CN112437550A

CN112437550A - Double-layer wire circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof

Info

Publication number: CN112437550A
Application number: CN201910812446.7A
Authority: CN
Inventors: 王定锋; 徐文红; 冉崇友; 徐磊; 琚生涛; 冷求章
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-08-24
Filing date: 2019-08-24
Publication date: 2021-03-02

Abstract

The invention relates to a double-layer wire circuit board using solder resist ink as an anti-corrosion layer and a manufacturing method thereof, in particular to a double-layer wire circuit board using solder resist ink as an anti-corrosion layer and a manufacturing method thereof, which comprises the steps of arranging and coating wires on a substrate with glue in parallel, printing the solder resist ink, exposing element pads and metal connection points on the wires during printing, exposing parts needing to be etched and disconnected on the wires at the same time, baking and curing, printing the anti-etching ink on the pads and the metal connection points on the wires, baking, etching the exposed copper-clad aluminum wires to disconnect, removing the anti-etching ink by using alkaline de-inking ink after etching to manufacture a front single-side wire circuit board, gluing the back to form a via hole, coating the back parallel wires on a back glue layer, exposing the back parallel wires from the front side at the via hole position, and enabling the front and back wires at the hole position to, baking and curing the adhesive layer to obtain the double-layer lead circuit board.

Description

Double-layer wire circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof

Technical Field

The invention relates to the field of circuit boards, in particular to a double-layer wire circuit board with solder resist ink as an anti-corrosion layer and a manufacturing method thereof.

Background

A series of prior wire guide plate patents by the present inventors, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the transshipment adhesive film and the juxtaposed flat wires adopts a mode of die cutting or drilling by a drilling machine to break the wires, and has the defects of high die opening cost and inflexible design due to the use of the die, difficulty in changing once the die opening is finished, high cost due to the adoption of a mode of heavy drilling for drilling, insufficient alignment precision and high defective scrap due to easy drilling deviation.

In order to overcome the defects and the shortcomings, the invention adopts the steps of arranging and covering wires on a substrate with glue in parallel, printing solder resist ink to expose an element bonding pad and a metal connecting point on the wires, simultaneously exposing a part needing to be etched and disconnected on the wires, printing the etch resist ink to protect the bonding pad and the metal connecting point, then baking, exposing the wires at the position where a wire circuit needs to be disconnected outside, and etching and disconnecting the exposed wires by adopting an etching mode to form a circuit, thereby having flexible design and low cost.

Disclosure of Invention

The invention provides a method for manufacturing a double-layer lead circuit board by using solder resist ink as a corrosion resistant layer, which comprises the following steps of arranging and coating leads on a substrate with glue in parallel, printing the solder resist ink, exposing element pads and metal connecting points on the leads during printing, simultaneously exposing parts needing to be etched and disconnected on the leads, baking the solder resist ink, printing the etching resistant ink on the pads and the metal connecting points on the leads (but not limited to) and baking to form the etching resistant layer with two kinds of ink, wherein the solder resist ink is a solder resist layer used during the use of a circuit board and an etching resistant layer used for protecting a circuit during etching, the pads are used for welding elements, the metal connecting points are used during the connection of the circuit board and a power supply circuit or used during the interconnection between the circuit boards, the etching resistant layer comprises two materials, and the solder resist ink layer is an etching resistant layer at some positions, the anti-etching ink is an anti-etching layer at some positions, the anti-etching ink is superposed on the anti-etching layer formed on the anti-etching ink layer at some positions, then aqueous solution with main components of hydrochloric acid, copper dichloride and aluminum trichloride is used as etching solution, the chemical method is used for etching the exposed copper-clad aluminum conductor to break off, because the etching speed of aluminum is faster than that of copper, the section of the conductor cut towards the longitudinal direction (long direction) shows a short-sight C-shaped structure at the position of the broken section after etching, aluminum in the middle of the copper-clad aluminum conductor forms a recess, after etching, the anti-etching ink is removed by alkaline desizing ink, the anti-etching ink is retained to manufacture a front single-sided conductor circuit board, a through hole is punched after the back is coated, a back parallel conductor is coated on a back glue layer, the back parallel conductor is exposed from the front at the position of the through hole to ensure that the back parallel conductor is convenient to form conduction with, baking and curing the adhesive layer to obtain the double-layer lead circuit board.

