CN112004312B

CN112004312B - Printed circuit board and overcurrent upper limit adjusting method of printed circuit board

Info

Publication number: CN112004312B
Application number: CN202011026871.2A
Authority: CN
Inventors: 何增龙; 罗青妮
Original assignee: Guangzhou Xiaopeng Motors Technology Co Ltd
Current assignee: Guangzhou Xiaopeng Motors Technology Co Ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2022-03-18
Anticipated expiration: 2040-09-25
Also published as: CN112004312A

Abstract

The embodiment of the invention discloses a printed circuit board and an overcurrent upper limit adjusting method of the printed circuit board, and relates to the technical field of electronic components. The method for adjusting the overcurrent upper limit of the printed circuit board comprises the following steps: acquiring the current overcurrent of the third metal body; and adjusting the current value output by the direct current power supply to the semiconductor module according to the current overcurrent of the third metal body so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, wherein the overcurrent upper limit of the third metal body is in negative correlation with the temperature of the first metal body. The invention can adjust the overcurrent capacity of the printed circuit board in real time according to the current overcurrent of the power supply line, thereby improving the overcurrent capacity of the printed circuit board.

Description

Printed circuit board and overcurrent upper limit adjusting method of printed circuit board

Technical Field

The present invention relates to the field of electronic component technology, and more particularly, to a printed circuit board and an overcurrent upper limit adjusting method for the printed circuit board.

Background

With the development of technology, the integration level of smart devices is becoming higher, for example, in new energy vehicles and smart vehicles, various functions are integrated on one or more Printed Circuit Boards (PCBs).

However, the integration of a plurality of functions on the printed circuit board may cause an increase of the over-current on the printed circuit board, and the over-current capability of the printed circuit board at present often cannot satisfy the requirement of integrating a plurality of functions on the printed circuit board for normal operation, so that the printed circuit board at present has a problem of insufficient over-current capability.

Disclosure of Invention

In view of the above problems, the present invention provides a printed circuit board and an overcurrent upper limit adjusting method for the printed circuit board to solve the above problems.

An embodiment of the present invention provides a printed circuit board, including: the semiconductor module comprises a supporting layer, a first metal body, a second metal body and a semiconductor module. The supporting layer comprises a first surface and a second surface opposite to the first surface; the first metal body is arranged on the first surface of the supporting layer; the second metal body is arranged on the second surface of the supporting layer; the semiconductor module is buried in the supporting layer and is electrically connected with the first metal body and the second metal body respectively, and when the semiconductor module and the first metal body and the second metal body form an electrifying loop, the first metal body is cooled and the second metal body is heated under the action of the semiconductor module.

The embodiment of the invention provides an overcurrent upper limit adjusting method of a printed circuit board, which is applied to the printed circuit board provided by the embodiment, the printed circuit board further comprises a third metal body, the third metal body is arranged on the first surface of a supporting layer, the third metal body is positioned in a temperature radiation area of the first metal body, the third metal body and the first metal body are insulated from each other, and a semiconductor module is connected with a direct current power supply through the second metal body, the method comprises the following steps: acquiring the current overcurrent of the third metal body; and adjusting the current value output by the direct current power supply to the semiconductor module according to the current overcurrent of the third metal body so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, wherein the overcurrent upper limit of the third metal body is in negative correlation with the temperature of the first metal body.

According to the printed circuit board provided by the embodiment of the invention, the printed circuit board is formed by the supporting layer, the first metal body, the second metal body and the semiconductor module, wherein the supporting layer comprises a first surface and a second surface opposite to the first surface; the first metal body is arranged on the first surface of the supporting layer; the second metal body is arranged on the second surface of the supporting layer; the semiconductor module is buried in the supporting layer and is electrically connected with the first metal body and the second metal body respectively, and when the semiconductor module and the first metal body and the second metal body form an electrifying loop, the first metal body is cooled and the second metal body is heated under the action of the semiconductor module. If the power supply route is arranged near the first metal body of the printed circuit board, the temperature around the power supply line on the printed circuit board can be reduced, so that the overcurrent capacity of the power supply line is improved, the overcurrent capacity of the power supply line of the printed circuit board on the first surface can be improved by cooling the first metal body, and the problem that the overcurrent capacity of the existing printed circuit board is insufficient is solved.

According to the overcurrent upper limit adjusting method of the printed circuit board, provided by the embodiment of the invention, the current overcurrent of the third metal body is obtained; and adjusting the current value output by the direct current power supply to the semiconductor module according to the current overcurrent of the third metal body so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, wherein the overcurrent upper limit of the third metal body is in negative correlation with the temperature of the first metal body. Therefore, the upper limit of the overcurrent of the third metal body can be adjusted in real time according to the current overcurrent of the third metal body, so that the power consumption of the printed circuit board can be reduced, and the overcurrent capacity of the printed circuit board is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram illustrating a structure of a printed circuit board according to an embodiment of the present invention.

Fig. 2 is a schematic distribution diagram of a semiconductor module and a first metal body according to an embodiment of the present invention.

Fig. 3 is a schematic diagram illustrating a structure of a printed circuit board according to another embodiment of the present invention.

Fig. 4 shows a schematic distribution diagram of the first metal body and the third metal body provided according to an embodiment of the present invention.

Fig. 5 is a flowchart illustrating an overcurrent upper limit adjusting method for a printed circuit board according to an embodiment of the invention.

Fig. 6 is a flowchart illustrating an overcurrent upper limit adjustment method for a printed circuit board according to another embodiment of the invention.

Fig. 7 is a flowchart illustrating a method of providing an embodiment of step S250 in the method for adjusting an overcurrent upper limit of the printed circuit board shown in fig. 6 according to the present invention.

