CN112014000B - Multi-device packaging structure and manufacturing method thereof - Google Patents
Multi-device packaging structure and manufacturing method thereof Download PDFInfo
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- CN112014000B CN112014000B CN201910451107.0A CN201910451107A CN112014000B CN 112014000 B CN112014000 B CN 112014000B CN 201910451107 A CN201910451107 A CN 201910451107A CN 112014000 B CN112014000 B CN 112014000B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
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Abstract
The application discloses a multi-device packaging structure and a manufacturing method thereof. Wherein, this multi-device packaging structure includes: a substrate; a control device and a pressure sensing device disposed on one side of the substrate; the packaging shell is positioned on one side of the substrate, a cavity is arranged on the packaging shell, and at least part of sensing area of the pressure sensing device is exposed at the bottom of the cavity; wherein, the lateral wall of cavity has at least one angle to be chamfer structure. By the scheme, the manufacturing yield of the multi-device packaging structure can be improved.
Description
Technical Field
The application relates to the technical field of packaging, in particular to a multi-device packaging structure and a manufacturing method thereof.
Background
Pressure sensing devices are widely used in the consumer electronics, automotive electronics, and industrial electronics fields. For example, in the automotive electronics industry, the application of the tire pressure monitoring system can monitor the condition of the tire pressure, thereby greatly reducing the occurrence of traffic accidents.
To achieve pressure monitoring, a multi-device package structure is generally formed by packaging a pressure sensing device and a control device, and the packaging requirement for the pressure sensing device is different from the packaging requirement for the control device because the pressure sensing device needs to sense the external pressure. Based on the special packaging requirements of the multi-device packaging structure, how to improve the manufacturing yield of the multi-device packaging structure containing the pressure sensing device is a critical issue at present.
Disclosure of Invention
The application mainly solves the technical problem of providing the multi-device packaging structure and the manufacturing method thereof, and can improve the manufacturing yield of the multi-device packaging structure.
In order to solve the above problems, a first aspect of the present application provides a multi-device package structure, including:
a substrate;
a control device and a pressure sensing device disposed on one side of the substrate;
the packaging shell is positioned on one side of the substrate, a cavity is arranged on the packaging shell, and at least part of the sensing area of the pressure sensing device is exposed at the bottom of the cavity;
wherein, the lateral wall of cavity has at least one angle to be chamfer structure.
In order to solve the above problems, a second aspect of the present application provides a method for manufacturing a multi-device package structure, including:
providing a substrate;
a control device is arranged on one side of the substrate;
injecting a packaging material on one side of the substrate, and opening a cavity of the packaging material through a protective film by using a die to form a packaging shell provided with a cavity, wherein at least one corner of the side wall of the cavity is of a chamfer structure;
a pressure sensing device is arranged in the cavity;
and covering the devices in the cavity with a protective layer.
In order to solve the above problems, a third aspect of the present application provides a method for manufacturing a multi-device package structure, including:
providing a substrate;
a control device and a pressure sensing device are arranged on one side of the substrate;
and injecting a packaging material on one side of the substrate, and opening a cavity of the packaging material through a protective film by utilizing a die to form a packaging shell provided with a cavity, wherein at least part of a sensing area of the pressure sensing device is exposed at the bottom of the cavity, and at least one corner of the side wall of the cavity is of a chamfer structure.
In the scheme, the multi-device packaging structure packages the pressure sensing device by using the packaging shell provided with the cavity, at least one corner of the side wall of the cavity is of a chamfer structure, and when the cavity of the packaging shell is formed by opening the cavity of the packaging shell by using the die through the protective film in the manufacturing process of the multi-device packaging structure, the stress concentration suffered by the protective film in the cavity opening process can be reduced due to the fact that the corner of the side wall of the cavity is of the chamfer structure, so that the damage of the protective film is avoided, and the manufacturing yield is improved.
Drawings
FIG. 1 is a schematic side sectional view of a first embodiment of a multi-device package structure of the present application;
FIG. 2 is a schematic side cross-sectional view of a first embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 3 is a schematic side cross-sectional view of a second embodiment of a multi-device package structure of the present application;
FIG. 4 is a schematic side cross-sectional view of a third embodiment of a multi-device package structure of the present application;
FIG. 5 is a schematic side cross-sectional view of a fourth embodiment of a multi-device package structure of the present application;
FIG. 6 is a schematic side cross-sectional view of a fifth embodiment of a multi-device package structure of the present application;
FIG. 7 is a schematic side sectional view of a sixth embodiment of a multi-device package structure of the present application;
FIG. 8 is a schematic side sectional view of a seventh embodiment of a multi-device package structure of the present application;
FIG. 9 is a schematic side sectional view of an eighth embodiment of a multi-device package structure of the present application;
FIG. 10 is a schematic side sectional view of a ninth embodiment of a multi-device package structure of the present application;
FIG. 11 is a schematic side sectional view of a tenth embodiment of a multi-device package structure of the present application;
FIG. 12 is a schematic side cross-sectional view of a second embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 13 is a schematic side cross-sectional view of a third embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 14 is a schematic side cross-sectional view of a fourth embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 15 is a schematic side cross-sectional view of a fifth embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 16 is a schematic side cross-sectional view of a sixth embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 17 is a schematic side cross-sectional view of a seventh embodiment of a pressure sensing device of the multi-device package structure of the present application;
FIG. 18 is a flow chart of an embodiment of a method for fabricating a multi-device package structure according to the present application;
fig. 19 a-19 h are schematic structural views of a multi-device package structure manufactured by corresponding steps in an embodiment of a method for manufacturing a multi-device package structure according to the present application;
fig. 20 is a flowchart illustrating a method for fabricating a multi-device package according to another embodiment of the present application.
