CN112148095B - Control method for automatically loading heat dissipation parameters and mainboard system - Google Patents
Control method for automatically loading heat dissipation parameters and mainboard system Download PDFInfo
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- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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Abstract
The embodiment of the invention discloses a control method for automatically loading heat dissipation parameters and a mainboard system, wherein the method comprises the following steps: obtaining TDP power consumption of current electronic equipment; setting a numerical value of a preset zone bit based on TDP power consumption, wherein the numerical value represents the heat dissipation type of the electronic equipment; the method comprises the steps of calling DPTF heat dissipation parameters corresponding to the numerical values according to the numerical values of the preset zone bits, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameters, calling the first DPTF heat dissipation parameters when the numerical values of the preset zone bits are first numerical values, and calling the second DPTF heat dissipation parameters when the numerical values of the preset zone bits are second numerical values.
Description
Technical Field
The invention relates to the field of computer heat dissipation control, in particular to a control method for automatically loading heat dissipation parameters and a mainboard system.
Background
With the current notebook computer market being more and more favored with ultra-thin designs, the notebook computer generates a large amount of heat in a limited space, which can severely reduce the performance of the device if not effectively controlled. In the conventional method, only one group of DPTF parameters (mechanisms for improving heat dissipation and performance) are configured, which cannot be commonly used for processors with different thermal design power consumption, and only parameters can be configured for each thermal design power consumption, so that inconvenience is brought to designers, and meanwhile, risks are brought to users needing to replace CPUs.
Disclosure of Invention
In view of the above technical problems, embodiments of the present invention provide a control method and a motherboard system for automatically loading heat dissipation parameters, which can automatically load corresponding DPTF parameters according to the type of an electronic device.
A first aspect of an embodiment of the present invention provides a method for controlling automatic loading of heat dissipation parameters, where the method includes: obtaining TDP power consumption of current electronic equipment; setting a numerical value of a preset zone bit based on TDP power consumption, wherein the numerical value represents the heat dissipation type of the electronic equipment; and calling DPTF heat dissipation parameters corresponding to the numerical values according to the numerical values of the preset zone bits, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameters, calling the first DPTF heat dissipation parameters when the numerical values of the preset zone bits are first numerical values, and calling the second DPTF heat dissipation parameters when the numerical values of the preset zone bits are second numerical values.
Optionally, the step of acquiring the TDP power consumption of the current electronic device includes: the address value of the mode specific register is obtained.
Optionally, the preset flag bit is a flag bit of a CMOS register, and a value of the flag bit represents flag bit information of a CPU type of the electronic device.
Optionally, the obtaining the address value of the mode special register further includes: and clearing the address of the zone bit information representing the CPU type of the electronic equipment and configuring the initial heat dissipation parameter.
Optionally, a register flag bit value table corresponding to TDP power consumption is stored in the CMOS register in advance, and a register flag bit value is set based on the register flag bit value table.
Optionally, the method further comprises: and when the temperature rises, reducing the thermal design power value step by step according to the preset temperature and the thermal design power table so as to reduce the temperature.
A second aspect of the embodiments of the present invention provides a motherboard system, including a CPU, a controller, and a mode special register connected to the controller, where TDP power consumption of the CPU of an electronic device is stored in the mode special register in advance; the method comprises the steps that a controller obtains TDP power consumption of a CPU of current electronic equipment, and the numerical value of a register flag bit is set based on the TDP power consumption; and calling DPTF heat dissipation parameters corresponding to the numerical values according to the numerical values of the preset zone bits, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameters, calling the first DPTF heat dissipation parameters when the numerical values of the preset zone bits are first numerical values, and calling the second DPTF heat dissipation parameters when the numerical values of the preset zone bits are second numerical values.
Optionally, a register flag bit value table corresponding to TDP power consumption is stored in the CMOS register in advance, and a register flag bit value is set based on the register flag bit value table.
Optionally, the TDP power consumption of the electronic device CPU is represented by an address value of a mode specific register.
In the technical scheme provided by the embodiment of the invention, the flag bit of the CMOS register is set according to the TDP power consumption, the type of the electronic equipment is identified according to the numerical value of the flag bit, and the corresponding DPTF heat dissipation parameter is called, so that compared with the prior art, the method provided by the embodiment of the invention can load the corresponding DPTF heat dissipation parameter according to different TDPs, does not need to replace processors of different TDPs, and realizes the balance of heat dissipation and performance. The universality is high, and the compiling can be used for different TDP designs of the platform once, so that the development workload is reduced.
Drawings
Fig. 1 is a schematic flowchart of a control method for automatically loading heat dissipation parameters according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a control method for automatically loading heat dissipation parameters according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a motherboard system according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of a method for controlling auto-loading heat dissipation parameters according to an embodiment of the present invention includes:
step S10, obtaining TDP power consumption of the current electronic device. The electronic equipment comprises a computer, and the electronic equipment can work by adopting Thermal Design Power (TDP), so that a CPU (central processing unit) of the electronic equipment runs under the maximum Power consumption, and the working performance of the electronic equipment is ensured.
