CN112363041B - Full-automatic AA equipment for semiconductor - Google Patents
Full-automatic AA equipment for semiconductor Download PDFInfo
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- CN112363041B CN112363041B CN202011315590.9A CN202011315590A CN112363041B CN 112363041 B CN112363041 B CN 112363041B CN 202011315590 A CN202011315590 A CN 202011315590A CN 112363041 B CN112363041 B CN 112363041B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- General Physics & Mathematics (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The invention discloses a full-automatic AA device for a semiconductor, which comprises a working plate, wherein a conveying module, a detection module, a clamping module, a receiving module, a static eliminator and a gas source module are respectively arranged on the working plate, the conveying module is arranged in the middle of the working plate, the static eliminator is arranged on the top of one end of the conveying module, the clamping module is arranged on the top of the other end of the conveying module, the detection module is arranged on one side of the conveying module, the receiving module is arranged on the other side of the conveying module in parallel, the gas source module is arranged on one side of the detection module, the detection module is arranged as an AA device, the AA device comprises an AA frame, a first AA component, a second AA component and a detection component, the AA frame is arranged on the working plate, the first AA component is arranged on the AA frame, the second AA component is arranged on the first AA component, and the detection component is arranged on the second AA component, low cost, high productivity, low reject ratio and good market application value.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a full-automatic AA device for a semiconductor.
Background
Semiconductor detection, which is to examine and test the specified technical performance index of a certain object (gas, liquid and solid) by a specified method. The method is suitable for quality assessment of various industry categories, such as: the device for manufacturing the AA part is used for detecting the assembled semi-finished product when each part is assembled, actively aligning according to the actual condition of the assembled semi-finished product, and then assembling the next part in place.
The prior art has defects and needs to be improved.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a full-automatic AA device for a semiconductor.
The invention provides technical documents, in particular to a full-automatic AA device for semiconductors, which comprises a working plate, wherein a conveying module, a detection module, a clamping module, a material receiving module, an electrostatic eliminator and a gas source module are respectively arranged on the working plate, the conveying module is arranged in the middle of the working plate, the electrostatic eliminator is arranged on the top of one end of the conveying module, the clamping module is arranged on the top of the other end of the conveying module, the detection module is arranged on one side of the conveying module, the material receiving module is arranged on the other side of the conveying module in parallel, the gas source module is arranged on one side of the detection module, the detection module is arranged as an AA device, the AA device comprises an AA frame, a first AA component, a second AA component and a detection module, the AA frame is arranged on the working plate, the first AA component is arranged on the AA frame, the second AA component is arranged on the first AA component, and a detection module is arranged on the second AA component.
Preferably, the first AA component comprises an AA bottom plate, an AA sliding rail, an AA motor, an AA lead screw, an AA sliding block and an AA moving block, the AA bottom plate is arranged on an AA frame, the AA sliding rail is arranged on the AA bottom plate, an AA carrier plate is arranged at one end of the AA bottom plate, the AA motor is arranged on the AA carrier plate, the AA motor is connected with one end of the AA lead screw, the other end of the AA lead screw penetrates through the AA sliding block, the AA sliding block is arranged in the AA sliding rail, and the AA moving block is arranged on the AA sliding block.
Preferably, the detection module comprises a detection bottom plate, a detection slide rail, a detection cylinder, a detection slide block, a detection slide rod, a detection frame and a detector, the detection bottom plate is arranged on the AA second component, the detection slide rail is arranged on the detection bottom plate, the detection cylinder is arranged on the side face of the detection bottom plate, the detection slide block is arranged in the detection slide rail, the detection cylinder is connected with one end of the detection slide rail, the other end of the detection slide rod penetrates through the detection slide block, the detection frame is arranged on the detection slide block, and the detector is arranged on the detection frame.
Preferably, the static eliminator comprises an ion wind bracket, a static support plate and an eliminator, the ion wind bracket is arranged on the working plate and is positioned above one end of the conveying module, one side surface of the static support plate is arranged on one side surface of the ion wind bracket, and the eliminator is arranged on the other side surface of the static support plate.
