CN111849376A - Heat dissipation type foam adhesive tape and preparation method thereof - Google Patents
Heat dissipation type foam adhesive tape and preparation method thereof Download PDFInfo
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- CN111849376A CN111849376A CN202010765577.7A CN202010765577A CN111849376A CN 111849376 A CN111849376 A CN 111849376A CN 202010765577 A CN202010765577 A CN 202010765577A CN 111849376 A CN111849376 A CN 111849376A
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- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 128
- 239000006260 foam Substances 0.000 title claims abstract description 67
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 46
- 238000000576 coating method Methods 0.000 claims abstract description 46
- 239000012790 adhesive layer Substances 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 34
- 239000004642 Polyimide Substances 0.000 claims abstract description 27
- 229920001721 polyimide Polymers 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000013329 compounding Methods 0.000 claims abstract description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 36
- 239000003522 acrylic cement Substances 0.000 claims description 27
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000011265 semifinished product Substances 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000007865 diluting Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000009775 high-speed stirring Methods 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 6
- 238000011084 recovery Methods 0.000 description 5
- 229920000742 Cotton Polymers 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to the field of foam tapes, in particular to a heat dissipation type foam tape which comprises a foam layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a polyimide coating, a copper foil and a release film, wherein the foam layer is arranged on the first heat dissipation adhesive layer; the first heat dissipation adhesive layer is arranged on the upper surface of the foam layer; the second heat dissipation adhesive layer is arranged on the lower surface of the foam layer; the polyimide coating is arranged on the lower surface of the copper foil and is arranged on the upper surface of the first heat dissipation adhesive layer; the release film is arranged on the lower surface of the second heat dissipation adhesive layer, so that the heat dissipation effect of the heat dissipation type foam adhesive tape is good, and the practicability is high; the invention also provides a preparation method of the heat dissipation type foam adhesive tape, which reduces the compounding process, effectively reduces the loss in the processing process, simplifies the structure of the use layer, and improves the production efficiency and labor cost of terminal customers.
Description
Technical Field
The invention relates to the field of foam tapes, in particular to a heat dissipation type foam tape and a preparation method thereof.
Background
The adhesive tape is one of tools commonly used for fixing and shielding in daily life and work, and can be classified into a high-temperature adhesive tape, a PET double-sided adhesive tape, a conductive adhesive tape, a light-shielding adhesive tape, a pressure-sensitive adhesive tape, a die-cutting adhesive tape, a shielding adhesive tape, and the like according to functions thereof.
The single foam has no bonding function, needs gum, has complicated gum process, is easy to deform and has poor heat dissipation function; the single reticulate pattern adhesive tape is thick in meshes, cannot recover automatically, is single in function, does not have a heat dissipation function, and cannot reach the use standard that bonding that both can exhaust and can stabilize and have a heat dissipation function.
The existing product is used independently in foam and reticulated rubber, and the acrylic acid foam alone is soft, is not easy to position when in use and is heat-insulating; if the acrylic acid foam is compounded with the grid double faced adhesive tape, the adhesive layer and the foam are layered and separated, the heat dissipation of electronic parts is not facilitated, and the foam and a glue layer bonded with the foam are defective.
Disclosure of Invention
In order to solve the technical problems, the invention provides the heat dissipation type foam adhesive tape with good heat dissipation effect and strong practicability.
The invention also provides a preparation method of the heat dissipation type foam adhesive tape, which reduces the compounding process, effectively reduces the loss in the processing process, simplifies the structure of the use layer, and improves the production efficiency and labor cost of terminal customers.
The invention adopts the following technical scheme:
a heat dissipation type foam adhesive tape comprises a foam layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a polyimide coating, a copper foil and a release film; the first heat dissipation adhesive layer is arranged on the upper surface of the foam layer; the second heat dissipation adhesive layer is arranged on the lower surface of the foam layer; the polyimide coating is arranged on the lower surface of the copper foil and is arranged on the upper surface of the first heat dissipation adhesive layer; the release film is arranged on the lower surface of the second heat dissipation adhesive layer.
The technical proposal is further improved in that the foam layer is a black acrylic foam layer.
The technical scheme is further improved in that the first heat dissipation adhesive layer and the second heat dissipation adhesive layer are both high-fluidity heat dissipation acrylic acid adhesives.
The technical scheme is further improved in that the high-fluidity heat-dissipation acrylic adhesive is prepared from acrylic glue, a heat-dissipation material, a leveling auxiliary agent, an isocyanate curing agent and a diluting solvent according to the mass ratio of (50-60): (5-10): (5-10): (1-5): (10-15) mixing to form; the heat dissipation material is one of aluminum oxide and graphene.
