CN111941155A - Grinding pad processing method for eliminating grinding trace of glass surface - Google Patents
Grinding pad processing method for eliminating grinding trace of glass surface Download PDFInfo
- Publication number
- CN111941155A CN111941155A CN202010813324.2A CN202010813324A CN111941155A CN 111941155 A CN111941155 A CN 111941155A CN 202010813324 A CN202010813324 A CN 202010813324A CN 111941155 A CN111941155 A CN 111941155A
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- Prior art keywords
- grinding
- pad
- glass
- sponge layer
- grinding pad
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Links
- 239000011521 glass Substances 0.000 title claims abstract description 41
- 238000003672 processing method Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 239000002689 soil Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000007547 defect Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The invention discloses a grinding pad treatment method for eliminating grinding traces on a glass surface, which comprises the steps of fixing a grinding disc below a grinding disc bracket, and then adhering a high-density sponge layer with the thickness of 5-10 mm to the non-grinding surface of the grinding pad, wherein the density of the high-density sponge layer is 0.3 g/cm30.08, the water absorption is less than 20 percent of soil 10; then the high-density sponge layer is adhered to the bottom surface of the grinding disc, so that the grinding surface of the grinding pad faces downwards; the grinding disc drives the grinding pad to rotate and press down to the surface of the glass to be ground, the high-density sponge layer serves as a buffer layer, and the pressing pressure is gradually released in the pressing process of the grinding pad; the method optimizes the grinding pad, can alleviate the grinding defects caused by the impact of the grinding pad on the glass surface during the pressing and starting processes of the grinding head, and improves the grinding effect.
Description
Technical Field
The invention relates to the technical field of glass surface grinding, in particular to a grinding pad processing method for eliminating grinding traces of a glass surface.
Background
The traditional glass surface grinding technology grinding pad is larger than glass, can fully cover the glass surface, and the edge of the grinding pad does not contact the glass surface and the edge of the glass in the pressing and starting processes. Because the current 8.5 generation substrate glass has a large specification, and the maximum substrate size is 2250mmx2600mm, the diameter of the full-coverage grinding head is not less than 3000mm, which is difficult to be objectively realized. Therefore, the technological scheme of the multiple groups of grinding heads in parallel is adopted, the coverage rate of the area of the grinding head relative to the area of the glass is about 50-70%, and the grinding head does not completely cover the surface of the glass.
The surface grinding of the glass needs to use a grinding pad to grind the surface of the substrate glass, a plurality of groups of parallel grinding heads are adopted, the groups of parallel grinding heads are fixed on a grinding head support, and the grinding head support can move in parallel in two horizontal directions of an X axis and a Y axis. And the grinding head controls the lifting cylinder to move up and down by adopting an electro-hydraulic proportional valve in the Z-axis direction. The grinding head bottom adopts the abrasive disc support, and the abrasive disc uses fastening screw to fix on the abrasive disc support, and the grinding pad uses double-sided adhesive to paste on the abrasive disc. The glass substrate is fixed on the tray by using the adsorption pad in a relatively static state below.
During the pressing and starting of the polishing head, two polishing defects may occur due to the variation of the torque on the contact surface between the polishing pad and the glass:
1. the edge of the polishing pad may affect the uniformity of the polishing of the glass surface to produce curved polishing marks. The index characteristic of such a mark is that the glass microwaviness W value is large, and rainbow defects are formed after the liquid crystal panel is synthesized.
2. Meanwhile, the edge of the glass is impacted to generate a chip drop, the edge drop generates a hard scratch between the glass and the grinding pad, and the index characteristic of the scratch is that the scratch is visible by using a projection light method for inspection. An open circuit is formed when the liquid crystal panel is assembled.
In summary, the conventional surface polishing does not have the above two polishing defects because the polishing head can completely cover the glass surface. In the existing process scheme of the multi-group parallel grinding head, the coverage of the area of the grinding head relative to the area of the glass is about 50-70%, the grinding head does not fully cover the surface of the glass, and the grinding head may generate the two grinding defects in the pressing and starting processes. At present, the buffer of the adsorption pad is only used, so that the two defects caused by the impact of pressing and starting cannot be eliminated.
