CN111968698B - Test system and test method of FLASH chip - Google Patents
Test system and test method of FLASH chip Download PDFInfo
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- CN111968698B CN111968698B CN202010858517.XA CN202010858517A CN111968698B CN 111968698 B CN111968698 B CN 111968698B CN 202010858517 A CN202010858517 A CN 202010858517A CN 111968698 B CN111968698 B CN 111968698B
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Abstract
The invention discloses a test system and a test method of a FLASH chip, wherein the test method comprises the following steps: the sub-server establishes connection with the main server through a switch; the sub-server acquires the configuration parameters issued by the main server and forwards the configuration parameters to the test machine; the test machine executes corresponding configuration operation according to the configuration parameters and feeds back an execution result to the sub-server; and the sub-server forwards the execution result fed back by the test machine to the main server. According to the embodiment of the invention, a plurality of production devices are managed through a server of a PC end, and simultaneously, each production device can also configure parameters according to needs, so that a production factory of NAND flash products can select centralized or independent management of the production of the devices according to needs, the production and detection of NANDflash are realized through software, the production and detection are realized by adopting a low-power processor chip + DRAM + EMMC, and a plurality of units are integrated into one device, so that the power consumption and the heat generation are reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to a testing system and a testing method of a FLASH chip.
Background
The NAND Flash memory chip is an indispensable component of a semiconductor component, and is widely applied to the fields of memories, consumer electronics, intelligent terminals and the like along with rapid development of big data, cloud computing, the Internet of things and the like. However, in industrial applications, the memory chip must be matched with the memory controller chip to be able to be assembled into a final product.
Regardless of manufacturers at home and abroad, the NAND flash module is mostly produced based on the following 2 modes:
firstly, installing software of different main control manufacturers on a PC, connecting a test frame of the main control manufacturer by a USB, scanning and producing NAND flash particles (in the form of TSOP/BGA/LGA and other packaging pieces) in batch, and then welding the tested NAND flash particles onto a PCB.
And secondly, firstly, attaching the NAND flash (in a Dies form) to a PCB (printed Circuit Board) or packaging the NAND flash into a UDP form, connecting the NAND flash to a PC (personal computer) through a USB HUB (Universal Serial bus) device, and then opening software on the PC corresponding to a master control manufacturer for mass production.
After two kinds of volume productions succeed, insert the USB HUB device with the product again, open detection software and test the product, select unqualified. At present, the production mode is based on a PC system, and the bus bandwidth of USB on the PC is fixed, so that the more USB devices are accessed each time, the transmission speed of each product is reduced, and the production and detection quantity of each PC cannot be too much. Therefore, the yield of the factory can be improved by greatly increasing the PC, the USB HUB device and the test jig, and the problems that the power consumption of the factory and the cost increase, the working environment is severe and the social resource utilization rate is low caused by the large amount of heat generation are urgently solved along with the increase of the PC at present.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a testing system and a testing method of a FLASH chip, and aims to solve the problems of high testing cost and low detection speed of the FLASH chip in the prior art.
The technical scheme of the invention is as follows:
a test system of a FLASH chip comprises a main server, a switch, a sub-server and a test machine, wherein the switch is respectively connected with the main server and the sub-server, and the test machine is connected with the sub-server;
the main server is used for remotely configuring the data of the test machine and processing the production information;
the switch is used for connecting the sub-server and the main server to the same network;
the sub-server is used for managing the test machine, forwarding the configuration signal sent by the main server to the test machine, and forwarding the feedback signal fed back by the test machine to the main server;
the testing machine comprises a plurality of testing subsystems, and the testing subsystems are used for testing the FLASH chip.
Optionally, the test system further includes a display device, and the display device is connected to the main server;
the display device is used for displaying the production information.
Optionally, the main server includes a UDP notification unit, a barcode management unit, a configuration management unit, a sub-server management unit, and a result recording unit;
the UDP notification unit is used for notifying UDP information in the local area network;
the bar code management unit is used for numbering and managing production trays of the test machine
The configuration management unit is used for configuring the production parameters of the test machine and updating the configuration to the specified sub-server;
the sub-server management unit is used for managing the naming, configuration and production state of the sub-servers;
and the result recording unit is used for recording the operation result of the test subsystem.