Preferably, the clamping module comprises a clamping frame, a sliding cylinder, a first sliding L plate, a second sliding L plate, a clamping slide rail, a first clamping cylinder, a second clamping cylinder, a first clamping jaw and a second clamping jaw, the clamping frame is arranged on the working plate, the sliding cylinder is arranged on the clamping frame top, one side surface of the clamping frame is provided with the clamping slide rail, the sliding cylinder is respectively provided with one end of the first sliding L plate and one end of the second sliding L plate, the other end of the first sliding L plate and the other end of the second sliding L plate are respectively arranged on the clamping slide rail through a first sliding block and a second sliding block, one side surface of the first sliding L plate and one side surface of the second sliding L plate are respectively provided with the first clamping cylinder and the second clamping cylinder, and the bottom ends of the first clamping cylinder and the second clamping cylinder are respectively provided with the first clamping jaw and the second clamping jaw.
Preferably, the material receiving module comprises a material receiving frame, a material receiving motor, a material receiving track, a material receiving rotating shaft and a material receiving shaft sleeve, the material receiving frame is arranged on the working plate, the material receiving track is arranged on the material receiving frame, the material receiving motor is arranged on one side face of the material receiving frame, a material receiving bearing is arranged on the material receiving motor, the material receiving rotating shaft is arranged in the material receiving track, and one end of the material receiving rotating shaft is connected with the material receiving shaft sleeve through a material receiving synchronous belt.
Preferably, the air source module comprises an air source support, an electromagnetic valve and an air source piece, the air source support is arranged on the working plate, and the electromagnetic valve and the air source piece are arranged in parallel and are arranged on the air source support.
Preferably, a rotary manipulator is arranged on the working plate.
Compared with the prior art, the semiconductor product detection device has the advantages that the conveying module, the detection module, the clamping module, the material receiving module, the static electricity eliminator and the gas source module are arranged, the semiconductor product can be placed into the conveying module after being processed, then the detection module carries out all-around detection on the semiconductor product in the vertical direction, the horizontal direction and the inner part of the semiconductor product, after the detection is finished, the clamping module places the semiconductor product into the material receiving module, the detection process of the semiconductor product is automatically finished, manual taking and carrying are not needed, damage to the semiconductor product is avoided, the cost is low, the production rate is high, the reject ratio is low, and the semiconductor product detection device has good market application value.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the inspection module according to the present invention;
FIG. 3 is a schematic view of the overall structure of the inspection module according to the present invention;
FIG. 4 is a schematic view of the entire structure of the electrostatic eliminator according to the present invention;
FIG. 5 is a schematic view of the overall structure of the clamping module of the present invention.
Detailed Description
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The present invention will be described in detail with reference to the accompanying drawings.
One embodiment as described in fig. 1-5: a full-automatic AA device for semiconductors comprises a working plate 1, wherein a conveying module 2, a detection module 3, a clamping module 4, a receiving module 5, a static eliminator 6 and a gas source module 7 are respectively arranged on the working plate 1, the conveying module 2 is arranged in the middle of the working plate 1, the static eliminator 636 is arranged on the top of one end of the conveying module 2, the clamping module 4 is arranged on the top of the other end of the conveying module 2, the detection module 3 is arranged on one side of the conveying module 2, the receiving module 5 is arranged on the other side of the conveying module 2 in parallel, the gas source module 7 is arranged on one side of the detection module 3, the detection module 3 is arranged as an AA device, the AA device comprises an AA frame 31, a first AA component 32, a second AA component 33 and a detection module 34, the AA frame 31 is arranged on the working plate 1, the first AA component 32 is arranged on the AA frame 31, the first AA component 32 is provided with the second AA component 33, and the second AA component 33 is provided with a detection module 34; further, rotatory manipulator presss from both sides the semiconductor clamp that the rubber coating was accomplished or soldering tin was accomplished and puts into in carrying module 2, carries module 2 at first through static eliminator 636 to carry out the electrostatic elimination to the semiconductor, then detects module 3 and carries out all-round detection around from top to bottom to the product after the electrostatic elimination, detects the completion back, presss from both sides and gets module 4 and press from both sides the product clamp that detects the completion and place in receiving material module 5, receives material module 5 and distinguishes yields and defective products to slowly deliver out.
