CN111710772A - LED lamp bead and dispensing method thereof - Google Patents
LED lamp bead and dispensing method thereof Download PDFInfo
- Publication number
- CN111710772A CN111710772A CN202010429227.3A CN202010429227A CN111710772A CN 111710772 A CN111710772 A CN 111710772A CN 202010429227 A CN202010429227 A CN 202010429227A CN 111710772 A CN111710772 A CN 111710772A
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- Prior art keywords
- fluorescent powder
- led
- glue
- phosphor
- led lamp
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- 239000011324 bead Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 148
- 239000003292 glue Substances 0.000 claims abstract description 57
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000741 silica gel Substances 0.000 claims abstract description 31
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 31
- 238000002156 mixing Methods 0.000 claims abstract description 23
- 239000000499 gel Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 13
- 239000013078 crystal Substances 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 47
- 230000001376 precipitating effect Effects 0.000 claims description 3
- 230000005284 excitation Effects 0.000 abstract description 11
- 239000003086 colorant Substances 0.000 abstract description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED lamp bead and a dispensing method thereof, wherein the dispensing method of the LED lamp bead is characterized in that a first fluorescent powder glue is formed by mixing solid crystal silica gel and first fluorescent powder according to a preset proportion; then coating the first fluorescent powder glue with a preset area on the bottom of the LED support bowl cup, and fixing an LED chip on the first fluorescent powder glue; mixing the LED packaging silica gel with second fluorescent powder to form second fluorescent powder gel; and then injecting the second fluorescent powder glue into the bracket bowl cup which is subjected to die bonding and wire bonding, so that the second fluorescent powder glue covers the LED chip in the bracket bowl cup, and separating the fluorescent powder with different colors into different kinds of fluorescent powder, thereby effectively solving the problem of multiple excitation when the blue light chip excites the fluorescent powder to emit light and further improving the light emitting efficiency of the LED lamp bead.
Description
Technical Field
The invention relates to the technical field of LED dispensing, in particular to an LED lamp bead and a dispensing method thereof.
Background
The existing white light products are all excited and mixed by using a blue light chip and fluorescent powder to emit white light, in the process of producing and manufacturing an LED lamp bead, yellow-green fluorescent powder and red fluorescent powder are mixed to be sealed, the light emitting mechanism of the obtained LED lamp bead is that after the blue light chip emits blue light, a part of the blue light excites the yellow-green fluorescent powder to emit yellow-green light, a part of the blue light excites the red fluorescent powder to emit red light, and then the blue light emitted by the blue light chip, the red light emitted by the blue light excited fluorescent powder and the yellow-green light are mixed to form white light; however, the yellow-green fluorescent powder and the red fluorescent powder are mixed and then sealed, the blue light excites the yellow-green fluorescent powder to emit yellow-green light in the actual light emitting process, the excited yellow-green light excites the red fluorescent powder to emit red light, and thus the excited yellow-green fluorescent powder repeatedly excites the red fluorescent powder to cause multiple excitation, so that the overall light efficiency of the LED lamp bead is reduced.
Thus, the prior art has yet to be improved and enhanced.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide the LED lamp bead and the dispensing method thereof, and the fluorescent powder with different colors is separated into the dispensing powder, so that the problem of multiple excitation when the blue light chip excites the fluorescent powder to emit light can be effectively solved, and the light emitting efficiency of the LED lamp bead is improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a dispensing method of LED lamp beads comprises the following steps:
mixing the solid crystal silica gel and the first fluorescent powder according to a preset proportion to form first fluorescent powder gel;
coating the first fluorescent powder glue with a preset area at the bottom of the LED support bowl cup, and fixing an LED chip on the first fluorescent powder glue;
mixing the LED packaging silica gel with second fluorescent powder to form second fluorescent powder gel;
and injecting the second fluorescent powder glue into the bracket bowl with the die bonding and wire bonding completed, so that the second fluorescent powder glue covers the LED chip in the bracket bowl.
In the method for dispensing the LED lamp bead, the step of injecting the second phosphor glue into the bracket cup after die bonding and wire bonding are completed, so that the step of covering the LED chip in the bracket cup with the second phosphor glue is completed further includes:
and carrying out centrifugal treatment on the support bowl cup, and precipitating the second fluorescent powder to the surface of the LED chip and the bottom of the LED support bowl cup.
In the method for dispensing the LED lamp bead, the step of mixing the die bond silica gel and the first fluorescent powder to form the first fluorescent powder glue comprises the following steps:
and mixing the solid crystal silica gel and the first fluorescent powder according to a ratio of 10:1 to form the first fluorescent powder gel.
In the method for dispensing the LED lamp bead, the step of mixing the die bond silica gel and the first fluorescent powder to form the first fluorescent powder glue comprises the following steps:
and mixing the solid crystal silica gel and the first fluorescent powder according to the proportion of 100:1 to form the first fluorescent powder gel.