According to the present invention, there is also provided a double-layer wire circuit board using solder resist ink as a resist layer, comprising: a front single-sided wire circuit board; the adhesive layer is arranged on the back surface of the single-side lead circuit board; a via hole disposed on the front single-sided wire circuit board; a back side parallel conductor circuit; it is characterized in that the front single-side lead circuit board comprises: the substrate layer with the glue is the substrate layer with the glue of the single-sided conducting wire circuit board and is also the middle insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; a front solder resist ink layer; a disconnection port of the conductive line circuit disposed on the front parallel conductive line circuit layer; a bonding pad and a metal connection point on the wire; specifically, a plurality of completely-middle-disconnected disconnection openings are formed on all the leads or part of the leads in the front circuit of the lead circuit board, the completely-disconnected leads are copper-clad aluminum leads, the disconnection openings of the copper-clad aluminum leads disconnected from the middle are formed in a near-sighted C-shaped structure on the section of the leads cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads is formed with a recess, a window is arranged at the disconnection opening of the copper-clad aluminum leads, a front solder mask ink layer is provided with a window, the disconnection position of the leads in the circuit board is at the edge position of the window of the front solder mask ink, the disconnection surface of the leads and the edge of the window of the solder mask ink are at one section or close to one section, or the disconnection position of the leads is in the solder mask ink window, the leads at the disconnection position of the leads are exposed from the window, the pads are pads of a welding element, are arranged on two leads or are arranged at two sides of one lead disconnection, the metal connection points are connection points used for being connected with a power circuit or connection points used for being interconnected between circuit boards, the solder mask ink layer is provided with a plurality of windows, one part of the windows are a pad window and a metal connection point window, one part of the windows are windows at the disconnection positions of the leads, the adhesive layer is arranged on the back surface of the front single-sided lead circuit board, namely on the middle insulating layer, the via holes are arranged at the positions where the back parallel leads need to be communicated with the front surface, the via holes penetrate through the front ink solder mask layer, the front parallel lead circuit layer, the substrate with adhesive (namely the middle insulating layer) and the adhesive layer to form holes, the back parallel lead circuit is formed by adhering the back parallel leads on the adhesive layer, the back parallel lead circuit is in contraposition overlapping and adhering with the front single-sided lead circuit board, and the back parallel leads are exposed from the front surface at the via holes, the back lead can be conveniently connected and conducted with the front face at the hole position when the back lead is used, namely the double-layer lead circuit board is formed.

According to a preferred embodiment of the present invention, the double-layer conductive line circuit board using solder resist ink as the resist layer is characterized in that the substrate with glue is a polyimide PI substrate, a PET substrate, an epoxy glass fiber substrate, a phenolic aldehyde substrate, or a ceramic substrate.

According to a preferred embodiment of the present invention, the double-layer conducting wire circuit board using solder resist ink as the anti-corrosion layer is characterized in that all conducting wires of the middle conducting wire circuit layer are copper-clad aluminum wires, or one part of the conducting wires are copper-clad aluminum wires, one part of the conducting wires are copper wires, and the other part of the conducting wires are copper wires, and the conducting wires are etched to be completely disconnected and only copper-clad aluminum wires.

According to a preferred embodiment of the present invention, the double-layer conducting wire circuit board using solder resist ink as an anti-corrosion layer is characterized in that insulating ink can be printed at the cut-off position of the copper-clad aluminum wire after etching, so that the cut-off position forms insulation protection.

According to a preferred embodiment of the present invention, the two-layer wiring circuit board with solder resist ink as a resist layer is characterized in that an insulating ink or an insulating film can be formed on the back surface to protect the back surface circuit.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.

Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.

Fig. 2 is a schematic plan view of a solder resist printed on a conductive line.

Fig. 3 is a schematic plan view of the exposed component pads and metal contacts after printing of a resist ink.

FIG. 4 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, and the cut-off surface of the copper-clad aluminum wire and the window edge of the solder resist ink are on a cross section.

FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, the cut-off position of the copper-clad aluminum wire is in the solder resist ink window, and a lead at the cut-off position of the lead is exposed from the window.

FIG. 6 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after etching of copper clad aluminum wire to form insulation protection at the cut-off portion.

Fig. 7 is a schematic plan view of a front-side single-conductor circuit board.

Fig. 8 is a schematic plan view of a front single-sided circuit board with vias after glue is applied to the back surface of the circuit board.

Fig. 9 is a schematic cross-sectional view of a front single-sided circuit board after glue is applied to the back surface of the circuit board and through holes are formed.