Fig. 8 is a flowchart illustrating an overcurrent upper limit adjustment method for a printed circuit board according to another embodiment of the invention.

Fig. 9 is a flowchart illustrating an overcurrent upper limit adjusting method for a printed circuit board according to still another embodiment of the invention.

Fig. 10 is a functional block diagram showing an overcurrent upper limit adjustment apparatus for a printed circuit board according to an embodiment of the present invention.

Fig. 11 shows a block diagram of an electronic device according to an embodiment of the present invention.

Fig. 12 is a storage medium for storing or carrying a program code implementing an overcurrent upper limit adjusting method of a printed circuit board according to an embodiment of the present invention.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.

With the continuous development of intelligent automobile technology, the functions integrated on the automobile become more and more, the performance is more and more powerful, and the power consumption of the automobile is larger and larger. If the prior automobile needs to increase the electric power, the wire diameter of a power supply circuit is increased for corresponding electric components of the automobile, so that the overcurrent capacity of the wire is improved. However, unlike conventional automobiles, the existing new energy automobiles and smart automobiles can solve the problem of insufficient overcurrent capability by increasing the wire diameter of the power supply cable because the functional devices are distributed. The integration level of the existing new energy automobile and intelligent automobile is higher, multiple functions can be integrated into one or more PCBs, and the PCBs do not have enough space to increase the wire diameter of a power supply circuit, so that the problem that the existing PCBs are insufficient in overcurrent capacity cannot be solved by the traditional method for increasing the wire diameter of the power supply circuit.

Generally, to increase the overcurrent capability of the PCB, the line width of the power supply line may be increased or the copper thickness may be increased, but as new functions and new applications of the smart car are more and more integrated, the space available for increasing the line width of the power supply line and the space available for increasing the copper thickness of the PCB are not sufficient. Therefore, limited by hardware conditions, it is difficult for the PCB to improve the overcurrent capability of the power supply line by the above method.

The inventor finds that the overcurrent capacity of the PCB in practical researchUsually represented by the formula I ═ k Δ T^0.44A^0.725It is shown that I is the overcurrent capacity of the power supply line (hereinafter referred to as power supply trace), k is the coefficient of the power supply trace, Δ T is the allowable temperature difference between the temperature of the power supply trace on the PCB (hereinafter referred to as overcurrent upper limit) and other parts of the PCB, and a is the cross-sectional area of the trace. It can be seen that for a trace of the same width and copper thickness in the same PCB, the factor affecting the ability of the trace to pass current is the allowable temperature difference between the trace on the PCB and the rest of the PCB. If the temperature difference between the temperature of the wire on the PCB and other parts of the PCB is increased, the overcurrent capacity of the PCB can be improved under the condition that the line width of the power supply circuit and the copper thickness on the PCB are not increased.

Therefore, in view of the above problems, the inventor proposes a printed circuit board and an overcurrent upper limit adjusting method for a printed circuit board in the embodiments of the present invention, which can dynamically change the temperature of the printed circuit board except for the power supply line by designing the structure of the printed circuit board, so as to increase the allowable temperature difference between the temperature of the power supply line on the PCB and other parts of the PCB, and improve the overcurrent capability of the power supply line.

Referring to fig. 1, a printed circuit board 100 according to an embodiment of the present invention includes: a support layer 110, a first metal body 120, a second metal body 130, and a semiconductor module 140. Wherein: the support layer 110 may have a first surface 111 and a second surface 112 opposite to the first surface 111; the first metal body 120 is disposed on the first surface 111 of the support layer 110; the second metal body 130 is disposed on the second surface 112 of the support layer 110; the semiconductor module 140 is embedded in the supporting layer 110 and electrically connected to the first metal body 120 and the second metal body 130, respectively, and when the semiconductor module 140 forms a conductive loop with the first metal body 120 and the second metal body 130, the first metal body 120 is cooled and the second metal body 130 is heated under the action of the semiconductor module 140.

In practical applications, the second metal body 130 can be connected to the dc power source 150 to energize the semiconductor module 140, and when the semiconductor module 140 is energized, the semiconductor module 140, the first metal body 120, the second metal body 130 and the dc power source 150 can be energizedThe electricity returns, thereby generating the peltier effect, also known as the thermoelectric phenomenon. At this time, one of the first metal body 120 and the second metal body 130 connected to the semiconductor module 140 may be increased in temperature and the other may be decreased in temperature, and optionally, the temperature of the first metal body 120 may be decreased, and when the power feeding line is disposed on the first surface 111 of the printed circuit board 100, that is, the power feeding line and the first metal body 120 are on the same surface, the temperature of the printed circuit board 100 is decreased, which corresponds to the temperature decrease of the portion of the printed circuit board 100 other than the power feeding line, according to the above formula I^0.44A^0.725It is known that the temperature difference Δ T between the temperature of the power supply line on the PCB and other parts of the PCB is allowed to increase, and accordingly, the overcurrent capacity of the power supply line is also increased. Therefore, the overcurrent capacity of the PCB is effectively improved under the condition that the line width of a power supply line on the PCB and the copper thickness of the PCB are not increased.