The technical proposal is further improved in that the release film is a special grid release film.
The technical proposal is further improved that the thickness of the foam layer is 80-150 μm; the thickness of the first heat dissipation glue layer is 5-15 mu m; the thickness of the second heat dissipation glue layer is 10-25 mu m; the thickness of the polyimide coating is 5-20 μm; the thickness of the copper foil is 12-35 μm; the thickness of the release film is 80-180 mu m.
A preparation method of a heat dissipation type foam adhesive tape comprises the following steps:
preparing a high-fluidity heat-dissipation acrylic adhesive;
coating a high-fluidity heat-dissipation acrylic acid adhesive on the upper surface of the special reticulate release film, adhering black acrylic acid foam on the upper surface of the high-fluidity heat-dissipation acrylic acid adhesive, and rolling to form a semi-finished product;
and coating a polyimide coating on the lower surface of the copper foil, coating a high-fluidity heat-dissipation acrylic adhesive on the lower surface of the polyimide coating, compounding the high-fluidity heat-dissipation acrylic adhesive with the semi-finished product, and rolling to obtain the heat-dissipation foam adhesive tape.
The technical scheme is further improved in that the preparation method of the high-fluidity heat-dissipation acrylic adhesive comprises the following steps:
adding the components into a high-speed stirring dispersion machine according to the proportion, keeping the stirring speed at 800-1000 revolutions per minute, stirring for 20-30min, standing and filtering to obtain the high-fluidity heat-dissipation acrylic adhesive.
The technical scheme is further improved in that a high-fluidity heat-dissipation acrylic adhesive is coated on the upper surface of the special reticulate pattern release film, black acrylic foam is attached to the upper surface of the high-fluidity heat-dissipation acrylic adhesive, the thickness of the adhesive layer is set through coating by a scraper, the adhesive layer passes through a high-temperature oven, the temperature of the oven is 75-105 ℃, the baking time is 2-5min, and the semi-finished product is formed through rolling.
The technical proposal is further improved in that the lower surface of the copper foil is coated with a polyimide coating and is cured at a high temperature of 150-180 ℃; coating a high-fluidity heat-dissipation acrylic acid adhesive on the lower surface of the polyimide coating, coating a scraper with a set adhesive layer thickness, compounding with the semi-finished product, passing through a high-temperature oven at 75-105 ℃ for 2-5min, rolling to obtain the heat-dissipation foam adhesive tape, and curing at 50 ℃ for 72 h.
The invention has the beneficial effects that:
the invention adopts high-fluidity acrylic adhesive, cooperates with auxiliary agents (such as aluminum oxide, graphene and other heat dissipation materials) with heat dissipation function to prepare the high-fluidity modified acrylic adhesive with heat dissipation function according to a certain proportion, black acrylic acid is used as a base material, acrylic pressure-sensitive adhesive is coated on two sides to prepare a black double-sided adhesive tape, one side of the double-sided adhesive tape is attached by a special reticulate release film material, so that the adhesive tape has reticulate exhaust and self-recovery characteristics and is accompanied with heat dissipation function; the non-grid surface is compounded with the copper foil with the polyimide coating, so that the copper foil has an excellent heat dissipation function; black acrylic acid bubble cotton adds has the function that the shading shielded and has excellent shock resistance, and its advantage of net face of glue will possess from recovery, radiating function, has good shielding performance and adhesive property moreover, and weatherability can, resistant high low temperature performance has effectively solved the risk of bubble cotton with the glue film separation, has also reduced compound process, effectively reduces the loss of course of working, simplifies the structure on use layer, improves terminal customer production efficiency and cost of labor.
Drawings
Fig. 1 is a schematic structural view of the heat dissipation foam tape of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention.
As shown in fig. 1, a heat dissipation type foam tape includes a foam layer 10, a first heat dissipation adhesive layer 20, a second heat dissipation adhesive layer 30, a polyimide coating layer 40, a copper foil 50, and a release film 60; the first heat dissipation adhesive layer 20 is arranged on the upper surface of the foam layer 10; the second heat dissipation adhesive layer 30 is arranged on the lower surface of the foam layer 10; the polyimide coating 40 is disposed on the lower surface of the copper foil 50, and the polyimide coating 40 is disposed on the upper surface of the first heat dissipation adhesive layer 20; the release film 60 is disposed on the lower surface of the second heat dissipation glue layer 30.
The foam layer 10 is a black acrylic foam layer 10. The black acrylic acid foam has the functions of shading, covering flaws and buffering, and the practicability of the product is improved.
