CN112063349A - Low-odor UV hot melt adhesive and preparation method thereof - Google Patents
Low-odor UV hot melt adhesive and preparation method thereof Download PDFInfo
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- CN112063349A CN112063349A CN202010839968.9A CN202010839968A CN112063349A CN 112063349 A CN112063349 A CN 112063349A CN 202010839968 A CN202010839968 A CN 202010839968A CN 112063349 A CN112063349 A CN 112063349A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 39
- 239000004831 Hot glue Substances 0.000 title claims abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000003112 inhibitor Substances 0.000 claims abstract description 9
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims abstract description 8
- 239000008367 deionised water Substances 0.000 claims abstract description 3
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 141
- 239000002253 acid Substances 0.000 claims description 109
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 102
- 238000010438 heat treatment Methods 0.000 claims description 80
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 64
- 239000004593 Epoxy Substances 0.000 claims description 49
- 238000006243 chemical reaction Methods 0.000 claims description 47
- 238000001816 cooling Methods 0.000 claims description 47
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 33
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 33
- 239000004925 Acrylic resin Substances 0.000 claims description 32
- 229920000178 Acrylic resin Polymers 0.000 claims description 32
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 18
- 229920003063 hydroxymethyl cellulose Polymers 0.000 claims description 18
- 229940031574 hydroxymethyl cellulose Drugs 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 16
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 16
- 238000005070 sampling Methods 0.000 claims description 16
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 15
- 238000009833 condensation Methods 0.000 claims description 15
- 230000005494 condensation Effects 0.000 claims description 15
- 229920000570 polyether Polymers 0.000 claims description 15
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 14
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 14
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 14
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 4
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 4
- 235000011152 sodium sulphate Nutrition 0.000 claims description 4
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 claims description 4
- 230000003472 neutralizing effect Effects 0.000 claims description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 claims description 2
- 229920002125 Sokalan® Polymers 0.000 claims description 2
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- 235000019837 monoammonium phosphate Nutrition 0.000 claims description 2
- 239000004584 polyacrylic acid Substances 0.000 claims description 2
- JZEXORLUKMQOFA-UHFFFAOYSA-N 2-(1-ethoxyethyl)-2-(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCOC(C)C(CO)(CO)CO JZEXORLUKMQOFA-UHFFFAOYSA-N 0.000 claims 1
- 239000004844 aliphatic epoxy resin Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 238000001723 curing Methods 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000012855 volatile organic compound Substances 0.000 abstract description 5
- 238000000016 photochemical curing Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000001035 drying Methods 0.000 description 15
- 230000018044 dehydration Effects 0.000 description 14
- 238000006297 dehydration reaction Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 239000013530 defoamer Substances 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000003847 radiation curing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000009512 pharmaceutical packaging Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
Abstract
The invention belongs to the field of photocuring coatings, and provides a low-odor UV hot melt adhesive and a preparation method thereof, wherein the UV hot melt adhesive comprises the following components in parts by weight: 100 parts of water-based prepolymer, 20-30 parts of water-based monomer, 0.1-0.5 part of polymerization inhibitor, 1-3 parts of neutralizer, 2-5 parts of photoinitiator, 2-4 parts of flatting agent, 0.5-1.5 parts of defoaming agent and 5-15 parts of deionized water; the UV hot melt adhesive disclosed by the invention has the advantages of environmental protection, no VOC (volatile organic compounds) emission, low viscosity, good leveling property, low curing power and strong adhesive force, and after the UV hot melt adhesive is coated, the UV hot melt adhesive is high in glossiness and good in transparency, has higher hardness and good flexibility, and has a wide application prospect.
Description
Technical Field
The invention belongs to the field of photocuring coatings, and particularly relates to a low-odor UV hot melt adhesive and a preparation method thereof.
Background
The hot melt adhesive and the water-based adhesive are environment-friendly adhesives except radiation curing adhesives. The hot melt adhesive has no pollution, high curing speed, wide application range and continuous production, and has the disadvantages of no organic solvent contained in the water-based adhesive affected by temperature, fast development, low initial bonding force, water volatilization in the bonding process, high energy consumption, slow curing speed and certain limitation on application.
