CN111681999A - A vacuum heat-conducting cavity soaking plate and an air-cooled heat sink - Google Patents

Abstract

The invention discloses a vacuum heat conducting cavity vapor chamber and an air-cooled heat dissipation device, which consists of a heat dissipation device consisting of a vacuum heat conducting cavity vapor chamber, a semiconductor refrigeration sheet, a heat insulation plate, fins and a heat pipe, wherein the heat dissipation device is provided with two layers of fins and semiconductor refrigeration sheets; the vacuum heat conduction cavity is filled with heat absorption vaporization phase-change liquid, when the soaking plate is heated, heat generated by a heat source is transferred to the soaking plate, the phase-change liquid in the heat conduction cavity of the soaking plate absorbs heat to vaporize, the phase-change liquid is in a gas state and moves upwards, the gas state is actively cooled by the first layer of semiconductor refrigerating sheet after reaching the upper surface, the heat is dissipated through the first layer of fins, the heat of the first layer of fins, which is connected with the high heat flow density end of the heat source, is conducted to the low heat flow density end and is actively cooled by the second semiconductor refrigerating sheet, the heat is dissipated through the fins, the temperature of the phase-change liquid is reduced, the phase-change liquid is re-condensed into a liquid state and flows back to the heat conduction cavity through.

Description

A vacuum heat-conducting cavity soaking plate and an air-cooled heat sink

technical field

The invention relates to the field of heat dissipation devices, in particular to a vacuum heat conduction chamber soaking plate and an air-cooled heat dissipation device.

Background technique

With the development of electronic devices to high performance and high integration, the power density increases, and the heat generation and heat flux density per unit volume of electronic devices also increase significantly. In order to ensure that the device can be in a good working temperature environment, the heat needs to be dissipated quickly.

A heat pipe is a heat transfer element that utilizes gas-liquid phase transition. Because its heat transfer capability is far superior to that of metal materials, it is widely used in the field of heat dissipation of electronics and other equipment. The principle of semiconductor refrigeration sheet is based on the Peltier principle, using the Peltier effect of semiconductor materials, when the direct current passes through the galvanic couple formed by two different semiconductor materials in series, the two ends of the galvanic couple can absorb heat and release heat respectively to achieve refrigeration. the goal of. The fins 2 heat the surrounding air by forced convection and radiation to dissipate the heat. Phase change materials (PCM) have great potential for thermal energy storage and utilization. The advantages of phase change liquid materials in endothermic vaporization and liquefaction are used to make up for the low thermal conductivity of phase change materials, and they can be used as good heat storage and heat transfer media.

Reliability studies of electronic components show that with the increase of temperature, the failure rate of components increases exponentially, resulting in a substantial decrease in their reliability. The traditional air-cooled radiator is not effective. Although the liquid-cooled radiator has a strong heat dissipation capacity, it has risks such as liquid leakage and needs to consume pump power. Phase change materials (PCM) have great potential for thermal energy storage, but their heat dissipation effect is not good it is good. The heat dissipation of electronic devices is imperative. For those skilled in the art, how to design a heat dissipation device with better heat conduction and heat dissipation effect, and more safety and reliability is an urgent problem for those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies of the prior art, and to provide a vacuum heat-conducting chamber soaking plate and an air-cooled heat dissipation device.

The object of the present invention is achieved through the following technical solutions:

A vacuum heat-conducting cavity soaking plate and an air-cooled heat dissipation device mainly include a soaking plate module and an air-cooling module. The soaking plate module is arranged on the heat source and absorbs the heat of the heat source. The air cooling module is installed on the vapor chamber module to help the vapor chamber module to dissipate heat.

Specifically, the vapor chamber module includes a phase change liquid, a bottom plate, a heat sink plate, a sealing ring, a support column, and a raised structure. The bottom plate is arranged on the heat source, and a concave cavity for accommodating the phase change liquid is arranged in the bottom plate. The heat sink plate is arranged on the bottom plate, and its edge is sealed with the bottom plate through a sealing ring to form a heat conduction cavity for the vaporization and liquefaction of the phase change liquid. The support column is located in the cavity of the bottom plate, the bottom of which is fixedly connected with the bottom plate, and the bottom of the top heat sink plate abuts. The protruding structure is arranged at the bottom of the heat sink plate and extends toward the bottom plate, and its position is staggered from the support column. The phase change liquid is filled in the heat conduction cavity formed by the bottom plate and the heat sink plate, which helps the heat source to dissipate heat quickly.

