CN112466805B - Semiconductor cleaning equipment and bearing device thereof - Google Patents
Semiconductor cleaning equipment and bearing device thereof Download PDFInfo
- Publication number
- CN112466805B CN112466805B CN202011267613.3A CN202011267613A CN112466805B CN 112466805 B CN112466805 B CN 112466805B CN 202011267613 A CN202011267613 A CN 202011267613A CN 112466805 B CN112466805 B CN 112466805B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 238000004891 communication Methods 0.000 claims description 77
- 239000012530 fluid Substances 0.000 claims description 55
- 238000003860 storage Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 18
- 238000007667 floating Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 7
- 238000004904 shortening Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application provides semiconductor cleaning equipment and a bearing device thereof. The carrying device comprises: the chuck assembly comprises a chuck and an adapter, wherein the adapter is arranged at the bottom of the chuck and is concentric with the chuck, and the chuck is used for bearing a wafer; the bearing assembly comprises a bearing piece and a telescopic structure, the accommodating cavity of the bearing piece is used for accommodating the adapter piece and is rotationally positioned with the adapter piece, and the driver drives the bearing assembly to rotate so as to drive the chuck to rotate; the telescopic structures are arranged in the bearing piece and distributed along the circumferential direction of the accommodating cavity, the axes of the telescopic structures are arranged in parallel with the radial direction of the accommodating cavity, and the end parts of the telescopic structures can extend into the accommodating cavity to prop against the peripheral wall of the adapter and are used for clamping and fixing the adapter in the accommodating cavity; the control assembly is arranged on the driver, selectively connected with the bearing assembly and used for controlling the telescopic structure to shrink so as to release the adapter. The embodiment of the application realizes the quick disassembly and assembly of the chuck, thereby greatly shortening the maintenance time of the chuck.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to semiconductor cleaning equipment and a bearing device thereof.
Background
At present, compared with a groove type cleaning machine, a single-chip cleaning machine in the semiconductor industry has the advantages that the single-chip cleaning machine is used for cleaning a single chip, the cleaning effect is good, but the working efficiency is relatively low, and the single-chip cleaning machine is required to shorten the takt time as much as possible so as to increase the working efficiency. The chuck of singlechip cleaning machine is used for centre gripping wafer, then carries out high-speed rotation according to predetermined speed under the drive of motor, because the part of centre gripping wafer in the chuck is the resin spare, and long-time operation has wearing and tearing, must regularly change, and current chuck dismouting is loaded down with trivial details, the time is longer, influences the operating efficiency of equipment.
In the prior art, the connecting piece is fixed through screw and motor rotor connection, and the chuck is fixed through screw and connecting piece connection, and motor stator and other mounting are connected, through this kind of connected mode, and the motor can drive the chuck and rotate. When the chuck needs to be maintained, the chuck cover is removed by removing the screw between the chuck cover and the chuck, and then the chuck is removed by removing the screw between the chuck and the connecting piece. Because the disassembly and assembly in the prior art are tedious and take longer time, the maintenance time of the equipment is greatly increased, and the production efficiency of the equipment is reduced.
Disclosure of Invention
The application provides a semiconductor cleaning device and a bearing device thereof, aiming at the defects of the prior art, and aims to solve the technical problem that the production efficiency is reduced due to longer disassembly, assembly and maintenance time of a chuck in the prior art.
Therefore, the invention provides a structure capable of realizing the rapid disassembly and assembly function of the chuck, which can effectively shorten the disassembly and assembly time of the chuck and improve the working efficiency of single-chip cleaning machine equipment.
In a first aspect, an embodiment of the present application provides a carrier device of a semiconductor cleaning apparatus, including: chuck assembly, bearing assembly, driver and control assembly; the chuck assembly comprises a chuck and an adapter, wherein the adapter is arranged at the bottom of the chuck and is concentric with the chuck, and the chuck is used for bearing a wafer; the bearing assembly comprises a bearing piece and a telescopic structure, a containing cavity is formed in the top of the bearing piece and used for containing the adapter piece and rotationally positioning the adapter piece, the bottom of the bearing piece is connected with the driver, and the driver drives the chuck to rotate by driving the bearing piece to rotate; the telescopic structures are arranged in the bearing piece and are distributed along the circumferential direction of the accommodating cavity, the axes of the telescopic structures are arranged in parallel with the radial direction of the accommodating cavity, and the end parts of the telescopic structures can extend into the accommodating cavity to prop against the peripheral wall of the adapter and are used for clamping and fixing the adapter in the accommodating cavity;
the control assembly is arranged on the driver, is selectively connected with the bearing assembly and is used for controlling the telescopic structure to shrink so as to release the adapter.
