CN112014931A

CN112014931A - Connector with a locking member

Info

Publication number: CN112014931A
Application number: CN201910475003.3A
Authority: CN
Inventors: 冯辉舜
Original assignee: Tyco Electronics Holdings Bermuda No 7 Ltd
Current assignee: Tyco Electronics Holdings Bermuda No 7 Ltd
Priority date: 2019-05-31
Filing date: 2019-05-31
Publication date: 2020-12-01

Abstract

The invention discloses a connector, which is arranged on a circuit board and comprises: the shell is provided with a contact surface electrically connected with the circuit board, and a first outer side surface and a second outer side surface which are arranged on two sides of the contact surface; the heat dissipation device is arranged on the first outer side face and/or the second outer side face and protrudes out of the shell; and the fixing device fixes the heat dissipation device on the shell. The connector can increase the contact area between the heat sink base of the connector and the optical module, thereby improving the heat dissipation effect.

Description

Connector with a locking member

Technical Field

The present invention relates to a connector, and more particularly, to a connector which is applied to a small pluggable module and increases a heat dissipation area.

Background

With the development of network information, the flow of network processing and management data is continuously increasing, so that more and more updated communication transmission technologies are required to be developed continuously to provide faster transmission speed, longer transmission distance, and efficient and safe data transmission, and in order to increase the port Density when interconnecting with network devices, development of a dual-Density four-channel Small-sized Pluggable (QSFP-DD) module is mainly used, so as to meet the above requirements.

However, with the continuous increase of transmission rate, the energy for transmitting signals is increased, and more heat is generated, while a general QSFP optical module can normally operate at a temperature of 70 ℃ at the maximum, if the temperature exceeds 70 ℃, the performance of an optical component will be reduced, and the service life will be shortened, and because the transmission rate of QSFP-DD is higher, the requirement for the temperature is lower, therefore, in order to solve the heat dissipation problem, the roughness and the flatness of the connector are generally improved between the connector and the heat sink base, but a common solution is to form a hole on the housing of the connector, but according to the current structural configuration, the hole cannot be formed any more, so that only the contact area between the heat sink base of the connector and the optical module can be increased, and how to increase the contact area between the heat sink base of the connector and the optical module, so as to accelerate the heat dissipation effect, the problem to be solved is urgent for the industry.

Disclosure of Invention

The invention aims to provide a connector which increases the contact area between a heat sink base of the connector and an optical module so as to improve the heat dissipation effect.

According to an aspect of the present invention, there is provided a connector provided on a circuit board, the connector including: the shell is provided with a contact surface electrically connected with the circuit board, and a first outer side surface and a second outer side surface which are arranged on two sides of the contact surface; the heat dissipation device is arranged on the first outer side face and/or the second outer side face and protrudes out of the shell; and the fixing device fixes the heat dissipation device on the shell.

According to an exemplary embodiment of the present invention, the housing further has a top surface opposite to the contact surface, and the contact surface and the top surface are respectively provided with a first buckling portion.

According to another exemplary embodiment of the invention, the fixing device is further provided with a second snap connection corresponding to the first snap connection of the contact surface and the top surface of the housing.

According to another exemplary embodiment of the present invention, the first fastening portion is a protrusion, and the second fastening portion is a fastening hole.

According to a further exemplary embodiment of the present invention, the contact surface is provided with a plurality of plug pins which are adapted to be electrically connected with the circuit board for fixing the housing on the circuit board.

According to yet another exemplary embodiment of the present invention, the heat dissipating device has a base and a plurality of dies disposed on the base.

According to yet another exemplary embodiment of the present invention, the connector is further provided with a light pipe, the light pipe being provided on the top surface of the housing.

According to a further exemplary embodiment of the present invention, the connector is further provided with a plug interface adapted for plugging an optical module.

Drawings

Fig. 1 is an exploded perspective view showing a connector according to an exemplary embodiment of the present invention;

FIG. 2 is an assembled perspective view showing a connector according to an exemplary embodiment of the present invention; and

fig. 3 is a schematic diagram showing a connector according to an exemplary embodiment of the present invention disposed on a circuit board.

List of reference numerals

100-connector

10- -shell

11- -contact surface

12- -first outer side

13- -second outside lateral surface

14- -top surface

15- -first snap-on connection

16-plug pin

17- -interface

20- -heat sink

21- -heat sink base

22-bit blade

30- -fixing device

31- -second snap connection

40-light pipe

50- -circuit board

60- -optical module

Detailed Description

Referring to fig. 1, an exploded perspective view of a connector according to an exemplary embodiment of the present invention is shown. The connector 100 is provided on a circuit board 50 (see fig. 3), and includes: a housing 10 having a contact surface 11 electrically connected to the circuit board 50, and a first outer side surface 12 and a second outer side surface 13 provided on both sides of the contact surface 11; a heat sink 20 disposed on the first outer side 12 and/or the second outer side 13 and protruding from the housing 10; a fixing means 30 adapted to fix the heat sink 20 to the housing 10.

