CN111984098B - Heat dissipation method, device, equipment and medium for computer system - Google Patents
Heat dissipation method, device, equipment and medium for computer system Download PDFInfo
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- CN111984098B CN111984098B CN202010887212.1A CN202010887212A CN111984098B CN 111984098 B CN111984098 B CN 111984098B CN 202010887212 A CN202010887212 A CN 202010887212A CN 111984098 B CN111984098 B CN 111984098B
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- 238000000034 method Methods 0.000 title claims abstract description 58
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract 6
- 238000013507 mapping Methods 0.000 claims description 38
- 238000001514 detection method Methods 0.000 claims description 23
- 238000004590 computer program Methods 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000009529 body temperature measurement Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000004364 calculation method Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/004—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by varying driving speed
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2270/00—Control
- F05D2270/30—Control parameters, e.g. input parameters
- F05D2270/303—Temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application discloses a heat dissipation method of a computer system, which is applied to BMC in a target computer system and comprises the following steps: detecting a temperature value of the target computer system by utilizing the busbar; wherein, the busbar is a wire cable which is inserted in advance on the PCBA in the target computer system; and acquiring a temperature value, and adjusting the rotating speed of a fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system. Obviously, compared with the prior art, the method detects the temperature value of the target computer system by using the current flowing through the PCBA, and can avoid the influence of the temperature of the PCBA on the temperature measurement value of the target computer system, so that the temperature value of the computer system can be more accurately detected by the arrangement mode, and the computer system can be accurately radiated. Accordingly, the heat dissipation device, the equipment and the medium of the computer system provided by the application also have the beneficial effects.
Description
Technical Field
The present invention relates to the field of computer technologies, and in particular, to a method, an apparatus, a device, and a medium for heat dissipation in a computer system.
Background
Under the existing computer system architecture, a temperature sensing component is usually used to feed back a temperature value of the computer system, and the detected temperature value is used to cool down the computer system. In the process of feeding back the temperature value of the computer system by using the temperature sensing element, firstly, a relatively common temperature sensing element BJT (Bipolar Junction Transistor) chip, IC (Integrated Circuit) chip or thermistor needs to be attached to a Printed Circuit Board Assembly (PCBA) through an SMD (Surface Mounted device), and then the temperature value of the computer system is determined by a voltage current fed back by the temperature sensing element. Therefore, under the detection mechanism, an additional software algorithm is required to estimate the actual temperature value of the computer system, and finally, the BMC cools the computer system by dissipating heat according to the actual temperature value of the computer system. Obviously, the temperature value of the target computer system cannot be fed back accurately by the temperature detection method, so that the problem that the computer system cannot perform heat dissipation accurately occurs. At present, no effective solution exists for the phenomenon.
Therefore, it is an urgent technical problem for those skilled in the art to accurately detect the temperature value of the computer system and accurately dissipate heat of the computer system.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method, an apparatus, a device and a medium for dissipating heat of a computer system, so as to detect a temperature value of the computer system more accurately and dissipate heat of the computer system accurately. The specific scheme is as follows:
a heat dissipation method of a computer system is applied to BMC in a target computer system, and comprises the following steps:
detecting a temperature value of the target computer system by utilizing the busbar; the busbar is a wire cable which is pre-inserted on a PCBA in the target computer system;
and acquiring the temperature value, and adjusting the rotating speed of a fan in the target computer system according to the temperature value so as to radiate the target computer system.
Preferably, the busbar is uniformly inserted on the PCBA.
Preferably, the step of detecting the temperature value of the target computer system by using the buss bar includes:
detecting a target voltage value of the busbar by using a current detection circuit;
determining the temperature value of the target computer system according to the target voltage value and a target mapping relation; the target mapping relationship is a mapping relationship between the temperature value of the busbar and the impedance value of the busbar per unit area, which is established in advance according to the attribute characteristics of the busbar.