In an embodiment of the present application, a plurality of mounting grooves are formed in the carrier, and a plurality of the telescopic structures are respectively disposed in the plurality of mounting grooves; the telescopic structure comprises a propping rod, an elastic piece and a plug, wherein the propping rod is arranged in the mounting groove in a sliding mode, the elastic piece is arranged between the propping rod and the plug and is used for applying acting force to the propping rod so that the end part of the propping rod enters the accommodating cavity, and the plug is connected with a port of the mounting groove so as to limit the elastic piece and the propping rod in the mounting groove.
In an embodiment of the application, the bottom wall of the mounting groove is communicated with the side wall of the accommodating cavity through a through hole, and the inner diameter of the through hole is smaller than the inner diameter of the mounting groove; the propping rod comprises a sliding part and a propping part, the sliding part is in sliding fit with the mounting groove, and the propping part can extend into the accommodating cavity through the through hole.
In an embodiment of the application, an end of the propping portion is tapered, and a limiting groove is correspondingly formed in the peripheral wall of the adapter along the circumferential direction, and the end of the propping portion is matched with the limiting groove so as to press the adapter into the accommodating cavity.
In an embodiment of the application, a pressure storage cavity is formed on the bottom wall of the mounting groove, and the pressure storage cavity is arranged around the periphery of the through hole; the bearing piece is internally provided with a fluid channel, the fluid channel is communicated with the pressure storage cavities of the mounting grooves, the control assembly is selectively communicated with the fluid channel and is used for inputting fluid into the pressure storage cavities through the fluid channel so that the propping rod can be withdrawn from the accommodating cavity to release the adapter.
In an embodiment of the present application, the bearing member includes a bearing ring and a bearing disc that are stacked, a bottom surface of the bearing ring is provided with a plurality of air inlets, the plurality of air inlets are in one-to-one correspondence with a plurality of pressure storage cavities, a top surface of the bearing disc is provided with an annular groove, the bearing ring is in sealing fit with the bearing disc, the annular groove is communicated with the plurality of air inlets, an air inlet is further provided in the bearing disc, the air inlet is communicated with the annular groove, the control component is selectively communicated with the air inlet, and the air inlet, the annular groove and the plurality of air inlets form the fluid channel; the plurality of mounting grooves are uniformly distributed in the circumferential direction of the bearing ring.
In an embodiment of the present application, a groove is formed on the top surface of the bearing disc, and the inner sidewall of the bearing ring and the groove together form the accommodating cavity; the bottom surface of the adapter is provided with a positioning table, the positioning table and the adapter are eccentrically arranged, the bottom wall of the groove is provided with a positioning groove corresponding to the positioning table, and the positioning table is matched with the positioning groove to rotate and position the adapter and the bearing plate.
In an embodiment of the present application, the air inlet channel includes a first flow channel, a second flow channel and a sealing plug, the first flow channel extends from the outer peripheral wall of the bearing disc to be communicated with the annular groove, the second flow channel extends from the bottom surface of the bearing disc to be communicated with the first flow channel, and the sealing plug is disposed at a port of the first flow channel for sealing the first flow channel; the control assembly is in selective communication with the second flow passage.
In an embodiment of the present application, the control assembly includes a communication structure and a driving structure, where the communication structure is slidably disposed on one side of the driver, and is used for guiding fluid to the fluid channel when communicating with the fluid channel; the driving structure is arranged on the same side as the communication structure and is in transmission connection with the communication structure, and is used for driving the lifting of the communication structure to be selectively communicated with the fluid channel.
In an embodiment of the present application, the communication structure includes a linear bearing, a communication rod, and a connection joint, where the linear bearing is disposed on the driver, the communication rod is sleeved in the linear bearing, a third flow channel is provided in the communication rod, an outlet of the third flow channel is located at a top end of the communication rod, and the top end of the communication rod can be selectively connected with the bearing assembly to selectively communicate the third flow channel with the fluid channel, a bottom end of the communication rod is connected with the driving structure, and the connection joint is disposed on one side of the communication rod and is used for connection with a fluid source.
In an embodiment of the application, the driving structure includes a driving portion and a floating joint, and the telescopic rod of the driving portion is connected with the bottom end of the communication rod through the floating joint.
In a second aspect, an embodiment of the present application provides a semiconductor cleaning apparatus comprising a carrier device as provided in the first aspect.