Preferably, the first AA component 32 includes an AA bottom plate, an AA slide rail, an AA motor, an AA lead screw, an AA sliding block, and an AA moving block, the AA bottom plate is disposed on the AA frame 31, the AA slide rail is disposed on the AA bottom plate, an AA carrier plate is disposed at one end of the AA bottom plate, the AA motor is disposed on the AA carrier plate, the AA motor is connected to one end of the AA lead screw, the other end of the AA lead screw passes through the AA sliding block, the AA sliding block is disposed in the AA slide rail, and the AA moving block is disposed on the AA sliding block; further, the AA motor drives the AA screw rod to work, the AA screw rod drives the AA sliding block to move, the AA sliding block moves in the AA sliding block, the AA moving plate moves on the AA moving sliding block, and the AA moving plate drives the second AA component 33 to move while moving.
Preferably, the detection module 34 includes a detection bottom plate 341, a detection slide rail 343, a detection cylinder 342, a detection slider, a detection slide bar, a detection frame 344 and a detector 345, the detection bottom plate 341 is disposed on the AA second component, the detection slide rail 343 is disposed on the detection bottom plate 341, the detection cylinder 342 is disposed on the side surface of the detection bottom plate 341, the detection slider is disposed in the detection slide rail 343, the detection cylinder 342 is connected to one end of the detection slide rail 343, the other end of the detection slide bar passes through the detection slider, the detection frame 344 is disposed on the detection slider, and the detector 345 is disposed on the detection frame 344; further, the detection cylinder 342 drives the detection slide bar to rotate, the detection slide bar drives the detection slide block to move in the detection slide rail 343, the detection slide block drives the detection frame 344 to move, and the detection frame 344 drives the product on the conveying module 2 below the detector 345 to perform all-dimensional detection.
Preferably, the static eliminator 6 comprises an ion wind bracket 61, a static support plate 62 and an eliminator 63, the ion wind bracket 61 is arranged on the working plate 1 and above one end of the conveying module 2, one side surface of the static support plate 62 is arranged on one side surface of the ion wind bracket 61, and the eliminator 63 is arranged on the other side surface of the static support plate 62; further, the eliminator 63 is for eliminating static electricity from the processed product.
Preferably, the gripping module 4 comprises a gripping frame 41, a sliding cylinder 42, a first sliding L-plate 43, a second sliding L-plate 44, a gripping slide rail 45, a first gripping cylinder 46, a second gripping cylinder 47, a first gripping jaw 48 and a second gripping jaw 49, the clamping frame 41 is arranged on the working plate 1, the sliding cylinder 42 is arranged on the top of the clamping frame 41, one side surface of the clamping frame 41 is provided with the clamping slide rail 45, the sliding cylinder 42 is respectively provided with one end of a first sliding L plate 43 and one end of a second sliding L plate 44, the other ends of the first sliding L-plate 43 and the second sliding L-plate 44 are respectively arranged on the clamping slide rail 45 through a first slide block and a second slide block, a first clamping cylinder 46 and a second clamping cylinder 47 are respectively arranged on one side surface of the first sliding L plate 43 and the second sliding L plate 44, the bottom ends of the first clamping cylinder 46 and the second clamping cylinder 47 are respectively provided with a first clamping jaw 48 and a second clamping jaw 49; further, the sliding cylinder 42 drives the first sliding L plate 43 and the second sliding L plate 44 to move respectively, the first sliding L plate 43 and the second sliding L plate 44 move on the clamping slide rail 45 at the same time, and drive the first clamping cylinder 46 and the second clamping cylinder 47 to move respectively, and the first clamping cylinder 46 and the second clamping cylinder 47 drive the first clamping jaw 48 and the second clamping jaw 49 to work respectively.
