the triangular base, further ensure that the adapter probe is not damaged in the assembly and disassembly process, which is also beneficial to the repeatability test.
Fourth, in this application, owing to be provided with probe adaptor and the socket structure that matches each other, and be provided with four adapter sockets that can change in the probe adaptor to every adapter socket all connects the adapter probe through the winding displacement, like this, can pass through: 1) the same chip is inserted into different adapter sockets, non-detachable type synchronous testing is carried out on a plurality of chips, testing time is shortened, and time cost is saved; 2) the same chip is inserted into the same adapter socket, complete synchronous testing of a plurality of chips is achieved, testing time is further shortened, and time cost is saved.
Fifthly, in the application, because the adapter socket can be replaced, the adapter socket corresponding to the chip can be replaced, the compatibility of the probe adapter to the chip is improved, different chips are inserted into different adapter sockets, in the test process, only the hollow shaft motor needs to run, the three processes of downwards moving the uniform distribution frame and upwards moving the uniform distribution frame are needed, another chip can be replaced for testing, the test time is shortened, the time cost is saved, and the similar synchronous test of different chips is realized.
Drawings
FIG. 1 is a schematic diagram of the matching relationship between the probe adaptor and the socket structure for synchronous or quasi-synchronous testing according to the present invention.
Fig. 2 is a first structural schematic diagram of the probe adapter of the present invention.
Fig. 3 is a schematic structural diagram of a probe adapter according to the present invention.
Fig. 4 is a schematic view of the socket structure of the present invention.
Fig. 5 is a flowchart of a probe adapter and socket matching method for synchronous testing or quasi-synchronous testing according to the present invention.
In the figure: 1-1 limiting plate, 1-2 switching probes, 1-3 gears, 1-4 rack frames, 1-4-1 racks, 1-4-2 synchronous plates, 1-4-3 lead screws, 1-4-4 nuts, 1-4-5 hollow shaft motors, 1-5-1 first bearings, 1-5-2 second bearings, 1-6 switching sockets, 1-7 flat cables, 1-7-1 outer skins, 1-7-2 core wires, 2-1 base plates, 2-1-1 slideways, 2-1-2 limiting parts, 2-1-3 wire holes, 2-2 triangular bases, 2-2-1 conducting layers, 2-2-2 conducting wires, 2-2-3 insulating plates, a power supply, 2-3 are equally divided.
Detailed Description
The following describes in further detail specific embodiments of the present invention with reference to the accompanying drawings.
Detailed description of the invention
The following are specific embodiments of the probe adapter and socket structure for synchronous or quasi-synchronous testing of the present invention.
The probe adapter and the socket structure for synchronous or quasi-synchronous testing in the embodiment comprise a probe adapter and a socket structure which are matched with each other, and the matching relationship is shown in fig. 1;
the probe adaptor is shown in fig. 2 and fig. 3, wherein fig. 3 is a schematic view of a direction of fig. 2A-a, the probe adaptor includes four adaptor sockets 1-6 capable of being replaced, each adaptor socket 1-6 is connected with an adaptor probe 1-2 through a flat cable 1-7, holes on the adaptor sockets 1-6 are distributed in a matrix, needles on the adaptor probes 1-2 are distributed in a vector manner, the adaptor probes 1-2 penetrate through a limiting plate 1-1 and can rotate around themselves, gears 1-3 are arranged on the part of the adaptor probes 1-2 above the limiting plate 1-1, four sets of gears 1-3 corresponding to the four sets of adaptor probes 1-2 have an equal difference sequence with the first term and the equal difference sequence with the difference, and a rack frame 1-4 is arranged on the same plane with the gears 1-3, the rack frame 1-4 is composed of a plurality of parallel stepped racks 1-4-1, the racks 1-4-1 are meshed with gears 1-3, a bending structure is arranged below the transfer probe 1-2, and the bending structures of all the transfer probes 1-2 are bent towards the same direction at the initial position;
the socket structure is shown in fig. 4 and comprises a base plate 2-1, a triangular base 2-2 capable of sliding on the base plate 2-1 and an even distribution frame 2-3 capable of moving up and down; a notch is formed in one side of the triangular base 2-2, a conducting layer 2-2-1 is arranged on the inner side face of the notch, the width of the conducting layer 2-2-1 is smaller than 2rsin (pi/8), and r is the radius of a bending structure below the adapter probe 1-2; the conducting layer 2-2-1 penetrates through the base plate 2-1 from the lower part of the triangular base 2-2 to be connected with the outside through a conducting wire 2-2-2, an insulating plate 2-2-3 is arranged on the other side of the triangular base 2-2, the uniform distribution frame 2-3 is composed of a plurality of insulating columns which are parallel and have the same interval, and the direction of each insulating column is perpendicular to the direction of the rack 1-4-1.