The technical scheme provided by the embodiment of the application has the beneficial technical effects that:
According to the embodiment of the application, the adapter of the chuck assembly is accommodated in the accommodating cavity of the bearing piece, and the end part of the telescopic structure can extend into the accommodating cavity so as to clamp and fix the adapter in the accommodating cavity; the control assembly is used for controlling the telescopic structure to shrink so that the telescopic structure releases the adapter, and therefore quick assembly disassembly of the chuck is achieved. The embodiment of the application can realize the quick assembly and disassembly of the chuck assembly, thereby not only realizing the semi-automatic control of the assembly and disassembly of the chuck, but also being quick and effective, greatly shortening the maintenance time of the chuck and further improving the working efficiency of the semiconductor cleaning equipment.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of a carrying device according to an embodiment of the present application;
Fig. 2 is a schematic cross-sectional view of a carrier device with a chuck omitted;
fig. 3 is a schematic structural diagram of an adaptor according to an embodiment of the present application;
Fig. 4 is an exploded view of a carrying device according to an embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a carrier according to an embodiment of the present application;
FIG. 6 is a schematic top view of a supporting ring and a telescopic structure according to an embodiment of the present application;
Fig. 7 is a schematic cross-sectional view of a bearing ring and a telescopic structure according to an embodiment of the present application.
Detailed Description
The present application is described in detail below, examples of embodiments of the application are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments.
An embodiment of the present application provides a carrying device of a semiconductor cleaning apparatus, where a schematic structural diagram of the carrying device of the semiconductor cleaning apparatus is shown in fig. 1 and fig. 2, and the carrying device includes: chuck assembly 1, carrier assembly 2, driver 3 and control assembly 4; the chuck assembly 1 comprises a chuck 11 and an adapter 12, wherein the adapter 12 is arranged at the bottom of the chuck 11 and is concentric with the chuck 11, and the chuck 11 is used for bearing a wafer (not shown in the figure); the bearing assembly 2 comprises a bearing piece 21 and a telescopic structure 22, the top of the bearing piece 21 is provided with a containing cavity 23, the containing cavity 23 is used for containing the adapter piece 12 and is rotationally positioned with the adapter piece 12, the bottom of the bearing piece 21 is connected with the driver 3, and the driver 3 drives the chuck 11 to rotate by driving the bearing piece 21 to rotate; the telescopic structures 22 are all arranged in the bearing piece 21 and distributed along the circumferential direction of the accommodating cavity 23, the axes of the telescopic structures 22 are arranged in parallel with the radial direction of the accommodating cavity 23, and the end parts of the telescopic structures 22 can extend into the accommodating cavity 23 to prop against the peripheral wall of the adapter 12 and are used for clamping and fixing the adapter 12 in the accommodating cavity 23; the control assembly 4 is disposed on the driver 3, and the control assembly 4 is selectively connected with the bearing assembly 2, so as to control the telescopic structure 22 to retract to release the adaptor 12.
As shown in fig. 1 and 2, the carrier device is specifically disposed in a process chamber (not shown) of the semiconductor cleaning apparatus, but the embodiment of the application is not limited thereto, and for example, the carrier device may be applied to other semiconductor process apparatuses. The chuck assembly 1 comprises a chuck 11 and an adapter 12, the adapter 12 can be in a cylindrical structure, the adapter 12 is arranged at the bottom of the chuck 11 and is concentrically arranged with the chuck 11 so as to drive the chuck 11 and a wafer carried on the chuck 11 to rotate. The adaptor 12 and the chuck 11 may be integrally connected and fixed by bolts, but the embodiment of the application is not limited thereto. The bearing assembly 2 includes a bearing member 21 and a telescopic structure 22, and the top of the bearing member 21 may be provided with a concentric accommodating cavity 23 for accommodating the adaptor 12, but the embodiment of the application does not limit that the accommodating cavity 23 must be concentric with the bearing member 21. The accommodating cavity 23 can be rotatably positioned with the adaptor 12, that is, when the driver 3 drives the carrier 21 to rotate, the accommodating cavity 23 is cooperatively positioned with the adaptor 12 to drive the carrier plate 212 to rotate. The bottom of the carrier 21 may be connected to the driver 3, for example, the driver 3 may be a motor, and the carrier 21 may be connected to a rotor of the motor, but the embodiment of the application is not limited thereto. The plurality of telescopic structures 22 are arranged in the bearing piece 21, the plurality of telescopic structures 22 can be circumferentially distributed along the accommodating cavity 23, the axes of the telescopic structures 22 are parallel to the radial direction of the accommodating cavity 23, and the end parts of the telescopic structures 22 can extend into the accommodating cavity 23 to prop against the peripheral wall of the adapter 12 so as to clamp and fix the adapter 12 in the accommodating cavity 23. The control assembly 4 may be disposed on the driver 3, for example, the driver 3 may be a motor, the control assembly may be connected with a housing of the motor or other fixed components, the control assembly 4 is selectively connected with the carrier assembly 2, and the control assembly 4 may control the telescopic structure 22 to retract to release the adaptor 12, so as to realize quick assembly and disassembly between the chuck assembly 1 and the carrier assembly 2.