In the LED lamp bead dispensing method, the step of coating the first fluorescent powder glue with a preset area at the bottom of the LED support bowl cup and fixing the LED chip on the first fluorescent powder glue comprises the following steps:
coating the first fluorescent powder glue with the area equal to the bottom surface of the LED chip on the bottom of the LED support bowl cup;
and fixing the LED chip on the first fluorescent powder.
In the dispensing method of the LED lamp bead, the first fluorescent powder comprises red fluorescent powder.
In the dispensing method of the LED lamp bead, the second fluorescent powder comprises yellow-green fluorescent powder.
An LED lamp bead is sealed by the glue dispensing method.
Compared with the prior art, the LED lamp bead and the dispensing method thereof provided by the invention have the advantages that the dispensing method of the LED lamp bead mixes the die bond silica gel and the first fluorescent powder according to a preset proportion to form the first fluorescent powder glue; then coating the first fluorescent powder glue with a preset area on the bottom of the LED support bowl cup, and fixing an LED chip on the first fluorescent powder glue; mixing the LED packaging silica gel with second fluorescent powder to form second fluorescent powder gel; and then injecting the second fluorescent powder glue into the bracket bowl cup which is subjected to die bonding and wire bonding, so that the second fluorescent powder glue covers the LED chip in the bracket bowl cup, and separating the fluorescent powder with different colors into different kinds of fluorescent powder, thereby effectively solving the problem of multiple excitation when the blue light chip excites the fluorescent powder to emit light and further improving the light emitting efficiency of the LED lamp bead.
Drawings
Fig. 1 is a flow chart of a dispensing method of an LED lamp bead provided by the present invention;
fig. 2 is a flowchart of step S200 in the method for dispensing an LED lamp bead provided by the present invention;
fig. 3 is a structural schematic diagram of the LED lamp bead provided by the present invention.
Detailed Description
In view of the defects of the prior art, the invention aims to provide the LED lamp bead and the dispensing method thereof, and the fluorescent powder with different colors is separated to be dispensed, so that the problem of multiple excitation when the blue light chip excites the fluorescent powder to emit light can be effectively solved, and the light emitting efficiency of the LED lamp bead is improved.
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the method for dispensing an LED provided by the present invention includes the following steps:
s100, mixing the solid crystal silica gel and first fluorescent powder according to a preset proportion to form first fluorescent powder gel;
s200, coating the first fluorescent powder glue with a preset area at the bottom of the LED support bowl cup, and fixing an LED chip on the first fluorescent powder glue;
s300, mixing the LED packaging silica gel with second fluorescent powder to form second fluorescent powder gel;
s400, injecting the second fluorescent powder glue into the bracket cup after die bonding and wire bonding are completed, so that the second fluorescent powder glue covers the LED chip in the bracket cup.
In the process of manufacturing the LED white light, after the bracket bowl of the LED lamp bead is dehumidified, the solid crystal silica gel and the first fluorescent powder are mixed according to a preset proportion to obtain a first fluorescent powder adhesive, the first fluorescent powder adhesive is coated on the bottom of the bracket bowl, and then an LED chip is fixed on the first fluorescent powder adhesive; in the traditional die bonding operation, the die bonding silica gel is directly coated, and the operation of mixing the first fluorescent powder in the die bonding silica gel in the application is not available, so that the die bonding operation by using the first fluorescent powder glue is not available.
In the subsequent glue sealing process after the die bonding is finished, mixing the LED packaging silica gel with the second fluorescent powder to obtain a second fluorescent powder colloid, then injecting the second fluorescent powder into the bracket bowl cup which finishes the die bonding and the wire bonding, wherein the second fluorescent powder colloid completely covers the LED chip and fills the bracket bowl cup, compared with the traditional method of directly mixing the two fluorescent powders and then filling the bracket bowl cup for glue sealing, the two fluorescent powders are separately processed in the application, the first fluorescent powder is positioned at the bottom of the LED chip along with the first fluorescent powder colloid, the second fluorescent powder is positioned on the surface of the LED chip and around the LED chip along with the second fluorescent powder colloid, so that the two fluorescent powders are separated in the bracket bowl cup, and the first fluorescent powder is excited from the bottom to emit light after the LED chip emits light, the second fluorescent powder is excited to emit light from the top and the periphery, so that the problem of multiple excitation after two kinds of fluorescent powder are mixed and sealed by glue is solved, and the luminous efficiency is improved.
Further, the step S400 is followed by the step of:
s500, carrying out centrifugal treatment on the support bowl cup, and precipitating the second fluorescent powder to the surface of the LED chip and the bottom of the LED support bowl cup.
