CN111693739A - Soldering connection structure of crystal oscillator test tool seat - Google Patents
Soldering connection structure of crystal oscillator test tool seat Download PDFInfo
- Publication number
- CN111693739A CN111693739A CN202010431376.3A CN202010431376A CN111693739A CN 111693739 A CN111693739 A CN 111693739A CN 202010431376 A CN202010431376 A CN 202010431376A CN 111693739 A CN111693739 A CN 111693739A
- Authority
- CN
- China
- Prior art keywords
- test
- seat
- test card
- pin
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a soldering connecting structure of a crystal oscillator test tool seat in the technical field of crystal oscillator test tool seats, which comprises a test card, wherein the upper end surface of the test card is provided with a test seat mounting hole, a test seat pin is inserted in the test seat mounting hole, one side of the test seat pin is provided with a test card pad, a soldering tin is arranged between the test seat pin and the test card pad, the test card pad is fixedly connected to the upper end surface of the test card close to the test seat mounting hole, the test seat pin protrudes out of the test seat mounting hole, the number of the test card pad and the test seat mounting hole is the same, one of the test card pad and the test seat pin corresponds to the other, a second pin is arranged between one end of the soldering tin and the test card pad, the test seat pin is provided with a structure without a soldering hole, the test card pad structure is adjacently connected, the test seat pin is convenient to install and fix, and the nondestructive connecting point can be conveniently removed when the, therefore, the contact pin of the test socket can be replaced quickly, the contact surface is large, and heat dissipation is fast.
Description
Technical Field
The invention relates to the technical field of crystal oscillator test tool bases, in particular to a soldering connection structure of a crystal oscillator test tool base.
Background
The crystal oscillator is taken as the heart of the electronic equipment, and the importance degree in the equipment is self-evident; along with the development of the technology, the crystal oscillator is gradually pasted and miniaturized, so that higher requirements are met on a connecting structure of a test tool, the existing test seat is installed on a test board card, a test seat needle is directly welded into a test card installation hole, when the test seat needs to be maintained and replaced, welded welding pads need to be sucked and welded one by one, soldering tin is removed, the test seat can be taken down, the operation is difficult, the welding pads are easy to damage, the soldering tin is arranged in the test card installation hole, the heat dissipation effect of the device is also hindered in the using process, and the defect exists in the use.
Disclosure of Invention
The invention aims to provide a soldering connection structure of a crystal oscillator test tool seat, which aims to solve the problems that soldering pads are required to be sucked and soldered one by one, soldering tin is removed, and then the test seat can be taken down, so that the operation is difficult and the soldering pads are easy to damage.
In order to achieve the purpose, the invention provides the following technical scheme: the soldering connecting structure of the crystal oscillator test tool base comprises a test card, wherein a test base mounting hole is formed in the upper end face of the test card, a test base contact pin is inserted into the test base mounting hole in an inserting mode, a test card bonding pad is arranged on one side of the test base contact pin, and soldering tin is arranged between the test base contact pin and the test card bonding pad.
Preferably, the test card bonding pad is fixedly connected to the position, close to the test seat mounting hole, of the upper end face of the test card, and the test seat pin protrudes out of the test seat mounting hole.
Preferably, the number of the test card pads is the same as that of the test socket mounting holes, and one of the test card pads corresponds to one of the test socket mounting holes.
Preferably, a second welding leg is arranged between one end of the lap welding soldering tin and the testing card welding pad, and a first welding leg is arranged between the other end of the lap welding soldering tin and the testing seat contact pin.
Preferably, the lap welding soldering tin is fixedly connected with the test socket contact pin and the test card welding disc through the first welding leg and the second welding leg respectively.
Preferably, the area of the upper end surface of the test card pad is larger than the area of one end surface of the lap welding soldering tin.