Preferably, the current detection circuit includes: the device comprises a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sensing resistor and an operational amplifier, wherein the sensing resistor is used for measuring the resistance value of the busbar;
the first end of the sensing resistor is connected with the first end of the first resistor, the first end of the sensing resistor is further used for receiving a target voltage, the second end of the sensing resistor is respectively connected with the first end of the second resistor and the first end of the third resistor, the second end of the second resistor is grounded, the second end of the first resistor is respectively connected with the positive phase input end of the operational amplifier and the first end of the fourth resistor, the second end of the fourth resistor is grounded, the second end of the third resistor is respectively connected with the negative phase input end of the operational amplifier and the first end of the fifth resistor, and the second end of the fifth resistor is connected with the output end of the operational amplifier.
Preferably, the determining the temperature value of the target computer system according to the target voltage value and the target mapping relationship includes:
acquiring a target impedance value of the busbar by using the target voltage value;
and searching a target temperature value corresponding to the target impedance value from the target mapping relation, and determining the target temperature value as the temperature value of the target computer system.
Preferably, the method further comprises the following steps:
and storing the target mapping relation to the BMC in advance.
Correspondingly, the invention also discloses a heat dissipation device of the computer system, which is applied to the BMC in the target computer system and comprises the following components:
the temperature detection module is used for detecting the temperature value of the target computer system by utilizing the busbar; the busbar is a wire cable which is pre-inserted on a PCBA in the target computer system;
and the rotating speed adjusting module is used for acquiring the temperature value and adjusting the rotating speed of the fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system.
Correspondingly, the invention also discloses a heat dissipation device of the computer system, which comprises:
a memory for storing a computer program;
a processor for implementing the steps of the heat dissipation method of the computer system as disclosed in the foregoing when executing the computer program.
Accordingly, the present invention also discloses a computer readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the steps of the heat dissipation method of the computer system as disclosed in the foregoing.
Therefore, in the invention, firstly, the busbar is inserted into the PCBA of the target computer system in advance, and as the busbar can generate conduction loss and emit heat under the condition of current flowing, the temperature value of the target computer system can be detected by using the busbar inserted into the PCBA; when the BMC obtains the temperature value of the computer system, the rotating speed of a fan in the target computer system is adjusted according to the temperature value so as to radiate the target computer system. Obviously, compared with the prior art, the method provided by the invention has the advantages that the temperature value of the target computer system is detected by utilizing the current flowing through the PCBA, so that the influence of the temperature of the PCBA board on the temperature measurement value of the target computer system can be avoided, and the temperature value of the computer system can be detected more accurately by the method, and the computer system can be subjected to accurate heat dissipation. Accordingly, the heat dissipation device, the equipment and the medium of the computer system provided by the invention also have the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a method for dissipating heat of a computer system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a mapping relationship between a temperature value and an impedance value of the buss bar;
fig. 3 is a structural diagram of a current detection circuit according to an embodiment of the present invention;
FIG. 4 is a block diagram of a heat dissipation device of a computer system according to an embodiment of the present invention;
fig. 5 is a structural diagram of a heat dissipation apparatus of a computer system according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a flowchart of a heat dissipation method of a computer system according to an embodiment of the present invention, where the method includes:
step S11: detecting a temperature value of the target computer system by utilizing the busbar;
wherein, the busbar is a wire cable which is inserted in advance on the PCBA in the target computer system;
step S12: and acquiring a temperature value, and adjusting the rotating speed of a fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system.
In this embodiment, a novel heat dissipation method for a computer system is provided, by which a temperature value of the computer system can be detected more accurately, and heat dissipation of the computer system can be performed accurately. It should be noted that, the heat dissipation method provided in this embodiment is described with the BMC in the target computer system as an execution main body, and in the heat dissipation method, a busbar needs to be inserted in advance on the PCBA of the target computer system.
It will be appreciated that the PCBA in the target computer system is typically used to carry various electronic components in the target computer system, and therefore, the PCBA temperature values are typically used to characterize the temperature values of the entire target computer system, while the busbars are typically used in power systems as transmission conductors for transmitting power in distribution grids, distribution boxes and substations. Since the busbar can generate conduction loss and emit heat under the condition of current flowing, in the present embodiment, the busbar inserted on the PCBA is used to detect the temperature value of the target computer system.