Detailed Description
The following describes embodiments of the present application in detail with reference to the drawings.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application.
The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. The term "plurality of" or "plurality of" as used herein is to be understood as two or more.
The multi-device package structure described herein may be used in any pressure sensing system, such as tire pressure monitoring systems (tire pressure monitoring system). Specifically, the multi-device package structure may be a tire pressure monitoring chip. It is understood that the multi-device package structure includes a pressure sensing device and may also be referred to as a pressure sensor.
Referring to fig. 1, fig. 1 is a schematic side sectional view of a multi-device package structure according to an embodiment of the application. In this embodiment, the multi-device package structure 100 includes a substrate 110, a control device 120, a pressure sensing device 130, a package housing 140, and a protective layer 150.
Specifically, the substrate 110 may be, but is not limited to, a metal lead frame, a plastic substrate, a ceramic substrate, or the like.
The control device 120 is arranged on one side 111 of the substrate 110. In one embodiment, the control device 120 may be secured to the substrate 110 by a first device attach material 121 and may be electrically connected to the substrate 110 by bond wires 122. The control device 120 may be a micro control unit (Microcontroller Unit, MCU) chip in particular.
The pressure sensing device 130 is disposed on one side 111 of the substrate 110. The pressure sensing device 130 may be fixed to one side 111 of the substrate 110 by a second device bonding material 131 and may be electrically connected to the substrate 110 or the control device 120 by bonding wires 132. For example, as shown in fig. 1, the pressure sensing device 130 is fixed to an upper surface 123 of the control device 120 (it will be appreciated that the upper surface is the surface of the corresponding device or structure remote from the substrate herein), and the pressure sensing device 130 is electrically connected to the control device 120 by bonding wires 132; as another example, as shown in fig. 7, the pressure sensing device 130 and the control device 120 are respectively fixed on the surface of one side 111 of the substrate 110, and the pressure sensing device 130 is electrically connected to the substrate 110 through bonding wires 132.
The pressure sensing device 130 is provided with a sensing area for sensing external pressure. Specifically, referring to fig. 2 in combination, the pressure sensing device 130 includes a sensing region 133 and an external pressure sensing capsule 134, the sensing region 133 corresponding to a surface of the external pressure sensing capsule 134 (it is understood that the surface of the sensing capsule described herein may be any orientation of the surface within the sensing capsule). Specifically, the sensing region 133 is formed of a first pressure film 135, and one surface of the sensing region 133 and the external pressure sensing hermetic chamber 134 are opposite sides of the first pressure film 135, respectively.
The package body 140 is located on one side 111 of the substrate 110, and is provided with a cavity 141, and at least a part of the sensing region 133 of the pressure sensing device 130 is exposed to the bottom 1411 of the cavity 141. In a specific application, the package body 140 may be any material capable of protecting the device, and is typically a relatively hard material such as plastic.
Specifically, as shown in fig. 1, the package housing 140 may cover devices on one side 111 of the substrate 110 (may be understood as covering a part or all of the devices on one side 111 of the substrate 110) such as the control device 120, the sensor device 170 described below, and bonding wires thereof, so as to perform package protection on devices other than the pressure sensor device 130, for example, the cavity 141 is disposed on the control device 120, and at least a part of the upper surface of the control device 120 is exposed at the bottom 1411 of the cavity 141, and the pressure sensor device 130 is disposed on the upper surface of the control device 120 at the bottom 1411 of the cavity. Of course, as shown in fig. 7, the cavity 141 is disposed on the substrate 110, and the bottom 1411 of the cavity 141 exposes a portion of the upper surface of the substrate 110, and the pressure sensing device 130 is disposed on the upper surface of the substrate 110 at the bottom 1411 of the cavity; alternatively, as shown in fig. 9, the package body 140 may also partially cover the pressure sensing device 130, for example, the cavity 141 is disposed on the upper surface of the pressure sensing device 130, so long as a portion of the sensing area 133 is exposed from the bottom 1411 of the cavity 141. For at least part of devices on the substrate 100 are covered by the packaging shell 140, the cavity 141 is packaged and protected by the following protective layer, so that compared with the case that all devices on the substrate are directly packaged by the protective layer, the use of protective layer materials can be reduced, the packaging cost of the protective layer is reduced, and compared with the case that the protective layer is adopted, the non-pressure sensing devices can be better protected by adopting the packaging shell, the packaging reliability can be improved, and the packaging is realized by adopting the combination mode of the packaging shell and the protective layer, the control requirement of the packaging process can be reduced, and the manufacturing yield is improved. It should be noted that, in the embodiment shown in fig. 9, the cavity 141 is disposed on the pressure sensing device 130, and the following protection layers may be disposed or disposed in the cavity according to actual requirements, i.e., the multi-device package structure may or may not include the following protection layers. For example, if the bonding wires of the pressure sensing device 130 are not exposed in the cavity, the cavity may not be provided with a protection layer as described below, so that the packaging cost is further reduced and the sensitivity of the sensing area of the pressure sensing device to pressure is improved.