Compared with the prior art, the invention has the beneficial effects that: when the test socket contact pin needs to be taken down for maintenance, the test socket contact pin is not directly connected with the inside of the test socket mounting hole in a soldering manner, and only the lap welding soldering tin on the plane of the test card needs to be fused, so that the soldering tin in the test socket mounting hole does not need to be absorbed, the test socket is very easy to replace, the test socket contact pin is provided with a tin-free via hole structure, the adjacent test card pad structure is connected, and the test socket contact pin is convenient to mount and fix through the tin-free via hole; and be connected test seat contact pin and test card through the mode of taking tin, take off when easy to assemble and maintenance and change the test seat contact pin, the maintainability of reinforcing crystal oscillator test fixture can conveniently be harmless when the test seat contact pin is dismantled in the maintenance and demolish the tie point to swiftly change the test seat contact pin, the contact surface is big, and the heat dissipation is fast.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a view of the combination of the test card and the mounting hole of the test socket of the present invention;
FIG. 3 is a combined view of the test card pad and the socket pin according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a test card; 2. a test seat mounting hole; 3. testing a card pad; 4. a test socket pin is inserted; 5. lap welding tin soldering; 6. a first solder tail; 7. a second solder tail.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a solder joint structure for a crystal oscillator test tool seat, which comprises: the soldering connecting structure of the crystal oscillator test tool base comprises a test card 1, wherein a test base mounting hole 2 is formed in the upper end face of the test card 1, a test base pin 4 is inserted into the test base mounting hole 2, a test card pad 3 is arranged on one side of the test base pin 4, a soldering tin 5 is arranged between the test base pin 4 and the test card pad 3, the test base pin 4 is not directly connected with the inside of the test base mounting hole 2 in a soldering manner, and only the soldering tin 5 on the plane of the test card is required to be fused, so that soldering tin in the test base mounting hole 2 is not required to be absorbed, the test base is very easy to replace, a tin-free through hole structure is arranged on the test base pin 4, the test card pad 3 structures are adjacently connected, and the test base pin 4 is convenient to mount and fix through the tin-free through holes; and be connected test seat contact pin 4 and test card 1 through the mode of taking tin, take off when easy to assemble and maintenance and change test seat contact pin 4, the maintainability of reinforcing crystal oscillator test fixture can conveniently be harmless when dismantling test seat contact pin 4 in the maintenance demolishs the tie point to swiftly change test seat contact pin 4, the contact surface is big, and the heat dissipation is fast.
The test card pad 3 is fixedly connected to the position, close to the test seat mounting hole 2, of the upper end face of the test card 1, and the test seat pin 4 protrudes out of the test seat mounting hole 2, so that the lap welding soldering tin 5 can be conveniently connected, welded and fixed.
The number of the test card welding pads 3 is the same as that of the test seat mounting holes 2, one of the test card welding pads corresponds to one of the test seat mounting holes, and the test seat pins 4 can be dismounted without damage through each test seat mounting hole 2.
A second leg 7 is arranged between one end of the lap welding soldering tin 5 and the testing card pad 3, a first leg 6 is arranged between the other end of the lap welding soldering tin 5 and the testing seat pin 4, and the two ends of the lap welding soldering tin 5 are connected.
The lap welding soldering tin 5 is respectively fixedly connected with the test socket contact pin 4 and the test card pad 3 through the first welding leg 6 and the second welding leg 7, and the test card pad 3 and the test socket contact pin 4 are in stable triangular arrangement, so that the stability of the test card pad is ensured.
The area of the upper end face of the test card welding plate 3 is larger than the area of one end face of the lap welding soldering tin 5, and therefore workers can fix the lap welding soldering tin conveniently.