According to the embodiment of the application, the adapter of the chuck assembly is accommodated in the accommodating cavity of the bearing piece, and the end part of the telescopic structure can extend into the accommodating cavity so as to clamp and fix the adapter in the accommodating cavity; the control assembly is used for controlling the telescopic structure to shrink so that the telescopic structure releases the adapter, and therefore quick assembly disassembly of the chuck is achieved. The embodiment of the application can realize the quick assembly and disassembly of the chuck assembly, thereby not only realizing the semi-automatic control of the assembly and disassembly of the chuck, but also being quick and effective, greatly shortening the maintenance time of the chuck and further improving the working efficiency of the semiconductor cleaning equipment.
In an embodiment of the present application, as shown in fig. 2, 5 and 6, a plurality of mounting slots 24 are formed in the carrier 21, and a plurality of telescopic structures 22 are respectively disposed in the plurality of mounting slots 24; the telescopic structure 22 comprises a propping rod 221, an elastic piece 222 and a plug 223, wherein the propping rod 221 is slidably arranged in the mounting groove 24, the elastic piece 222 is arranged between the propping rod 221 and the plug 223 and is used for applying a force to the propping rod 221 so that the end part of the propping rod 221 enters the accommodating cavity 23, and the plug 223 is connected with the port of the mounting groove 24 so as to limit the elastic piece 222 and the propping rod 221 in the mounting groove 24. Specifically, the carrier 21 has a plurality of mounting grooves 24 formed therein, and the plurality of telescopic structures 22 are respectively disposed in the plurality of mounting grooves 24. The supporting rod 221 adopts a rod-shaped structure, the supporting rod 221 is disposed in the mounting groove 24, and an end portion of the supporting rod 221 can extend into the accommodating cavity 23 to support the adaptor 12. The elastic member 222 may be a coil spring, and the elastic member 222 is disposed between the supporting rod 221 and the plug 223, so as to apply an elastic force to the supporting rod 221, so that an end of the supporting rod 221 extends into the accommodating cavity 23, but the embodiment of the application is not limited to the specific type of the elastic member 222. The plug 223 may specifically adopt a plate structure, and the plug 223 and the mounting groove 24 may be fixedly connected by a screw connection manner, so as to limit the elastic member 222 and the propping rod 221 in the mounting groove 24. By adopting the design, the embodiment of the application has simple structure and easy realization, thereby greatly reducing the application and maintenance cost of the embodiment of the application.
It should be noted that the embodiment of the present application is not limited to the specific implementation of the telescopic structure 22, for example, the telescopic structure 22 may also be an elastic protruding pin structure. Therefore, the embodiment of the application is not limited to this, and the person skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 2 and 6, the bottom wall of the mounting groove 24 is communicated with the side wall of the accommodating cavity 23 through a through hole 25, and the inner diameter of the through hole 25 is smaller than the inner diameter of the mounting groove 24; the propping rod 221 comprises a sliding portion 2211 and a propping portion 2212, the sliding portion 2211 is in sliding fit with the mounting groove 24, and the propping portion 2212 can extend into the accommodating cavity 23 through the through hole 25. Specifically, a through hole 25 is formed between the bottom wall of the mounting groove 24 and the side wall of the receiving chamber 23, and the inner diameter of the through hole 25 may be smaller than the inner diameter of the mounting groove 24 to define the position of the abutment bar 221. The outer diameter of the sliding portion 2211 of the propping rod 221 is slightly smaller than the inner diameter of the mounting groove 24, so that the sliding portion 2211 slides relative to the mounting groove 24, the propping portion 2212 and the sliding portion 2211 are integrally formed, the outer diameter of the propping portion 2212 is slightly smaller than the inner diameter of the through hole 25, so that the propping portion 2212 slides relative to the through hole 25, and the end portion of the propping portion 2212 can extend into the accommodating cavity 23. By adopting the design, the embodiment of the application has simpler structure and is easy to use, thereby reducing the manufacturing and application cost.