It will be appreciated that the package body 140 may not cover all or part of the devices on the substrate 110, for example, the package body 140 is disposed on the periphery of the side 111 of the substrate 110 to enclose all the devices on the substrate 110, and all the devices are exposed at the bottom 1411 of the cavity 141. At this time, all devices on the substrate are covered with a protective layer described below for package protection.
The protective layer 150 is used to cover the devices in the cavity 141. As shown in fig. 1, the protective layer 150 covers the pressure sensing device 130 and its bonding wires 132. It will be appreciated that if there are other devices in the cavity 141, the protection layer 150 covers the other devices and their associated bonding wires. Specifically, the protective layer 150 may be a gel (gel) or other material having a certain elasticity to be able to transmit external pressure to the pressure sensing device 130. For example, in the process of packaging the multi-device package structure 100, glue is injected into the cavity 141 to a certain height to cover the devices in the cavity 141, and then the glue is cured to form gel, so as to protect the devices in the cavity 141. The external pressure of the multi-device package structure of the present embodiment is transmitted to the sensing region of the pressure sensing device 130 through the protection layer 150, so that the measurement of the external pressure can be realized.
With continued reference to fig. 1, the multi-device package structure 100 may also be used to detect data other than pressure, so the multi-device package structure 100 may further include at least one sensor device 160 for detecting other data, where the at least one sensor device 160 is disposed on one side 111 of the substrate 110. As shown in fig. 1, the entirety of each sensing device 160 is covered by the package housing 140. It should be understood that in other embodiments, the sensor device 160 may also be partially covered by the package body 140 (e.g., the package body 140 only covers the solder joints of the sensor device 160 and the bonding wires thereof), and the portion of the sensor device 160 not covered by the package body 140 may be covered by a protective layer or other material or directly exposed. Specifically, the sensing device 160 may be an acceleration, temperature, or the like sensing device. In one specific application, the multi-device package structure 100 includes an acceleration sensor device 160 in addition to the above-described structure as a tire pressure monitoring chip capable of monitoring tire pressure and acceleration.
The at least one sensor device 160 may be integrated in a device group, and in particular may be integrated in a stacked or tiled manner. In addition, as shown in FIG. 1, the at least one sensing device 160 may be disposed on the substrate 110. In another embodiment, as shown in fig. 8, the at least one sensing device 160 may be disposed on an upper surface of the control device 120. In one specific application, the sensing device 160 may be secured to the substrate 110 or the control device 120 by a third device attach material 161 and may be electrically connected to the substrate 110 or the control device 120 by bond wires 162. It is to be understood that the multi-device package structure 100 may be provided with the sensing device 160 according to actual requirements, and in some embodiments, the multi-device package structure 100 may not be provided with the sensing device 160, which is not limited herein.
It is understood that the first device bonding material, the second device bonding material, and the third device bonding material may be the same or different bonding materials, and may specifically be conductive glue, non-conductive glue, adhesive film, underfill, molding compound, and the like. The control device, the pressure sensing device and the sensing device can be specifically a control chip, a pressure sensing chip and a related sensing chip. The control device, the pressure sensing device, the sensing device and the like can be arranged on the substrate or other devices in a flip-chip bonding mode.
With continued reference to fig. 1, in some embodiments, at least one corner of the sidewall 1412 of the cavity 141 of the package body 140 may be provided with a chamfer structure. As shown in fig. 1, all corners of the sidewall 1412 of the cavity 141 may be chamfered. For the manufacturing process of the multi-device package structure, the cavity 141 is typically formed by pressing the package material with a mold, and the shape of the sidewall 1412 of the cavity 141 depends on the shape of the mold. In order to protect the device or substrate at the location corresponding to the cavity 141, a mold is typically used to press the encapsulant through a protective film to reduce the pressure of the mold against the device or substrate within the formed cavity. In order to avoid damage to the protective film when the mold presses the encapsulation material through the protective film, at least part of corners of the mold may be set to a chamfer structure, and thus, the corresponding corners of the cavity 141 may be finally formed to the chamfer structure. Therefore, the stress concentration of the protective film in the cavity opening process can be reduced, the damage of the protective film is avoided, the service life of the protective film in the manufacturing process is prolonged, the alarm rate caused by the damage of the protective film in the manufacturing process is reduced, and the manufacturing yield (also called as packaging yield) is improved.