One specific application of this embodiment is: when the device is installed and used, the test seat pin 4 can be inserted into the test seat mounting hole 2, then the lap welding soldering tin 5 is arranged between the test card pad 3 and the test seat pin 4, then the two ends of the lap welding soldering tin 5 are respectively fixed on the test seat pin 4 and the test card pad 3 through the first pin 6 and the second pin 7, at the moment, the lap welding soldering tin 5, the test card pad 3 and the test seat pin 4 are arranged in a stable triangle shape, the test seat pin 4 can be fixed, when the test seat pin 4 needs to be taken down in maintenance, the test seat pin 4 is not directly connected with the test seat mounting hole 2 in a soldering way, only the lap welding soldering tin 5 on the plane of the test card needs to be fused, therefore, the soldering tin in the test seat mounting hole 2 does not need to be absorbed, the test seat is very easy to replace, the test seat pin 4 is provided with a tin-free hole structure, and is adjacently connected with the test card pad 3 structure, through the tin-free via hole, the test socket contact pin 4 is convenient to mount and fix; and be connected test seat contact pin 4 and test card 1 through the mode of taking tin, take off when easy to assemble and maintenance and change test seat contact pin 4, the maintainability of reinforcing crystal oscillator test fixture can conveniently be harmless when dismantling test seat contact pin 4 in the maintenance demolishs the tie point to swiftly change test seat contact pin 4, the contact surface is big, and the heat dissipation is fast.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The scrap tin connection structure of the crystal oscillator test tool seat is characterized in that: the test device is characterized by comprising a test card (1), wherein a test seat mounting hole (2) is formed in the upper end face of the test card (1), a test seat contact pin (4) is inserted into the test seat mounting hole (2), a test card pad (3) is arranged on one side of the test seat contact pin (4), and a lap welding tin (5) is arranged between the test seat contact pin (4) and the test card pad (3).
2. The bonding connection structure of the crystal oscillator test tool base according to claim 1, characterized in that: the test card pad (3) is fixedly connected to the position, close to the test seat mounting hole (2), of the upper end face of the test card (1), and the test seat contact pin (4) protrudes out of the test seat mounting hole (2).
3. The bonding connection structure of the crystal oscillator test tool base according to claim 1, characterized in that: the number of the test card welding pads (3) is the same as that of the test seat mounting holes (2), and one of the test card welding pads corresponds to one of the test seat mounting holes.
4. The bonding connection structure of the crystal oscillator test tool base according to claim 1, characterized in that: a second welding leg (7) is arranged between one end of the lap welding soldering tin (5) and the test card welding pad (3), and a first welding leg (6) is arranged between the other end of the lap welding soldering tin (5) and the test socket contact pin (4).
5. The bonding connection structure of the crystal oscillator test tool base according to claim 4, wherein: the lap welding soldering tin (5) is fixedly connected with the test socket contact pin (4) and the test card pad (3) through the first welding leg (6) and the second welding leg (7) respectively.
6. The bonding connection structure of the crystal oscillator test tool base according to claim 4, wherein: the area of the upper end face of the test card welding pad (3) is larger than that of one end face of the lap welding soldering tin (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010431376.3A CN111693739B (en) | 2020-05-20 | 2020-05-20 | Solder joint structure of crystal oscillator test tool seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010431376.3A CN111693739B (en) | 2020-05-20 | 2020-05-20 | Solder joint structure of crystal oscillator test tool seat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111693739A true CN111693739A (en) | 2020-09-22 |
| CN111693739B CN111693739B (en) | 2022-07-22 |
Family
ID=72478036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010431376.3A Active CN111693739B (en) | 2020-05-20 | 2020-05-20 | Solder joint structure of crystal oscillator test tool seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111693739B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59103275A (en) * | 1983-11-14 | 1984-06-14 | Matsushita Electric Ind Co Ltd | Battery socket |
| US20080001612A1 (en) * | 2004-05-21 | 2008-01-03 | January Kister | Probes with self-cleaning blunt skates for contacting conductive pads |