The radiation curing adhesive is an important branch in radiation curing materials, has the advantages of high solid content, curing within seconds, wide application field and the like, and is an important novel adhesive. The characteristics of no solvent volatilization, high curing speed and energy conservation are more and more attracting attention of people, and the radiation curing adhesive can be used for realizing bonding particularly in places where the traditional adhesive cannot be used, and has more superiority on bonding heat-sensitive substrates. The method is widely applied to the fields of chemical industry, machinery, electronics, light industry, communication and the like. Radiation curable adhesives include electron beam curing and ultraviolet light curing (UV light curing). The electron beam is a high-energy electron flow, has strong penetrating power, does not need a photoinitiator, is not influenced by the color of a coating, can cure a thick coating, can be used for curing a coating, can also be used for curing an adhesive, a laminated material and the like, and has no requirement on the transparency of a bonded substrate. But sensitive to oxygen and high in equipment and operation cost. Although the UV curing has the defects of being difficult to be used for a substrate with a complex shape, requiring at least one of the bonded parts to be transparent, being difficult to cure with a colored system, and the like, the UV curing can be compensated by low energy consumption, excellent performance of a coating film and improvement of production efficiency, and is relatively cheap and easy to popularize.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the low-odor UV hot melt adhesive and the preparation method thereof.
The technical scheme adopted by the invention is as follows.
The invention provides a low-odor UV hot melt adhesive which comprises the following raw materials in parts by weight: 100 parts of prepolymer, 20-30 parts of monomer, 0.1-0.5 part of polymerization inhibitor, 1-3 parts of neutralizer, 2-5 parts of photoinitiator, 2-4 parts of flatting agent, 0.5-1.5 parts of defoaming agent and 5-15 parts of deionized water.
The preparation method comprises the following steps: adding 5-15 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.1-0.5 part of polymerization inhibitor, 2-5 parts of photoinitiator and 2-4 parts of flatting agent, heating to 40-50 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the polymerization inhibitor, the photoinitiator and the flatting agent are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of prepolymer and 20-30 parts of aqueous monomer, stirring for 20 min, adding 0.5-1.5 parts of defoaming agent and 1-3 parts of neutralizing agent, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating to dewater, drying, cooling to room temperature, stopping stirring, and transferring to a light-proof container for storage.
In the technical scheme, the aqueous prepolymer in the raw materials is modified epoxy acrylic resin, and the preparation method comprises the following steps:
a. adding 50-80 parts of epoxy resin, 10-20 parts of acrylic acid, 10-20 parts of hydroxyethyl acrylate, 1-2 parts of hydroquinone and 1-2 parts of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 hours, measuring the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, measuring the acid value once every 30 minutes until the acid value reaches the standard, cooling to room temperature, placing in a brown bottle for storage, and obtaining epoxy acrylic acid;
b. and (b) adding 100 parts of epoxy acrylic acid obtained in the step (a), 10-20 parts of maleic anhydride, 1-2 parts of hydroquinone and 1-2 parts of triethylamine into a three-neck flask, installing a condensing tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
In the technical scheme, the polymerization inhibitor in the raw materials is one or more of ferric chloride, sodium sulfate and sodium thiocyanate; the photoinitiator is one or more of organosilicon modified 2-hydroxy-2-methyl-1-phenyl acetone (HP 1173), silicon-containing photoinitiator (HISiIH) and 1-hydroxycyclohexyl phenyl ketone (photoinitiator 184); the defoaming agent is one of polyether defoaming agent and organic silicon defoaming agent; the flatting agent is one or two of hydroxymethyl cellulose and polyacrylic acid; the neutralizer is one or more of triethanolamine, triethylamine, ammonium dihydrogen phosphate and ammonia water; the water-based monomer is one of ethoxy ethyl acrylate (EOEOEA) and ethoxylated trimethylolpropane triacrylate (TMPTA).
According to the invention, the aliphatic epoxy acrylic resin is modified by maleic anhydride and hydroquinone, the viscosity of the resin is obviously reduced while the film-forming hardness of the resin is maintained, and good leveling property can be obtained by adding a small amount of aqueous solvent; the resin is copolymerized with functional aqueous monomers, so that the flexibility, glossiness and wear resistance of the resin after film formation are effectively improved; at present, the UV hot melt adhesive on the market adopts toluene as a solvent, and is used after the solvent is removed by heating, but the residual toluene cannot be completely eliminated, and a large amount of odor can be remained. The invention uses water as solvent, and has no VOC emission.
The low-odor UV hot melt adhesive disclosed by the invention has the advantages of no VOC (volatile organic compounds) emission, low viscosity, good leveling property, low curing power, strong adhesive force, high glossiness, good transparency, higher hardness and good flexibility after being coated with the adhesive, is particularly suitable for high-grade or environment-friendly application occasions, especially for children's readings and food and drug packaging adhesives, and has wide application prospects.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The above-described and other features, aspects, and advantages of the present invention will become more apparent with reference to the following detailed description.