It can be thought that, when the temperature value of the target computer is obtained, the BMC may adjust the rotation speed of the fan in the target computer according to the temperature value of the target computer, thereby achieving the purpose of dissipating heat of the target computer. Since the process of adjusting the fan speed by the BMC according to the temperature value of the target computer is well known by those skilled in the art, and the present application focuses on a process of more accurately detecting the temperature value of the target computer system, in this embodiment, the process of adjusting the fan speed by the BMC is not described in detail.
Compared with the prior art, the heat dissipation method provided by the embodiment is to detect the temperature value of the target computer system by using the current flowing through the PCBA, so that the influence of the temperature of the PCBA board on the temperature measurement value of the target computer system can be avoided, and therefore, the temperature value of the target computer system can be accurately detected by the detection method, and the target computer system can be accurately dissipated.
In addition, since the manufacturing cost of the buss bar is lower than that of the temperature sensing component in the prior art, when the method provided by the embodiment is used for detecting the temperature value of the target computer system, the design cost required by the target computer system can be relatively reduced.
It can be seen that, in this embodiment, firstly, the busbar is inserted in advance on the PCBA of the target computer system, and since the busbar can generate conduction loss and emit heat under the condition of current flowing, the temperature value of the target computer system can be detected by using the busbar inserted on the PCBA; when the BMC obtains the temperature value of the computer system, the rotating speed of a fan in the target computer system is adjusted according to the temperature value so as to radiate the target computer system. Obviously, compared with the prior art, because the method provided by the embodiment detects the temperature value of the target computer system by using the current flowing through the PCBA, the influence of the temperature of the PCBA board itself on the temperature measurement value of the target computer system can be avoided, and therefore, the temperature value of the computer system can be detected more accurately by using the method, and the computer system can be cooled accurately.
Based on the above embodiments, this embodiment further describes and optimizes the technical solution, and as a preferred implementation, the buss bars are uniformly inserted on the PCBA.
It will be appreciated that in practice, a chip or processor mounted on the target computer system PCBA must have logic devices that are relatively powerful and relatively low in power, and the heat dissipated by them must be different, which may result in local overheating or local lowering of the temperature of the surface of the PCBA.
Obviously, if the surface temperature of the PCBA is locally overheated or locally low, the resistance value of the busbar inserted at a higher temperature position of the PCBA will be larger, and the resistance value of the busbar inserted at a lower temperature position of the PCBA will be smaller, so in the present embodiment, in order to avoid measurement errors caused by uneven insertion of the busbar on the PCBA, the busbar is uniformly inserted on the PCBA in advance, and thus the temperature value of the target computer system can be more accurately detected by using the busbar.
Based on the above embodiments, this embodiment further describes and optimizes the technical solution, and as a preferred implementation, the above steps: the process for detecting the temperature value of the target computer system by utilizing the busbar comprises the following steps:
detecting a target voltage value of the busbar by using a current detection circuit;
determining a temperature value of the target computer system according to the target voltage value and the target mapping relation;
the target mapping relationship is a mapping relationship between a temperature value of the busbar and an impedance value of the busbar per unit area, which is established in advance according to attribute characteristics of the busbar.
It is understood that the busbar is mainly composed of copper foil, and therefore, when current passes through the busbar, the copper foil in the busbar generates impedance, which causes the busbar to generate voltage difference and cause the buabar to emit corresponding heat. Obviously, under this setting mechanism, the temperature value of the busbar can represent the temperature value of the target computer, since the heat dissipated by the busbar is caused by the current flowing through the PCBA.
Referring to fig. 2, fig. 2 is a schematic diagram of a mapping relationship between a temperature value and an impedance value of a busbar, wherein the mapping relationship shown in fig. 2 is a corresponding relationship between the impedance value and the temperature value of a copper foil when the length, the width and the thickness of the copper foil in the busbar are 1mm, 1mm and 35um, respectively. Obviously, when the mapping relation between the impedance value and the temperature value of the copper foil in the busbar is obtained, the target mapping relation between the temperature value and the impedance value of the busbar is established according to the attribute characteristics of the busbar.