With continued reference to fig. 1, in the illustrated embodiment, the housing 10 further has a top surface 14 opposite to the contact surface 11, and the contact surface 11 and the top surface 14 are respectively provided with a first fastening portion 15. In addition, the fixing device 30 is provided with a second fastening portion 31 corresponding to the first fastening portion 15, and the heat sink 20 is fastened to the housing 10 by the first fastening portion 15 being fastened to the second fastening portion 31. In an exemplary embodiment of the present invention, the first fastening portion 15 is a protrusion, and the second fastening portion 31 is a fastening hole. The contact surface 11 is provided with a plurality of pins 16, and the pins 16 are adapted to be electrically connected to the circuit board 50 to fix the housing 10 on the circuit board 50. In addition, in the illustrated embodiment, the heat dissipation device 20 includes a base 21 and a plurality of bits 22, and the plurality of bits 22 are disposed on the base 21.

Fig. 2 shows an assembled perspective view of a connector according to an exemplary embodiment of the present invention. As shown in fig. 1 and fig. 2, when assembling the connector 100 of the present invention, the housing 10 is vertically placed, the contact surface 11 is located at the bottom of the housing 10, the plurality of pins 16 extend downward from the bottom of the housing 10, the heat sink 20 is placed at the left and right sides of the housing 10, that is, the heat sink base 21 of the heat sink 20 is disposed at the first outer side 12 and the second outer side 13, and the plurality of tabs 22 extend outward and toward both sides, and the protruding portion of the first fastening portion 15 of the housing 10 is fastened by the fastening hole of the second fastening portion 31 of the fixing device 30, so as to fix the heat sink 30 at the first outer side 12 and the second outer side 13 of the housing 10, thereby completing the assembly of the connector 100 of the present invention.

With continued reference to fig. 1 and 2, the connector 100 further includes a light pipe 40, the light pipe 40 is disposed on the top surface 14 of the housing 10 for guiding the light source. In an exemplary embodiment of the present invention, the light guide 40 may be a single lamp or a double lamp, and is not limited thereto.

Referring to fig. 3, a schematic diagram of a connector according to an exemplary embodiment of the present invention disposed on a circuit board is shown. In the present embodiment, the connector 100 is an optical transceiver module, and the connector 100 is a 1 × 1 small form-factor pluggable connector structure, so that when the connector 100 is in an upright position, the connector can meet the requirements of the specification. As shown in fig. 3, the connector 100 is further provided with a socket 17, and the socket 17 is suitable for receiving an optical module 60.

With continued reference to fig. 3, in the present invention, the generally horizontal connector is integrally transposed at a 90 degree angle to form the connector 100 into an upright configuration, thereby enabling the width of the connector to be shortened while increasing the height and increasing the contact area between the connector 100 and the heat sink. Therefore, in this embodiment, the connector 100 is disposed on the circuit board 50 and is respectively in contact connection with the heat dissipation device 20 through the first outer side 12 and the second outer side 13 of the housing 10, and then the first fastening portion 15 of the housing 10 is fastened through the second fastening portion 31 of the fixing device 30 to fix the heat dissipation device 20 on the housing 10, so as to increase the contact area between the connector 100 and the heat dissipation device 20, and increase the heat dissipation area, so as to reduce the overall temperature of the connector 100, achieve the desired temperature, and improve the transceiving performance of the connector 100.

The connector is vertically arranged by integrally transposing the connector at an angle of 90 degrees, so that the first outer side surface and the second outer side surface of the shell can be connected with the heat dissipation device, the contact area between the heat dissipation fin base of the connector and the optical module is increased, the heat dissipation area is increased, the effective heat dissipation effect is achieved, and the transceiving efficiency of the connector is improved.

Claims

1. A connector disposed on a circuit board, the connector comprising:

the shell is provided with a contact surface electrically connected with the circuit board, and a first outer side surface and a second outer side surface which are arranged on two sides of the contact surface;

the heat dissipation device is arranged on the first outer side face and/or the second outer side face and protrudes out of the shell; and

a fixing device fixing the heat sink on the housing.

2. The connector of claim 1, wherein the housing further has a top surface opposite to the contact surface, and the contact surface and the top surface are respectively provided with a first buckling portion.

3. The connector of claim 2, wherein the fixing means is provided with a second catching portion corresponding to the first catching portion of the contact surface and the top surface of the housing.

4. The connector of claim 3, wherein the first snap-fit portion is a protrusion and the second snap-fit portion is a snap-hole.

5. The connector of claim 2, further comprising a light pipe disposed on the top surface of the housing.

6. The connector of claim 1, wherein the contact surface is provided with a plurality of pins adapted to electrically connect with the circuit board to secure the housing to the circuit board.

7. The connector of claim 1 wherein the heat sink has a base and a plurality of dies formed on the base.

8. The connector of claim 1, further comprising a mating interface adapted for mating with an optical module.