Detailed description of the invention
The following are specific embodiments of the probe adapter and socket structure for synchronous or quasi-synchronous testing of the present invention.
In the probe adaptor and the socket structure for synchronous or quasi-synchronous testing in the embodiment, on the basis of the first specific embodiment, it is further limited that a first bearing 1-5-1 is arranged between the adaptor probe 1-2 and a limit plate 1-1, an outer ring of the first bearing 1-5-1 is in interference fit with the limit plate 1-1, the limit plate 1-1 is made of an insulating material plate, an inner ring of the first bearing 1-5-1 is in interference fit with the adaptor probe 1-2, and a gear 1-3 and a second bearing 1-5-2 which are coaxial with the first bearing 1-5-1 are sequentially arranged above the first bearing 1-5-1; the flat cable 1-7 comprises a sheath 1-7-1 and a core wire 1-7-2, the sheath 1-7-1 is sleeved on an outer ring of the second bearing 1-5-2, the core wire 1-7-2 is welded on the outer ring of the second bearing 1-5-2, and the core wire 1-7-2 is in short circuit with the adapter probe 1-2 sequentially through the outer ring of the second bearing 1-5-2, a rolling body of the second bearing 1-5-2 and an inner ring of the second bearing 1-5-2, as shown in fig. 2.
Detailed description of the invention
The following are specific embodiments of the probe adapter and socket structure for synchronous or quasi-synchronous testing of the present invention.
In the probe adaptor and socket structure for synchronous or quasi-synchronous testing in the embodiment, on the basis of the first specific embodiment, synchronous plates 1-4-2 are further arranged at two ends of a plurality of parallel stepped racks 1-4-1 in a rack frame 1-4, a screw rod 1-4-3 is arranged at the outer end of one synchronous plate 1-4-2, a nut 1-4-4 capable of rotating around the screw rod 1-4-3 is arranged on the screw rod 1-4-3, the nut 1-4-4 is installed inside a hollow shaft motor 1-4-5, the hollow shaft motor 1-4-5 operates to drive the nut 1-4-4 to rotate, and further drive the synchronous plate 1-4-2 to translate, finally, the transit probe 1-2 is driven to rotate, as shown in fig. 3.
Detailed description of the invention
The following are specific embodiments of the probe adapter and socket structure for synchronous or quasi-synchronous testing of the present invention.
In the probe adaptor and the socket structure for synchronous or quasi-synchronous testing in the embodiment, on the basis of the first specific embodiment, it is further limited that a slide way 2-1-1 is arranged on a substrate 2-1, a triangular base 2-2 is seated on the slide way 2-1-1 and can move on the slide way 2-1-1, limiting parts 2-1-2 are arranged at two ends of the slide way 2-1-1 and used for limiting the moving track of the triangular base 2-2, a wire guide 2-1-3 is arranged between two adjacent slide ways 2-1-1 of the substrate 2-1, and the wire 2-2-2 extends out of the wire guide 2-1-3 and is connected with the outside, as shown in fig. 4.
Detailed description of the invention
The following are specific embodiments of the probe adapter and the probe adapter in the socket structure for synchronous or quasi-synchronous testing according to the present invention.
In the present embodiment, as shown in fig. 2 and 3, the probe adaptor includes four exchangeable adaptor sockets 1-6, each adaptor socket 1-6 is connected to an adaptor probe 1-2 through a flat cable 1-7, holes on the adaptor sockets 1-6 are distributed in a matrix, needles on the adaptor probes 1-2 are distributed in a vector, the adaptor probes 1-2 penetrate through a limiting plate 1-1 and can rotate around themselves, the adaptor probes 1-2 are provided with gears 1-3 at a portion above the limiting plate 1-1, radii of four sets of gears 1-3 corresponding to the four sets of adaptor probes 1-2 form an arithmetic progression with an initial term and a tolerance equal to each other, a rack frame 1-4 is provided on a same plane with the gears 1-3, the rack frame 1-4 is composed of a plurality of parallel stepped racks 1-4-1, the rack 1-4-1 is meshed with the gear 1-3, a bending structure is arranged below the adapter probe 1-2, and the bending structures of all the adapter probes 1-2 are bent towards the same direction at the initial position.