Wherein, the calculation expression of the copper foil impedance value is as follows:
wherein l is the length of the busbar, w is the width of the busbar, t is the thickness of the busbar, and rho is the specific impedance of the copper foil in the busbar.
In practical application, if the calculation is performed by using the impedance value of the busbar per unit area, the calculation expression of the impedance value of the busbar is as follows:
in the formula, RPFor the impedance value per unit area of the busbar read from the mapping table shown in FIG. 2, l is the length of the busbarW is the width of the busbar and t is the thickness of the busbar.
If the length and the width of the copper foil in the busbar are respectively 50mm and 3mm, and the temperature of the busbar is 25 ℃, the impedance value of the busbar is as follows: r ═ RpX 1/w × 35/t is 0.49 × 50/3 × 35/35 is 8.17m Ω. In this case, if the current on the PCBA is 3A, then the voltage drop of the busbar is 24.5 mA; when the temperature of the busbar rises to 100 ℃, according to the mapping shown in fig. 2, the resistance value of the busbar will increase by 29%, and the voltage drop of the busbar will also increase to 31.6 mV. Therefore, in the actual operation process, in the process of detecting the temperature value of the target computer system by using the busbar, the current detection circuit is firstly used for detecting the target voltage value of the busbar, and then the temperature value of the target computer system is determined according to the target voltage value of the busbar and the target mapping relation created in advance.
Referring to fig. 3, fig. 3 is a structural diagram of a current detection circuit according to an embodiment of the invention. As a preferred embodiment, the current detection circuit includes: a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sensing resistor Rs for measuring the resistance value of the busbar, and an operational amplifier U;
the first end of the sensing resistor Rs is connected to the first end of the first resistor R1, the first end of the sensing resistor Rs is further configured to receive a target voltage, the second end of the sensing resistor Rs is respectively connected to the first end of the second resistor R2 and the first end of the third resistor R3, the second end of the second resistor R2 is grounded, the second end of the first resistor R1 is respectively connected to the positive-phase input terminal of the operational amplifier U and the first end of the fourth resistor R4, the second end of the fourth resistor R4 is grounded, the second end of the third resistor R3 is respectively connected to the negative-phase input terminal of the operational amplifier U and the first end of the fifth resistor R5, and the second end of the fifth resistor R5 is connected to the output terminal of the operational amplifier U.
In this embodiment, the current detection circuit shown in fig. 3 is used to detect the target voltage value of the busbar, and in the actual operation process, the sensing resistor may be replaced by two connection ports of the busbar, obviously, the busbar is connected to the detection circuit in such a manner, in this case, the operational amplifier U may be used to detect the voltage drop of the busbar, that is, the target voltage value of the busbar.
As a preferred embodiment, the above steps: the process of determining a temperature value for the target computer system based on the target voltage value and the target mapping relationship includes:
acquiring a target impedance value of the busbar by using the target voltage value;
and searching a target temperature value corresponding to the target impedance value from the target mapping relation, and determining the target temperature value as the temperature value of the target computer system.
In the embodiment, in the process of calculating the target computer system temperature value, firstly, the target impedance value of the busbar is obtained by using the target voltage value of the busbar, that is, the target impedance value of the busbar is determined according to the target voltage value of the busbar and the current flowing through the busbar; and then searching a target temperature value corresponding to the target impedance value from the target mapping relation according to the obtained target impedance value of the busbar.
It can be understood that, since the target temperature value found is the temperature value of the busbar, which is the temperature value generated due to the current flowing on the PCBA, in this case, the temperature value of the busbar can be determined as the temperature value of the target computer system.
As a preferred embodiment, the method further comprises:
and storing the target mapping relation to the BMC in advance.