In this embodiment, the support layer 110, the first metal body 120, the second metal body 130 and the semiconductor module 140 form a printed circuit board, wherein the support layer 110 includes a first surface 111 and a second surface 112 opposite to the first surface 111; the first metal body 120 is disposed on the first surface 111 of the support layer 110; the second metal body 130 is disposed on the second surface 112 of the support layer 110; the semiconductor module 140 is embedded in the supporting layer 110 and electrically connected to the first metal body 120 and the second metal body 130, respectively, and when the semiconductor module 140 forms a conductive loop with the first metal body 120 and the second metal body 130, the first metal body 120 is cooled and the second metal body 130 is heated under the action of the semiconductor module 140. If the power supply route is disposed near the first metal body 120 of the printed circuit board, the temperature around the power supply line on the printed circuit board 100 can be reduced, so as to improve the over-current capability of the power supply line, and therefore, the over-current capability of the power supply line on the first surface 111 of the printed circuit board 100 can be improved by reducing the temperature of the first metal body 120, thereby solving the problem of insufficient over-current capability of the existing printed circuit board 100, and improving the safety of the printed circuit board 100 during operation.

Optionally, the first metal body 120 and the second metal body 130 may be one or more conductive traces on the printed circuit board 100, or may also be conductive metal layers covering the printed circuit board 100, where the number and shape of the conductive metal layers are not limited herein.

It is understood that when the power feeding course is disposed on the first surface 111, the power feeding course and the first metal body 120 are insulated from each other, and specifically, the power feeding course and the first metal body 120 may be spaced apart from each other or may be separated by an insulating material.

It should be noted that in a known physical phenomenon, two different connection points are generated by passing a direct current through a closed circuit formed by connecting two different metal wires to each other. When direct current is applied, one of the connection points is heated and the other connection point is cooled, which is the peltier effect.

The semiconductor module 140 is used to generate the peltier effect between the first metal body 120 and the second metal body 130 when forming a power-on loop with the first metal body 120, the second metal body 130, and the dc power source 150. Specifically, the semiconductor module 140 may be a semiconductor pair formed of a P-type semiconductor 141 and an N-type semiconductor 142, or may be a semiconductor material that can be used to generate a temperature difference.

Alternatively, the first metal body 120 and the second metal body 130 may be the same metal material or different metal materials, and specifically, the first metal body 120 and the second metal body 130 include but are not limited to: a metal material such as copper or aluminum, and specifically, a copper foil can be used. Alternatively, the first and

second metal bodies

120 and 130 may be symmetrically disposed with respect to the support layer 110.

Alternatively, the support layer 110 may be made of a polypropylene (PP) material, and may be composed of an epoxy resin, and mainly functions to provide a supporting force for the PCB and determine the thickness of the PCB.

Referring to fig. 1 again, the second metal body 130 may include: the first sub-metal body 131 and the second sub-metal body 132 are disposed on the second surface 112 of the supporting layer 110, and the first sub-metal body 131 and the second sub-metal body 132 are insulated from each other, wherein the first sub-metal body 131 is configured to be connected to a negative electrode of the dc power source 150, and the second sub-metal body 132 is configured to be connected to a positive electrode of the dc power source 150.

In some embodiments, the first sub-metal body 131 and the second sub-metal body 132 may be spaced apart from each other and may be electrically isolated by an insulating material. Alternatively, the first metal body 120 and the second metal body 130 may be the same metal material, or may be different metal materials, and specifically, the first sub-metal body 131 and the second sub-metal body 132 include but are not limited to: copper, aluminum, and other metal materials.

Alternatively, the first sub-metal body 131 and the second sub-metal body 132 may be metal traces on the printed circuit board 100. The first and

second sub-metal bodies

131 and 132 may be symmetrical to portions of the first metal body 120 with respect to the support layer 110.

The semiconductor module 140 includes a P-type semiconductor 141(Bi2Te3-Sb2Te3) and an N-type semiconductor 142(Bi2Te3-Bi2Se3), the P-type semiconductor 141 and the N-type semiconductor 142 are both embedded in the supporting layer 110, the P-type semiconductor 141 is electrically connected to the first sub-metal body 131 and the first metal body 120, and the N-type semiconductor 142 is electrically connected to the second sub-metal body 132 and the first metal body 120.

The P-type semiconductor 141 and the N-type semiconductor 142 are embedded in the supporting layer 110 in a manner similar to that of a conventional PCB in which capacitors and resistors are embedded.

In practical applications, after the first sub-metal body 131 is connected to the negative electrode of the dc power supply 150 and the second sub-metal body 132 is connected to the positive electrode of the dc power supply 150, the current generated by the dc power supply 150 passes through the second sub-metal body 132, the N-type semiconductor 142, the first metal body 120, the P-type semiconductor 141 and the first sub-metal body 131 in sequence, and due to the energy level difference, i.e. the thermal potential difference, between the two materials of the charge carrier movement, the current passes through the N-type semiconductor 142 and the P-type semiconductor 141, so that a temperature difference is generated between the first metal body 120 and the second metal body 130, specifically, the first metal body 120 absorbs heat to generate a cooling effect, and the second metal body 130 emits heat to generate a heating effect, at this time, the surface of the first metal body 120 on the PCB may be used as the cold end, the surface of the second metal body 130 may be used as the hot end, and when the power supply line is disposed on the cold end of the PCB, the temperature of the PCB except the power supply line is reduced, and the temperature of the PCB allowed to reach the power supply line is fixed, so that the temperature difference delta T between the temperature of the PCB allowed to reach the power supply line and other parts of the PCB is increased, and the overcurrent capacity I of the power supply line is improved.