With continued reference to fig. 1, in some embodiments, the sidewalls 1412 of the cavity 141 may be configured in a stepped configuration. For example, the side wall 1412 includes a plurality of steps 1412a, and the plurality of steps 1412a are sequentially connected to form a stepped structure. Wherein at least one corner of the stepped structure is a chamfer structure, such as a junction 1412b between an end corner 1412a1 of each step 1412a and the step 1412a is a chamfer structure. In addition, the step 1412a may be provided in any shape according to practical needs, for example, the step 1412a shown in fig. 1 is rectangular or rectangular-like, and the upper surface of the step 1412a may be horizontal (shown in fig. 1) or have an angle with the horizontal. In addition, the included angle β formed by the connection portion 1412b between the steps 1412a may be set to be a right angle (as shown in fig. 1), an obtuse angle (as shown in fig. 3), or an acute angle (as shown in fig. 4) according to practical requirements. In this embodiment, the side wall of the cavity 141 is configured to be stepped, so that the depth of each step of the side wall is reduced compared with the depth of the whole non-stepped side wall (as shown in fig. 5), so that the stress concentration to which the protective film is subjected in the packaging process is reduced, the damage to the protective film is avoided, the service life of the protective film in the manufacturing process is prolonged, the alarm rate caused by the damage to the protective film in the manufacturing process is reduced, and the manufacturing yield is improved.
It will be appreciated that in the embodiment where the side wall is stepped, the height of a certain step 1412a may be used as the reference height of the protection layer 150, that is, the height of the protection layer is added to the height of a certain step 1412a when the protection layer 150 is added. Furthermore, as shown in fig. 4, the connection portion 1412b between the steps 1412a may be a groove extending toward the substrate 110, so that when the protective layer is added, the height of a certain step 1412a may be used as a reference height of the protective layer, and the addition of the protective layer material thermally converted into liquid is stopped after the protective layer material is added to the height of a certain step 1412a, and the excessive protective layer material may flow into the groove of the connection portion 1412 b.
In addition, the side wall 1412 of the cavity 141 may not have a stepped structure, and as shown in fig. 5, the side wall 1412 may have a relatively large step. Wherein the corners 1412c of the sidewalls 1412 may be, but are not limited to, provided as chamfer structures.
With continued reference to fig. 1, in some embodiments, to further enhance protection of the devices in cavity 141, multi-device package structure 100 may further include a cover 170. The cover 170 covers the cavity 141, and an opening 172 is provided at a position corresponding to the cavity 141. The cover 170 serves to further protect the devices in the cavity 141. The external pressure of the multi-device package structure of the present embodiment changes the air pressure in the cavity through the opening, and the pressure sensing device 130 senses the external pressure by sensing the air pressure in the cavity 141. Of course, in other embodiments, the multi-device package structure 100 may not include the cover 170, which is not limited herein.
Specifically, the cover 170 is connected to at least a portion of the upper surface 142 of the package body 140, and extends to above the cavity 141 through the connection portion, so as to cover the cavity 141. Specifically, the cover 170 may be attached by a cover adhesive material 171. Because the upper surface 142 of the package housing 140 has a larger area, the cover 170 can be adhered with a larger area, so as to improve the reliability of the cover connection, and the process is simple, the warpage of the package housing is smaller, and the heat dissipation capability is stronger. It is understood that, for maximum connection reliability, the upper surface of the package case 140 may be used as a connection region to the cover 170, that is, the cover adhesive 171 and the connection cover 170 are covered. However, in the case that the upper surface 142 of the package body 140 has a large area, the cover 170 may be selectively coupled to a portion of the upper surface 142 of the package body 140, wherein at least a portion of the upper surface 1422 not coupled to the cover 170 has a height equal to or lower than that of the upper surface 1421 coupled to the cover 170. For example, as shown in fig. 1, the height of the upper surface 1422 of the package case 140, which is not connected to the cover 170, is equal to the height of the upper surface 1421 connected to the cover 170; alternatively, as shown in fig. 6, the height h1 of the upper surface 1422 of the portion of the package body 140 not connected to the cover 170 is lower than the height h2 of the upper surface 1421 connected to the cover 170, so as to reduce the use of the package material and reduce the cost.
It is understood that in the case where the cover 170 is coupled to at least a portion of the upper surface of the package body 140, the cover 170 may be disposed to cover the entire upper surface of the package body 140, as shown in fig. 1, and the cover 170 is also covered on the upper surface of the package body 140, which is not coupled to the cover 170. By covering the entire upper surface of the package case 140 with a cover, the warpage of the package case can be made smaller
In addition, in the embodiment where the side wall 1412 is stepped, the cover 170 may be connected to a step of the side wall 1412, for example, by using a cover adhesive material, so that the area of the cover 170 can be reduced and the cost can be reduced. In addition, the cover body adhesive material can be specifically realized by adopting a device adhesive material, such as glue, double-sided adhesive tape and the like.
Referring to fig. 7 and 8, the pressure sensing device 130 of the multi-device package structure 100 may be disposed on a surface of one side 111 of the substrate 110. Specifically, the cavity 141 of the package body 140 is disposed on the substrate 110, and the bottom 1411 of the cavity 141 exposes a portion of the surface of the substrate 110, the pressure sensing device 130 is disposed on the surface of the substrate 110 at the bottom 1411 of the cavity, and the protection layer 150 covers the pressure sensing device 130 and the bonding wires 132 thereof. Wherein for the embodiment shown in fig. 8, the sensing device 170 may be disposed on an upper surface of the control device 120.