In practical application, a target mapping relation between the temperature value of the busbar and the impedance value can be stored in the BMC in advance, so that the BMC can directly search the temperature value corresponding to the target computer system from the target mapping relation stored in the BMC in the process of regulating and controlling the rotating speed of the fan, and directly regulate and control the rotating speed of the fan according to the temperature value of the target computer system, and the aim of radiating the target computer system can be achieved.
Obviously, according to the technical scheme provided by this embodiment, since a tedious process that the BMC calls the target mapping relationship from other storage areas can be avoided, the speed of the BMC in controlling the fan can be further increased by such a setting manner.
Referring to fig. 4, fig. 4 is a structural diagram of a heat dissipation device of a computer system according to an embodiment of the present invention, the heat dissipation device is applied to a BMC in a target computer system, and includes:
the temperature detection module 21 is used for detecting the temperature value of the target computer system by utilizing the busbar; wherein, the busbar is a wire cable which is inserted in advance on the PCBA in the target computer system;
and the rotating speed adjusting module 22 is used for acquiring the temperature value and adjusting the rotating speed of the fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system.
Preferably, the temperature detection module 21 includes:
the voltage detection submodule is used for detecting a target voltage value of the busbar by using the current detection circuit;
the temperature detection submodule is used for determining a temperature value of the target computer system according to the target voltage value and the target mapping relation; the target mapping relation is a mapping relation between a temperature value of the busbar and an impedance value of the busbar per unit area, which is established in advance according to the attribute characteristics of the busbar.
Preferably, the temperature detection submodule includes:
the impedance obtaining unit is used for obtaining a target impedance value of the busbar by using the target voltage value;
and the temperature determining unit is used for searching a target temperature value corresponding to the target impedance value from the target mapping relation and determining the target temperature value as the temperature value of the target computer system.
Preferably, the method further comprises the following steps:
and the relation storage module is used for storing the target mapping relation to the BMC in advance.
The heat dissipation device of the computer system provided by the embodiment of the invention has the beneficial effects of the heat dissipation method of the computer system disclosed in the foregoing.
Referring to fig. 5, fig. 5 is a structural diagram of a heat dissipation apparatus of a computer system according to an embodiment of the present invention, the heat dissipation apparatus includes:
a memory 31 for storing a computer program;
the processor 32 is configured to implement the steps of the heat dissipation method of the computer system as disclosed in the foregoing when executing the computer program.
The heat dissipation device of the computer system provided by the embodiment of the invention has the beneficial effects of the heat dissipation method of the computer system disclosed in the foregoing.
Correspondingly, the embodiment of the invention also discloses a computer readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the heat dissipation method of the computer system as disclosed in the foregoing are realized.
The computer-readable storage medium provided by the embodiment of the invention has the beneficial effects of the heat dissipation method of the computer system disclosed in the foregoing.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Finally, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly limited by the phrase "comprising one … …," without precluding the presence of additional like elements in the process, method, article, or apparatus that comprises the elements.
The above detailed description is provided for the heat dissipation method, apparatus, device and medium of the computer system, and the principle and implementation of the present invention are explained in this document by applying specific examples, and the description of the above examples is only used to help understanding the method and core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (8)
1. A heat dissipation method of a computer system is applied to a BMC in a target computer system, and comprises the following steps:
detecting a temperature value of the target computer system by utilizing the busbar; the busbar is a wire cable which is pre-inserted on a PCBA in the target computer system;
acquiring the temperature value, and adjusting the rotating speed of a fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system;
the process of detecting the temperature value of the target computer system by using the busbar comprises the following steps:
detecting a target voltage value of the busbar by using a current detection circuit;
determining the temperature value of the target computer system according to the target voltage value and a target mapping relation; the target mapping relation is a mapping relation between the temperature value of the busbar and the impedance value of the busbar per unit area, which is established in advance according to the attribute characteristics of the busbar.