As an example, when the ambient temperature is 20 ℃, the temperature of the entire PCB should be approximately equal to 20 ℃ and 30 ℃ if the power feeding course allows the temperature rise to be 10 ℃ and the maximum temperature allowed for the power feeding course. Because the temperature difference of the common thermoelectric refrigerating sheet can be more than 80 ℃, the temperature difference between the cold end and the hot end of the PCB board can be 80 ℃. If the temperature of the hot end is controlled to be 50 ℃ by means of heat conduction of the metal radiating fins, air cooling heat dissipation or water cooling heat dissipation and the like, the temperature of the PCB wiring (namely the first metal body 120) of the cold end is 80 ℃ lower than 50 ℃ and is-30 ℃. The PCB structure of this embodiment reduces the temperature of the PCB trace to-30 c, and if the allowable temperature of the power supply line is 10 c higher than other temperatures of the PCB, the temperature rise of the trace is 30-60 c. From the formula, it can be calculated that the overcurrent capacity of the PCB 2.754 when the solution of the present embodiment is not used, and the overcurrent capacity of the PCB when the solution of the present embodiment is used is 6.059, so that the same PCB, the same line width and copper thickness, the overcurrent capacity of the PCB using the present embodiment is more than 2 times that of the PCB not using the conventional PCB.

In the present embodiment, the semiconductor module 140 is formed by the P-type semiconductor 141 and the N-type semiconductor 142, so that a large temperature difference effect can be generated when the semiconductor module 140 is powered on, and the overcurrent capability of the printed circuit board 100 can be effectively improved.

In some embodiments, the first metal body 120 is disposed on the first surface 111 of the supporting layer 110 according to predetermined traces, the number of the semiconductor modules 140 is multiple, and the plurality of semiconductor modules 140 are uniformly distributed along the predetermined traces.

As an example, as shown in fig. 2, the first metal body 120 may be disposed on the support layer 110 according to the routing manner in fig. 2, the plurality of semiconductor modules 140 are buried in the support layer 110, a distance between each two adjacent semiconductor modules 140 in the plurality of semiconductor modules 140 is equal, and for example, a first semiconductor module 1401, a second semiconductor module 1402, and a third semiconductor module 1403 are sequentially disposed along the routing of the first metal body 120. The distance between the first semiconductor module 1401 and the second semiconductor module 1402 is d, and the distance between the second semiconductor module 1402 and the third semiconductor module 1403 is also d. Alternatively, the plurality of semiconductor modules 140 may share one dc power supply 150, or each semiconductor module 140 may use one dc power supply 150 separately, and the currents passing through each semiconductor module 140 of the plurality of semiconductor modules 140 are equal.

In this embodiment, the first metal body 120 is disposed on the first surface 111 of the supporting layer 110 according to the preset routing, the number of the semiconductor modules 140 is multiple, and the plurality of semiconductor modules 140 are uniformly distributed along the preset routing, so that when the plurality of semiconductor modules 140 are powered on, the cooling effect of each position of the first metal body 120 is consistent, the temperature of each position of the first metal body 120 is ensured to be equal, and the overall overcurrent capability of the printed circuit board 100 is further improved.

In some embodiments, the first metal body 120 may include a first cooling region and a second cooling region, wherein the first cooling region is provided with a first number of semiconductor modules 140, and the second cooling region is provided with a second number of semiconductor modules 140, wherein the first number is greater than the second number.

As an example, an area of the first metal body 120 where the routing is more dense on the support layer 110 may be used as a first cooling area, and an area of the first metal body 120 other than the first cooling area may be used as a second cooling area. Specifically, the first metal body 120 may be provided with a plurality of wires of the first metal body 120, an intersection point a of the plurality of wires may be used as a first cooling area, and a portion other than the first cooling area may be used as a second cooling area. Alternatively, the first cooling area and the second cooling area on the first metal body 120 may be customized according to actual situations. Alternatively, for example, a third cooling area, a fourth cooling area … …, an nth cooling area, etc. may be provided according to actual situations, wherein the number of the semiconductor modules 140 corresponding to the third cooling area, the fourth cooling area … …, and the nth cooling area may be gradually reduced.

In this embodiment, the first metal body 120 includes a first cooling area and a second cooling area, wherein the first cooling area is correspondingly provided with a first number of semiconductor modules 140, and the second cooling area is correspondingly provided with a second number of semiconductor modules 140, wherein the first number is greater than the second number, so that effective cooling can be achieved for the position of the first metal body 120 where the temperature needs to be lowered heavily, and the overcurrent capability of the printed circuit board 100 is further effectively improved.

In some embodiments, the printed circuit board 100 may further include:

the temperature sensors may be respectively disposed on the first metal body 120 and the second metal body 130 to monitor the temperature of the first metal body 120 and the temperature of the second metal body 130 in real time, so as to conveniently adjust the current output from the dc power supply 150 to the semiconductor module 140 according to the temperature of the first metal body 120 and the temperature of the second metal body 130, thereby accurately improving the over-current capability of the printed circuit board 100.

In some embodiments, the printed circuit board 100 may further include:

the heat sink is disposed on the second metal body 130 and used for dissipating heat from the second metal body 130.

Alternatively, the heat sink may include a heat dissipation fan, a coolant heat sink, a thermally conductive metal, and the like. Alternatively, the heat sink may be in contact with the second metal body 130 to dissipate heat, or may not be in contact with the second metal body 130 as long as the second metal body 130 can dissipate heat.

In this embodiment, the heat sink is disposed on the second metal body 130, so that heat generated by the second metal body 130 can be effectively dissipated to reduce the temperature of the second metal body 130, thereby improving the over-current capability of the printed circuit board 100 while ensuring the safety of the printed circuit board 100 during operation.