In this embodiment, the bracket cup filled with the second phosphor paste is centrifuged to precipitate the first phosphor in the first phosphor paste and the second phosphor in the second phosphor paste, and the corresponding first phosphor is precipitated to the bottom of the LED chip, and the second phosphor is precipitated to the bottom of the bracket cup and the upper surface of the LED chip, so that the LED chip can emit light from the excitation of the bottom of the bracket cup and the excitation of the LED chip from the upper surface of the LED chip and the surrounding of the LED chip and the second phosphor emits light, so as to separate the two phosphors and avoid multiple excitation. In addition, after the second fluorescent powder glue is filled, the centrifugal treatment enables the first fluorescent powder and the second fluorescent powder to be precipitated, so that the addition of an anti-precipitation agent can be reduced, and the transparent silica gel can be atomized due to the addition of the anti-precipitation agent, so that the transparency of the solid silica gel and the LED packaging silica gel can be improved; just first phosphor powder with can help after the second phosphor powder deposits will the luminous heat direction of LED chip the bottom of support bowl cup, because the bottom parcel of support bowl cup has the copper pad, will luminous heat direction the copper pad is favorable to the heat dissipation of LED lamp pearl, and then has improved the heat-sinking capability of LED lamp pearl.
Further, the step S100 includes:
s110, mixing the solid crystal silica gel and the first fluorescent powder according to a ratio of 10:1 to form the first fluorescent powder gel.
In this embodiment, when the first phosphor glue is prepared, the amount of the mixed first phosphor cannot be too much, and the too much amount of the first phosphor will affect the die bonding effect, so as to prevent the LED chip from being fixed insufficiently.
Further, the step S100 includes:
s120, mixing the solid crystal silica gel and the first fluorescent powder according to the proportion of 100:1 to form the first fluorescent powder gel.
In this embodiment, the die bond silica gel and the first phosphor are mixed in a ratio of 100:1 to form the first phosphor gel, so that the ratio of the die bond silica gel can be further increased to avoid the influence of the amount of the first phosphor, and the LED chip can be more firmly fixed.
Further, referring to fig. 2, the step S200 includes:
s210, coating the first fluorescent powder glue with the area equal to the bottom surface of the LED chip on the bottom of the LED support bowl cup;
s220, fixing the LED chip on the first fluorescent powder glue.
In this embodiment, after the support bowl cup removes the tide the bottom surface area of the bottom coating of support bowl cup equals with the LED chip first phosphor glue, the primary function that first phosphor glue lies in fixedly the LED chip, consequently the coating with the equal area in bottom surface of LED chip first phosphor glue can guarantee first phosphor glue with the area of contact of LED chip bottom surface for the solid brilliant more firm of LED chip can avoid again first phosphor glue quantity is too big to cause the waste.
Furthermore, the first fluorescent powder comprises red fluorescent powder, the second fluorescent powder comprises yellow-green fluorescent powder, the red fluorescent powder is positioned at the bottom of the LED chip along with the first fluorescent powder, the yellow-green fluorescent powder is positioned on the surface and around the LED chip along with the second fluorescent powder, when the LED chip of the blue LED chip emits light, the red fluorescent powder is excited from the bottom to emit red light, the yellow-green fluorescent powder is excited from the surface and around to emit yellow-green light, and the yellow-green fluorescent powder is mixed with the blue light of the LED chip to emit white light, so that the red fluorescent powder and the yellow-green fluorescent powder are separately arranged in the support bowl, the multiple problem that the yellow-green light excites the red fluorescent powder to emit red light is avoided, the red fluorescent powder and the yellow-green fluorescent powder are fully utilized, and the light emitting efficiency of the LED lamp bead is improved.
Referring to fig. 3, the invention also provides a corresponding LED lamp bead, which is dispensed by the above dispensing method, and includes an LED bracket cup 1, and the LED lamp bead is manufactured by the above dispensing method of the LED lamp bead, so that the bottom of the bracket cup 1 is coated with a first phosphor glue 10 with a preset area, an LED chip 20 is fixed on the first phosphor glue 10, a second phosphor glue 30 is filled in the bracket cup 1, the LED chip 20 is a blue light chip, the first phosphor in the first phosphor glue 10 is a red phosphor, the second phosphor in the second phosphor glue 30 is a yellow-green phosphor, when the blue LED chip emits light, the red phosphor is excited from the bottom to emit red light, the yellow-green phosphor is excited from the surface and the periphery to emit yellow-green light, and when the yellow-green phosphor is mixed with the blue light of the LED chip, the white light is emitted, the multiple excitation problem that the yellow green light generated by exciting the yellow green fluorescent powder in the LED lamp bead excites the red fluorescent powder again to emit red light is avoided, and the luminous efficiency of the LED lamp bead is further ensured.