The first heat dissipation adhesive layer 20 and the second heat dissipation adhesive layer 30 are both high-fluidity heat dissipation acrylic adhesives; the high-fluidity heat-dissipation acrylic adhesive has the functions of heat dissipation, high adhesion, self-leveling and self-recovery, effectively improves the heat dissipation performance of the product, and has strong practicability.
The high-fluidity heat-dissipation acrylic adhesive is prepared from acrylic glue, a heat-dissipation material, a leveling auxiliary agent, an isocyanate curing agent and a diluting solvent according to the mass ratio of (50-60): (5-10): (5-10): (1-5): (10-15) mixing to form; the heat dissipation material is one of aluminum oxide and graphene.
The release film 60 is a special grid release film 60. The special grid release film 60 has the functions of embossing and carrying adhesive tape, and has the function of heat dissipation, so that the heat dissipation effect of the product is improved.
The thickness of the foam layer 10 is 80-150 μm; the thickness of the first heat dissipation glue layer 20 is 5-15 μm; the thickness of the second heat dissipation glue layer 30 is 10-25 μm; the thickness of the polyimide coating 40 is 5-20 μm; the thickness of the copper foil 50 is 12-35 μm; the thickness of the release film 60 is 80-180 μm; the copper foil 50 has a good heat conduction effect, and the heat dissipation effect of the product is further improved; the polyimide coating 40 has good electrical insulation, chemical resistance, further improving the practicality of the product.
A preparation method of a heat dissipation type foam adhesive tape comprises the following steps:
preparing a high-fluidity heat-dissipation acrylic adhesive;
coating a high-fluidity heat-dissipation acrylic adhesive on the upper surface of the special reticulated release film 60, adhering black acrylic foam on the upper surface of the high-fluidity heat-dissipation acrylic adhesive, and rolling to form a semi-finished product;
and coating a polyimide coating 40 on the lower surface of the copper foil 50, coating a high-fluidity heat-dissipation acrylic adhesive on the lower surface of the polyimide coating 40, compounding with a semi-finished product, and rolling to obtain the heat-dissipation foam adhesive tape.
The preparation method of the high-fluidity heat-dissipation acrylic adhesive comprises the following steps:
adding the components into a high-speed stirring dispersion machine according to the proportion, keeping the stirring speed at 800-1000 revolutions per minute, stirring for 20-30min, standing and filtering to obtain the high-fluidity heat-dissipation acrylic adhesive.
Coating a high-fluidity heat-dissipation acrylic acid adhesive on the upper surface of the special reticulate pattern release film 60, adhering black acrylic acid foam on the upper surface of the high-fluidity heat-dissipation acrylic acid adhesive, coating the adhesive layer with a scraper to set the thickness of the adhesive layer, passing through a high-temperature oven with the oven temperature of 75-105 ℃ and the baking time of 2-5min, and rolling to form a semi-finished product.
Coating a polyimide coating 40 on the lower surface of the copper foil 50, and carrying out high-temperature curing at 150-180 ℃; coating a high-fluidity heat-dissipation acrylic acid adhesive on the lower surface of the polyimide coating 40, coating a scraper with a set adhesive layer thickness, compounding with the semi-finished product, passing through a high-temperature oven at the oven temperature of 75-105 ℃ for 2-5min, rolling to obtain the heat-dissipation foam adhesive tape, and curing at 50 ℃ for 72 h.
The invention adopts high-fluidity acrylic adhesive, cooperates with auxiliary agents (such as heat dissipation materials like alumina, graphene and the like) with heat dissipation function to prepare the high-fluidity modified acrylic adhesive with heat dissipation function according to a certain proportion, black acrylic acid is used as a base material, acrylic pressure-sensitive adhesive is coated on two surfaces to prepare a black double-sided adhesive tape, one surface of the double-sided adhesive tape is attached by a special reticulate release film 60 material, so that the adhesive tape has reticulate exhaust and self-recovery characteristics and is accompanied with heat dissipation function; the non-grid surface is compounded with the copper foil 50 with the polyimide coating 40, so that the excellent heat dissipation function is endowed; black acrylic acid bubble cotton adds has the function that the shading shielded and has excellent shock resistance, and its advantage of net face of glue will possess from recovery, radiating function, has good shielding performance and adhesive property moreover, and weatherability can, resistant high low temperature performance has effectively solved the risk of bubble cotton with the glue film separation, has also reduced compound process, effectively reduces the loss of course of working, simplifies the structure on use layer, improves terminal customer production efficiency and cost of labor.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A heat dissipation type foam adhesive tape is characterized by comprising a foam layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a polyimide coating, a copper foil and a release film; the first heat dissipation adhesive layer is arranged on the upper surface of the foam layer; the second heat dissipation adhesive layer is arranged on the lower surface of the foam layer; the polyimide coating is arranged on the lower surface of the copper foil and is arranged on the upper surface of the first heat dissipation adhesive layer; the release film is arranged on the lower surface of the second heat dissipation adhesive layer.