Detailed description of the invention
The following is a specific embodiment of the socket structure in the probe adaptor and socket structure for synchronous or quasi-synchronous testing of the present invention.
As shown in fig. 4, the socket structure of the present embodiment includes a base plate 2-1, a triangular base 2-2 capable of sliding on the base plate 2-1, and an even distribution frame 2-3 capable of moving up and down; a notch is formed in one side of the triangular base 2-2, a conducting layer 2-2-1 is arranged on the inner side face of the notch, the width of the conducting layer 2-2-1 is smaller than 2rsin (pi/8), and r is the radius of a bending structure below the adapter probe 1-2; the conducting layer 2-2-1 penetrates through the base plate 2-1 from the lower part of the triangular base 2-2 to be connected with the outside through a conducting wire 2-2-2, an insulating plate 2-2-3 is arranged on the other side of the triangular base 2-2, the uniform distribution frame 2-3 is composed of a plurality of insulating columns which are parallel and have the same interval, and the direction of each insulating column is perpendicular to the direction of the rack 1-4-1.
Detailed description of the invention
The following is a specific embodiment of the probe adaptor and the cable spacing plate probe combination structure in the socket structure for synchronous or quasi-synchronous testing according to the present invention.
In the flat cable limiting plate probe combination structure according to the embodiment, as shown in fig. 2, in the flat cable limiting plate probe combination structure, a first bearing 1-5-1 is arranged between a switching probe 1-2 and a limiting plate 1-1, an outer ring of the first bearing 1-5-1 is in interference fit with the limiting plate 1-1, the limiting plate 1-1 is an insulating material plate, an inner ring of the first bearing 1-5-1 is in interference fit with the switching probe 1-2, and a gear 1-3 and a second bearing 1-5-2 which are coaxial with the first bearing 1-5-1 are sequentially arranged above the first bearing 1-5-1; the flat cable 1-7 comprises a sheath 1-7-1 and a core wire 1-7-2, the sheath 1-7-1 is sleeved on an outer ring of the second bearing 1-5-2, the core wire 1-7-2 is welded on the outer ring of the second bearing 1-5-2, and the core wire 1-7-2 is in short circuit with the adapter probe 1-2 sequentially through the outer ring of the second bearing 1-5-2, a rolling body of the second bearing 1-5-2 and an inner ring of the second bearing 1-5-2.
Detailed description of the invention
The following is a specific embodiment of the probe adaptor and socket matching method for synchronous testing or quasi-synchronous testing of the present invention.
In the probe adaptor and socket matching method for synchronous testing or quasi-synchronous testing in this embodiment, a flowchart is shown in fig. 5, and the probe adaptor and socket matching method for synchronous testing or quasi-synchronous testing includes the following steps:
step a, inserting a chip to be tested into an adapter socket 1-6, and inserting an adapter probe 1-2 of a probe adapter into a socket structure;
b, operating the hollow shaft motor 1-4-5 to enable the bending structure below the switching probe 1-2 to be consistent with the direction of the insulating column in the uniform distribution frame 2-3;
c, inserting the adapter probe 1-2 to a fixed depth towards the direction of the socket structure;
d, testing the first group of transfer probes 1-2;
the hollow shaft motor 1-4-5 operates to enable the switching probe 1-2 corresponding to the gear 1-3 with the smallest radius to rotate around the hollow shaft motor, and the bending structure below the switching probe 1-2 points to the conducting layer 2-2-1 on the inner side surface of the opening in the triangular base 2-2;
downwards moving the uniform distribution frame 2-3 to enable the insulating columns in the uniform distribution frame 2-3 to be in contact with the insulating plates 2-2-3 on the triangular base 2-2, and further enabling the bent structure below the switching probe 1-2 in the step to be in contact with the conducting layer 2-2-1;
testing the switching probe 1-2;
moving the equalizing frame 2-3 upwards to separate the insulating columns in the equalizing frame 2-3 from the insulating plates 2-2-3 on the triangular base 2-2;
step e, testing a second group of transfer probes 1-2;