The following description is directed to an application environment of the method for adjusting the upper limit of the overcurrent of the printed circuit board according to the embodiment of the present invention:

the method for adjusting the upper limit of the overcurrent of the printed circuit board according to the embodiment of the present invention may be applied to the printed circuit board according to the above-mentioned embodiment, which may include the support layer 110, the first metal body 120, the second metal body 130, and the semiconductor module 140, wherein the detailed description of the support layer 110, the first metal body 120, the second metal body 130, and the semiconductor module 140 may refer to the above-mentioned embodiment, as shown in fig. 3 and 4, the printed circuit board 100 may further include a third metal body 160, a dc power source 150, a temperature sensor (not shown in fig. 3), and a controller 170, the third metal body 160 may correspond to a power supply line in the above-mentioned embodiment, the third metal body 160 is disposed on the first surface 111 of the support layer 110, the third metal body 160 is located in the temperature radiation region of the first metal body 120, the third metal body 160 and the first metal body 120 are insulated from each other, the semiconductor module 140 is connected to a dc power source 150 through the second metal body 130. The temperature sensors may be respectively disposed on the first metal body 120, the second metal body 130, and the third metal body 160, and configured to detect the temperatures of the first metal body 120, the second metal body 130, and the third metal body 160 in real time. The controller 170 may be electrically connected to the dc power supply 150 and the temperature sensor, respectively, and may be configured to process the temperature collected by the temperature sensor, adjust the current output by the dc power supply 150, and so on. The method for adjusting the upper limit of the overcurrent of the printed circuit board 100 provided by the implementation of the invention can be particularly applied to the controller 170 in the printed circuit board 100.

Referring to fig. 5, a method for adjusting an upper limit of an overcurrent of a printed circuit board according to an embodiment of the present invention includes:

and S110, acquiring the current overcurrent of the third metal body.

In some embodiments, the third metal body can be connected to a load device on the printed circuit board as a power supply trace on the printed circuit board, and an operating current of the load device can be detected when the load device is operated, and the operating current can be used as a present overcurrent of the third metal body, so as to obtain the present overcurrent of the third metal body.

In other embodiments, a current detection device may be disposed on the third metal body, and the current detection device may be electrically connected to the controller, and the controller may obtain the current overcurrent of the third metal body in real time through the current detection device.

And S120, adjusting the current value output by the direct current power supply to the semiconductor module according to the current overcurrent of the third metal body so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, wherein the overcurrent upper limit of the third metal body is in negative correlation with the temperature of the first metal body.

In some embodiments, the controller may detect whether the present overcurrent exceeds a limit, for example, whether the present overcurrent exceeds 50% of the rated current of the load device. If the overcurrent of the third metal body is not in the normal range, the overcurrent of the third metal body is within the normal range, and the normal operation cannot be influenced. If the overcurrent exceeds the standard, the overcurrent of the third metal body exceeds the normal range, and the device or the printed circuit board can be damaged, at the moment, the controller can control the direct-current power supply to output current to the semiconductor module, and the semiconductor module generates the Peltier effect under the electrified condition to reduce the temperature of the first metal body, so that the overcurrent upper limit of the third metal body is improved, and the overcurrent capacity of the printed circuit board is improved.

Therefore, in the embodiment, the current overcurrent of the third metal body is obtained, and the current value output to the semiconductor module by the direct current power supply is adjusted according to the current overcurrent of the third metal body to adjust the temperature of the first metal body, so that the overcurrent upper limit of the third metal body is adjusted, and thus the overcurrent upper limit of the third metal body can be adjusted in real time according to the current overcurrent of the third metal body, thereby avoiding the waste of unnecessary electric quantity caused by always turning on the direct current power supply, reducing the power consumption of the printed circuit board, and improving the overcurrent capacity of the printed circuit board.

In some embodiments, the printed circuit board and the overcurrent upper limit adjustment method of the printed circuit board of the above embodiments may be applied to a vehicle.

Referring to fig. 6, another method for adjusting an upper limit of an overcurrent in a printed circuit board according to an embodiment of the present invention may be applied to the printed circuit board in the foregoing embodiment, and the method may include:

and S210, acquiring the current overcurrent of the third metal body.

The specific implementation of S210 may refer to S110, and therefore is not described herein.

And S220, judging whether the current overcurrent of the third metal body exceeds a current threshold value.

In some embodiments, the controller is further connected with a memory, data such as a current threshold value can be stored in the memory in advance, and the controller can call the current threshold value from the memory and then compare the collected current overcurrent with the current threshold value to judge whether the current overcurrent exceeds the current threshold value.

Alternatively, the current threshold may be determined according to the material of the third metal body, and different materials may have different overcurrent capabilities when energized, for example, the current threshold may be higher for a material with better overcurrent capability. Alternatively, the current threshold may be adjusted according to the current temperature value of the third metal body, and generally, the lower the temperature of the third metal body is, the larger the current can pass through, and therefore, the lower the temperature of the third metal body is, the higher the current threshold may be adjusted. Alternatively, the current threshold may be determined in combination with the material of the third metal body and the present temperature of the third metal body.

And S230, if the current overcurrent of the third metal body does not exceed the current threshold, adjusting the current value of the direct current power supply output to the semiconductor module to be 0.

As an example, the current threshold is 1.6A, and the current overcurrent of the third metal body is 1.4A, at this time, the third metal body can ensure that the PCB operates normally without increasing the overcurrent capability, so the controller can adjust the current value of the dc power output to the semiconductor module to 0. If the dc power supply originally has no output current, the controller may not perform any processing. If the dc power supply is outputting current, the controller may control the dc power supply to adjust the current output to the semiconductor module to 0, i.e., turn off the dc power supply.

S240, if the current overcurrent of the third metal body exceeds the current threshold, obtaining the target overcurrent upper limit of the third metal body and the current temperature of the first metal body.

As an example, the current threshold is 1.6A, the current overcurrent of the third metal body is 2A, and the third metal body needs to increase the overcurrent capability to ensure that the PCB can work normally, otherwise the PCB may be damaged, and the controller may obtain the target upper overcurrent limit of the third metal body and the current temperature of the first metal body.