In an embodiment of the present application, as shown in fig. 2, 3 and 6, the end of the propping portion 2212 is tapered, and the peripheral wall of the adapter 12 is correspondingly provided with a limiting groove 13 along the circumferential direction, and the end of the propping portion 2212 is matched with the limiting groove 13 to press the adapter 12 into the accommodating cavity 23. Specifically, the end of the propping portion 2212 near the accommodating cavity 23 adopts a conical structure, and the peripheral wall of the adapter 12 is correspondingly provided with a limiting groove 13, and the limiting groove 13 may specifically be a conical surface groove arranged in the middle of the peripheral edge of the adapter 12. In practical application, the end of the propping portion 2212 protrudes out and enters the limiting groove 13, and the end of the propping portion 2212 can apply a downward force to the adaptor 12, so that the adaptor 12 is pressed into the accommodating cavity 23, and the structural stability of the embodiment of the application is greatly improved. It should be noted that, the embodiment of the present application is not limited to the specific structure of the end of the propping portion 2212, for example, the end of the propping portion 2212 may be configured as a hemispherical structure, and the limiting groove 13 may be correspondingly configured as a cambered groove to achieve the above-mentioned effects. Therefore, the embodiment of the application is not limited to this, and the person skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 2 and 5, a pressure storage chamber 26 is formed on the bottom wall of the mounting groove 24, and the pressure storage chamber 26 is disposed around the periphery of the through hole 25; the carrier 21 has a fluid passage 27 therein, the fluid passage 27 being disposed in communication with the pressure storage chambers 26 of the plurality of mounting slots 24, the control assembly 4 being selectively in communication with the fluid passage 27 for inputting fluid into the pressure storage chambers 26 through the fluid passage 27 to withdraw the abutment bar 221 out of the receiving chamber 23 to release the adapter 12. Specifically, the bottom wall of the mounting groove 24 may be provided with an annular pressure storage cavity 26, the pressure storage cavity 26 is specifically disposed around the periphery of the through hole 25, the bearing member 21 may be formed with a fluid channel 27 therein, the fluid channel 27 is in communication with the pressure storage cavities 26 in the plurality of mounting grooves 24, and the control assembly 4 may be selectively in communication with the fluid channel 27 to input fluid, such as gas, into the pressure storage cavity 26 through the fluid channel 27, and the fluid continuously flows into the pressure storage cavity 26 to push the propping rod 221 out of the accommodating cavity 23 to release the adaptor 12. With the above design, the embodiments of the present application are easy to implement due to the shrinkage of the fluid control telescopic structure 22, so that the failure rate of the embodiments of the present application is greatly reduced, and the service life is further prolonged.
In an embodiment of the present application, as shown in fig. 4 to 7, the bearing member 21 includes a concentric and stacked bearing ring 211 and a bearing disc 212, a plurality of air inlets 213 are formed on the bottom surface of the bearing ring 211, the plurality of air inlets 213 are in one-to-one correspondence with the plurality of pressure storage chambers 26, an annular groove 214 is formed on the top surface of the bearing disc 212, the bearing ring 211 is in sealing fit with the bearing disc 212, the annular groove 214 is in communication with the plurality of air inlets 213, an air inlet is further formed in the bearing disc 212, the air inlet is in communication with the annular groove 214, the control assembly 4 is selectively in communication with the air inlet, and the air inlet, the annular groove 214 and the plurality of air inlets 213 form a fluid channel 27; the plurality of mounting grooves 24 are uniformly distributed in the circumferential direction of the carrier ring 211.
As shown in fig. 4 to 7, the carrier ring 211 may be a ring structure made of metal, and a plurality of air inlets 213 may be formed on the bottom surface of the carrier ring 211. The bearing plate 212 may be a disc-shaped structure made of metal, the top surface of the bearing plate 212 is provided with an annular groove 214, the bearing ring 211 is stacked on the bearing plate 212, and the bearing plate and the bearing ring are sealed and adhered to each other, so that the plurality of air inlets 213 are communicated with the annular groove 214. An air inlet channel may also be provided on one side of the carrier plate 212 and in communication with the annular groove 214, and the control assembly 4 may be selectively in communication with the air inlet channel to direct fluid into the pressure storage chamber 26. The inlet holes 213, annular grooves 214, and inlet channels cooperate to form the fluid channel 27. By adopting the design, the bearing piece 21 adopts a split structure, namely the bearing ring 211 and the bearing disc 212 are combined, so that the embodiment of the application is convenient to process, and the processing and manufacturing cost is greatly reduced. Optionally, the carrier 21 further includes a sealing assembly 28, where the sealing assembly 28 is disposed between the carrier ring 211 and the carrier plate 212, so that the carrier ring 211 and the carrier plate 212 are in sealing engagement, thereby preventing the fluid leakage of the fluid channel 27. The seal assembly 28 may be specifically two seal rings disposed inside and outside the annular groove 214, respectively, but embodiments of the present application are not limited to a specific type of seal assembly 28. Six mounting grooves 24 are uniformly distributed in the circumferential direction of the bearing ring 211, and six telescopic structures 22 are respectively arranged in the six mounting grooves 24, and the plurality of telescopic structures 22 are uniformly distributed, so that the stress of the adapter 12 is uniform, and the stability of the embodiment of the application is greatly improved. In addition, the mounting groove 24 is disposed on the carrier ring 211, thereby facilitating the disposition of the fluid channel 27, so that the structure of the embodiment of the present application is simple and easy to manufacture. However, the embodiment of the present application is not limited to the specific number of the installation grooves 24, and those skilled in the art can adjust the arrangement according to the actual situation.