Specifically, the air cooling module includes a heat insulation plate, a cooling sheet, a thermally conductive silica gel, a heat dissipation fin, and a heat pipe. The heat insulating plate is arranged on the heat sink plate and is fixedly connected with the heat sink plate and the bottom plate, and a mounting notch for installing the cooling sheet is arranged in the middle thereof. The refrigerating sheet is arranged on the heat insulating plate, embedded in the installation notch, and the refrigerating end of the refrigerating plate is in contact with the heat sink plate. The cooling fins are arranged on the cooling fins and are connected to the cooling ends of the cooling fins through thermally conductive silica gel. The side surfaces of the heat dissipation fins are provided with heat pipe mounting holes, and the heat pipe mounting holes pass through the heat dissipation fins. The heat pipes are arranged in the heat dissipation fins, and are connected and contacted with the heat dissipation fins through the installation holes of the heat pipes.

Further, the heat insulating plate is also provided with a through hole through which the wire of the cooling fin passes. The through hole is arranged on the side surface of the heat insulation board and penetrates into the installation notch.

As a preferred solution of the present invention, the refrigerating sheet adopts a semiconductor refrigerating sheet.

As a preferred solution of the present invention, the heat pipe adopts a sintered copper rod heat pipe.

As a preferred solution of the present invention, the protruding structure is made of copper powder.

As a preferred solution of the present invention, the air-cooling modules are arranged in several groups, and several groups of air-cooling modules are stacked upward to improve the heat dissipation effect.

Further, the bottom plate is also provided with an injection port for injecting the phase change liquid. The injection port is arranged on the side of the bottom plate, one end of which is communicated with the cavity of the bottom plate, and the other end is communicated with the outside world.

As a preferred solution of the present invention, the filling rate of the phase change liquid filling is 35% to 50%.

As a preferred solution of the present invention, the convex structure adopts a conical convex structure design, the bottom of which is fixed to the bottom of the heat sink plate, the conical portion extends downward, and its height is smaller than that of the support column.

Compared with the prior art, the present invention also has the following advantages:

(1) The vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device provided by the present invention adopt a reasonable combination of soaking plate, semiconductor refrigeration and air-cooled heat dissipation device, which have simple structure, high efficiency and environmental protection, simple maintenance, and can improve the electronic Product performance, reliability and service life.

(2) The vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device provided by the present invention utilize the high conductivity of the vaporization and liquefaction of the phase-change liquid material, the semiconductor refrigeration and the high thermal conductivity of the heat pipe to conduct the heat at the higher end of the fin heat flow density to the The lower heat flux density is used for heat dissipation to achieve higher heat conduction and heat dissipation efficiency.

Description of drawings

FIG. 1 is an exploded view of the vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device provided by the present invention.

FIG. 2 is a schematic structural diagram of the bottom plate provided by the present invention.

FIG. 3 is a schematic structural diagram of the heat sink plate provided by the present invention.

FIG. 4 is a schematic structural diagram of the air cooling module provided by the present invention.

5 is a schematic structural diagram of a vacuum heat-conducting chamber soaking plate and an air-cooled heat dissipation device provided by the present invention.

Description of the symbols in the above drawings:

1- Heat pipe, 2- Fin, 21- Mounting hole, 3- Cooling plate, 31- Conductor, 4- Insulation plate, 41- Escape hole, 5- Vaporizing plate, 51- Heat sink plate, 511- Convex From the structure, 52 - bottom plate, 521 - support column, 522 - injection port.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer and clearer, the present invention will be further described below with reference to the accompanying drawings and examples.