Step S20, setting a numerical value of a preset zone bit based on TDP power consumption, wherein the numerical value represents the heat dissipation type of the electronic equipment; TDP power consumption represents a matching relation between temperature and power consumption, and different types of CPUs correspond to different TDP power consumption, so that the types of the CPUs can be distinguished according to the TDP power consumption.
And step S30, calling corresponding DPTF heat dissipation parameters according to the numerical value of the preset zone bit.
The temperature of the electronic equipment is controlled according to the DPTF heat dissipation parameters, when the numerical value of the preset zone bit is a first numerical value, the first DPTF heat dissipation parameters are called, and when the numerical value of the preset zone bit is a second numerical value, the second DPTF heat dissipation parameters are called.
The invention controls the power consumption of the CPU of the electronic equipment through DPTF (Dynamic Platform and Thermal Framework) and controls the TDP power consumption of the CPU to balance the heating and the performance.
In one embodiment of the present invention, please refer to fig. 2, the method specifically includes:
in step S11, the address value of the mode specific register is acquired. The present invention represents TDP power consumption according to the address value of the special register. Different address values represent different power consumptions.
In step S21, the value of the preset flag is set based on the address value of the mode specific register.
The invention sets the value of the preset zone bit according to different address values. The preset flag bit is a flag bit of a CMOS (complementary Metal Oxide semiconductor) register, and the numerical value of the flag bit represents the flag bit information of the CPU type of the electronic equipment.
In one embodiment of the present invention, a register flag bit value table corresponding to TDP power consumption is stored in advance in the CMOS register, and a register flag bit value is set based on the register flag bit value table.
In one embodiment of the present invention, the obtaining the address value of the mode special register further includes:
and clearing the address of the zone bit information representing the CPU type of the electronic equipment and configuring the initial heat dissipation parameter.
And step S31, calling the corresponding DPTF heat dissipation parameters according to the value of the zone bit of the CMOS register.
The temperature of the electronic equipment is controlled according to the DPTF heat dissipation parameters, when the flag bit value of the CMOS register is a first value, the first DPTF heat dissipation parameters are called, and when the flag bit value of the CMOS register is a second value, the second DPTF heat dissipation parameters are called.
According to the invention, DPTF heat dissipation parameters are set according to the type information of the electronic element, namely the TDP power consumption, different TDP power consumptions correspond to different DPTF heat dissipation parameters, different TDP processors do not need to be replaced, and the balance of heat dissipation and performance is realized. The universality is high, and the compiling can be used for different TDP designs of the platform once, so that the development workload is reduced.
After the computer is started, the type of the electronic element is detected, and the type of the electronic element is judged, wherein the electronic element comprises a CPU (central processing unit) arranged in a computer, a mainboard, a power supply and other electronic elements which are easy to generate high temperature when in use. Because TDP power consumptions corresponding to different electronic components are different, the TDP power consumption values representing different types of electronic components are written into the CMOS register, and therefore the types of the electronic components can be represented according to the flag bit values of the CMOS register.
The controller reads a program stored in the CMOS register, so that the type information (TDP power consumption) of the electronic element is obtained, DPTF heat dissipation parameters are set according to the type information of the electronic element, different TDP power consumptions correspond to different DPTF heat dissipation parameters, processors of different TDPs do not need to be replaced, and balance of heat dissipation and performance is achieved. The universality is high, and the compiling can be used for different TDP designs of the platform once, so that the development workload is reduced.
In one embodiment of the invention, after the computer is started, the address of the flag bit information of the CMOS register, which represents the CPU type, is cleared, namely the Offset [30H ] position of the CMOS register is initialized first, the Offset [30H ] position is cleared by 0, the Offset [30H ] position of the CMOS register is used for storing the flag bit information which represents the CPU type, so that the value of the address is prevented from being modified by other application programs, the rotating speed of a fan has instantaneous errors when the computer is restarted, and meanwhile, an initial heat dissipation parameter table is configured for the CPU.
The invention sets the flag bit of the CMOS register according to the read TDP power consumption, and for example, as the following, when the read thermal design power, namely the TDP power consumption is 0xE0, sets Offset [30H ] to 0x 28; when the thermal design power is equal to 0x78, set Offset [30H ] to 0x 15; at this time, the setting of the flag bit is completed, and the set flag bit is used for the system to start the type of the thermal design power used by the query platform. When a system driver is loaded, a DPTF parameter is called through a Method GDDV function, a flag bit set in the front is required to be judged in advance when the parameter is called, the DPTF parameter is called according to the flag bit, different calling DPTF parameters are called by different flag bits, the DPTF settings 1 are called when the flag bit Offset [30H ] is equal to 0x28, and the DPTF settings 2 are called when the flag bit Offset [30H ] is equal to 0x 15. After the parameters are loaded successfully, along with the gradual increase of the CPU core temperature of the processor and the acquired temperature of the on-board thermistor, the heat dissipation mechanism can gradually reduce the thermal design power value according to the set temperature and the thermal design power table, along with the reduction of the thermal design power, the temperature can also be reduced, the thermal design power is increased again, and the steps are repeated so as to achieve the balance of the temperature and the performance.