2. The heat dissipating foam tape of claim 1, wherein the foam layer is a black acrylic foam layer.
3. The heat dissipation type foam tape of claim 1, wherein the first heat dissipation adhesive layer and the second heat dissipation adhesive layer are both high-fluidity heat dissipation acrylic adhesives.
4. The heat dissipation type foam adhesive tape according to claim 3, wherein the high-fluidity heat dissipation acrylic adhesive is prepared from an acrylic adhesive, a heat dissipation material, a leveling assistant, an isocyanate curing agent and a diluting solvent in a mass ratio of (50-60): (5-10): (5-10): (1-5): (10-15) mixing to form; the heat dissipation material is one of aluminum oxide and graphene.
5. The heat dissipation type foam tape according to claim 1, wherein the release film is a special mesh release film.
6. The heat dissipation foam tape of claim 1, wherein the foam layer has a thickness of 80-150 μ ι η; the thickness of the first heat dissipation glue layer is 5-15 mu m; the thickness of the second heat dissipation glue layer is 10-25 mu m; the thickness of the polyimide coating is 5-20 μm; the thickness of the copper foil is 12-35 μm; the thickness of the release film is 80-180 mu m.
7. The preparation method of the heat dissipation foam tape as claimed in any one of claims 1 to 6, wherein the method comprises the following steps:
preparing a high-fluidity heat-dissipation acrylic adhesive;
coating a high-fluidity heat-dissipation acrylic acid adhesive on the upper surface of the special reticulate release film, adhering black acrylic acid foam on the upper surface of the high-fluidity heat-dissipation acrylic acid adhesive, and rolling to form a semi-finished product;
and coating a polyimide coating on the lower surface of the copper foil, coating a high-fluidity heat-dissipation acrylic adhesive on the lower surface of the polyimide coating, compounding the high-fluidity heat-dissipation acrylic adhesive with the semi-finished product, and rolling to obtain the heat-dissipation foam adhesive tape.
8. The method for preparing the heat dissipation type foam adhesive tape according to claim 7, wherein the high-fluidity heat dissipation acrylic adhesive is prepared by the following steps:
adding the components into a high-speed stirring dispersion machine according to the proportion, keeping the stirring speed at 800-1000 revolutions per minute, stirring for 20-30min, standing and filtering to obtain the high-fluidity heat-dissipation acrylic adhesive.
9. The preparation method of the heat dissipation type foam adhesive tape according to claim 7, wherein a high-fluidity heat dissipation acrylic acid adhesive is coated on the upper surface of the special reticulated release film, black acrylic acid foam is attached to the upper surface of the high-fluidity heat dissipation acrylic acid adhesive, the thickness of the adhesive layer is set by coating with a scraper, the adhesive layer is rolled into a semi-finished product through a high-temperature oven at 75-105 ℃ for 2-5 min.
10. The method for preparing the heat dissipation type foam adhesive tape as claimed in claim 7, wherein the polyimide coating is coated on the lower surface of the copper foil, and the curing is performed at 150-180 ℃; coating a high-fluidity heat-dissipation acrylic acid adhesive on the lower surface of the polyimide coating, coating a scraper with a set adhesive layer thickness, compounding with the semi-finished product, passing through a high-temperature oven at 75-105 ℃ for 2-5min, rolling to obtain the heat-dissipation foam adhesive tape, and curing at 50 ℃ for 72 h.
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| CN202010765577.7A CN111849376A (en) | 2020-08-03 | 2020-08-03 | Heat dissipation type foam adhesive tape and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113570967A (en) * | 2021-07-08 | 2021-10-29 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and flexible display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208200824U (en) * | 2018-04-17 | 2018-12-07 | 厦门海洋南方特种光电材料有限公司 | A kind of graphene Heat dissipation adhesive tape with buffering effect |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN208200824U (en) * | 2018-04-17 | 2018-12-07 | 厦门海洋南方特种光电材料有限公司 | A kind of graphene Heat dissipation adhesive tape with buffering effect |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113570967A (en) * | 2021-07-08 | 2021-10-29 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and flexible display device |
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