Wherein the controller may acquire the current temperature of the first metal body through a temperature sensor provided on the first metal body. The target overcurrent upper limit may be stored in a memory in advance, and the controller may call from the memory, wherein the target overcurrent upper limit may be set by a user, but the target overcurrent upper limit cannot exceed the maximum overcurrent corresponding to the material of the third metal body.

And S250, determining the allowable temperature difference of the third metal body according to the target overcurrent upper limit of the third metal body, wherein the allowable temperature difference of the third metal body is the difference between the temperature upper limit of the third metal body and the temperature of the first metal body.

The upper temperature limit of the third metal body can be stored in a memory in advance, the controller can be called from the memory, and the upper temperature limit which can be borne is different due to different metal materials, so that the upper temperature limit can be determined in advance according to the material of the third metal body.

It is understood that the target overcurrent upper limit of the third metal body must not exceed the temperature upper limit of the third metal body.

In some embodiments, as shown in fig. 7, S250 may include the steps of:

and S251, acquiring the cross section area of the third metal body and the material coefficient of the third metal body.

In some embodiments, the cross-sectional area of the third metal body and the material coefficient of the third metal body can be pre-queried and then saved in a memory, from which the controller can recall when needed.

S252, based on the cross-sectional area of the third metal body, the material coefficient of the third metal body, the target overcurrent upper limit of the third metal body, and the formula I ═ k Δ T^0.44A^0.725And determining an allowable temperature difference of the third metal body, wherein a is a cross-sectional area of the third metal body, k is a material coefficient of the third metal body, I is a target upper overcurrent limit of the third metal body, and Δ T is an allowable temperature difference of the third metal body.

Specifically, the cross-sectional area a of the third metal body obtained in S251, the material coefficient k of the third metal body, and the target overcurrent upper limit I of the third metal body obtained in S240 may be substituted into the formula I ═ k Δ T^0.44A^0.725Thereby, the allowable temperature difference Δ T of the third metal body is obtained.

S260, a target temperature of the first metal body is determined based on the allowable temperature difference of the third metal body and the current temperature of the first metal body.

In accordance with the above example, the target temperature to which the first metal body needs to be adjusted can be obtained by subtracting the allowable temperature difference Δ T from the upper temperature limit of the third metal body. As an example, for example, the allowable temperature difference Δ T is 50 ℃, the upper limit of the temperature of the third metal body is 60 ℃, and the target temperature to which the first metal body needs to be adjusted is 10 ℃.

And S270, acquiring a target current value corresponding to the target temperature, and adjusting the current value output to the semiconductor module by the direct current power supply to the target current value.

In some embodiments, a mapping relationship table of temperature values and current values may be pre-established, where the mapping relationship table may be obtained by mapping relationships between a plurality of temperature values and a plurality of current values in a one-to-one correspondence manner, and then a target current value corresponding to a target temperature may be found according to the target temperature and the mapping relationship table. As an example, as shown in table 1:

TABLE 1

Temperature value (. degree. C.)	Current value (A)
		A1	B1
A2	B2
		A3	B3

As can be seen from table 1, when the target temperature is a2, the corresponding target current value is B2 can be found from table 1. By analogy, the corresponding target current value can be quickly and effectively found according to the target temperature by means of the lookup table 1. The PCB can be used for testing the corresponding relation between the temperature of the first metal body and the current value output to the semiconductor module by the direct-current power supply in advance, and then a mapping relation table is generated according to test data.

Optionally, the mapping relationship table may be stored in a memory connected to the controller, so as to facilitate direct invocation by the controller. The controller can also be stored in a cloud server in communication connection with the controller, and when the controller needs to be used, the controller can obtain the data from the cloud server through a wireless communication module connected with the controller.

In this embodiment, whether the dc power is turned on is determined by determining whether the current over-current of the third metal body exceeds the current threshold, and the magnitude of the current flowing into the semiconductor module is adjusted in real time according to the current over-current of the third metal body. Therefore, if the third metal body does not need to pass current (such as the load is closed), the current flowing through the semiconductor module is cut off, and the energy-saving effect can be achieved; when the current flowing through the third metal body is small (the current overcurrent capacity can be met without cooling), the current flowing through the semiconductor module is cut off, and the energy-saving effect can be achieved; when the current flowing through the third metal body is too large, the current flowing through the semiconductor pair can be dynamically adjusted according to the temperature value of the temperature sensor, and the effect of ensuring the overcurrent capacity of the third metal body with the minimum energy consumption can be achieved.

Referring to fig. 8, according to another method for adjusting an upper limit of an overcurrent in a printed circuit board provided in an embodiment of the present invention, the method may be applied to the printed circuit board in the foregoing embodiment, the printed circuit board further includes an alarm device, wherein the alarm device may be connected to the controller, and the method may include:

and S310, acquiring the current overcurrent of the third metal body.

The specific implementation of S310 may refer to S110, and therefore is not described herein.

And S320, if the current overcurrent of the third metal body exceeds a preset current value, alarming by an alarm device.

The controller may determine whether the current overcurrent exceeds a preset current value, where the preset current value may be greater than the current threshold in the above embodiment, but does not exceed the upper current limit of the third metal body. If the current overcurrent of the third metal body exceeds the preset current value, the controller can send an alarm instruction to the alarm device to indicate the alarm device to alarm. The alarm device can be a sound and light alarm device or a wireless communication device, and sends alarm information to the mobile terminal of the user when receiving an alarm instruction.