Example 1:

As shown in FIG. 1 to FIG. 5 , this embodiment discloses a vacuum heat-conducting chamber soaking plate and an air-cooled heat dissipation device, including two parts:

The first part is the heat-conducting block of the vacuum heat-conducting cavity vapor chamber, including:

The soaking plate 5 is used for contacting the heat source, and is provided with a heat conduction cavity sealed and isolated from the outside, and the heat conduction cavity is filled with a phase change liquid that absorbs heat and vaporizes;

The soaking plate 5 includes a heat sink plate 51 and a bottom plate 52, and the soaking plate 5 can be used as a flat heat pipe;

The heat sink plate 51 is provided with a conical convex structure 511, which can break the liquid film formed by the vaporization of the phase change liquid in the vacuum chamber on the surface of the heat sink plate 51 and reduce thermal resistance; in addition, the conical convex structure 511 can also As the liquid drainage function after the phase change liquid is vaporized and cooled;

The bottom plate 52 is provided with a groove and the heat sink plate 51 to form a vacuum heat conduction cavity, and a support column 521 protrudes from the lower surface of the bottom plate 52 groove, and the support column 521 can connect with the bottom of the heat sink plate 51 Contact and stagger with the conical convex structure 511 to prevent the groove from being deformed and depressed due to uneven force on the outer surface of the groove;

Optionally, a gap/injection port 522 is provided on the periphery of the groove of the bottom plate 52, and a liquid injection pipe is installed at the gap;

Optionally, the conical convex structure 511 is made of copper powder;

Optionally, the vacuum heat conduction chamber is filled with an endothermic and vaporizable phase change liquid through a liquid injection pipe, and the filling rate of the phase change liquid is 35% to 50%;

Optionally, when the phase-change liquid is filled, the lower surface of the vacuum chamber collects the phase-change liquid when it is not heated. When the bottom plate 52 is heated, the phase-change liquid absorbs heat and vaporizes, and sends the heat to the heat sink plate 51. 3 Actively dissipate heat;

Optionally, the heat sink plate 51 and the bottom plate 52 can be detachably connected and fixed, and sealed by a square-shaped sealing ring; the outer periphery can also be welded into one body to form a sealed vacuum heat conduction cavity space;

The second part is an air-cooled heat sink, including:

Optionally, the condensation end of the semiconductor refrigeration sheet 3 contacts the upper surface of the heat sink plate 51, the phase change liquid can absorb heat and vaporize, and the phase change gas is cooled into the phase change liquid on the heat sink plate 51, and passes through the conical convex structure. 511 drains back to the surface of the heat-absorbing end of the bottom plate 52;

Optionally, the hot end of the semiconductor refrigeration sheet 3 is connected to the heat dissipation fins 2 through thermally conductive silica gel, and the heat derived from the phase change liquid in the heat conduction cavity is actively cooled by the semiconductor refrigeration sheet 3, and further, the heat is dissipated by the fins 2;

Optionally, the air-cooled heat dissipation device includes two layers of semiconductor refrigeration, two layers of heat dissipation fins 2 and several heat pipes 1;

Optionally, a heat insulating plate 4 is provided between the first layer of fins 2 and the heat sink plate 51 , the heat insulating plate 4 is provided with a mounting groove, and the semiconductor refrigeration sheet 3 is embedded in the heat insulating plate 4 through the thermal conductive silica gel and the heat sink. The heat sink plate 51 is in contact;

Optionally, a heat insulating plate 4 is provided between the first layer and the second layer of fins 2, the heat insulating plate 4 is provided with a mounting groove, and the semiconductor refrigeration sheet 3 is embedded in the heat insulating plate 4 through the thermally conductive silica gel and the first layer. One layer of fins 2 contacts;

Optionally, the heat insulation plate 4 is provided with an escape hole 41 for the outlet of the semiconductor refrigeration sheet 3, and the wire 31 on the semiconductor refrigeration sheet 3 passes through the escape hole 41 and is connected to the power supply;

The beneficial effect of adopting the above scheme is: by opening a mounting groove on the heat insulating plate 4 and arranging the semiconductor refrigeration sheet 3 in the mounting groove, the installation of the semiconductor refrigeration sheet 3 is more convenient and stable;

Optionally, each of the fins 2 is provided with a plurality of holes/installation holes 21 for configuring the heat pipe 1;

Optionally, the evaporating end of the heat pipe 1 is arranged at the end of the fin 2 connected to the semiconductor refrigeration fin 3, and the condensation end is arranged at the other end of the fin 2; the heat pipe 1 is used to realize the heat transfer element by means of its own internal working liquid phase change, and has a high temperature. The thermal conductivity conducts the heat at the higher end of the heat flux density of the fin 2 to the lower end of the heat flux density for heat dissipation, so as to achieve higher heat conduction and heat dissipation efficiency;