Fig. 10 is a schematic plan view of a double-layer wire board formed by covering a back-side parallel wire on a back-side glue layer and exposing the back-side parallel wire from the front side at a via hole position.

Fig. 11 is a schematic plan view of the double-layered wire guide plate viewed from the back.

Fig. 12 is a schematic cross-sectional view of a two-layer wire guide plate at the via location.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).

On a coil screen printing machine, a copper-clad aluminum conductor 2 arranged on a PI substrate 1 is upwards arranged on a platform below a screen of the screen printing machine, solder resist ink 3 is printed, element pads 3.1a and 3.2a and metal connecting points 3.3a and 3.4a on the conductor are exposed during printing, positions 2.2a and 2.2b (shown in figure 2) needing etching disconnection on the copper-clad aluminum conductor 2 are exposed, after the solder resist ink is baked, etching resistant ink 3.1b, 3.2b, 3.3b and 3.4b are printed on the element pads 3.1a and 3.2a and the metal connecting points 3.3a and 3.4a (shown in figure 3) and then baked to form two-ink etching resistant layers, wherein the solder resist ink 3 is a solder resist layer when a circuit board is used, is a circuit pad during etching, and the copper-clad aluminum conductor 3.1a and the metal connecting points 3.2a are used for welding components, the metal connection points 3.3a, 3.4a are used when the circuit board is connected with a power circuit or when the circuit board is interconnected, then the copper-clad aluminum conductor 2 exposed at the positions 2.2a and 2.2b to be disconnected is etched and disconnected by a chemical method by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, because the etching speed of aluminum in the copper-clad aluminum conductor 2 is higher than that of copper, the section of the conductor cut towards the longitudinal direction (the long direction) forms a structure 2.1 which is nearly in a C shape at the position of the section after the etching disconnection, aluminum in the middle of the copper-clad aluminum conductor forms a recess, and the front solder resist ink layer is provided with a window at the etching disconnection position of the copper-clad aluminum conductor 2, the disconnection surface of the copper-clad aluminum conductor 2 and the window edge of the solder resist ink are on one section (as shown in figure 4), or the front solder resist ink layer is provided with a window at the etching disconnection position of, the broken position of the copper-clad aluminum wire is in a solder resist ink window, the wire at the broken position of the wire is exposed from the window (shown in figure 5), the anti-etching line ink 3.1b, 3.2b, 3.3b and 3.4b printed on the welding spots 3.1a, 3.2a, 3.3a and 3.4a is removed by caustic soda aqueous solution at the film removing section, and then the insulating ink 4 is additionally printed at the broken position of the etched copper-clad aluminum wire to form insulating protection at the broken opening (shown in figure 6), thus manufacturing the front single-side wire circuit board shown in figure 7.

Gluing the back of a front single-sided lead circuit board, drilling a through hole 5 at the position where a front parallel lead 2 and a back parallel lead 6 need to be communicated, wherein the through hole 5 penetrates through a front cover film solder resist 3, the front parallel lead 2, a substrate 1 with glue and glue coated on the back of the front single-sided lead circuit board (shown in figures 8 and 9), then coating and adhering the back parallel lead 6 on the glue coated on the back of the front single-sided lead circuit board, the back parallel lead circuit 6 and the front single-sided lead circuit board are aligned, overlapped and adhered together, the back parallel lead 6 is exposed from the front at the position of the through hole 5 (shown in figures 10 and 12), so that the front lead and the back lead at the hole position can be connected and communicated at the hole when in use, the back parallel lead 6 is adhered on the glue on the back of the single-sided lead circuit board when viewed from the back and is exposed outside (, and then the double-layer lead circuit board using solder resist ink as an anti-corrosion layer is manufactured through the processes of silk-screen character printing, OSP surface anti-oxidation treatment, molding, FQC inspection, packaging and the like.