Preferably, the material receiving module 5 comprises a material receiving frame, a material receiving motor, a material receiving track, a material receiving rotating shaft and a material receiving shaft sleeve, wherein the material receiving frame is arranged on the working plate 1, the material receiving track is arranged on the material receiving frame, the material receiving motor is arranged on one side surface of the material receiving frame, a material receiving bearing is arranged on the material receiving motor, the material receiving rotating shaft is arranged in the material receiving track, and one end of the material receiving rotating shaft is connected with the material receiving shaft sleeve through a material receiving synchronous belt; further, the material receiving motor drives the material receiving shaft sleeve to work, the material receiving shaft sleeve drives the material receiving rotating shaft to work, and the material receiving rotating shaft drives the material receiving track to work.
Preferably, the air source module 7 comprises an air source support, an electromagnetic valve and an air source piece, the air source support is arranged on the working plate 1, and the electromagnetic valve and the air source piece are arranged in parallel and are arranged on the air source support.
Preferably, the working plate 1 is provided with a rotary manipulator, and further, the rotary manipulator clamps the product and places the product on the conveying module 2.
The second embodiment is different from the above embodiments in that the rotation degree of the rotary robot is 360 degrees.
The third embodiment is different from the above embodiments in that the conveying module 2 includes a conveying frame, a first conveying mold and a second conveying mold, and the first conveying mold and the second conveying mold are disposed opposite to each other and are both disposed in the conveying frame.
The fourth embodiment is different from the above embodiments in that the first conveying module 2 includes a conveying bottom plate, a conveying carrier and a conveying motor, the conveying bottom plate is disposed in the conveying frame, the conveying motor is disposed at the bottom end of the conveying bottom plate, the conveying carrier is disposed on the conveying bottom plate, and one end of the conveying motor is connected in the conveying carrier.
Embodiment five differs from the above in that a protective cover is provided on the work plate 1, which protective cover is intended to ensure that the product is static-free.
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A full-automatic AA device for semiconductors is characterized by comprising a working plate, wherein a conveying module, a detection module, a clamping module, a receiving module, a static eliminator and a gas source module are respectively arranged on the working plate, the conveying module is arranged in the middle of the working plate, the static eliminator is arranged on the top of one end of the conveying module, the clamping module is arranged on the top of the other end of the conveying module, the detection module is arranged on one side of the conveying module, the receiving module is arranged on the other side of the conveying module in parallel, the gas source module is arranged on one side of the detection module, the detection module is arranged as an AA device, the AA device comprises an AA frame, a first AA component, a second AA component and a detection module, the AA frame is arranged on the working plate, the first AA component is arranged on the AA frame, the second AA component is arranged on the first AA component, and a detection module is arranged on the second AA component.
2. The full-automatic AA device for the semiconductor of claim 1, wherein the first AA assembly comprises an AA bottom plate, an AA sliding rail, an AA motor, an AA screw rod, an AA sliding block and an AA moving block, the AA bottom plate is arranged on an AA frame, the AA sliding rail is arranged on the AA bottom plate, one end of the AA bottom plate is provided with an AA support plate, the AA motor is arranged on the AA support plate and connected with one end of the AA screw rod, the other end of the AA screw rod penetrates through the AA sliding block, the AA sliding block is arranged in the AA sliding rail, and the AA moving block is arranged on the AA sliding block.
3. The full-automatic AA device for the semiconductor of claim 1, wherein the detection module comprises a detection bottom plate, a detection slide rail, a detection cylinder, a detection slide block, a detection slide bar, a detection frame and a detector, the detection bottom plate is arranged on the AA second component, the detection slide rail is arranged on the detection bottom plate, the detection cylinder is arranged on the side surface of the detection bottom plate, the detection slide block is arranged in the detection slide rail, the detection cylinder is connected with one end of the detection slide rail, the other end of the detection slide bar penetrates through the detection slide block, the detection frame is arranged on the detection slide block, and the detector is arranged on the detection frame.
4. The automatic AA equipment for the semiconductor of claim 1, wherein the static eliminator comprises an ion wind bracket, a static support plate and an eliminator, the ion wind bracket is arranged on the working plate and is positioned above one end of the conveying module, one side surface of the static support plate is arranged on one side surface of the ion wind bracket, and the eliminator is arranged on the other side surface of the static support plate.