Referring to fig. 9-11, the cavity 141 of the multi-device package structure 100 is disposed on the pressure sensing device 130, and a portion of the sensing area of the pressure sensing device 130 is exposed at the bottom 1411 of the cavity 141. In some embodiments, as shown in fig. 9, the pressure sensing device 130 may be disposed on the upper surface of the control device 120, and the sensing device 160 may be disposed on the substrate 110, where the sensing device 160 and the pressure sensing device 130 may be disposed on the control device 120 separately, and is not limited herein. In some embodiments, as shown in fig. 10, the pressure sensing device 130 may also be disposed on the substrate 110 separately from the control device 120. In some embodiments, as shown in fig. 11, the pressure sensing device 130 may be disposed on the substrate 110 separately from the control device 120, and the sensing device 160 may be disposed on an upper surface of the control device 120. For embodiments in which the cavity 141 of the multi-device package structure 100 is disposed on the pressure sensing device 130, a protection layer may be disposed or not disposed in the cavity 141 according to actual requirements.
It should be noted that, in the above embodiment, the cavity side wall 1412 of the multi-device package structure may or may not be configured as the chamfer structure and the step structure according to the requirement, and the control device 120, the sensing device 160 and the cover 170 may be selectively configured according to the actual requirement of the multi-device package structure, which is not limited herein. For example, in one embodiment, the pressure sensing device may be individually packaged to obtain a pressure sensor, and other devices such as the control device and the sensing device are individually packaged in another system, that is, the pressure sensor is a package structure formed by eliminating the control device and the sensing device in the multi-device package structure embodiment herein. However, compared to packaging the control device in addition, the above embodiment packages the pressure sensing device together with the control device, the sensing device, and other devices, so as to obtain a smaller system package (system in package), and reduce the package size, so that the control device and the pressure sensing device can be directly interconnected at the package level, and package parasitics between the devices are reduced.
For each of the above embodiments, to prevent external objects from acting on the sensing region of the pressure sensing device 130 to damage the sensing region, referring to fig. 12-14, the upper surface 136 of the pressure sensing device 130 is further provided with an isolation structure 137, and the isolation structure 137 is used to isolate the external objects from acting on the sensing region 133 in the upper surface 136. For example, for embodiments in which the cavity of the package housing is provided with a pressure sensing device, the mold is required to act on the encapsulant through the protective film during fabrication to form the cavity on the pressure sensing device, at which time the isolation structure 137 may be used to prevent the mold from acting on the sensing region to damage the sensing region.
In some embodiments, as shown in fig. 12, isolation structure 137 includes a protective cavity 1371 formed by an upper surface 136 extending toward a lower surface of pressure sensing device 130, wherein a portion of the upper surface that is a bottom or sidewall of protective cavity 137 is sensing region 133 of the pressure sensing device. For example, in an embodiment in which the external pressure sensing hermetic chamber 134 is provided at the bottom of the protection chamber 137, the bottom upper surface portion of the protection chamber 137 is one side of the first pressure film 135, and a portion of the surface of the external pressure sensing hermetic chamber 134 is the other side of the first pressure film 135; for the embodiment in which the external pressure sensing hermetic chamber 134 is provided at the side of the protection chamber 137, the upper surface portion of the sidewall of the protection chamber 137 is one side of the first pressure film 135, and a portion of the surface of the external pressure sensing hermetic chamber 134 is the other side of the first pressure film 135
In some embodiments, as shown in fig. 13, the isolation structure 137 includes a protective cover 1372 disposed on the upper surface 136, the protective cover 1372 and the sensing region 133 in the upper surface 136 form a space 13721, and the protective cover 1372 is provided with an opening 13722 communicating with the space 13721. Specifically, the upper surface of the pressure sensing device 130 is provided with a first pressure film 135, wherein one side of the first pressure film 135 serves as the sensing region 133 in the upper surface 136, and the other side of the first pressure film 135 serves as a part of the surface of the external pressure sensing closed cavity 134.
In some embodiments, as shown in fig. 14, isolation structure 137 may include protective cavities 1371 and protective caps 1372 described above.
In the embodiment provided with the isolation structure, the protection cavity 1371 and/or the protection cap 1372 in the isolation structure can prevent the first pressure film 135 from being damaged by the mold when the mold is used to open the cavity on the pressure sensing device in the process of manufacturing the multi-device package structure, so that the first pressure film 135 can be protected.
Referring to fig. 15-17, specifically, fig. 15 illustrates an embodiment in which the isolation structure includes the protection cavity 1371, fig. 16 illustrates an embodiment in which the isolation structure includes the protection cap 1372, and fig. 17 illustrates an embodiment in which the isolation structure includes the protection cavity 1371 and the protection cap 1372. To improve the accuracy of the pressure measurement of the pressure sensing device 130, the pressure sensing device 130 may be provided with a reference pressure sensing capsule 138 and a second pressure membrane 139 in addition to the external pressure sensing capsule 134 and the first pressure membrane 135. Wherein, the opposite sides of the second pressure film 139 are the other surface of the external pressure sensing hermetic chamber 134 and one surface of the reference pressure sensing hermetic chamber 138, respectively. The reference pressure sensing capsule 138 may be a vacuum setting. In making the pressure measurements, the current sensed values of the external pressure sensing capsule 134 and the reference pressure sensing capsule 138 may be measured using the first pressure membrane 135 and the second pressure membrane 139, respectively; the current sensed value of the external pressure sensing enclosure 134 is compensated based on the current sensed value of the reference pressure sensing enclosure 138 and the reference sensed value of the reference pressure sensing enclosure 138 measured before encapsulation to obtain an accurate measured pressure value. The compensation structure can ensure accurate measurement of pressure data even when the package housing 130 is subjected to abnormal conditions such as warpage.