the hollow shaft motor 1-4-5 operates to enable the switching probe 1-2 corresponding to the second pinion 1-3 with the radius to rotate around the hollow shaft motor, and the bent structure below the switching probe 1-2 points to the conducting layer 2-2-1 on the inner side surface of the opening in the triangular base 2-2;
downwards moving the uniform distribution frame 2-3 to enable the insulating columns in the uniform distribution frame 2-3 to be in contact with the insulating plates 2-2-3 on the triangular base 2-2, and further enabling the bent structure below the switching probe 1-2 in the step to be in contact with the conducting layer 2-2-1;
testing the switching probe 1-2;
moving the equalizing frame 2-3 upwards to separate the insulating columns in the equalizing frame 2-3 from the insulating plates 2-2-3 on the triangular base 2-2;
f, testing a third group of transfer probes 1-2;
the hollow shaft motor 1-4-5 operates to enable the transfer probe 1-2 corresponding to the second big gear wheel 1-3 with the radius to rotate around the hollow shaft motor, and the bending structure below the transfer probe 1-2 points to the conducting layer 2-2-1 on the inner side surface of the opening in the triangular base 2-2;
downwards moving the uniform distribution frame 2-3 to enable the insulating columns in the uniform distribution frame 2-3 to be in contact with the insulating plates 2-2-3 on the triangular base 2-2, and further enabling the bent structure below the switching probe 1-2 in the step to be in contact with the conducting layer 2-2-1;
testing the switching probe 1-2;
moving the equalizing frame 2-3 upwards to separate the insulating columns in the equalizing frame 2-3 from the insulating plates 2-2-3 on the triangular base 2-2;
step g, testing a fourth group of transfer probes 1-2;
the hollow shaft motor 1-4-5 operates to enable the switching probe 1-2 corresponding to the gear 1-3 with the largest radius to rotate around the hollow shaft motor, and the bent structure below the switching probe 1-2 points to the conducting layer 2-2-1 on the inner side surface of the opening in the triangular base 2-2;
downwards moving the uniform distribution frame 2-3 to enable the insulating columns in the uniform distribution frame 2-3 to be in contact with the insulating plates 2-2-3 on the triangular base 2-2, and further enabling the bent structure below the switching probe 1-2 in the step to be in contact with the conducting layer 2-2-1;
testing the switching probe 1-2;
moving the equalizing frame 2-3 upwards to separate the insulating columns in the equalizing frame 2-3 from the insulating plates 2-2-3 on the triangular base 2-2;
h, operating the hollow shaft motor 1-4-5 to enable the transfer probe 1-2 to rotate around the hollow shaft motor, so that the direction of a bending structure below the transfer probe 1-2 is consistent with that of an insulating column in the uniform distribution frame 2-3;
and i, pulling the probe adapter out of the socket structure, and pulling the chip to be tested out of the adapter socket 1-6 of the probe adapter.
Detailed description of the invention
The following is a specific embodiment of the probe adaptor and socket matching method for synchronous testing or quasi-synchronous testing of the present invention.
The probe adaptor and the socket matching method for the synchronous test or the quasi-synchronous test in the embodiment further define that:
only one chip to be tested is inserted into the adapter socket 1-6 corresponding to the gear 1-3 with the smallest radius, and the step a, the step b, the step c, the step d, the step h and the step i are executed;
inserting the chips to be tested into the adapter sockets 1-6 corresponding to the radius minimum gear 1-3 and the radius second pinion 1-3, and executing the steps a, b, c, d, e, h and i;
inserting the chips to be tested into adapter sockets 1-6 corresponding to the radius minimum gear 1-3, the radius second pinion 1-3 and the radius second bull gear 1-3, and executing the steps a, b, c, d, e, f, h and i;
and (4) inserting the chips to be tested into all the adapter sockets 1-6, and executing the steps a, b, c, d, e, f, g, h and i.
It should be noted that all the technical features listed in the above embodiments can be arranged and combined without contradiction, and those skilled in the art can exhaust the results of each arrangement and combination according to the mathematical knowledge of the arrangement and combination learned in the high-school stage, and all the results of the arrangement and combination should be understood as being disclosed in the present application.