The present invention is described in detail with reference to the accompanying drawings by way of specific examples of a two-layer wire circuit board using solder resist ink as an etch resist layer and a method for manufacturing the same. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims

1. A method for preparing double-layer wire circuit board using solder resist ink as anti-corrosion layer includes arranging wires in parallel and covering them on substrate with adhesive, printing solder resist ink to expose element pad and metal connection point on wire and to expose position to be etched and cut on wire, baking, printing anti-corrosion ink on pad and metal connection point on wire, baking to form two anti-corrosion layers, using solder resist ink as both solder resist layer for circuit board and circuit protection layer for circuit board, using pad for welding element and metal connection point for connecting circuit board and power supply circuit or for interconnecting circuit board, using two materials as anti-corrosion layer, using solder resist ink layer as anti-corrosion layer at some positions, the anti-etching ink is an anti-etching layer at some positions, the anti-etching ink is superposed on the anti-etching layer formed on the anti-etching ink layer at some positions, then aqueous solution with main components of hydrochloric acid, copper dichloride and aluminum trichloride is used as etching solution, the chemical method is used for etching the exposed copper-clad aluminum conductor to break off, because the etching speed of aluminum is faster than that of copper, the section of the conductor cut towards the longitudinal direction (long direction) shows a short-sight C-shaped structure at the position of the broken section after etching, aluminum in the middle of the copper-clad aluminum conductor forms a recess, after etching, the anti-etching ink is removed by alkaline desizing ink, the anti-etching ink is retained to manufacture a front single-sided conductor circuit board, a through hole is punched after the back is coated, a back parallel conductor is coated on a back glue layer, the back parallel conductor is exposed from the front at the position of the through hole to ensure that the back parallel conductor is convenient to form conduction with, baking and curing the adhesive layer to obtain the double-layer lead circuit board.

2. A two-layer wire circuit board having a solder resist ink as a resist layer, comprising:

a front single-sided wire circuit board;

the adhesive layer is arranged on the back surface of the single-side lead circuit board;

a via hole disposed on the front single-sided wire circuit board;

a back side parallel conductor circuit;

it is characterized in that the front single-side lead circuit board comprises: the substrate layer with the glue is the substrate layer with the glue of the single-sided conducting wire circuit board and is also the middle insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; a front solder resist ink layer; a disconnection port of the conductive line circuit disposed on the front parallel conductive line circuit layer; a bonding pad and a metal connection point on the wire; specifically, a plurality of completely-middle-disconnected disconnection openings are formed on all the leads or part of the leads in the front circuit of the lead circuit board, the completely-disconnected leads are copper-clad aluminum leads, the disconnection openings of the copper-clad aluminum leads disconnected from the middle are formed in a near-sighted C-shaped structure on the section of the leads cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads is formed with a recess, a window is arranged at the disconnection opening of the copper-clad aluminum leads, a front solder mask ink layer is provided with a window, the disconnection position of the leads in the circuit board is at the edge position of the window of the front solder mask ink, the disconnection surface of the leads and the edge of the window of the solder mask ink are at one section or close to one section, or the disconnection position of the leads is in the solder mask ink window, the leads at the disconnection position of the leads are exposed from the window, the pads are pads of a welding element, are arranged on two leads or are arranged at two sides of one lead disconnection, the metal connection points are connection points used for being connected with a power circuit or connection points used for being interconnected between circuit boards, the solder mask ink layer is provided with a plurality of windows, one part of the windows are a pad window and a metal connection point window, one part of the windows are windows at the disconnection positions of the leads, the adhesive layer is arranged on the back surface of the front single-sided lead circuit board, namely on the middle insulating layer, the via holes are arranged at the positions where the back parallel leads need to be communicated with the front surface, the via holes penetrate through the front ink solder mask layer, the front parallel lead circuit layer, the substrate with adhesive (namely the middle insulating layer) and the adhesive layer to form holes, the back parallel lead circuit is formed by adhering the back parallel leads on the adhesive layer, the back parallel lead circuit is in contraposition overlapping and adhering with the front single-sided lead circuit board, and the back parallel leads are exposed from the front surface at the via holes, the back lead can be conveniently connected and conducted with the front face at the hole position when the back lead is used, namely the double-layer lead circuit board is formed.

3. The double-layer wire circuit board with the solder resist ink as the anti-corrosion layer according to claim 1 or 2, wherein the substrate with the adhesive is a polyimide PI substrate, a PET substrate, an epoxy glass fiber substrate, a phenolic aldehyde substrate or a ceramic substrate.

4. The circuit board of claim 1 or 2, wherein the parallel wires are all copper-clad aluminum wires, or a part of the parallel wires are copper-clad aluminum wires, a part of the parallel wires are copper wires, and the parallel wires are etched to be completely disconnected and only the copper-clad aluminum wires.

5. The circuit board of claim 1 or 2, wherein an insulating ink is applied to the etched cut of the copper clad aluminum wire to protect the cut.

6. The circuit board of claim 1 or 2, wherein an insulating ink or film is formed on the back side to protect the circuit on the back side.