In an embodiment of the present application, as shown in fig. 3 to 5, a groove is formed on the top surface of the bearing plate 212, and the inner sidewall of the bearing ring 211 and the groove together form the accommodating cavity 23; the bottom surface of the adapter 12 is provided with a positioning table 14, the positioning table 14 and the adapter 12 are eccentrically arranged, the bottom wall of the groove is provided with a positioning groove 29 corresponding to the positioning table 14, and the positioning table 14 is matched with the positioning groove 29 to rotationally position the adapter 12 and the bearing disc 212. Specifically, the top surface of the bearing plate 212 may be provided with a groove, and the inner sidewall of the bearing ring 211 and the groove of the bearing ring 211 together form the accommodating cavity 23. A positioning table 14 is integrally formed on the bottom surface of the adapter 12, and the positioning table 14 is disposed eccentrically to the adapter 12. The bottom wall of the groove on the carrying disc 212 is provided with a positioning groove 29, and the positioning groove 29 is eccentrically arranged with the carrying disc 212 and is arranged corresponding to the positioning table 14. When the adaptor 12 is disposed in the accommodating cavity 23, the positioning table 14 extends into the positioning groove 29, so that the adaptor 12 can be directly and rotatably positioned on the bearing disc 212, and the bearing disc 212 is connected with the driver 3, so that the operation of the embodiment of the application is stable, and the failure rate of the embodiment of the application is greatly reduced.
In an embodiment of the present application, as shown in fig. 2 and 5, the air inlet includes a first flow channel 215, a second flow channel 216 and a sealing plug 217; a first flow passage 215 extends from the outer peripheral wall of the carrier plate 212 to communicate with the annular groove 214, a second flow passage 216 extends from the bottom surface of the carrier plate 212 to communicate with the first flow passage 215, and a sealing plug 217 is provided at a port of the first flow passage 215 for sealing the first flow passage 215; the control assembly 4 is selectively in communication with the second flow passage 216. With the above design, the second flow channel 216 is disposed along the axial direction of the carrier plate 212, that is, the opening of the second flow channel 216 is disposed downward, so that the control assembly 4 can be disposed on the driver 3 below the carrier plate 212, thereby greatly saving the space occupation in the embodiment of the present application. However, the implementation of the present application is not limited thereto, for example, in some other embodiments, the second flow channel 216 may be omitted, and the control assembly 4 may be connected to the fluid channel 27 through the first flow channel 215, and a person skilled in the art may adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 1, 2 and 5, the control assembly 4 includes a communication structure 41 and a driving structure 42, where the communication structure 41 is slidably disposed on one side of the driver 3, for guiding the fluid into the fluid channel 27 when communicating with the fluid channel 27; the driving structure 42 is arranged on the same side as the communication structure 41 and is in transmission connection with the communication structure 41 for driving the tip of the communication structure 41 to selectively communicate with the fluid channel 27. Specifically, since the carrier plate 212 is rotated by the driver 3, when the chuck assembly 1 needs to be disassembled, the carrier plate 212 rotates to move the second flow channel 216 to a preset position, that is, when the port of the second flow channel 216 is aligned with the communication structure 41, the driving structure 42 drives the communication structure 41 to lift up so that the communication structure 41 is in sealing connection with the port of the second flow channel 216, that is, the communication structure 41 is in communication with the fluid channel 27, so that fluid is input into the fluid channel 27 through the second flow channel 216. With the above design, not only is the selective connection of the communication structure 41 and the second flow passage 216 realized, but also the structure is simple and easy to realize.
In an embodiment of the present application, as shown in fig. 1, 2 and 5, the communication structure 41 includes a linear bearing 43, a communication rod 44 and a connection joint 45, the linear bearing 43 is disposed on the driver 3, the communication rod 44 is sleeved in the linear bearing 43, a third flow channel 441 is disposed in the communication rod 44, an outlet of the third flow channel 441 is disposed at a top end of the communication rod 44, the top end of the communication rod 44 can be connected with the bearing assembly 2 to selectively communicate the third channel 441 and the fluid channel 27, a bottom end of the communication rod 44 is connected with the driving structure 42, and the connection joint 45 is disposed at one side of the communication rod 44 for connection with a fluid source.