Claims (5)
1. The probe adapter and the socket structure for synchronous or quasi-synchronous testing are characterized by comprising a probe adapter and a socket structure which are matched with each other;
the probe adaptor comprises four replaceable adaptor sockets (1-6), each adaptor socket (1-6) is connected with an adaptor probe (1-2) through a flat cable (1-7), holes in the adaptor sockets (1-6) are distributed in a matrix manner, needles on the adaptor probes (1-2) are distributed in a vector manner, the adaptor probes (1-2) penetrate through a limiting plate (1-1) and can rotate around the adaptor probes, gears (1-3) are arranged on the parts, above the limiting plate (1-1), of the adaptor probes (1-2), radiuses of four groups of gears (1-3) corresponding to the four groups of adaptor probes (1-2) form an equal-difference number array with the first item and the same tolerance, and rack frames (1-4) are arranged on the same plane with the gears (1-3), the rack frame (1-4) is composed of a plurality of parallel stepped racks (1-4-1), the racks (1-4-1) are meshed with gears (1-3), a bending structure is arranged below the transfer probes (1-2), and the bending structures of all the transfer probes (1-2) bend in the same direction at the initial positions;
the socket structure comprises a substrate (2-1), a triangular base (2-2) capable of sliding on the substrate (2-1) and an even distribution frame (2-3) capable of moving up and down; a notch is formed in one side of the triangular base (2-2), a conducting layer (2-2-1) is arranged on the inner side face of the notch, the width of the conducting layer (2-2-1) is smaller than 2rsin (pi/8), and r is the radius of a bending structure below the switching probe (1-2); the conducting layer (2-2-1) penetrates through the base plate (2-1) from the lower portion of the triangular base (2-2) through a conducting wire (2-2-2) to be connected with the outside, an insulating plate (2-2-3) is arranged on the other side of the triangular base (2-2), the uniform distribution frame (2-3) is composed of a plurality of parallel insulating columns with the same interval, and the direction of each insulating column is perpendicular to the direction of the rack (1-4-1).
2. The probe adaptor and socket structure for synchronous or quasi-synchronous tests according to claim 1, wherein a first bearing (1-5-1) is arranged between the adaptor probe (1-2) and the limit plate (1-1), an outer ring of the first bearing (1-5-1) is in interference fit with the limit plate (1-1), the limit plate (1-1) is made of an insulating material plate, an inner ring of the first bearing (1-5-1) is in interference fit with the adaptor probe (1-2), and a gear (1-3) and a second bearing (1-5-2) coaxial with the first bearing (1-5-1) are sequentially arranged above the first bearing (1-5-1); the flat cable (1-7) comprises a sheath (1-7-1) and a core wire (1-7-2), the sheath (1-7-1) is sleeved on an outer ring of the second bearing (1-5-2), the core wire (1-7-2) is welded on the outer ring of the second bearing (1-5-2), and the core wire (1-7-2) is in short circuit with the adapter probe (1-2) sequentially through the outer ring of the second bearing (1-5-2), a rolling body of the second bearing (1-5-2) and an inner ring of the second bearing (1-5-2).
3. The probe adaptor and socket structure for synchronous or quasi-synchronous testing according to claim 1, wherein in the rack frame (1-4), both ends of a plurality of parallel stepped racks (1-4-1) are provided with synchronous plates (1-4-2), the outer end of one synchronous plate (1-4-2) is provided with a lead screw (1-4-3), the lead screw (1-4-3) is provided with a nut (1-4-4) capable of rotating around itself, the nut (1-4-4) is installed inside a hollow shaft motor (1-4-5), the hollow shaft motor (1-4-5) operates to drive the nut (1-4-4) to rotate, and further drive the synchronous plates (1-4-2) to translate, finally, the switching probe (1-2) is driven to rotate.
4. The probe adaptor and socket structure for synchronous or quasi-synchronous testing according to claim 1, wherein a slideway (2-1-1) is arranged on the base plate (2-1), the triangular base (2-2) is seated on the slideway (2-1-1) and can move on the slideway (2-1-1), two ends of the slideway (2-1-1) are provided with limiting parts (2-1-2) for limiting the moving track of the triangular base (2-2), the base plate (2-1) is provided with a wire guide hole (2-1-3) between two adjacent slideways (2-1-1), the wire (2-2-2) extends out of the wire guide hole (2-1-3), the outside is connected.