Example 1
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, drying, cooling to room temperature, stopping stirring, and transferring to a light-proof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 2
Adding 5 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 3
Adding 15 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 4
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of sodium sulfate, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the sodium sulfate, the HP1173 and the hydroxymethyl cellulose are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoaming agent and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 5
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of sodium thiocyanate, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the sodium thiocyanate, the HP1173 and the hydroxymethyl cellulose are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 6
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HISiIH and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoaming agent and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 7
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of photoinitiator 184 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 8
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoaming agent and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 9
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of TMPTA, stirring for 20 min, adding 1 part of polyether defoaming agent and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 10
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of organic silicon defoamer and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 11
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of triethanolamine, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Example 12
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoamer and 1 part of triethylamine, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Comparative example 1
Adding 10 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of modified epoxy acrylic resin, stirring for 20 min, adding 1 part of polyether type defoaming agent and 1 part of ammonia water, adjusting the pH value to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle;
b. and c, adding 100 parts of epoxy acrylic acid obtained in the step a, 10 parts of maleic anhydride, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuing stirring for 10 min, and stopping the reaction.
Comparative example 2
Adding 5 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.2 part of ferric chloride, 3 parts of HP1173 and 3 parts of hydroxymethyl cellulose, heating to 45 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the materials are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of epoxy acrylic resin and 25 parts of EOEOEA, stirring for 20 min, adding 1 part of polyether defoaming agent and 1 part of ammonia water, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating for dehydration, and drying. Cooling to room temperature, stopping stirring, and transferring to a lightproof container for storage. The preparation method of the epoxy acrylic resin comprises the following steps:
adding 80 parts of epoxy resin, 10 parts of acrylic acid, 10 parts of hydroxyethyl acrylate, 1 part of hydroquinone and 1 part of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 h, determining the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, determining the acid value once every 30 min until the acid value reaches the standard, cooling to room temperature, and storing in a brown bottle.
Performance detection
1. Liquid hot melt adhesive performance
The viscosity of the UV hot melt adhesive prepared in the above example was measured using a rotational viscometer model NDJ-79, and the results are shown in Table 1; the prepared aqueous UV hot melt adhesive is stored in a room-temperature and dark environment, the stability of the aqueous UV hot melt adhesive is judged according to the layering phenomenon, and the results are listed in Table 1; the appearance results of the aqueous UV hot melt adhesive prepared in the above specific examples are shown in Table 1.
TABLE 1
UV hot melt adhesive curing film Properties
The aqueous UV hot melt adhesive prepared in the above example was coated on a standard printing A4 paper, cured to a film by a UV curing machine, and the 60 ℃ gloss of the UV light film was measured by a WGG-60 gloss meter, and the results are shown in Table 2; the adhesion of the UV films was measured according to GB9286-1998 and the results are given in Table 2; the hardness of the UV light films was measured according to GB/T6739-1996 method, and the results are shown in Table 2; the UV hot-melt adhesive cured films prepared were subjected to standard test strips in accordance with the 5B strip standard of ISO527/2-1993(E), and the film layers were stretched at a rate of 2 mm/min on a universal micro-controlled electronic tester WDW3020 to measure the flexibility, expressed as the elongation at break.
TABLE 2
According to the test results in tables 1 and 2, the UV hot melt adhesive synthesized in the system has excellent mechanical strength and strong adhesive force, can meet the bonding of paper, and is a novel environment-friendly UV hot melt adhesive.
Details not described in this specification are within the skill of the art that are well known to those skilled in the art.
The invention is not to be considered as limited to the particular embodiments shown and described, but is to be understood that all changes, equivalents, and modifications that come within the spirit and scope of the invention are desired to be protected.
Claims (11)
1. The low-odor UV hot melt adhesive is characterized by comprising the following components in parts by weight: 100 parts of water-based prepolymer, 20-30 parts of water-based monomer, 0.1-0.5 part of polymerization inhibitor, 1-3 parts of neutralizer, 2-5 parts of photoinitiator, 2-4 parts of flatting agent, 0.5-1.5 parts of defoaming agent and 5-15 parts of deionized water.