It is understood that the pressure sensing device 130 may be selectively provided with the isolation structure and the reference pressure sensing closed cavity according to actual requirements, for example, in an embodiment, the pressure sensing device 130 may be provided with only the reference pressure sensing closed cavity without the isolation structure. Therefore, the specific structure of the pressure sensing device is not limited herein.
Referring to fig. 18, fig. 18 is a flow chart illustrating a method for manufacturing a multi-device package according to an embodiment of the application. In this embodiment, the manufacturing method includes the following steps:
s1810: a substrate is provided.
As shown in fig. 19a, a substrate 1910 is provided. The substrate 1910 may be, but is not limited to, a metal lead frame, a plastic substrate, a ceramic substrate, or the like.
S1820: a control device is provided on one side of the substrate.
As shown in fig. 19b, a control device 1920 is provided on one side of the substrate 1910, wherein a first device bonding material 1921 may be used to bond the control device 1920 to the substrate 1910.
It will be appreciated that for multi-device packages where data other than pressure is to be sensed, this step further includes providing at least one sensing device 1960 on one side of the substrate 1910, wherein a third device bonding material 1961 may be used to bond the sensing device 1960 to the substrate 1910. Of course, in other embodiments, this step may also include providing at least one sensing device 1960 on the control device 1920 such that the sensing device 1960 is stacked on the control device 1920.
With continued reference to fig. 19c, after the relevant devices are placed, this step may further include connecting the relevant devices with bond wires. For example, the control device 1920 is connected to the substrate 1910 by a bonding wire 1922, and the sensor device 1960 is connected to the control device 1920 by a bonding wire 1962.
S1830: and injecting a packaging material on one side of the substrate, and opening a cavity of the packaging material through a protective film by using a die to form a packaging shell provided with a cavity.
As shown in fig. 19d, a package housing 1940 provided with a cavity 1941 as shown in fig. 19e is formed by injecting a package material 1940 at one side of a substrate 1910 and pressing the package material 1940 through a protective film 1949 using a mold 1948 to open a cavity (open cavity). Wherein, the package material can be plastic, so the cavity can be formed by molding and opening the cavity.
It will be appreciated that this embodiment uses a mold 1948 to open a cavity corresponding to the location of the control device 1920 to form a cavity 1941 exposing at least a portion of the upper surface of the control device 1920. In other embodiments, mold 1948 may also be used to open cavities corresponding to the location of the substrate to form cavities 1941 exposing at least a portion of the upper surface of substrate 1910.
In some embodiments, at least one corner of the sidewall of the cavity 1941 is a chamfer. Specifically, the encapsulation material 1940 is opened by a mold 1948 having at least one corner with a chamfer structure through a protective film 1949 to form a cavity 1941 having a corresponding corner with a chamfer structure. Therefore, the stress concentration of the protective film can be reduced due to the chamfer, so that the damage of the protective film is avoided, and the manufacturing yield is improved.
In some embodiments, the sidewalls of the cavity 1941 may be provided in a stepped configuration. Specifically, a mold 1948 having a stepped structure on the side wall is used to perform stepped cavity opening (step open cavity) on the encapsulation material 1940 through a protective film 1949, so as to form a cavity 1941 having a stepped structure on the side wall. Therefore, the depth of each step is lower than the depth of the whole side wall by the step-shaped structure, so that stress concentration of the protective film can be reduced, the protective film is prevented from being damaged, process control in the cavity opening process is facilitated, and the manufacturing yield is improved. In addition, the steps of the step-shaped structure can also be used as a height reference surface for adding the protective layer.
In some embodiments, the package housing 1940 is formed to cover devices such as the control device 1920 and the sensing device 1960 on one side of the substrate 1910, and the cavity 1941 is disposed on the control device 1920 or the substrate 1910 with a bottom of the cavity 1941 exposing a portion of the surface of the control device 1920 or a portion of the surface of the substrate 1910.
S1840: a pressure sensing device is disposed within the cavity.
As shown in fig. 19f, a pressure sensing device 1930 is provided on the control device 1920 at the bottom of the cavity 1941, wherein a second device bonding material 1931 may be used to press the pressure sensing device 1930 against the control device 1920. Of course, in embodiments where the bottom of the other cavity 1941 is bare substrate 1910, a pressure sensing device 1930 may be provided on the substrate 1910 at the bottom of the cavity 1941.
With continued reference to fig. 19g, after the pressure sensing device 1930 is provided, this step may further include connecting the pressure sensing device 1930 with a bonding wire. For example, the pressure sensing device 1930 is connected to the control device 1920 using bond wires 1932. Of course, in other embodiments in which the bottom of the cavity 1941 is bare to the substrate 1910, the pressure sensing device 1930 may be connected to the substrate 1910 with bonding wires 1932 after the pressure sensing device 1930 is disposed on the substrate 1910 at the bottom of the cavity 1941.
S1850: and covering the device in the cavity with a protective layer.