As shown in fig. 1,2 and 5, the linear bearing 43 is specifically provided on one side of the upper fixture 31 of the driver 3. The communication rod 44 is specifically of a hollow rod-like structure so that a third flow passage 441 is formed in the communication rod 44, and a discharge port of the third flow passage 441 is located at a tip end of the communication rod 44. The top end selective carrier member 2 of the communication rod 44 is connected to selectively communicate the third flow passage 441 with the fluid passage 27. The bottom end of the communication rod 44 is a closed structure so that the communication rod 44 is connected to the driving structure 42. The connection joint 45 is provided at one side of the communication rod 44 and communicates with the third flow passage 441 in the communication rod 44, and the connection joint 45 is used for connection with a fluid source to introduce a fluid into the third flow passage 441 in the communication rod 44. The connection joint 45 may be disposed proximate the drive structure 42 to facilitate sliding of the communication rod 44 relative to the linear bearing 43 to avoid mechanical interference between the connection joint 45 and the linear bearing 43, thereby substantially reducing the failure rate of embodiments of the present application. Optionally, a sealing member (e.g., a sealing ring) is further disposed at the top end of the communication rod 44, so that the communication rod 44 is in sealing connection with the second flow channel 216, thereby avoiding leakage of the fluid, and improving the stability of the implementation of the present application.
In an embodiment of the present application, as shown in fig. 1 and 2, the driving structure 42 includes a driving portion 46 and a floating joint 47, and a telescopic rod of the driving portion 46 is connected to a bottom end of the communication rod 44 through the floating joint 47. Specifically, the driving portion 46 may be a telescopic cylinder or an electric cylinder, the cylinder body of the driving portion 46 is disposed on one side of the lower fixing member 32 of the driver 3, the telescopic rod of the driving portion 46 may be connected to the bottom end of the communication rod 44 through the floating joint 47, and the floating joint 47 may absorb an installation error, so as to further improve stability of the embodiment of the present application, thereby further reducing failure rate and application cost.
Based on the same inventive concept, an embodiment of the present application provides a semiconductor cleaning apparatus, which includes the carrying device provided in each embodiment.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
According to the embodiment of the application, the adapter of the chuck assembly is accommodated in the accommodating cavity of the bearing piece, and the end part of the telescopic structure can extend into the accommodating cavity so as to clamp and fix the adapter in the accommodating cavity; the control assembly is used for controlling the telescopic structure to shrink so that the telescopic structure releases the adapter, and therefore quick assembly disassembly of the chuck is achieved. The embodiment of the application can realize the quick assembly and disassembly of the chuck assembly, thereby not only realizing the semi-automatic control of the assembly and disassembly of the chuck, but also being quick and effective, greatly shortening the maintenance time of the chuck and further improving the working efficiency of the semiconductor cleaning equipment.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
The foregoing is only a partial embodiment of the present application, and it should be noted that it will be apparent to those skilled in the art that modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.
Claims (12)
1. A carrier for semiconductor cleaning equipment, comprising: chuck assembly, bearing assembly, driver and control assembly;
the chuck assembly comprises a chuck and an adapter, wherein the adapter is arranged at the bottom of the chuck and is concentric with the chuck, and the chuck is used for bearing a wafer;
The bearing assembly comprises a bearing piece and a telescopic structure, a containing cavity is formed in the top of the bearing piece and used for containing the adapter piece and rotationally positioning the adapter piece, the bottom of the bearing piece is connected with the driver, and the driver drives the chuck to rotate by driving the bearing piece to rotate; the telescopic structures are arranged in the bearing piece and are distributed along the circumferential direction of the accommodating cavity, the axes of the telescopic structures are arranged in parallel with the radial direction of the accommodating cavity, and the end parts of the telescopic structures can extend into the accommodating cavity to prop against the peripheral wall of the adapter and are used for clamping and fixing the adapter in the accommodating cavity;
The control assembly is arranged on the driver, is selectively connected with the bearing assembly and is used for controlling the telescopic structure to shrink so as to release the adapter;
The bearing part is internally provided with a plurality of mounting grooves, the bottom wall of each mounting groove is communicated with the side wall of each accommodating cavity through a through hole, a plurality of telescopic structures are respectively arranged in a plurality of mounting grooves, the bottom wall of each mounting groove is provided with a pressure storage cavity, the pressure storage cavities surround the peripheries of the through holes, the bearing part is internally provided with a fluid channel, the fluid channel is communicated with the pressure storage cavities of a plurality of mounting grooves, and the control assembly is selectively communicated with the fluid channel and is used for inputting fluid into the pressure storage cavities through the fluid channel.