In this embodiment, by obtaining the current overcurrent of the third metal body, if the current overcurrent of the third metal body exceeds the preset current value, the alarm device alarms. The method can effectively remind a user that the work of the printed circuit board is abnormal and needs to be processed in time, thereby ensuring the safety of the printed circuit board during working and reducing the damage probability of the printed circuit board.

Referring to fig. 9, according to another method for adjusting an upper limit of an overcurrent of a printed circuit board provided in an embodiment of the present invention, the method may be applied to the printed circuit board in the foregoing embodiment, the printed circuit board further includes a load connected to the third metal body, and the load may be connected to a controller, and the method may include:

and S410, acquiring the current overcurrent of the third metal body.

The specific implementation of S410 can refer to S110, and therefore is not described herein.

And S420, if the current overcurrent of the third metal body exceeds a preset current value, closing the load or reducing the working current value of the load.

In some embodiments, the controller may determine whether the current overcurrent exceeds a predetermined current value, and if the current overcurrent does not exceed the predetermined current value, the controller may not perform any processing. If the current overcurrent exceeds the preset current value, the controller can control the load to close the load or reduce the working current value of the load so as to prevent the printed circuit board from being damaged due to the overlarge current.

In this embodiment, by obtaining the current overcurrent of the third metal body, if the current overcurrent of the third metal body exceeds the preset current value, the load is turned off or the working current value of the load is reduced, so that the safety of the printed circuit board during working can be ensured.

Referring to fig. 10, which illustrates an overcurrent upper limit adjustment apparatus for a printed circuit board according to an embodiment of the present invention, which can be applied to the printed circuit board of the above embodiment, the printed circuit board further includes a third metal body disposed on the first surface of the supporting layer, the third metal body is located in a temperature radiation area of the first metal body, the third metal body and the first metal body are insulated from each other, and the semiconductor module is connected to a dc power source through the second metal body, the overcurrent upper limit adjustment apparatus 500 for a printed circuit board includes:

and a current overcurrent obtaining module 510 for obtaining a current overcurrent of the third metal body.

And the adjusting module 520 is configured to adjust a current value output by the dc power supply to the semiconductor module according to the current overcurrent of the third metal body, so as to adjust the temperature of the first metal body, thereby adjusting an overcurrent upper limit of the third metal body, where the overcurrent upper limit of the third metal body is negatively correlated to the temperature of the first metal body.

Optionally, the adjusting module 520 comprises:

and the first adjusting unit is used for adjusting the current value of the direct current power supply output to the semiconductor module to be 0 if the current overcurrent of the third metal body does not exceed the current threshold value.

Optionally, the adjusting module 520 comprises:

and the data acquisition unit is used for acquiring a target overcurrent upper limit of the third metal body and the current temperature of the first metal body if the current overcurrent of the third metal body exceeds the current threshold.

And an allowable temperature difference determination unit for determining an allowable temperature difference of the third metal body according to a target overcurrent upper limit of the third metal body, wherein the allowable temperature difference of the third metal body is a difference between the temperature upper limit of the third metal body and the temperature of the first metal body.

A target temperature determination unit for determining a target temperature of the first metal body based on the allowable temperature difference of the third metal body and the current temperature of the first metal body.

And the second adjusting unit is used for acquiring a target current value corresponding to the target temperature and adjusting the current value output to the semiconductor module by the direct-current power supply to be the target current value.

Optionally, a temperature difference determining unit is allowed, in particular for obtaining a cross-sectional area of the third metal body and a material coefficient of the third metal body; based on the cross-sectional area of the third metal body, the material coefficient of the third metal body, the target overcurrent upper limit of the third metal body, and formula I ═ k Δ T^0.44A^0.725And determining an allowable temperature difference of the third metal body, wherein a is a cross-sectional area of the third metal body, k is a material coefficient of the third metal body, I is a target upper overcurrent limit of the third metal body, and Δ T is an allowable temperature difference of the third metal body.

Optionally, the printed circuit board further includes an alarm device, and the overcurrent upper limit adjusting device of the printed circuit board further includes:

and the alarm module is used for giving an alarm through the alarm device if the current overcurrent of the third metal body exceeds the preset current value.

Optionally, the printed circuit board further includes a load connected to the third metal body, and the overcurrent upper limit adjustment device of the printed circuit board further includes:

and the load adjusting module is used for closing the load or reducing the working current value of the load if the current overcurrent of the third metal body exceeds the preset current value.

It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described apparatuses and modules may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the embodiments of the present invention, the coupling or direct coupling or communication connection between the modules shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or modules may be in an electrical, mechanical or other form.

In addition, functional modules in the embodiments of the present invention may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.

Referring to fig. 11, a block diagram of an electronic device according to an embodiment of the invention is shown. The electronic device 600 may be the electronic device 600 capable of running the program in the foregoing embodiments. The electronic device 600 of the present invention may include one or more of the following components: a processor 610, a memory 620, and one or more programs, wherein the one or more programs may be stored in the memory 620 and configured to be executed by the one or more processors 610, the one or more programs configured to perform a method as described in the aforementioned method embodiments.

The processor 610 may include one or more processing cores. The processor 610 interfaces with various components throughout the electronic device 600 using various interfaces and circuitry to perform various functions of the electronic device 600 and process data by executing or executing instructions, programs, code sets, or instruction sets stored in the memory 620 and invoking data stored in the memory 620. Alternatively, the processor 610 may be implemented in hardware using at least one of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The processor 610 may integrate one or more of a Central Processing Unit (CPU) 610, a Graphics Processing Unit (GPU) 610, a modem, and the like. Wherein, the CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing display content; the modem is used to handle wireless communications. It is understood that the modem may not be integrated into the processor 610, but may be implemented by a communication chip.