As shown in fig. 19h, a protective layer 1950, such as gel, is injected into the cavity 1941 to cover the pressure sensing device 1930 and its bonding wires within the cavity 1941. It will be appreciated that in order to be able to protect the pressure sensing device 1930 and its bonding wires within the cavity 1941, the height of the protective layer should be higher than the height of the pressure sensing device 1930 and its bonding wires.
In some embodiments, after S1850, it may further comprise: and arranging a cover body corresponding to the cavity, wherein the cover body is provided with an opening and is connected to the upper surface of the packaging shell so as to obtain the multi-device packaging structure shown in fig. 1. In another embodiment, the cover is connected to a portion of the upper surface of the package body, so in order to reduce the material cost of the package body, the height of the portion of the upper surface of the package body, which is not used for connecting the cover, may be set to be lower than the height of the upper surface of the portion of the upper surface used for connecting the cover, and the package material may be pressed by a mold with a corresponding shape at step S1830 to obtain the upper surfaces of the package bodies with different heights (as shown in fig. 6). In yet another embodiment, the cover may be attached to a step of the stepped sidewall of the chamber.
According to the embodiment, the corner of the cavity is provided with the chamfer structure and/or the side wall of the cavity is provided with the stepped structure, so that the damage of the protective film in the manufacturing process can be avoided, the reliability and the controllability of the manufacturing process can be improved, and the manufacturing yield can be improved.
Referring to fig. 20, fig. 20 is a flowchart illustrating a manufacturing method of a multi-device package structure according to another embodiment of the application. The method comprises the following steps:
s2010: a substrate is provided.
S2020: a control device and a pressure sensing device are provided on one side of the substrate.
Steps S2010-S2020 may refer to the descriptions related to S1810-S1820 above, except that a pressure sensing device is further provided in step S2020, wherein the pressure sensing device may be provided on the control device or the substrate.
S2030: and injecting a packaging material at one side of the substrate, and opening a cavity of the packaging material through a protective film by using a die to form a packaging shell provided with a cavity.
Step S2030 may refer to the relevant description of S1830 above. However, in this embodiment, the mold is opened corresponding to the sensing area of the pressure sensing device, so that the cavity is disposed on the pressure sensing device and at least part of the sensing area is exposed at the bottom of the cavity. The pressure sensing device can be provided with an isolation structure, and at the moment, the die is opened corresponding to the isolation structure, so that the isolation structure can be ensured to prevent the die from acting on the sensing area to damage the sensing area.
S2040: and covering the pressure sensing device in the cavity with a protective layer.
In step S2040, reference is made to the above description of step S1850, and thus, description thereof is omitted herein. It should be understood that, since the pressure sensing device is opened in the present embodiment, if the bonding wire of the pressure sensing device is not exposed in the cavity, the step S2040 may not be performed, i.e. no protection layer is provided in the cavity.
In addition, the method can further comprise the following steps: a cover body is arranged corresponding to the cavity body. Specific arrangements are described with reference to the method embodiment described in fig. 19.
It should be understood that fig. 19 a-19 h are only schematic illustrations of the multi-device package structure fabricated in each process, and that the actual structure may be in and out of fig. 19 a-19 h, but does not affect the understanding of the fabrication steps and the fabricated multi-device package structure using the present fabrication method.
The manufacturing method can be used for manufacturing the multi-device packaging structure in the multi-device packaging structure embodiment, so that the specific structure of the multi-device packaging structure manufactured by the manufacturing method can be referred to the multi-device packaging structure embodiment.
In the scheme, the multi-device packaging structure can be used for packaging the pressure sensing device by using the packaging shell provided with the cavity, at least one corner of the side wall of the cavity is of a chamfer structure, and in the manufacturing process of the multi-device packaging structure, when the packaging shell is opened by using the die through the protective film to form the cavity of the packaging shell, the stress concentration of the protective film in the opening process can be reduced due to the fact that the corner of the side wall of the cavity is of the chamfer structure, damage of the protective film is avoided, and the manufacturing yield is improved.
In the scheme, the multi-device packaging structure can cover the control device by using the packaging shell, the cavity in the packaging shell exposes the pressure sensing device, and then the pressure sensing device is covered by combining the protective layer in the cavity or the protective layer is not arranged in the cavity when the exposed pressure sensing device in the cavity is not required to be protected, so that the packaging protection of each device of the multi-device packaging structure is realized.
In the scheme, the multi-device packaging structure can be provided with the cavity of the packaging shell on the pressure sensing device, at least the packaging shell is used for packaging all devices of the multi-device packaging structure, and the sensing area of the pressure sensing device exposed by the cavity is used for pressure sensing, wherein the upper surface of the pressure sensing device is provided with the isolation structure so as to prevent external objects from acting on the sensing area, so that the pressure sensing device can be effectively protected, the effective sensing of the pressure is ensured, and the reliability of the pressure sensing is improved.
