CN111941221A

CN111941221A - Belt-type chemical mechanical polishing device

Info

Publication number: CN111941221A
Application number: CN202010807315.2A
Authority: CN
Inventors: 魏运秀
Original assignee: Ganzhou Yerun Automation Equipment Co ltd
Current assignee: Ganzhou Yerun Automation Equipment Co ltd
Priority date: 2020-08-12
Filing date: 2020-08-12
Publication date: 2020-11-17

Abstract

The invention discloses a belt-type chemical mechanical grinding device, which comprises a rack, wherein two belt wheels which are arranged in the left-right direction at the same height are hinged on the rack, a clockwise transmission belt is tensioned on the two belt wheels, and a grinding pad is fixed on the outer wall of the belt; a grinding head is arranged above the middle of the two belt wheels, and the wafer is fixed on the grinding head and is opposite to the grinding pad; and a grinding fluid dropper is arranged on the left side of the grinding head. The invention changes the rotation motion of the grinding pad into belt-shaped conveying, and can effectively prevent grinding fluid from being thrown out of the grinding pad due to centrifugal force; meanwhile, the grinding of the wafer is uniform, and the grinding efficiency is high.

Description

Belt-type chemical mechanical polishing device

Technical Field

The invention relates to the technical field of semiconductor production, in particular to a belt-shaped chemical mechanical polishing device.

Background

In semiconductor manufacturing processes, it is often necessary to grind wafers. Specifically, a wafer is fixed by a polishing head, pressed against the surface of a polishing pad, and then the polishing pad is rotated to polish the wafer. In order to improve the polishing efficiency of the polishing pad on the wafer, in the process of polishing the wafer, polishing liquid is provided to the surface of the polishing pad, and the polishing liquid can soften the surface of the wafer and is easy to polish the wafer. However, during the polishing process, since the polishing pad is in a rotating state, part of the polishing slurry on the edge of the polishing pad is influenced by the centrifugal force and is thrown out of the polishing pad, so that the polishing slurry on the edge surface of the polishing pad is far less than that on the central surface of the polishing pad, and the polishing efficiency of the edge portion of the polishing pad on the wafer is lower than that of the central portion of the polishing pad on the wafer, so that the thickness of the edge portion of the polished wafer is different from that of the central portion, and the uniformity of the wafer is influenced.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a belt-type chemical mechanical polishing device, which changes the rotation motion of a polishing pad into belt-type conveying and can effectively prevent polishing liquid from being thrown out of the polishing pad due to centrifugal force; meanwhile, the grinding of the wafer is uniform, and the grinding efficiency is high.

The scheme for solving the technical problems is as follows:

a belt-type chemical mechanical grinding device comprises a rack, wherein two belt wheels which are arranged in the left-right direction at the same height are hinged on the rack, clockwise transmission belts are tensioned on the two belt wheels, and grinding pads are fixed on the outer walls of the belts; a grinding head is arranged above the middle of the two belt wheels, and the wafer is fixed on the grinding head and is opposite to the grinding pad; and a grinding fluid dropper is arranged on the left side of the grinding head.

The grinding liquid dropping pipe comprises a liquid separating pipe and a liquid inlet pipe, wherein the liquid separating pipe stretches across the upper part of the belt in the front-back direction, the liquid inlet pipe is fixed on the liquid separating pipe and is communicated with the liquid separating pipe, and grinding liquid enters the liquid separating pipe through the liquid inlet pipe;

and a plurality of drip holes arranged in the vertical direction are formed on the lower side wall of the liquid distribution pipe.

Two supporting rollers which are arranged at the same height are arranged between the two belt wheels, and the belt is pressed against the supporting rollers; the upper side wall of the supporting roller is higher than that of the belt wheel; the grinding head is positioned between the two supporting rollers, and the supporting rollers are hinged on the rack.

The grinding pad is formed by combining a plurality of rectangular grinding pads which are arranged in a block shape, and the rectangular grinding pads are fixed on the belt.

The belt is provided with a tensioning mechanism.

The rack comprises two supporting plates which are arranged in front and back, and I-shaped grooves are formed in the supporting plates;

tensioning mechanism is including pressing the tensioning roller on the lower half section inner wall of belt, and the tensioning roller is fixed at the middle part of pivot, and the both ends of pivot articulate respectively on a rectangle slider that corresponds, and rectangle slider sliding connection is at the lower extreme inslot in I-shaped groove, and the upper end inslot in I-shaped groove is fixed with the cylinder, the piston rod and the rectangle slider fixed connection that the vertical direction of cylinder set up.

The invention has the following outstanding effects: compared with the prior art, the rotary motion of the grinding pad is changed into belt-shaped conveying, so that the grinding liquid can be effectively prevented from being thrown out of the grinding pad due to centrifugal force; meanwhile, the grinding of the wafer is uniform, and the grinding efficiency is high.

Drawings

FIG. 1 is a schematic structural view of the present invention (after rotating 90 degrees clockwise);

fig. 2 is a partially enlarged view of fig. 1 about C.

Fig. 3 is a partially enlarged view of fig. 1 about B.

Fig. 4 is a cross-sectional view of fig. 3 taken about a-a.