The above description describes the control method for automatically loading heat dissipation parameters in the embodiment of the present invention, and the following description describes the motherboard system in the embodiment of the present invention.
Referring to fig. 3, in an embodiment of the present invention, a motherboard system is further provided, which includes a CPU, a controller 10, a CMOS register 20, and a mode specific register 30 connected to the controller 10, wherein the TDP power consumption of the CPU of the electronic device is pre-stored in the mode specific register 30;
the controller 10 obtains the TDP power consumption of the CPU of the current electronic equipment, and sets the value of the flag bit of the CMOS register 20 based on the TDP power consumption; and calling a DPTF heat dissipation parameter corresponding to the numerical value according to the numerical value of the zone bit of the CMOS register 20, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameter, calling a first DPTF heat dissipation parameter when the numerical value of the preset zone bit is a first numerical value, and calling a second DPTF heat dissipation parameter when the numerical value of the preset zone bit is a second numerical value.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A control method for automatically loading heat dissipation parameters is characterized by comprising the following steps:
obtaining TDP power consumption of current electronic equipment;
setting a numerical value of a preset zone bit based on TDP power consumption, wherein the numerical value represents the heat dissipation type of the electronic equipment;
calling DPTF heat dissipation parameters corresponding to the numerical values according to the numerical values of the preset zone bits, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameters, calling the first DPTF heat dissipation parameters when the numerical values of the preset zone bits are first numerical values, and calling the second DPTF heat dissipation parameters when the numerical values of the preset zone bits are second numerical values;
the step of obtaining the TDP power consumption of the current electronic equipment comprises the following steps:
acquiring an address value of a mode special register;
the preset zone bit is a zone bit of a CMOS register, and the numerical value of the zone bit represents the zone bit information of the CPU type of the electronic equipment.
2. The method according to claim 1, wherein the obtaining the address value of the mode specific register further comprises:
and clearing the address of the zone bit information representing the CPU type of the electronic equipment and configuring the initial heat dissipation parameter.
3. The method for controlling auto-loading heat dissipation parameters according to claim 1, wherein a register flag bit value table corresponding to TDP power consumption is pre-stored in the CMOS register, and the register flag bit value is set based on the register flag bit value table.
4. The method for controlling auto-loading thermal dissipation parameters of claim 1, further comprising:
and when the temperature rises, reducing the thermal design power value step by step according to the preset temperature and the thermal design power table so as to reduce the temperature.
5. A motherboard system comprises a CPU, a controller, and a mode specific register connected with the controller,
the mode special register is pre-stored with TDP power consumption of the CPU of the electronic equipment;
the controller obtains TDP power consumption of a CPU of the current electronic equipment, and sets a numerical value of a flag bit of a CMOS register based on the TDP power consumption; calling a DPTF heat dissipation parameter corresponding to the numerical value according to the numerical value of the zone bit, controlling the temperature of the electronic equipment according to the DPTF heat dissipation parameter, calling a first DPTF heat dissipation parameter when the numerical value of the preset zone bit is a first numerical value, and calling a second DPTF heat dissipation parameter when the numerical value of the preset zone bit is a second numerical value;
the controller acquiring the TDP power consumption of the CPU of the current electronic equipment refers to the following steps:
acquiring an address value of a mode special register;
the preset zone bit is a zone bit of a CMOS register, and the numerical value of the zone bit represents the zone bit information of the CPU type of the electronic equipment.
6. The motherboard system according to claim 5, wherein the CMOS register stores a register flag bit value table corresponding to TDP power consumption in advance, and the register flag bit value is set based on the register flag bit value table.
7. Motherboard system according to claim 5, characterized in that the TDP power consumption of the electronic device CPU is represented by the address value of a mode specific register.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103261992A (en) * | 2010-12-21 | 2013-08-21 | 英特尔公司 | Method and apparatus to configure thermal design power in microprocessor |
| CN107430419A (en) * | 2015-03-26 | 2017-12-01 | 英特尔公司 | System and method for carrying out adaptive heat and performance management in the electronic device |
| CN110737322A (en) * | 2019-09-16 | 2020-01-31 | 联想(北京)有限公司 | Information processing method and electronic equipment |
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| US20150186157A1 (en) * | 2013-12-28 | 2015-07-02 | Guy M. Therien | Techniques for workload scalability-based processor performance state control |
| US11106272B2 (en) * | 2019-01-11 | 2021-08-31 | Dell Products L.P. | Bios-based user-selectable power control |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103261992A (en) * | 2010-12-21 | 2013-08-21 | 英特尔公司 | Method and apparatus to configure thermal design power in microprocessor |
| CN107430419A (en) * | 2015-03-26 | 2017-12-01 | 英特尔公司 | System and method for carrying out adaptive heat and performance management in the electronic device |
| CN110737322A (en) * | 2019-09-16 | 2020-01-31 | 联想(北京)有限公司 | Information processing method and electronic equipment |
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