Optionally, the main server further comprises a file transfer unit,
the file transmission unit is used for updating configuration and checking a log file generated by a test subsystem in the sub-server.
Optionally, the main server further comprises a display management unit,
and the display management unit is used for displaying the production information of the corresponding subsystem under the sub-server.
Optionally, the sub-server includes a result output unit, a parameter configuration unit, an alarm unit, a log management unit, a port locking unit, and a data replication unit;
the output unit is used for outputting the production information of the subsystem to the display equipment;
the parameter configuration unit is used for configuring parameters of the sub-servers;
the alarm unit is used for reminding state information when the material tray is put in;
the log management unit is used for recording the log information of the test subsystem;
the port locking unit is used for numbering the test subsystem and enabling the number of the test subsystem to be consistent with the number of the material tray;
and the data copying unit is used for copying the target data configured in the sub-server to a corresponding product in the testing subsystem.
Optionally, the test subsystem includes a communication unit, a data forwarding unit, a test unit, and a mass production tool;
the communication unit is used for communicating with a product to be tested and communicating with the sub-server;
the data forwarding unit is used for checking whether the data is used by the current testing subsystem according to the protocol and forwarding the data to the next-stage testing subsystem;
the test unit is used for testing the performance of a product to be tested;
the mass production tool is used for writing corresponding data into the product to be tested.
Another embodiment of the present invention provides a method for testing a test system based on any one of the FLASH chips, including:
the sub-server establishes connection with the main server through a switch;
the sub-server acquires the configuration parameters issued by the main server and forwards the configuration parameters to the test machine;
the test machine executes corresponding configuration operation according to the configuration parameters and feeds back an execution result to the sub-server;
and the sub-server forwards the execution result fed back by the test machine to the main server.
Another embodiment of the present invention also provides a non-transitory computer-readable storage medium storing computer-executable instructions that, when executed by one or more processors, cause the one or more processors to perform the above-described method for testing a FLASH chip-based test system.
Another embodiment of the present invention provides a computer program product comprising a computer program stored on a non-volatile computer-readable storage medium, the computer program comprising program instructions which, when executed by a processor, cause the processor to perform the above-described method of testing a FLASH chip-based test system.
Has the advantages that: compared with the prior art, the embodiment of the invention manages a plurality of production devices through a server of a PC end, and simultaneously each production device can configure parameters according to needs, so that a production factory of NAND FLASH products can select centralized or independent management of production of the devices according to needs, production and detection of NAND FLASH are realized through software, a low-power processor chip + DRAM + EMMC is adopted for realizing, a plurality of units are integrated into one device, and power consumption and heating are reduced.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a hardware structure diagram of a preferred embodiment of a FLASH chip based test system according to the present invention;
FIG. 2 is a schematic diagram of the architecture of an embodiment of a FLASH chip-based test system according to the present invention;
FIG. 3 is a flowchart of a testing method of a testing system based on a FLASH chip according to a preferred embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is described in further detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes embodiments of the present invention in detail with reference to the accompanying drawings.
The embodiment of the invention provides a FLASH chip-based test system. Referring to fig. 1, fig. 1 is a block diagram of a testing system of a FLASH chip according to a preferred embodiment of the present invention. As shown in fig. 1, the testing system includes a main server 100, a switch 200, a sub-server 300, and a testing machine 400, wherein the switch 200 is connected to the main server 100 and the sub-server 300, respectively, and the testing machine 400 is connected to the sub-server 300;
the main server is used for remotely configuring the data of the test machine and processing the production information;
the switch is used for connecting the sub-server and the main server to the same network;
the sub-server is used for managing the test machine, forwarding the configuration signal sent by the main server to the test machine, and forwarding the feedback signal fed back by the test machine to the main server;
the testing machine comprises a plurality of testing subsystems, and the testing subsystems are used for testing the FLASH chip.
In specific implementation, the FLASH chip of the embodiment of the invention is a NAND FLASH memory chip. The Nand flash memory is one of flash memories, and a nonlinear macro-unit mode is adopted in the Nand flash memory, so that a cheap and effective solution is provided for realizing a solid-state large-capacity memory. The Nand-flash memory has the advantages of large capacity, high rewriting speed and the like, is suitable for storing a large amount of data, and is applied to embedded products including digital cameras, MP3 walkman memory cards, small-sized U disks and the like. According to the system, a server at a PC end manages a plurality of production devices, and each production device can configure parameters according to needs, so that a production factory of NAND flash products can select centralized or independent management of production of the devices according to needs.
As shown in fig. 2, the system is composed of a main server, a switch, a sub-server, a display device, and a testing machine (a plurality of sub-systems). The main server has the main functions of monitoring production, remotely configuring machine production data, recording production results, inquiring production information and the like; the main purpose of the switch is to connect the sub-servers and the main server to the same network. The sub-server has the main function of managing a plurality of subsystems, forwarding signals from the main server and the subsystems, displaying production information of the subsystems and configuring production parameters of the subsystems. The test machine table is composed of a plurality of test subsystems, wherein the test machine table is used for being connected with a product, and a point needle type is adopted to contact signal points of the NAND flash product, so that the scratch problem caused by plugging and unplugging in a traditional mode is well solved for the product, a plurality of board cards can be inserted into the test machine table, the board cards are the test subsystems composed of a plurality of groups of processor chips, and each subsystem can simultaneously test USB and SD products.
Optionally, the test system further includes a display device, and the display device is connected to the main server;
the display device is used for displaying production information.
During specific implementation, the display equipment is convenient to check the production information, as a selectable item, a factory can select not to access the production information according to conditions, and the production information can be checked through the main server.
Optionally, the main server includes a UDP notification unit, a barcode management unit, a configuration management unit, a sub-server management unit, and a result recording unit;
the UDP notification unit is used for notifying UDP information in the local area network;
the bar code management unit is used for numbering and managing production trays of the test machine
The configuration management unit is used for configuring the production parameters of the test machine and updating the configuration to the specified sub-server;
the sub-server management unit is used for managing the naming, configuration and production state of the sub-servers;
and the result recording unit is used for recording the operation result of the test subsystem.
In specific implementation, the UDP notification unit is configured to notify UDP information in the local area network; the main server adopts UDP notification in the local area network, each sub-server can automatically find the main server without configuring the address of the main server by each sub-server, and all the sub-servers are prevented from changing the address information configuration of the main server after the address of the main server is changed.
The bar code management unit is used for numbering production trays of each machine, and has the functions of adding, inquiring, printing and the like, so that the bar codes on each tray give unique identification to the tray, and after the production of products on the tray is finished, the result is recorded on the server, so that a data basis is provided for the subsequent distribution.
The main server can configure the production parameters through the configuration management unit and update the configuration to the designated sub-server.
The sub-server management unit is used for naming, configuring and managing the production state of the sub-servers, and when the sub-servers are connected with the main server, the main server displays the information of the sub-servers in a list, such as IP addresses, names of the sub-servers and the like.
After each subsystem runs, the result of each NAND flash product is transmitted to the main server through the sub-server, and the result recording unit of the main server records information such as the bar code number on the feeding disc and the production result (such as BIN level, error code, capacity, speed) of the product, so that the data can be provided for the distribution.
Optionally, the main server further comprises a file transfer unit,
the file transmission unit is used for updating the configuration and viewing the log file generated by the test subsystem in the sub server.
In specific implementation, the file transmission is mainly used for configuration updating, software updating, checking log files generated by subsystems on the sub-servers and the like.
Optionally, the main server further comprises a display management unit,
the display management unit is used for displaying the production information of the corresponding subsystem under the sub-server.
In specific implementation, the display management unit is used for clicking the sub-servers by a user and checking the production progress, the state and the result of each sub-system under each sub-server.
Optionally, the sub-server includes a result output unit, a parameter configuration unit, an alarm unit, a log management unit, a port locking unit, and a data replication unit;
the output unit is used for outputting the production information of the subsystem to the display equipment;
the parameter configuration unit is used for configuring the parameters of the sub-servers;
the alarm unit is used for reminding the state information when the material tray is put in;
the log management unit is used for recording the log information of the test subsystem;
the port locking unit is used for numbering the test subsystem and enabling the number of the test subsystem to be consistent with the number of the material tray;
and the data copying unit is used for copying the target data configured in the sub-server to a corresponding product in the testing subsystem.
When the test system is externally connected with a display device, the sub server outputs production information, state and results of the subsystems to the display device through the result output unit for workers to check.
The parameter configuration unit is used for the sub-server to configure parameters. The main server can configure each sub-server, and also can configure parameters on the sub-servers by self, so that the centralized setting and the independent setting can be realized.
When a worker puts the material tray in, the bar code scanner automatically scans the bar codes on the material tray and is used for recording the production result of the batch of products, and the alarm unit is used for reminding information of success, failure and the like when the material tray is put in. The alarm unit can adopt a buzzer.
The log management unit can record information such as production logs, operation logs, debugging logs and the like of the subsystem, and can be used for managers, workers and product developers to check and solve problems.
The port locking unit is formed by connecting a plurality of subsystems together, and the subsystems need to be numbered, and the numbers on the subsystems are ensured to be consistent with the sequence on a material tray, so that a worker can correspondingly and directly find a corresponding NAND flash product when picking materials.
The data copying unit is used for copying the data in the master disc to the product in the subsystem when the produced NAND flash product needs to produce products including some special functions, such as a music disc, a material disc and the like, and the data in a finished disc needs to be put into all the products.
Optionally, the test subsystem includes a communication unit, a data forwarding unit, a test unit, and a mass production tool;
the communication unit is used for communicating with a product to be tested and communicating with the sub-server;
the data forwarding unit is used for checking whether the data is used by the current testing subsystem according to the protocol and forwarding the data to the next-stage testing subsystem;
the test unit is used for testing the performance of a product to be tested;
the mass production tool is used for writing corresponding data into the product to be tested.
In specific implementation, the communication unit is responsible for communication between the test subsystem and a product to be tested and information interaction between the test subsystem and the sub-server. The data forwarding unit is used for forwarding the data which are identified to not belong to the test subsystem of the data forwarding unit to the next-level test subsystem, the test unit is used for testing the performance of the product to be tested, and after the test is correct, the corresponding data can be written into the product to be tested by using a production tool to complete the production of the product.
Furthermore, the test subsystem in the embodiment of the invention is divided into a 3-layer architecture, and the 3-layer architecture is respectively composed of a kernel layer, a routing layer and an application layer.
The core layer may implement DWC3/DWC2 OTG. The OTG is realized by adopting a USB cascade mode for multiple devices to receive and transmit data transmitted by the HOST end, the DWC3 is in a USB3.0 mode, and the DWC2 is in a USB2.0 mode. Other Serial openings can be set for realizing subsequent expansion functions.
The kernel layer can also realize the realization of SD private commands, the mass production link of SD, and we do not use a production device and other card readers independently any more, and after the kernel layer realizes the realization of a command interface, the kernel layer is not limited by the card readers in mass production.
The kernel layer can also realize the communication between SD information and an upper layer, the SD and HOST need timing clock frequency and other information during mass production, and mass production software needs to read/configure the clock of HOST during adaptation, so that the communication is convenient to process.
The routing layer is used for forwarding signals during USB cascade connection, communicating with the inner core and communicating with application layer software; the routing layer is also used for communication with the kernel layer: when the subsystem is used as a Device to receive information sent by the USB HOST, the kernel layer needs to transmit data to the routing layer for analysis, and a connection path between the kernel and the routing layer is opened; the routing layer is also used for data forwarding: after receiving the data transmitted by the kernel layer, checking whether the data is to be used by other subsystems or the system according to the protocol, and sending the data to the next-level subsystem or forwarding the data to application layer software according to the situation.
And the application layer consists of a main program, a USB flash disk volume production tool and a test tool. The main program comprises USB enumeration and upper and lower disk management, SD enumeration and upper and lower disk management, Scsi communication of a USB/SD card, OTG server communication and Serial server communication.
The USB enumeration and the management of the loading and unloading of the disk specifically comprise two conditions of starting up to check connected equipment and hot plugging equipment, and when the equipment is detected to be inserted, the equipment is opened for subsequent mass production or a detection tool to carry out QC work. The device here refers to a USB product of NAND flash.
The SD enumeration and the disk loading and unloading management comprise two conditions of starting up to check connected equipment and hot plug equipment, and when the equipment is detected to be inserted, the equipment is opened for subsequent mass production or a detection tool to carry out QC work. The device here refers to the SD product of NAND flash.
The Scsi communication of the USB/SD card is realized by a Scsi mode.
The OTG server communication refers to communication with the sub-server in a USB OTG mode.
Serial server communication refers to communication with a sub-server in a Serial port mode.
The USB DISK mass PRODUCTION TOOL (PDT) writes corresponding data into the USB DISK, so that the computer can correctly identify the USB DISK and the USB DISK has certain special functions.
The test tool refers to a tool for testing the USB flash disk.
The test system based on the FLASH chip is disclosed by the embodiment of the invention. The method can develop an independent test system for production and detection based on a memory control core algorithm without using a PC, and reduces power consumption and heat generation. The patent integrates production and detection functions into a whole based on a memory core algorithm by combining the needs of manufacturers, and solves the industrial pain point. The system utilizes an Arm Linux system platform, realizes the production and detection of NAND flash through software under Linux, is realized by adopting a low-power-consumption processor chip + DRAM + EMMC, integrates a plurality of units into one device, and achieves the purposes of reducing power consumption, generating heat and the like. The main function principle of a Dynamic Random Access Memory (DRAM) is to represent whether a binary bit (bit) is 1 or 0 by using the amount of charges stored in a capacitor. In reality, the amount of charges stored in the capacitor is not enough to correctly determine data due to leakage current of the transistor, which results in data corruption. Therefore, for DRAM, periodic charging is an unavoidable requirement. Due to this characteristic of requiring timed refresh, it is referred to as "dynamic" memory. The MMC (embedded Multi Media card) has a standard specification for embedded memories of mobile phones and tablet computers.
The embodiment of the invention provides a test method of a test system based on a FLASH chip. Referring to fig. 3, fig. 3 is a flowchart illustrating a testing method of a testing system of a FLASH chip according to a preferred embodiment of the present invention. As shown in fig. 3, it includes the steps of:
s100, a sub server establishes connection with the main server through a switch;
s200, the sub server acquires the configuration parameters issued by the main server and forwards the configuration parameters to a test machine;
step S300, the test machine executes corresponding configuration operation according to the configuration parameters, and feeds back an execution result to the sub server;
and S400, the sub server forwards the execution result fed back by the test machine to the main server.
In specific implementation, the main server has the main functions of monitoring production, remotely configuring the production data of the machine, recording the production result, inquiring the production information and the like; the main purpose of the switch is to connect the sub-servers and the main server to the same network. The sub-server has the main function of managing a plurality of subsystems, forwarding signals from the main server and the subsystems, displaying production information of the subsystems and configuring production parameters of the subsystems. The test machine table is composed of a plurality of test subsystems, wherein the test machine table is used for being connected with a product, and a point needle type is adopted to contact signal points of the NAND flash product, so that the scratch problem caused by plugging and unplugging in a traditional mode is well solved for the product, a plurality of board cards can be inserted into the test machine table, the board cards are the test subsystems composed of a plurality of groups of processor chips, and each subsystem can simultaneously test USB and SD products.
According to the method for testing the FLASH chip testing system, the plurality of production devices are managed through the server of the PC end, and meanwhile, each production device can be configured with parameters according to needs, so that a production factory of NAND FLASH products can select centralized or independent management of production of the devices according to needs, production and detection of NAND FLASH are achieved through software, the low-power processor chip + DRAM + EMMC is adopted, a plurality of units are integrated into one device, and power consumption and heating are reduced.
Embodiments of the present invention provide a non-transitory computer-readable storage medium storing computer-executable instructions for execution by one or more processors, for example, to perform method steps S100-S400 of fig. 3 described above.
By way of example, non-volatile storage media can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), electrically erasable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM), which acts as external cache memory. By way of illustration and not limitation, RAM is available in many forms such as Synchronous RAM (SRAM), dynamic RAM, (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), and Direct Rambus RAM (DRRAM). The disclosed memory components or memory of the operating environment described herein are intended to comprise one or more of these and/or any other suitable types of memory.
Another embodiment of the invention provides a computer program product comprising a computer program stored on a non-volatile computer readable storage medium, the computer program comprising program instructions which, when executed by a processor, cause said processor to perform the method of testing a FLASH chip based test system of the above-described method embodiment. For example, method steps S100 to S400 in fig. 3 described above are performed.
The above-described embodiments are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of the embodiment.
Through the above description of the embodiments, those skilled in the art will clearly understand that the embodiments may be implemented by software plus a general hardware platform, and may also be implemented by hardware. Based on such understanding, the above technical solutions essentially or contributing to the related art can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of the various embodiments or some parts of the embodiments.
Conditional language such as "can," "might," or "may" is generally intended to convey that a particular embodiment can include (yet other embodiments do not include) particular features, elements, and/or operations, among others, unless specifically stated otherwise or otherwise understood within the context as used. Thus, such conditional language is also generally intended to imply that features, elements, and/or operations are in any way required for one or more embodiments or that one or more embodiments must include logic for deciding, with or without input or prompting, whether such features, elements, and/or operations are included or are to be performed in any particular embodiment.
What has been described herein in the specification and drawings includes examples of a test system and a test method capable of providing a FLASH chip. It will, of course, not be possible to describe every conceivable combination of components and/or methodologies for purposes of describing the various features of the disclosure, but it can be appreciated that many further combinations and permutations of the disclosed features are possible. It is therefore evident that various modifications can be made to the disclosure without departing from the scope or spirit thereof. In addition, or in the alternative, other embodiments of the disclosure may be apparent from consideration of the specification and drawings and from practice of the disclosure as presented herein. It is intended that the examples set forth in this specification and the drawings be considered in all respects as illustrative and not restrictive. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (10)
1. The testing system of the FLASH chip is characterized by comprising a main server, a switch, a sub-server and a testing machine, wherein the switch is respectively connected with the main server and the sub-server, and the testing machine is connected with the sub-server;
the main server is used for remotely configuring the data of the test machine and processing the production information;
the switch is used for connecting the sub-server and the main server to the same network;
the sub-server is used for managing the test machine, forwarding the configuration signal sent by the main server to the test machine, and forwarding the feedback signal fed back by the test machine to the main server;
the testing machine comprises a plurality of testing subsystems, and the testing subsystems are used for testing the FLASH chip;
the testing machine is connected with the FLASH chip and contacts signal points of the FLASH chip in a point contact manner;
the test subsystem is divided into 3 layers of architectures, and the 3 layers of architectures respectively consist of an inner core layer, a routing layer and an application layer;
the kernel layer is used for realizing DWC3/DWC2 OTG, wherein the OTG is realized by adopting a USB cascade mode for multiple devices to receive and transmit data transmitted by the HOST end, the DWC3 is in a USB3.0 mode, and the DWC2 is in a USB2.0 mode;
the kernel layer is also used for realizing the implementation of the SD private command;
the kernel layer is also used for realizing the communication between the SD information and the upper layer;
the routing layer is used for forwarding signals during USB cascade connection, communicating with the inner core and communicating with application layer software;
the routing layer is also used for communication with the kernel layer; when the test subsystem is used as a Device to receive information sent by the USB HOST, the kernel layer needs to transmit data to the routing layer for analysis, and a connection path between the kernel and the routing layer is opened;
the routing layer is also used for data forwarding; after receiving the data transmitted by the kernel layer, checking whether the data is intended to be used by other subsystems or the system according to a protocol, and sending the data to a next-level subsystem or forwarding the data to application layer software according to conditions;
the application layer consists of a main program, a USB flash disk volume production tool and a test tool; the main program comprises USB enumeration and upper and lower disk management, SD enumeration and upper and lower disk management, Scsi communication of a USB/SD card, OTG server communication and Serial server communication;
the USB enumeration and the management of the loading and unloading of the disk specifically comprise two conditions of starting up to check connected equipment and hot plugging equipment, and when the equipment is detected to be inserted, the equipment is opened for subsequent mass production or a detection tool to carry out QC work;
the SD enumeration and the management of loading and unloading disks comprise two conditions of starting up to check connected equipment and hot plugging equipment, and when the equipment is detected to be inserted, the equipment is opened for mass production or a detection tool carries out QC work;
the Scsi communication of the USB/SD card is realized by a Scsi mode;
the OTG server communication refers to the communication with the sub-server in a USB OTG mode;
serial server communication refers to communication with a sub-server in a Serial port mode.
2. The system for testing a FLASH chip of claim 1, further comprising a display device, said display device being connected to said main server;
the display device is used for displaying production information.
3. The system for testing a FLASH chip according to claim 1, wherein the main server comprises a UDP notification unit, a barcode management unit, a configuration management unit, a sub-server management unit, and a result recording unit;
the UDP notification unit is used for notifying UDP information in the local area network;
the bar code management unit is used for numbering and managing production trays of the test machine;
the configuration management unit is used for configuring the production parameters of the test machine and updating the configuration to the specified sub-server;
the sub-server management unit is used for managing the naming, configuration and production state of the sub-servers;
and the result recording unit is used for recording the operation result of the test subsystem.
4. The system for testing a FLASH chip according to claim 3, wherein the main server further comprises a file transfer unit,
the file transmission unit is used for updating configuration and checking a log file generated by a test subsystem in the sub-server.
5. The FLASH chip testing system of claim 4, wherein said primary server further comprises a display management unit,
and the display management unit is used for displaying the production information of the corresponding subsystem under the sub-server.
6. The system for testing a FLASH chip according to claim 2, wherein the sub-server comprises a result output unit, a parameter configuration unit, an alarm unit, a log management unit, a port locking unit and a data replication unit;
the output unit is used for outputting the production information of the subsystem to the display equipment;
the parameter configuration unit is used for configuring parameters of the sub-servers;
the alarm unit is used for reminding state information when the material tray is put in;
the log management unit is used for recording the log information of the test subsystem;
the port locking unit is used for numbering the test subsystem and enabling the number of the test subsystem to be consistent with the number of the material tray;
and the data copying unit is used for copying the target data configured in the sub-server to a corresponding product in the testing subsystem.
7. The testing system of the FLASH chip according to claim 6, wherein the testing subsystem comprises a communication unit, a data forwarding unit, a testing unit, a volume production tool;
the communication unit is used for communicating with a product to be tested and communicating with the sub-server;
the data forwarding unit is used for checking whether the data is used by the current testing subsystem according to the protocol and forwarding the data to the next-stage testing subsystem;
the test unit is used for testing the performance of a product to be tested;
the mass production tool is used for writing corresponding data into the product to be tested.
8. A method for testing a test system based on a FLASH chip according to any one of claims 1 to 7, said method comprising:
the sub-server establishes connection with the main server through a switch;
the sub-server acquires the configuration parameters issued by the main server and forwards the configuration parameters to the test machine;
the test machine executes corresponding configuration operation according to the configuration parameters and feeds back an execution result to the sub-server;
and the sub-server forwards the execution result fed back by the test machine to the main server.
9. A non-transitory computer-readable storage medium storing computer-executable instructions that, when executed by one or more processors, cause the one or more processors to perform the method of testing the FLASH chip-based test system of claim 8.
10. A computer program product, characterized in that it comprises a computer program stored on a non-volatile computer-readable storage medium, the computer program comprising program instructions which, when executed by a processor, cause the processor to carry out the method of testing a FLASH chip based test system of claim 8.
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| US7761624B2 (en) * | 2006-09-28 | 2010-07-20 | Virident Systems, Inc. | Systems and apparatus for main memory with non-volatile type memory modules, and related technologies |
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