| CN202168278U (en) * | 2011-08-04 | 2012-03-14 | 马夸特开关(上海)有限公司 | Welding structure of circuit board |
| CN202488880U (en) * | 2012-03-09 | 2012-10-10 | 常州海弘电子有限公司 | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering |
| CN202918586U (en) * | 2012-11-15 | 2013-05-01 | 佛山市顺德区顺达电脑厂有限公司 | Pull-button type structure for connecting pad and through hole |
| US20130164982A1 (en) * | 2011-12-23 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Electrical connector with multilayer surface treatment and method for fabricating the same |
| CN204028152U (en) * | 2014-07-25 | 2014-12-17 | 深圳市策维科技有限公司 | A kind of signal converting probe |
| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
| CN208188288U (en) * | 2018-06-11 | 2018-12-04 | 南京尤尼泰信息科技有限公司 | A kind of test plate suitable for plurality of specifications crystal oscillator |
| CN109490738A (en) * | 2018-11-05 | 2019-03-19 | 南京中电熊猫晶体科技有限公司 | A kind of measuring device of crystal oscillator diode characteristic |
| CN110524083A (en) * | 2019-08-20 | 2019-12-03 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of automation for QFN device goes metal working to fill and go golden method |
-
2020
- 2020-05-20 CN CN202010431376.3A patent/CN111693739B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59103275A (en) * | 1983-11-14 | 1984-06-14 | Matsushita Electric Ind Co Ltd | Battery socket |
| US20080001612A1 (en) * | 2004-05-21 | 2008-01-03 | January Kister | Probes with self-cleaning blunt skates for contacting conductive pads |
| CN202168278U (en) * | 2011-08-04 | 2012-03-14 | 马夸特开关(上海)有限公司 | Welding structure of circuit board |
| US20130164982A1 (en) * | 2011-12-23 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Electrical connector with multilayer surface treatment and method for fabricating the same |
| CN202488880U (en) * | 2012-03-09 | 2012-10-10 | 常州海弘电子有限公司 | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering |
| CN202918586U (en) * | 2012-11-15 | 2013-05-01 | 佛山市顺德区顺达电脑厂有限公司 | Pull-button type structure for connecting pad and through hole |
| CN204028152U (en) * | 2014-07-25 | 2014-12-17 | 深圳市策维科技有限公司 | A kind of signal converting probe |
| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
| CN208188288U (en) * | 2018-06-11 | 2018-12-04 | 南京尤尼泰信息科技有限公司 | A kind of test plate suitable for plurality of specifications crystal oscillator |
| CN109490738A (en) * | 2018-11-05 | 2019-03-19 | 南京中电熊猫晶体科技有限公司 | A kind of measuring device of crystal oscillator diode characteristic |
| CN110524083A (en) * | 2019-08-20 | 2019-12-03 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of automation for QFN device goes metal working to fill and go golden method |
Non-Patent Citations (4)
| Title |
|---|
| 付鑫: "BGA焊点缺陷分析", 《2007中国高端SMT学术会议论文集》 * |
| 俞叶萍等: "声纳PCB设计中的工艺改进", 《上海船舶运输科学研究所学报》 * |
| 杜连芳等: "PCB工艺设计中应注意的问题", 《中国新技术新产品》 * |
| 路佳: "几种SMT焊接缺陷及其解决措施", 《电子工艺技术》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111693739B (en) | 2022-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112654172A (en) | Circuit board production process | |
| CN111693739B (en) | Solder joint structure of crystal oscillator test tool seat | |
| CN103412161A (en) | Pressing mechanism of ICT testing fixture | |
| TW201340792A (en) | Printed circuit board | |
| CN206821068U (en) | Pcb board docking structure | |
| CN204560052U (en) | A kind of firm banking | |
| CN206251449U (en) | Circuit board tool with elastic component | |
| CN206237679U (en) | A kind of pcb board of stable connection | |
| CN209764923U (en) | Signal probe and stamp hole packaging module testing tool with same | |
| CN202262057U (en) | FPC pad anti-fracture structure | |
| CN206728381U (en) | Surface Mount power module | |
| JPH11195678A (en) | Surface-mounted module, printed board mounted therewith, and surface-mounted module mounting structure | |
| CN203596975U (en) | PCB with PIN connecting pin | |
| CN220858497U (en) | PCB circuit structure convenient for jumper connection | |
| CN113281541B (en) | Non-welding type lead device for space electronic component | |
| CN220067793U (en) | PCB (printed circuit board) and LED unit board and LED display screen applying same | |
| CN221381278U (en) | Short-circuit bonding pad structure easy to weld | |
| CN220731518U (en) | Semiconductor device | |
| CN221961272U (en) | Novel earphone packaging structure | |
| CN108680773A (en) | A kind of test contact chip connector | |
| CN216082831U (en) | Network branch test seat | |
| CN219802667U (en) | PCB board pad structure and PCB board | |
| CN212660376U (en) | Packaging structure of fixed cylindrical crystal oscillator of paster pad | |
| CN219831296U (en) | Circuit board testing device | |
| CN209822882U (en) | Novel SMD spring plate structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |