CN112366239A - High-flexibility photovoltaic cell assembly - Google Patents
High-flexibility photovoltaic cell assembly Download PDFInfo
- Publication number
- CN112366239A CN112366239A CN202011433815.0A CN202011433815A CN112366239A CN 112366239 A CN112366239 A CN 112366239A CN 202011433815 A CN202011433815 A CN 202011433815A CN 112366239 A CN112366239 A CN 112366239A
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- China
- Prior art keywords
- photovoltaic cell
- packaging layer
- conductive pattern
- graphical
- pattern
- Prior art date
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 50
- 238000000059 patterning Methods 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 210000004027 cell Anatomy 0.000 abstract description 42
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 6
- 210000003850 cellular structure Anatomy 0.000 abstract description 3
- 239000005022 packaging material Substances 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a high-flexibility photovoltaic cell assembly, which comprises: patterning the front packaging layer, the patterned back packaging layer and the photovoltaic cell; the graphical front packaging layer comprises a front packaging layer and a front conducting pattern, and the front packaging layer and the front conducting pattern are integrated and cover the upper surface of the photovoltaic cell component; the patterned back packaging layer comprises a back packaging layer and a back conductive pattern, and the back packaging layer and the back conductive pattern are integrated and cover the surface of the photovoltaic cell lower assembly; the photovoltaic cell pieces are arranged between the graphical front packaging layer and the graphical back packaging layer, and series connection areas are arranged among the photovoltaic cell pieces. According to the invention, the serial connection mode is changed, the serial bus bars are changed into the conductive patterns and are compounded with the packaging material into a whole, the serial connection can be synchronously realized in the packaging process, the process manufacturing flow of packaging after serial connection in the traditional assembly production process is changed, and the process manufacturing cost is reduced.
Description
Technical Field
The invention relates to the field of photovoltaic cells, in particular to a high-flexibility photovoltaic cell assembly.
Background
Because the output voltage of the single-chip battery component is low, and the electrodes of the unpackaged batteries are easy to fall off due to the influence of the environment, a certain number of single-chip batteries are sealed into the photovoltaic component in a series-parallel connection mode, so that the corrosion of the battery electrodes and the interaction wires is avoided.
In the production process of the photovoltaic cell assembly, the assembly electrode is mainly led out by using a silk-screen method, and the photovoltaic cell pieces in the photovoltaic assembly are connected in series by using a bus bar welding mode. In the whole process, the silk-screen printing method has insufficient flexibility and high raw material cost, and is not beneficial to the improvement and production of special customized products; and welding process equipment is with high costs, and the busbar is connected and is unfavorable for the miniaturized special production of photovoltaic module, is unfavorable for the subassembly to use in the mobile energy field or thing networking field. And the original series technology can not realize the integration of encapsulation and series connection, which is not beneficial to the development of the photovoltaic module towards the light and thin direction.
Disclosure of Invention
Therefore, the invention aims to solve the problems that in the prior art, the flexibility is insufficient, the cost of raw materials is high, the series connection cost of the solar cell sub-chips is high by welding the bus bars, and the miniaturization and special production of the photovoltaic module are not facilitated by using a silk-screen method to lead out the module electrodes.
In order to achieve the above object, the present invention provides a high flexibility photovoltaic cell assembly, comprising: patterning the front packaging layer, the patterned back packaging layer and the photovoltaic cell;
the graphical front packaging layer comprises a front packaging layer and a front conducting pattern, and the front packaging layer and the front conducting pattern are integrated and arranged on one side of the photovoltaic cell;
the patterned back packaging layer comprises a back packaging layer and a back conductive pattern, and the back packaging layer and the back conductive pattern are integrated and arranged on the other side of the photovoltaic cell;
the photovoltaic cell piece is arranged between the graphical front packaging layer and the graphical back packaging layer;
and the photovoltaic cell pieces are communicated with each other through the front conductive pattern and the back conductive pattern to realize two-to-two conduction.
The front conductive pattern is communicated with the back conductive pattern, the front conductive pattern is communicated with the photovoltaic cell piece, and the back conductive pattern is communicated with the photovoltaic cell piece.
The communication mode is direct contact, welding or conductive adhesive pasting.
The front conductive pattern and the back conductive pattern are made of conductive materials and used for leading out electrodes of the photovoltaic cell pieces.
The beneficial effect of this application:
(1) the components are manufactured by adopting the conductive patterns, the components with different specifications can be produced by only changing the conductive patterns, the flexibility is high, the technology for producing the photovoltaic cell component by using the conductive patterns is mature, and the cost is low;
(2) by changing the series connection mode, the bus bars connected in series are changed into the conductive patterns and are compounded with the packaging material into a whole, so that the series connection can be synchronously realized in the packaging process, the process manufacturing flow of firstly connecting in series and then packaging in the production process of the traditional assembly is changed, and the process manufacturing cost is reduced;
(3) the use of silver paste is reduced by changing the traditional electrode lead-out material, so that the cost of the photovoltaic cell assembly is reduced;
(4) because the precision of conducting pattern preparation is high, and the linewidth is narrow, consequently in the manufacturing process of small area subassembly, reduced original busbar to the sheltering from on battery surface, promoted the effective generating area of small subassembly to the subassembly power has been promoted.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the structures of the drawings without creative efforts.
FIG. 1 is a schematic diagram of a high flexibility photovoltaic cell assembly;
in the figure: 1-a front packaging layer, 2-a front conductive pattern, 3-a back packaging layer, 4-a back conductive pattern and 5-a photovoltaic cell;
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to more clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will now be described with reference to the accompanying drawings.
As shown in fig. 1, a high flexibility photovoltaic cell assembly, the photovoltaic cell assembly comprising: patterning the front packaging layer, the back packaging layer and the photovoltaic cell 5;
the patterned front packaging layer comprises a front packaging layer 1 and a front conducting pattern 2, and the front packaging layer 1 and the front conducting pattern 2 are integrated and cover the upper surface of the photovoltaic cell component;
the patterned back packaging layer comprises a back packaging layer 3 and a back conductive pattern 4, and the back packaging layer 3 and the back conductive pattern 4 are integrated and cover the surface of the photovoltaic cell lower component;
the photovoltaic cell piece 5 set up in before the graphics between encapsulated layer and the graphical back of the body encapsulated layer, be provided with the tandem area between photovoltaic cell piece 5, the photovoltaic cell piece is placed before the graphics between encapsulated layer and the graphical back of the body encapsulated layer, and its contact mode is: direct contact, conductive adhesive adhesion and welding;
it should be noted that the photovoltaic cell piece 5 may be a cut cell piece, or may be an uncut cell piece, and the grid line may be printed on the photovoltaic cell piece 5 in advance, or the grid line may not be prefabricated.
The series connection region is a place where the conductive regions of the graphical front packaging layer and the graphical back packaging layer are contacted, and the series connection region realizes the series connection of the photovoltaic cell 5 by realizing the conduction of the graphical front packaging layer and the graphical back packaging layer;
specifically, the series region may be located beside the photovoltaic cell pieces 5, between the photovoltaic cell pieces 5 or in the region of the photovoltaic cell pieces 5; the communication mode of the area can be direct contact, welding or conductive adhesive pasting.
The front packaging layer 1 and/or the back packaging layer 3 are made of high-light-transmittance composite materials, and the front packaging layer 1 and the back packaging layer 3 are made of composite materials of weather-resistant materials and photovoltaic adhesive films.
The weather-resistant material and/or the photovoltaic adhesive film can be a high-light-transmittance material.
The front conductive pattern 2 and the back conductive pattern 4 are made of conductive materials and used for leading out electrodes of the photovoltaic cell;
specifically, the front conductive pattern 2 and the back conductive pattern 4 are made of conductive materials into patterns required by the assembly through a certain means, and the front conductive pattern 2 and the back conductive pattern 4 can be the same or different; a layer of special material is arranged on the contact surface of the conductive pattern and the photovoltaic cell piece to reduce contact resistance and electrical loss, and an insulating layer can be arranged between the conductive pattern and the contact surface of the photovoltaic cell piece as required.
It is to be added that an insulating layer can be provided between the conductive pattern and the contact surface of the photovoltaic cell, as required.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (4)
1. A high flexibility photovoltaic cell assembly, comprising: the patterning front packaging layer, the patterning back packaging layer and the photovoltaic cell piece (5);
the patterned front packaging layer comprises a front packaging layer (1) and a front conducting pattern (2), and the front packaging layer (1) and the front conducting pattern (2) are integrated and arranged on one side of the photovoltaic cell (5);
the patterned back packaging layer comprises a back packaging layer (3) and a back conductive pattern (4), and the back packaging layer (3) and the back conductive pattern (4) are integrated and arranged on the other side of the photovoltaic cell (5);
the photovoltaic cell (5) is arranged between the graphical front packaging layer and the graphical back packaging layer;
and the photovoltaic cell pieces (5) are communicated with each other through the front conductive pattern (2) and the back conductive pattern (4).
2. A high flexibility photovoltaic cell assembly as claimed in claim 1, wherein said front conductive pattern (2) is interconnected with said back conductive pattern (4), said front conductive pattern (2) is interconnected with said photovoltaic cell sheet (5), and said back conductive pattern (4) is interconnected with said photovoltaic cell sheet (5).
3. The assembly of claim 2, wherein the communication means is direct contact, soldering, or conductive adhesive bonding.
4. A high flexibility photovoltaic cell module according to claim 1, wherein the front conductive pattern (2) and the back conductive pattern (4) are made of conductive materials for electrode extraction of the photovoltaic cell (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011433815.0A CN112366239A (en) | 2020-12-10 | 2020-12-10 | High-flexibility photovoltaic cell assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011433815.0A CN112366239A (en) | 2020-12-10 | 2020-12-10 | High-flexibility photovoltaic cell assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112366239A true CN112366239A (en) | 2021-02-12 |
Family
ID=74535187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011433815.0A Pending CN112366239A (en) | 2020-12-10 | 2020-12-10 | High-flexibility photovoltaic cell assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112366239A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415990A (en) * | 2010-06-08 | 2013-11-27 | 美亚国际科技公司 | Solar cell interconnection, module, panel and method |
| CN109390427A (en) * | 2017-08-02 | 2019-02-26 | 成都晔凡科技有限公司 | Back-contact conduction integrates backboard, photovoltaic module and its manufacturing method |
-
2020
- 2020-12-10 CN CN202011433815.0A patent/CN112366239A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415990A (en) * | 2010-06-08 | 2013-11-27 | 美亚国际科技公司 | Solar cell interconnection, module, panel and method |
| CN109390427A (en) * | 2017-08-02 | 2019-02-26 | 成都晔凡科技有限公司 | Back-contact conduction integrates backboard, photovoltaic module and its manufacturing method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210212 |
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| RJ01 | Rejection of invention patent application after publication |