In the description above, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
Claims (8)
1. A multi-device package structure, comprising:
a substrate;
a control device and a pressure sensing device disposed on one side of the substrate;
the packaging shell is positioned on one side of the substrate, a cavity is arranged on the packaging shell, and at least part of the sensing area of the pressure sensing device is exposed at the bottom of the cavity;
the cover body is connected to at least part of the upper surface of the packaging shell, and/or covers the whole upper surface of the packaging shell and is provided with an opening corresponding to the cavity; wherein when the cover body is connected to a part of the upper surface of the package housing, at least a part of the upper surface not connected to the cover body has a lower height than the upper surface connected to the cover body;
the isolation structure is arranged on the upper surface of the pressure sensing device and used for isolating an external object from acting on the sensing area, and the cavity is arranged above the isolation structure; the isolation structure comprises a protective cover arranged on the upper surface of the pressure sensing device and a protective cavity formed by extending the lower surface of the protective cover to the lower surface of the pressure sensing device, wherein the upper surface part of the bottom or the side wall of the protective cavity is a sensing area of the pressure sensing device, and the protective cover is provided with an opening communicated with the protective cavity;
wherein, the lateral wall of cavity has at least one angle to be chamfer structure.
2. The multi-device package of claim 1, wherein the sidewalls of the cavity are of a stepped configuration.
3. The multi-device package structure of claim 2, wherein the sidewall comprises a plurality of steps, the steps are sequentially connected to form the step-like structure, and the connection of the steps is a right angle, an obtuse angle or an acute angle.
4. A multi-device package structure of claim 3, wherein the connection between the end corner of each step and the step is a chamfer structure;
and/or the connection part between the steps is a groove extending towards the substrate.
5. The multi-device package structure of claim 1, wherein the package housing covers devices on the substrate; the cavity is arranged on the control device or the substrate, the bottom of the cavity exposes part of the surface of the control device or the substrate, and the pressure sensing device is arranged on the part of the surface of the control device or the substrate at the bottom of the cavity; a protective layer is arranged in the cavity and is used for covering devices in the cavity;
or the cavity is arranged on the pressure sensing device, and at least part of the sensing area of the pressure sensing device is exposed at the bottom of the cavity; the cavity is internally provided with or not provided with the protective layer.
6. The multi-device package structure of claim 1, wherein the package housing is plastic and the protective layer is gel; and/or
The multi-device packaging structure further comprises an acceleration sensing device arranged on one side of the substrate, and part or all of the acceleration sensing device is covered by the packaging shell.
7. A method of fabricating a multi-device package structure, comprising:
providing a substrate and a cover body;
a control device is arranged on one side of the substrate;
injecting a packaging material on one side of the substrate, and opening a cavity of the packaging material through a protective film by using a die to form a packaging shell provided with a cavity, wherein at least one corner of the side wall of the cavity is of a chamfer structure;
an opening is arranged at the position of the cover body corresponding to the cavity body, the cover body is connected with at least part of the upper surface of the packaging shell, and/or the cover body covers the whole upper surface of the packaging shell; wherein when the cover body is connected to a part of the upper surface of the package housing, at least a part of the upper surface not connected to the cover body has a lower height than the upper surface connected to the cover body;
a pressure sensing device is arranged in the cavity; an isolation structure is arranged on the upper surface of the pressure sensing device and is used for isolating an external object from acting on a sensing area of the pressure sensing device; the isolation structure comprises a protective cover arranged on the upper surface of the pressure sensing device and a protective cavity formed by extending the lower surface of the protective cover to the lower surface of the pressure sensing device, wherein the upper surface part of the bottom or the side wall of the protective cavity is a sensing area of the pressure sensing device, and the protective cover is provided with an opening communicated with the protective cavity;
and covering the devices in the cavity with a protective layer.
8. A method of fabricating a multi-device package structure, comprising:
providing a substrate and a cover body;
a control device and a pressure sensing device are arranged on one side of the substrate;
injecting a packaging material on one side of the substrate, and opening a cavity of the packaging material through a protective film by utilizing a die to form a packaging shell provided with a cavity, wherein at least part of a sensing area of the pressure sensing device is exposed at the bottom of the cavity, and at least one corner of the side wall of the cavity is of a chamfer structure;
an opening is arranged at the position of the cover body corresponding to the cavity body, the cover body is connected with at least part of the upper surface of the packaging shell, and/or the cover body covers the whole upper surface of the packaging shell; wherein when the cover body is connected to a part of the upper surface of the package housing, at least a part of the upper surface not connected to the cover body has a lower height than the upper surface connected to the cover body;
an isolation structure is arranged on the upper surface of the pressure sensing device and is used for isolating an external object from acting on a sensing area of the pressure sensing device; the isolation structure comprises a protective cover arranged on the upper surface of the pressure sensing device and a protective cavity formed by extending the lower surface of the protective cover to the lower surface of the pressure sensing device, wherein the upper surface part of the bottom or the side wall of the protective cavity is a sensing area of the pressure sensing device, and the protective cover is provided with an opening communicated with the protective cavity.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910451107.0A CN112014000B (en) | 2019-05-28 | 2019-05-28 | Multi-device packaging structure and manufacturing method thereof |
| TW109102245A TWI744779B (en) | 2019-05-28 | 2020-01-21 | Multi-device packaging structure and manufacturing method thereof |
| TW109102246A TWI741483B (en) | 2019-05-28 | 2020-01-21 | Multi-device packaging structure and manufacturing method thereof |
| TW109102247A TWI754210B (en) | 2019-05-28 | 2020-01-21 | Pressure sensor and manufacturing method thereof |
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| CN201910451107.0A CN112014000B (en) | 2019-05-28 | 2019-05-28 | Multi-device packaging structure and manufacturing method thereof |
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