Disclosure of Invention
The invention aims to provide a method for processing a grinding pad for eliminating grinding traces on a glass surface, which optimizes the grinding pad, can alleviate the grinding defects caused by the impact of the grinding pad on the glass surface in the processes of pressing down and starting a grinding head, and optimizes the grinding effect.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a grinding pad treatment method for eliminating grinding traces on a glass surface comprises the steps of fixing a grinding disc below a grinding disc support, and then adhering a high-density sponge layer with the thickness of 5-10 mm to the non-grinding surface of the grinding pad, wherein the density of the high-density sponge is 0.3 g/cm30.08, the water absorption is less than 20 percent of soil 10; then the high-density sponge layer is adhered to the bottom surface of the grinding disc, so that the grinding surface of the grinding pad faces downwards;
the abrasive disc drives the abrasive pad to rotate and press down to the surface of the glass to be ground, and the high-density sponge layer is used as a buffer layer, and gradually releases the pressing pressure in the pressing process of the abrasive pad.
The high-density sponge grinding pad has the advantages that the high-density sponge with specific requirements is arranged between the grinding pad and the grinding disc, the grinding disc drives the grinding pad to rotate and press down to the surface of glass to be ground, the high-density sponge layer serves as a buffer layer, and the pressing pressure is gradually released in the pressing process of the grinding pad; therefore, excessive impact of the grinding pad on the surface and the edge of the glass is reduced in the starting and pressing processes of the grinding head, the generation of grinding defects is reduced, and the surface quality of the glass after surface grinding is effectively improved.
Drawings
The invention is further illustrated with reference to the following figures and examples:
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a graph of a defect location distribution for glass ground using a conventional method;
FIG. 3 is a graph of the location distribution of glass defects polished by the present method.
Detailed Description
As shown in figure 1, the invention provides a method for processing a grinding pad for eliminating grinding traces on a glass surface, which comprises the steps of firstly fixing a grinding disc 1 below a grinding disc bracket 2, and then pasting a high-density sponge layer 4 with the thickness of 5-10 mm on the non-grinding surface of the grinding pad 3, wherein the density of the high-density sponge layer 4 is 0.3 g/cm30.08, the water absorption is less than 20 percent of soil 10; then the high-density sponge layer 4 is stuck on the bottom surface of the grinding disc 1, so that the grinding surface of the grinding pad 3 faces downwards;
the grinding disc 1 drives the grinding pad 3 to rotate and press down to the surface of the glass to be ground, and the high-density sponge layer is used as a buffer layer and gradually releases the pressing pressure in the pressing process of the grinding pad.
As shown in fig. 2 and fig. 3, the glass surface has obvious defects after being polished by the conventional method, and the glass surface has no obvious grinding marks on the whole after being polished by the polishing pad treated by the invention.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; those skilled in the art can make numerous possible variations and modifications to the present teachings, or modify equivalent embodiments to equivalent variations, without departing from the scope of the present teachings, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention.
Claims (1)
1. A grinding pad treatment method for eliminating grinding traces on a glass surface is characterized in that a grinding disc is fixed below a grinding disc support, then a high-density sponge layer with the thickness of 5-10 mm is pasted on a non-grinding surface of the grinding pad, and the density of the high-density sponge layer is 0.3 g/cm30.08, the water absorption is less than 20 percent of soil 10; then the high-density sponge layer is adhered to the bottom surface of the grinding disc, so that the grinding surface of the grinding pad faces downwards;
the abrasive disc drives the abrasive pad to rotate and press down to the surface of the glass to be ground, and the high-density sponge layer is used as a buffer layer, and gradually releases the pressing pressure in the pressing process of the abrasive pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010813324.2A CN111941155A (en) | 2020-08-13 | 2020-08-13 | Grinding pad processing method for eliminating grinding trace of glass surface |
Applications Claiming Priority (1)