2. The low odor UV hot melt adhesive of claim 1, wherein: the water-based prepolymer is modified epoxy acrylic resin.
3. The low-odor UV hot melt adhesive according to claim 1, wherein the preparation method of the modified epoxy acrylic resin comprises the following steps:
a. adding 50-80 parts of epoxy resin, 10-20 parts of acrylic acid, 10-20 parts of hydroxyethyl acrylate, 1-2 parts of hydroquinone and 1-2 parts of triethylamine into a three-neck flask, setting the stirring speed to be 500 rad/min, heating to 90-95 ℃, sampling after reacting for 3 hours, measuring the acid value, stopping the reaction if the acid value is less than 8 mgKOH/g, or continuing the reaction, measuring the acid value once every 30 minutes until the acid value reaches the standard, cooling to room temperature, placing in a brown bottle for storage, and obtaining epoxy acrylic acid;
b. and (b) adding 100 parts of epoxy acrylic acid obtained in the step (a), 10-20 parts of maleic anhydride, 1-2 parts of hydroquinone and 1-2 parts of triethylamine into a three-neck flask, installing a condenser tube, connecting water for condensation, setting the stirring speed to be 300 rad/min, heating to 90 ℃, measuring the acid value once every 30 min after reacting for 2 hours until the acid value is reduced to a half of the initial acid value, cooling to 60 ℃, adding a proper amount of triethanolamine, continuously stirring for 10 min, and stopping the reaction.
4. The low odor UV hot melt adhesive of claim 3, wherein: the epoxy resin is aliphatic epoxy resin.
5. The low odor UV hot melt adhesive of claim 1, wherein: the polymerization inhibitor is one or more of ferric chloride, sodium sulfate and sodium thiocyanate.
6. The low odor UV hot melt adhesive of claim 1, wherein: the photoinitiator is one or more of organosilicon modified 2-hydroxy-2-methyl-1-phenyl acetone, silicon-containing macromolecular photoinitiator and 1-hydroxycyclohexyl phenyl ketone.
7. The low odor UV hot melt adhesive of claim 1, wherein: the defoaming agent is one of polyether defoaming agent and organic silicon defoaming agent.
8. The low odor UV hot melt adhesive of claim 1, wherein: the leveling agent is one or two of hydroxymethyl cellulose and polyacrylic acid.
9. The low odor UV hot melt adhesive of claim 1, wherein: the neutralizing agent is one or more of triethanolamine, triethylamine, ammonium dihydrogen phosphate and ammonia water.
10. The low odor UV hot melt adhesive of claim 1, wherein: the water-based monomer is one of ethoxy ethyl acrylate and ethoxy trimethylolpropane triacrylate.
11. A preparation method of a low-odor UV hot melt adhesive is characterized by comprising the following steps: adding 5-15 parts of water into a container with stirring and heating functions, starting stirring, sequentially adding 0.1-0.5 part of polymerization inhibitor, 2-5 parts of photoinitiator and 2-4 parts of flatting agent, heating to 40-50 ℃, setting the stirring speed to be 200 rad/min, stirring for 30 min until the polymerization inhibitor, the photoinitiator and the flatting agent are completely dissolved, adjusting the rotating speed to be 100 rad/min, adding 100 parts of aqueous prepolymer and 20-30 parts of aqueous monomer, stirring for 20 min, adding 0.5-1.5 parts of defoaming agent and 1-3 parts of neutralizing agent, adjusting the pH to be 6.5-7.5, completing preparation when bubbles are remarkably reduced, heating to dewater, cooling to room temperature, and transferring to a lightproof container for storage.
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| CN1844229A (en) * | 2006-05-16 | 2006-10-11 | 广东工业大学 | UV curable aqueous resin composition |
| CN101012301A (en) * | 2006-12-15 | 2007-08-08 | 深圳市深赛尔实业有限公司 | Epoxy acrylic resin and preparing method thereof |
| CN101173033A (en) * | 2007-10-12 | 2008-05-07 | 广东天银化工实业有限公司 | Method for producing expediting setting type aquosity ultraviolet light solidifying composition |
| CN107384141A (en) * | 2017-08-22 | 2017-11-24 | 杭州雄鹰精细化工有限公司 | A kind of aqueous, environmental protective UV gloss oil and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844229A (en) * | 2006-05-16 | 2006-10-11 | 广东工业大学 | UV curable aqueous resin composition |
| CN101012301A (en) * | 2006-12-15 | 2007-08-08 | 深圳市深赛尔实业有限公司 | Epoxy acrylic resin and preparing method thereof |
| CN101173033A (en) * | 2007-10-12 | 2008-05-07 | 广东天银化工实业有限公司 | Method for producing expediting setting type aquosity ultraviolet light solidifying composition |
| CN107384141A (en) * | 2017-08-22 | 2017-11-24 | 杭州雄鹰精细化工有限公司 | A kind of aqueous, environmental protective UV gloss oil and preparation method thereof |
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Application publication date: 20201211 |