5. The key structure of the probe adapter and the socket structure for synchronous or quasi-synchronous testing is characterized in that the probe adapter is a probe adapter, the probe adapter comprises four adapter sockets (1-6) capable of being replaced, each adapter socket (1-6) is connected with an adapter probe (1-2) through a flat cable (1-7), holes in the adapter sockets (1-6) are distributed in a matrix manner, needles on the adapter probes (1-2) are distributed in a vector manner, the adapter probes (1-2) penetrate through a limiting plate (1-1) and can rotate around the adapter probes, gears (1-3) are arranged on the parts, above the limiting plate (1-1), of the adapter probes (1-2), the radiuses of four groups of gears (1-3) corresponding to the four groups of adapter probes (1-2) form an arithmetic series with the first item and the same tolerance, the gear rack is characterized in that a rack frame (1-4) is arranged on the same plane with the gear (1-3), the rack frame (1-4) is composed of a plurality of parallel stepped racks (1-4-1), the racks (1-4-1) are meshed with the gear (1-3), a bending structure is arranged below the transfer probe (1-2), and the bending structures of all the transfer probes (1-2) bend in the same direction at the initial position.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011365952.5A CN112462105B (en) | 2020-11-29 | 2020-11-29 | Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure |
| CN202110556811.XA CN113125817B (en) | 2020-11-29 | 2020-11-29 | Flat cable limiting plate probe composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011365952.5A CN112462105B (en) | 2020-11-29 | 2020-11-29 | Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110556811.XA Division CN113125817B (en) | 2020-11-29 | 2020-11-29 | Flat cable limiting plate probe composite structure |
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| CN112462105A CN112462105A (en) | 2021-03-09 |
| CN112462105B true CN112462105B (en) | 2021-07-30 |
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| CN202011365952.5A Active CN112462105B (en) | 2020-11-29 | 2020-11-29 | Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure |
| CN202110556811.XA Active CN113125817B (en) | 2020-11-29 | 2020-11-29 | Flat cable limiting plate probe composite structure |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110556811.XA Active CN113125817B (en) | 2020-11-29 | 2020-11-29 | Flat cable limiting plate probe composite structure |
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| CN117434314B (en) * | 2023-09-11 | 2024-07-12 | 法特迪精密科技（苏州）有限公司 | Adapting device and method for rotary probe and matched socket |
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| US6209194B1 (en) * | 1996-10-05 | 2001-04-03 | Samsung Electronics Co., Ltd. | Apparatus for loading and unloading semiconductor device packages using servo motors |
| JP2008309608A (en) * | 2007-06-14 | 2008-12-25 | Ricoh Co Ltd | Inspection apparatus |
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| CN210142138U (en) * | 2019-05-16 | 2020-03-13 | 陈龙 | Probe for communication tower maintenance |
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| US7759949B2 (en) * | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
| JP2008224640A (en) * | 2007-03-08 | 2008-09-25 | Isao Kimoto | Probe assembly with rotary tip |
| US9797928B2 (en) * | 2014-09-15 | 2017-10-24 | International Business Machines Corporation | Probe card assembly |
| GB2581129B (en) * | 2019-01-21 | 2021-08-04 | Megger Instruments Ltd | Conductive probe |
| CN210347721U (en) * | 2019-07-25 | 2020-04-17 | 成都汉芯国科集成技术有限公司 | Manual probe station for chip |
| CN111398791A (en) * | 2020-04-29 | 2020-07-10 | 苏州创瑞机电科技有限公司 | Test probe, optical chip module test probe assembly, probe assembly assembling method and optical chip module test device |
| CN212568890U (en) * | 2020-04-29 | 2021-02-19 | 苏州创瑞机电科技有限公司 | Assembling tool for chip test probe assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6209194B1 (en) * | 1996-10-05 | 2001-04-03 | Samsung Electronics Co., Ltd. | Apparatus for loading and unloading semiconductor device packages using servo motors |
| JP2008309608A (en) * | 2007-06-14 | 2008-12-25 | Ricoh Co Ltd | Inspection apparatus |
| JP2012220268A (en) * | 2011-04-06 | 2012-11-12 | Hioki Ee Corp | Test probe for measuring instrument |
| CN210142138U (en) * | 2019-05-16 | 2020-03-13 | 陈龙 | Probe for communication tower maintenance |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112462105A (en) | 2021-03-09 |
| CN113125817B (en) | 2022-04-19 |
| CN113125817A (en) | 2021-07-16 |
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