2. The carrier of claim 1, wherein the telescopic structure comprises a pushing rod, an elastic member and a plug, the pushing rod is slidably disposed in the mounting groove, the elastic member is disposed between the pushing rod and the plug, and is used for applying a force to the pushing rod so that an end of the pushing rod enters the accommodating cavity, and the plug is connected with a port of the mounting groove to limit the elastic member and the pushing rod in the mounting groove.
3. The carrier of claim 2, wherein the through bore has an inner diameter less than an inner diameter of the mounting groove; the propping rod comprises a sliding part and a propping part, the sliding part is in sliding fit with the mounting groove, and the propping part can extend into the accommodating cavity through the through hole.
4. The bearing device as claimed in claim 3, wherein the end of the propping part is conical, a limit groove is correspondingly formed in the peripheral wall of the adapter along the circumferential direction, and the end of the propping part is matched with the limit groove so as to press the adapter into the accommodating cavity.
5. The carrier of claim 3, wherein the control assembly is further configured to withdraw the abutment rod from the receiving cavity to release the adapter.
6. The bearing device according to claim 5, wherein the bearing piece comprises a bearing ring and a bearing disc which are overlapped, a plurality of air inlets are formed in the bottom surface of the bearing ring, the air inlets are communicated with the pressure storage cavities in a one-to-one correspondence manner, an annular groove is formed in the top surface of the bearing disc, the bearing ring is in sealing fit with the bearing disc, the annular groove is communicated with the air inlets, an air inlet channel is further formed in the bearing disc, the air inlet channel is communicated with the annular groove, the control assembly is selectively communicated with the air inlet channel, and the air inlet channel, the annular groove and the air inlets form the fluid channel; the plurality of mounting grooves are uniformly distributed in the circumferential direction of the bearing ring.
7. The carrier of claim 6, wherein the top surface of the carrier plate is provided with a groove, and the inner side wall of the carrier ring and the groove together form the accommodating cavity; the bottom surface of the adapter is provided with a positioning table, the positioning table and the adapter are eccentrically arranged, the bottom wall of the groove is provided with a positioning groove corresponding to the positioning table, and the positioning table is matched with the positioning groove to rotate and position the adapter and the bearing plate.
8. The carrier of claim 6, wherein the inlet channel comprises a first flow channel extending from the peripheral wall of the carrier disc into communication with the annular groove, a second flow channel extending from the bottom surface of the carrier disc into communication with the first flow channel, and a sealing plug disposed at a port of the first flow channel for sealing off the first flow channel; the control assembly is in selective communication with the second flow passage.
9. The carrier of claim 5, wherein the control assembly includes a communication structure and a driving structure, the communication structure being slidably disposed on one side of the driver for introducing fluid into the fluid channel when in communication therewith; the driving structure is arranged on the same side as the communication structure and is in transmission connection with the communication structure, and is used for driving the lifting of the communication structure to be selectively communicated with the fluid channel.
10. The carrier of claim 9, wherein the communication structure comprises a linear bearing, a communication rod and a connection joint, the linear bearing is arranged on the driver, the communication rod is sleeved in the linear bearing, a third flow passage is arranged in the communication rod, a discharge outlet of the third flow passage is positioned at the top end of the communication rod, the top end of the communication rod can be selectively connected with the carrier assembly to selectively communicate the third flow passage with the fluid channel, the bottom end of the communication rod is connected with the driving structure, and the connection joint is arranged at one side of the communication rod and is used for being connected with a fluid source.
11. The carrier of claim 10, wherein the drive structure comprises a drive portion and a floating joint, and wherein the telescopic rod of the drive portion is connected to the bottom end of the communication rod through the floating joint.
12. A semiconductor cleaning apparatus comprising a carrier device according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011267613.3A CN112466805B (en) | 2020-11-13 | 2020-11-13 | Semiconductor cleaning equipment and bearing device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011267613.3A CN112466805B (en) | 2020-11-13 | 2020-11-13 | Semiconductor cleaning equipment and bearing device thereof |
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| CN112466805A CN112466805A (en) | 2021-03-09 |
| CN112466805B true CN112466805B (en) | 2024-05-17 |
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| CN115195264B (en) * | 2022-08-01 | 2024-01-19 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Laminating workbench and laminating machine |
| CN115440633B (en) * | 2022-10-17 | 2023-07-11 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and exhaust gas adjusting mechanism |
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| CN112466805A (en) | 2021-03-09 |
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