The processor 610 may be, for example, the controller 170 in the printed circuit board shown in fig. 3.

The Memory 620 may include a Random Access Memory (RAM) or a Read-Only Memory (Read-Only Memory). The memory 620 may be used to store instructions, programs, code sets, or instruction sets. The memory 620 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playing function, an image playing function, etc., a photographing function), instructions for implementing various method embodiments described below, and the like. The storage data area may also store data created by the terminal in use, such as a phone book, audio-video data, map data, driving record data, and the like.

Alternatively, the electronic device 600 may be a vehicle-mounted terminal, a vehicle-mounted computer, or the like.

Referring to fig. 12, a block diagram of a computer-readable storage medium according to an embodiment of the present invention is shown. The computer readable medium 700 has stored therein a program code 710, the program code 710 being capable of being invoked by a processor to perform the methods described in the method embodiments above.

The computer-readable storage medium 700 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read only memory), an EPROM, a hard disk, or a ROM. Alternatively, the computer-readable storage medium includes a non-transitory computer-readable storage medium. The computer readable storage medium has a storage space for program code for performing any of the method steps of the above-described method. The program code can be read from or written to one or more computer program products. The program code may be compressed, for example, in a suitable form.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not necessarily depart from the spirit and scope of the corresponding technical solutions.

Claims

1. The method for adjusting the upper limit of the overcurrent of the printed circuit board is characterized by being applied to the printed circuit board, wherein the printed circuit board comprises a supporting layer and a supporting layer, wherein the supporting layer comprises a first surface and a second surface opposite to the first surface; a first metal body disposed on a first surface of the support layer; a second metal body disposed on a second surface of the support layer; the semiconductor module is buried in the supporting layer and is electrically connected with the first metal body and the second metal body respectively, and when the semiconductor module forms an electrifying loop with the first metal body and the second metal body, the first metal body is cooled and the second metal body is heated under the action of the semiconductor module; the printed circuit board further includes a third metal body disposed on the first surface of the support layer, the third metal body being located in a temperature radiation region of the first metal body, the third metal body and the first metal body being insulated from each other, the semiconductor module being connected to a dc power supply through the second metal body, the method including:

acquiring the current overcurrent of the third metal body;

and adjusting the current value output by the direct current power supply to the semiconductor module according to the current overcurrent of the third metal body so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, wherein the overcurrent upper limit of the third metal body is in negative correlation with the temperature of the first metal body.

2. The method according to claim 1, wherein the adjusting the current value of the dc power output to the semiconductor module according to the current over-current of the third metal body comprises:

and if the current overcurrent of the third metal body does not exceed the current threshold, adjusting the current value of the direct current power supply output to the semiconductor module to be 0.

3. The method according to claim 2, wherein the adjusting the current value of the dc power output to the semiconductor module according to the current over-current of the third metal body comprises:

if the current overcurrent of the third metal body exceeds the current threshold, acquiring a target overcurrent upper limit of the third metal body and the current temperature of the first metal body;

determining an allowable temperature difference of the third metal body according to a target overcurrent upper limit of the third metal body, wherein the allowable temperature difference of the third metal body is a difference value between the temperature upper limit of the third metal body and the temperature of the first metal body;

determining a target temperature of the first metal body based on the allowable temperature difference of the third metal body and the current temperature of the first metal body;

and acquiring a target current value corresponding to the target temperature, and adjusting the current value output to the semiconductor module by the direct current power supply to the target current value.

4. The method of claim 3, wherein said determining an allowable temperature difference for the third metal body based on a target over-current limit for the third metal body comprises:

obtaining a cross-sectional area of the third metal body and a material coefficient of the third metal body;

based on a cross-sectional area of the third metal body, a material coefficient of the third metal body, a target overcurrent upper limit of the third metal body, and a formula I ═ k Δ T^0.44A^0.725And determining the allowable temperature difference of the third metal body, wherein A is the cross-sectional area of the third metal body, k is the material coefficient of the third metal body, I is the target upper overcurrent limit of the third metal body, and Delta T is the allowable temperature difference of the third metal body.

5. The method of any of claims 1 to 4, wherein the printed circuit board further comprises an alarm device, the method further comprising:

and if the current overcurrent of the third metal body exceeds a preset current value, alarming by the alarm device.

6. The method of claim 5, wherein the printed circuit board further comprises a load connected to the third metal body, the method further comprising:

and if the current overcurrent of the third metal body exceeds the preset current value, closing the load or reducing the working current value of the load.

7. The method of claim 1, wherein the second metal body comprises a first sub-metal body and a second sub-metal body, the first sub-metal body and the second sub-metal body are both disposed on the second surface of the support layer, and the first sub-metal body and the second sub-metal body are insulated from each other, wherein the first sub-metal body is used for connecting with a negative electrode of a direct current power source, and the second sub-metal body is used for connecting with a positive electrode of the direct current power source;

the semiconductor module comprises a P-type semiconductor and an N-type semiconductor, the P-type semiconductor and the N-type semiconductor are both buried in the supporting layer, the P-type semiconductor is respectively and electrically connected with the first sub-metal body and the first metal body, and the N-type semiconductor is respectively and electrically connected with the second sub-metal body and the first metal body.

8. The method according to claim 1, wherein the first metal body is disposed on the first surface of the supporting layer according to a predetermined trace, the number of the semiconductor modules is multiple, and the multiple semiconductor modules are uniformly distributed along the predetermined trace.

9. The method of claim 1, wherein the printed circuit board further comprises:

and the heat dissipation device is arranged on the second metal body and used for dissipating heat of the second metal body.