In summary, in the LED lamp bead and the dispensing method thereof disclosed by the present invention, the dispensing method of the LED lamp bead mixes the die bond silica gel and the first phosphor in a preset ratio to form the first phosphor gel; then coating the first fluorescent powder glue with a preset area on the bottom of the LED support bowl cup, and fixing an LED chip on the first fluorescent powder glue; mixing the LED packaging silica gel with second fluorescent powder to form second fluorescent powder gel; and then injecting the second fluorescent powder glue into the bracket bowl cup which is subjected to die bonding and wire bonding, so that the second fluorescent powder glue covers the LED chip in the bracket bowl cup, and separating the fluorescent powder with different colors into different kinds of fluorescent powder, thereby effectively solving the problem of multiple excitation when the blue light chip excites the fluorescent powder to emit light and further improving the light emitting efficiency of the LED lamp bead.
It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the scope of the appended claims.
Claims (8)
1. A dispensing method of LED lamp beads is characterized by comprising the following steps:
mixing the solid crystal silica gel and the first fluorescent powder according to a preset proportion to form first fluorescent powder gel;
coating the first fluorescent powder glue with a preset area at the bottom of the LED support bowl cup, and fixing an LED chip on the first fluorescent powder glue;
mixing the LED packaging silica gel with second fluorescent powder to form second fluorescent powder gel;
and injecting the second fluorescent powder glue into the bracket bowl with the die bonding and wire bonding completed, so that the second fluorescent powder glue covers the LED chip in the bracket bowl.
2. The method for dispensing LED lamp beads according to claim 1, wherein the step of injecting the second phosphor paste into the bracket cup after die bonding and wire bonding are completed, so that the second phosphor paste covers the LED chip in the bracket cup further comprises:
and carrying out centrifugal treatment on the support bowl cup, and precipitating the second fluorescent powder to the surface of the LED chip and the bottom of the LED support bowl cup.
3. The dispensing method of the LED lamp bead according to claim 1, wherein the step of mixing the die bond silica gel and the first phosphor to form the first phosphor gel comprises:
and mixing the solid crystal silica gel and the first fluorescent powder according to a ratio of 10:1 to form the first fluorescent powder gel.
4. The dispensing method of the LED lamp bead according to claim 1, wherein the step of mixing the die bond silica gel and the first phosphor to form the first phosphor gel comprises:
and mixing the solid crystal silica gel and the first fluorescent powder according to the proportion of 100:1 to form the first fluorescent powder gel.
5. The method for dispensing the LED lamp beads according to claim 1, wherein the step of coating the first fluorescent powder glue with a preset area on the bottom of the LED support bowl cup and fixing the LED chip on the first fluorescent powder glue comprises the following steps:
coating the first fluorescent powder glue with the area equal to the bottom surface of the LED chip on the bottom of the LED support bowl cup;
and fixing the LED chip on the first fluorescent powder.
6. The method for dispensing LED lamp beads of claim 1, wherein said first phosphor comprises red phosphor.
7. The method for dispensing LED lamp beads of claim 1, wherein said second phosphor comprises yellow-green phosphor.
8. An LED lamp bead, characterized in that the glue is sealed by the glue dispensing method of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010429227.3A CN111710772A (en) | 2020-05-20 | 2020-05-20 | LED lamp bead and dispensing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010429227.3A CN111710772A (en) | 2020-05-20 | 2020-05-20 | LED lamp bead and dispensing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111710772A true CN111710772A (en) | 2020-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010429227.3A Pending CN111710772A (en) | 2020-05-20 | 2020-05-20 | LED lamp bead and dispensing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN111710772A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259662A (en) * | 2020-10-22 | 2021-01-22 | 江西瑞晟光电科技有限公司 | LED lamp bead and dispensing method thereof |
| CN117766666A (en) * | 2024-01-29 | 2024-03-26 | 惠州东君光源科技有限公司 | LED lamp bead and preparation process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101740706B (en) * | 2009-12-14 | 2013-02-06 | 深圳雷曼光电科技股份有限公司 | High-brightness white-light LED and manufacturing method thereof |
| CN203983334U (en) * | 2014-07-09 | 2014-12-03 | 深圳市源磊科技有限公司 | Package structure for LED |
-
2020
- 2020-05-20 CN CN202010429227.3A patent/CN111710772A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101740706B (en) * | 2009-12-14 | 2013-02-06 | 深圳雷曼光电科技股份有限公司 | High-brightness white-light LED and manufacturing method thereof |
| CN203983334U (en) * | 2014-07-09 | 2014-12-03 | 深圳市源磊科技有限公司 | Package structure for LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259662A (en) * | 2020-10-22 | 2021-01-22 | 江西瑞晟光电科技有限公司 | LED lamp bead and dispensing method thereof |
| CN117766666A (en) * | 2024-01-29 | 2024-03-26 | 惠州东君光源科技有限公司 | LED lamp bead and preparation process thereof |
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Application publication date: 20200925 |
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