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---|---|---|---|
CN202010813324.2A CN111941155A (en) | 2020-08-13 | 2020-08-13 | Grinding pad processing method for eliminating grinding trace of glass surface |
Publications (1)
Publication Number | Publication Date |
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CN111941155A true CN111941155A (en) | 2020-11-17 |
Family
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Family Applications (1)
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CN202010813324.2A Pending CN111941155A (en) | 2020-08-13 | 2020-08-13 | Grinding pad processing method for eliminating grinding trace of glass surface |
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CN (1) | CN111941155A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113714928A (en) * | 2021-08-23 | 2021-11-30 | 武汉华星光电半导体显示技术有限公司 | Grinding disk and substrate cleaning device |
CN114434321A (en) * | 2021-12-29 | 2022-05-06 | 蚌埠中光电科技有限公司 | Auxiliary frame capable of reducing grinding trace and protecting glass edge for surface grinding |
KR102731423B1 (en) * | 2021-08-23 | 2024-11-19 | 우한 차이나 스타 옵토일렉트로닉스 세미컨덕터 디스플레이 테크놀로지 컴퍼니 리미티드 | Polishing disc and substrate cleaning device |
Citations (10)
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CN1105618A (en) * | 1992-12-31 | 1995-07-26 | Bbf山手株式会社 | Polishing method, device and buff wheel therefor |
US6287175B1 (en) * | 1999-07-01 | 2001-09-11 | Nihon Micro Coating Co., Ltd. | Method of mirror-finishing a glass substrate |
US20040180611A1 (en) * | 2003-02-12 | 2004-09-16 | Hirokazu Tajima | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method |
JP2005335014A (en) * | 2004-05-27 | 2005-12-08 | Disco Abrasive Syst Ltd | Wafer grinding method and grinding wheel |
TW200815158A (en) * | 2006-09-26 | 2008-04-01 | Au Optronics Corp | Polishing system and polishing method |
JP2013136122A (en) * | 2011-12-28 | 2013-07-11 | Shin Etsu Handotai Co Ltd | Grinding device and grinding method |
CN107107309A (en) * | 2015-01-19 | 2017-08-29 | 株式会社荏原制作所 | The analogy method and polishing grinding device of amount of grinding in polishing grinding processing |
CN206550839U (en) * | 2017-03-14 | 2017-10-13 | 金成俊 | A kind of sponge grinding pad |
CN208409551U (en) * | 2018-07-17 | 2019-01-22 | 郑州龙达磨料磨具有限公司 | A kind of diamond concave grinding pad |
CN110281102A (en) * | 2019-06-24 | 2019-09-27 | 京东方科技集团股份有限公司 | Wiper mechanism and cleaning method |
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2020
- 2020-08-13 CN CN202010813324.2A patent/CN111941155A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1105618A (en) * | 1992-12-31 | 1995-07-26 | Bbf山手株式会社 | Polishing method, device and buff wheel therefor |
US6287175B1 (en) * | 1999-07-01 | 2001-09-11 | Nihon Micro Coating Co., Ltd. | Method of mirror-finishing a glass substrate |
US20040180611A1 (en) * | 2003-02-12 | 2004-09-16 | Hirokazu Tajima | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method |
JP2005335014A (en) * | 2004-05-27 | 2005-12-08 | Disco Abrasive Syst Ltd | Wafer grinding method and grinding wheel |
TW200815158A (en) * | 2006-09-26 | 2008-04-01 | Au Optronics Corp | Polishing system and polishing method |
JP2013136122A (en) * | 2011-12-28 | 2013-07-11 | Shin Etsu Handotai Co Ltd | Grinding device and grinding method |
CN107107309A (en) * | 2015-01-19 | 2017-08-29 | 株式会社荏原制作所 | The analogy method and polishing grinding device of amount of grinding in polishing grinding processing |
CN206550839U (en) * | 2017-03-14 | 2017-10-13 | 金成俊 | A kind of sponge grinding pad |
CN208409551U (en) * | 2018-07-17 | 2019-01-22 | 郑州龙达磨料磨具有限公司 | A kind of diamond concave grinding pad |
CN110281102A (en) * | 2019-06-24 | 2019-09-27 | 京东方科技集团股份有限公司 | Wiper mechanism and cleaning method |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113714928A (en) * | 2021-08-23 | 2021-11-30 | 武汉华星光电半导体显示技术有限公司 | Grinding disk and substrate cleaning device |
WO2023024190A1 (en) * | 2021-08-23 | 2023-03-02 | 武汉华星光电半导体显示技术有限公司 | Grinding disk and substrate cleaning device |
JP2023542258A (en) * | 2021-08-23 | 2023-10-06 | 武漢華星光電半導体顕示技術有限公司 | Polishing disk and substrate cleaning equipment |
JP7541079B2 (en) | 2021-08-23 | 2024-08-27 | 武漢華星光電半導体顕示技術有限公司 | Abrasive discs and substrate cleaning devices |
KR102731423B1 (en) * | 2021-08-23 | 2024-11-19 | 우한 차이나 스타 옵토일렉트로닉스 세미컨덕터 디스플레이 테크놀로지 컴퍼니 리미티드 | Polishing disc and substrate cleaning device |
CN114434321A (en) * | 2021-12-29 | 2022-05-06 | 蚌埠中光电科技有限公司 | Auxiliary frame capable of reducing grinding trace and protecting glass edge for surface grinding |
CN114434321B (en) * | 2021-12-29 | 2023-03-31 | 蚌埠中光电科技有限公司 | Auxiliary frame capable of reducing grinding trace and protecting glass edge for surface grinding |
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Application publication date: 20201117 |
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