2. The method for dissipating heat according to claim 1, wherein the buss bars are evenly inserted on the PCBA.
3. The method for dissipating heat according to claim 1, wherein the current detection circuit comprises: the device comprises a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sensing resistor and an operational amplifier, wherein the sensing resistor is used for measuring the resistance value of the busbar;
the first end of the sensing resistor is connected with the first end of the first resistor, the first end of the sensing resistor is further used for receiving a target voltage, the second end of the sensing resistor is respectively connected with the first end of the second resistor and the first end of the third resistor, the second end of the second resistor is grounded, the second end of the first resistor is respectively connected with the positive phase input end of the operational amplifier and the first end of the fourth resistor, the second end of the fourth resistor is grounded, the second end of the third resistor is respectively connected with the negative phase input end of the operational amplifier and the first end of the fifth resistor, and the second end of the fifth resistor is connected with the output end of the operational amplifier.
4. The method for dissipating heat according to claim 1, wherein the determining the temperature value of the target computer system according to the target voltage value and a target mapping comprises:
acquiring a target impedance value of the busbar by using the target voltage value;
and searching a target temperature value corresponding to the target impedance value from the target mapping relation, and determining the target temperature value as the temperature value of the target computer system.
5. The method for dissipating heat according to claim 1, further comprising:
and storing the target mapping relation to the BMC in advance.
6. A heat dissipation device for a computer system, applied to a BMC in a target computer system, comprising:
the temperature detection module is used for detecting the temperature value of the target computer system by utilizing the busbar; the busbars are electric wires and cables pre-inserted on a PCBA in the target computer system;
the rotating speed adjusting module is used for acquiring the temperature value and adjusting the rotating speed of a fan in the target computer system according to the temperature value so as to dissipate heat of the target computer system;
the process of detecting the temperature value of the target computer system by using the busbar comprises the following steps:
detecting a target voltage value of the busbar by using a current detection circuit;
determining the temperature value of the target computer system according to the target voltage value and a target mapping relation; the target mapping relation is a mapping relation between the temperature value of the busbar and the impedance value of the busbar per unit area, which is established in advance according to the attribute characteristics of the busbar.
7. A heat dissipation device for a computer system, comprising:
a memory for storing a computer program;
a processor for implementing the steps of a method of dissipating heat from a computer system as claimed in any one of claims 1 to 5 when executing said computer program.
8. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, carries out the steps of a method for dissipating heat of a computer system according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| KR101398219B1 (en) * | 2014-03-27 | 2014-05-22 | 태성전장주식회사 | Apparatus for high current sensing using hall sensor |
| CN207319085U (en) * | 2017-09-14 | 2018-05-04 | 郑州云海信息技术有限公司 | A kind of Bus bar system for detecting temperature |
| US10145744B2 (en) * | 2014-01-15 | 2018-12-04 | Tokuden Co., Ltd. | Induction-heated roller apparatus |
| EP3553808A2 (en) * | 2018-03-22 | 2019-10-16 | Huawei Technologies Co., Ltd. | Miniature circuit breaker, control method thereof, and control system thereof |
| CN111310362A (en) * | 2020-04-01 | 2020-06-19 | 纬湃科技投资(中国)有限公司 | Method for estimating temperature of DC bus connector and computer readable storage medium |
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| GB2563186A (en) * | 2017-01-30 | 2018-12-12 | Yasa Motors Ltd | Semiconductor arrangement |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10145744B2 (en) * | 2014-01-15 | 2018-12-04 | Tokuden Co., Ltd. | Induction-heated roller apparatus |
| KR101398219B1 (en) * | 2014-03-27 | 2014-05-22 | 태성전장주식회사 | Apparatus for high current sensing using hall sensor |
| CN207319085U (en) * | 2017-09-14 | 2018-05-04 | 郑州云海信息技术有限公司 | A kind of Bus bar system for detecting temperature |
| EP3553808A2 (en) * | 2018-03-22 | 2019-10-16 | Huawei Technologies Co., Ltd. | Miniature circuit breaker, control method thereof, and control system thereof |
| CN111310362A (en) * | 2020-04-01 | 2020-06-19 | 纬湃科技投资(中国)有限公司 | Method for estimating temperature of DC bus connector and computer readable storage medium |
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