5. The fully automatic AA device for semiconductor of claim 1, the clamping module comprises a clamping frame, a sliding cylinder, a first sliding L plate, a second sliding L plate, a clamping slide rail, a first clamping cylinder, a second clamping cylinder, a first clamping jaw and a second clamping jaw, the clamping frame is arranged on the working plate, the sliding cylinder is arranged on the top of the clamping frame, one side surface of the clamping frame is provided with the clamping slide rail, the sliding cylinder is respectively provided with one end of a first sliding L plate and one end of a second sliding L plate, the other ends of the first sliding L plate and the second sliding L plate are respectively arranged on the clamping slide rail through a first slide block and a second slide block, a first clamping cylinder and a second clamping cylinder are respectively arranged on one side surface of the first sliding L plate and one side surface of the second sliding L plate, the bottom ends of the first clamping cylinder and the second clamping cylinder are respectively provided with a first clamping jaw and a second clamping jaw.
6. The full-automatic AA equipment for the semiconductor of claim 1, wherein the material receiving module comprises a material receiving frame, a material receiving motor, a material receiving track, a material receiving rotating shaft and a material receiving shaft sleeve, the material receiving frame is arranged on the working plate, the material receiving track is arranged on the material receiving frame, the material receiving motor is arranged on one side face of the material receiving frame, a material receiving bearing is arranged on the material receiving motor, the material receiving rotating shaft is arranged in the material receiving track, and one end of the material receiving rotating shaft is connected with the material receiving shaft sleeve through a material receiving synchronous belt.
7. The fully automatic AA equipment for semiconductors according to claim 1, wherein the gas source module comprises a gas source bracket, a solenoid valve and a gas source piece, the gas source bracket is arranged on the working plate, and the solenoid valve and the gas source piece are arranged in parallel and are both arranged on the gas source bracket.
8. The fully automatic AA apparatus for semiconductors of claim 1, wherein a rotary robot is provided on the work plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011315590.9A CN112363041B (en) | 2020-11-21 | 2020-11-21 | Full-automatic AA equipment for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011315590.9A CN112363041B (en) | 2020-11-21 | 2020-11-21 | Full-automatic AA equipment for semiconductor |
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| CN112363041A CN112363041A (en) | 2021-02-12 |
| CN112363041B true CN112363041B (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011315590.9A Active CN112363041B (en) | 2020-11-21 | 2020-11-21 | Full-automatic AA equipment for semiconductor |
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Citations (3)
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| CN1837841A (en) * | 2005-03-22 | 2006-09-27 | 未来产业株式会社 | Handler for testing semiconductor devices |
| CN106226674A (en) * | 2016-09-25 | 2016-12-14 | 东莞市联洲知识产权运营管理有限公司 | A kind of IC chip detection device |
| WO2019018328A1 (en) * | 2017-07-17 | 2019-01-24 | Cornell University | Sonic testing method, apparatus and applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6660548B2 (en) * | 2002-03-27 | 2003-12-09 | Intel Corporation | Packaging of multiple active optical devices |
| US8818144B2 (en) * | 2011-01-25 | 2014-08-26 | Tyco Electronics Corporation | Process for preparing an optical interposer for waveguides |
| US10491479B2 (en) * | 2015-07-08 | 2019-11-26 | Fedex Corporate Services, Inc. | Systems, apparatus, and methods of time gap related monitoring for an event candidate related to an ID node within a wireless node network |
| KR102594414B1 (en) * | 2018-10-24 | 2023-10-30 | 삼성전자주식회사 | Probe device and test device including the same |
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2020
- 2020-11-21 CN CN202011315590.9A patent/CN112363041B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1837841A (en) * | 2005-03-22 | 2006-09-27 | 未来产业株式会社 | Handler for testing semiconductor devices |
| CN106226674A (en) * | 2016-09-25 | 2016-12-14 | 东莞市联洲知识产权运营管理有限公司 | A kind of IC chip detection device |
| WO2019018328A1 (en) * | 2017-07-17 | 2019-01-24 | Cornell University | Sonic testing method, apparatus and applications |
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| Development of skills and tools for micro opto-electrical integration on wafer level;S Schröder 等，;《International Symposium on Microelectronics》;20181031(第1期) * |
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