Detailed Description

In the embodiment, as shown in fig. 1 to 4, a belt-type chemical mechanical polishing apparatus comprises a frame 1, two belt wheels 21 arranged at the same height in the left-right direction are hinged on the frame 1, the belt wheels 21 are provided with motors for driving the belt wheels to rotate, clockwise transmission belts 22 are tensioned on the two belt wheels 21, and polishing pads 23 are fixed on the outer walls of the belts 22; a grinding head 3 is arranged above the middle of the two belt wheels 21, and a wafer 4 is fixed on the grinding head 3 and is opposite to a grinding pad 23; a grinding fluid dropper 5 is arranged on the left side of the grinding head 3.

More specifically, the grinding fluid dropper 5 comprises a fluid distribution pipe 51 crossing over the belt 22 in the front-back direction and a fluid inlet pipe 52 fixed on the fluid distribution pipe 51 and communicated with the fluid distribution pipe 51, and the grinding fluid enters the fluid distribution pipe 51 through the fluid inlet pipe 52;

a plurality of dropping holes 511 arranged in the vertical direction are formed on the lower side wall of the liquid distributing pipe 51.

Furthermore, two supporting rollers 24 with equal height are arranged between the two belt wheels 21, and the belt 22 is pressed against the supporting rollers 24; the upper side wall of the supporting roller 24 is higher than that of the belt wheel 21; the grinding head 3 is located between two support rollers 24, and the support rollers 24 are hinged to the frame 1.

More specifically, the polishing pad 23 is composed of a plurality of rectangular polishing pads arranged in a block shape, and the rectangular polishing pads are fixed on the belt 22.

Further, the belt 22 is provided with a tensioning mechanism 6.

Furthermore, the frame 1 comprises two supporting plates 11 arranged in front and back, and an i-shaped groove 12 is formed on the supporting plates 11;

tensioning mechanism 6 is including pressing the tensioning roller 61 on the lower half section inner wall of belt 22, and tensioning roller 61 is fixed at the middle part of pivot 62, and the both ends of pivot 62 articulate respectively on a rectangle slider 63 that corresponds, and rectangle slider 63 sliding connection is in the lower extreme inslot of I-shaped groove 12, and the upper end inslot of I-shaped groove 12 is fixed with cylinder 64, the piston rod and the rectangle slider 63 fixed connection of the vertical direction setting of cylinder 64.

The working principle is as follows: the two belt wheels 21 drive the belt 22 to rotate clockwise, and the belt 22 drives the grinding pad 23 to rotate simultaneously; the grinding fluid enters the liquid distribution pipe 51 through the liquid inlet pipe 52 and then drops on the grinding pad from the plurality of dropping holes 511, and the grinding fluid moves towards the wafer along with the grinding pad, so that the wafer is ground; the two supporting rollers can enable one section of the grinding pad in contact with the wafer to be in a horizontal device, so that the grinding efficiency can be improved, and the wafer can be ground more uniformly.

Finally, the above embodiments are only for illustrating the present invention and not for limiting the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that all equivalent technical solutions also belong to the scope of the present invention, and the scope of the present invention should be defined by the claims.

Claims

1. A belt-type chemical mechanical polishing device comprises a frame (1), and is characterized in that: two belt wheels (21) which are arranged in the same height in the left-right direction are hinged on the rack (1), clockwise transmission belts (22) are tensioned on the two belt wheels (21), and grinding pads (23) are fixed on the outer walls of the belts (22); a grinding head (3) is arranged above the middle of the two belt wheels (21), and a wafer (4) is fixed on the grinding head (3) and is opposite to a grinding pad (23); a grinding fluid dropper (5) is arranged on the left side of the grinding head (3).

2. The belt-type chemical mechanical polishing apparatus according to claim 1, wherein: the grinding fluid dropper (5) comprises a fluid distribution pipe (51) which stretches across the belt (22) in the front-back direction and a fluid inlet pipe (52) which is fixed on the fluid distribution pipe (51) and communicated with the fluid distribution pipe (51), and grinding fluid enters the fluid distribution pipe (51) through the fluid inlet pipe (52);

a plurality of dripping holes (511) arranged in the vertical direction are formed on the lower side wall of the liquid separating pipe (51).

3. The belt-type chemical mechanical polishing apparatus according to claim 1, wherein: two supporting rollers (24) which are arranged at the same height are arranged between the two belt wheels (21), and the belt (22) is pressed against the supporting rollers (24); the upper side wall of the supporting roller (24) is higher than that of the belt wheel (21); the grinding head (3) is positioned between two supporting rollers (24), and the supporting rollers (24) are hinged on the rack (1).

4. The belt-type chemical mechanical polishing apparatus according to claim 1, wherein: the grinding pad (23) is formed by combining a plurality of rectangular grinding pads which are arranged in a block shape, and the rectangular grinding pads are fixed on the belt (22).

5. The belt-type chemical mechanical polishing apparatus according to claim 1, wherein: the belt (22) is provided with a tensioning mechanism (6).

6. The belt-type chemical mechanical polishing apparatus according to claim 5, wherein: the rack (1) comprises two supporting plates (11) arranged in front and at back, and an I-shaped groove (12) is formed in each supporting plate (11);

straining device (6) are including pressing tensioning roller (61) on the lower half section inner wall of belt (22), and tensioning roller (61) are fixed at the middle part of pivot (62), and the both ends of pivot (62) articulate respectively on a rectangle slider (63) that corresponds, and rectangle slider (63) sliding connection is at the lower extreme inslot of I-shaped groove (12), and the upper end inslot of I-shaped groove (12) is fixed with cylinder (64), piston rod and rectangle slider (63) fixed connection that the vertical direction of cylinder (64) set up.