Optionally, the size of the heat pipe 1 and the number of embedded heat pipes 1 are set according to actual needs; the heat pipe 1 is optional but not limited to the U-shaped heat pipe 1;

Optionally, the heat pipe 1 is used as a heat transfer medium, and is specifically a sintered copper rod heat pipe 1;

Optionally, the material of the fins 2 can be but not limited to copper;

Example 2:

This embodiment discloses: as shown in FIG. 1, an exploded view of each component of the heat dissipation device provided by the present invention, which includes structures such as a soaking plate 5, a semiconductor refrigerating sheet 3 and an air-cooled heat dissipation device, wherein the soaking plate 5 For contacting the heat source, a vacuum heat conduction cavity formed by a heat sink plate 51 and a bottom plate 52 is arranged in the vapor chamber 5. The vacuum heat conduction cavity is sealed and isolated from the outside into an independent cavity structure, which is filled with a phase change of endothermic vaporization. When the liquid, the heat soaking plate 5 is heated, the heat generated by the heat source is transferred to the soaking plate 5, and the phase-change liquid in the heat conduction cavity of the soaking plate 5 absorbs heat and vaporizes, and the phase changes to a gaseous state and moves upward; the first layer of fins 2 and heat A heat shield 4 is arranged between the sink plates 51, the heat shield 4 is provided with a mounting groove, the semiconductor refrigeration sheet 3 is embedded in the heat shield 4 and contacts with the heat sink plate 51 through thermally conductive silica gel; the gaseous phase change material reaching the upper surface It is actively cooled by the first layer of semiconductor refrigeration fins 3, and the heat is dissipated through the first layer of fins 2. The heat pipe 1 conducts heat from the high heat flux end of the first layer fin 2 connected to the heat source to the low heat flux end. A heat insulating plate 4 is arranged between the second layer of fins 2, the heat insulating plate 4 is provided with a mounting groove, and the semiconductor refrigeration sheet 3 is embedded in the heat insulating plate 4 to contact the first layer of fins 2 through thermally conductive silica gel; The layer of semiconductor refrigeration fins 3 are actively cooled and emitted through the fins 2. The temperature of the phase-change liquid is reduced, and it is re-condensed into a liquid state and drained back to the lower surface of the heat-conducting cavity through the conical convex structure 511, reabsorbing heat, and continuously circulating heat conduction and heat dissipation.

The soaking plate 5 includes a bottom plate 52 and a heat sink plate 51. The bottom plate 52 is provided with a groove to form a vacuum heat conduction cavity with the heat sink plate 51. The square-shaped sealing ring is sealed; the outer periphery can also be welded into one body to form a closed vacuum heat conduction cavity space.

More specifically, as shown in FIG. 2 is the bottom plate 52 of the present invention, a support column 521 is protruded on the lower surface of the groove, and the support column 521 can be in contact with the bottom of the heat sink plate 51 and with the conical convex structure 511 Staggered to prevent the groove from being deformed and depressed due to uneven force on the outer surface of the groove; a gap is set on the outer circumference of the groove of the bottom plate 52, and a liquid injection pipe is installed at the gap, and the phase change liquid enters the vacuum heat conduction chamber through the liquid injection pipe.

As shown in FIG. 3 , the heat sink plate 51 of the present invention cooperates with the bottom plate 52 to form a vacuum heat conduction cavity; In addition, the conical convex structure 511 can also act as a liquid drainage after the phase change liquid is vaporized and cooled, and when the temperature of the phase change liquid decreases, it will condense into a liquid again and pass through the conical convex structure 511 The drainage flows back to the lower surface of the heat conduction cavity, absorbs heat again, and continuously circulates heat conduction.

On the basis of the high thermal conductivity of the above-mentioned soaking plate 5, the present invention also designs an air-cooled heat sink, as shown in FIG. A heat insulating plate 4 is arranged between 51, the heat insulating plate 4 is provided with a mounting groove, the semiconductor refrigeration sheet 3 is embedded in the mounting groove of the heat insulating plate 4, and the wire 31 is connected to the external power supply through the escape hole 41; the semiconductor refrigeration sheet 3 The hot end is connected with the heat dissipation fin 2 through the thermal conductive silica gel, and the cold end is in contact with the heat sink plate 51 through the thermal conductive silica gel. heat dissipation.

The beneficial effect of adopting the heat insulating plate 4 is: by opening the installation groove on the heat insulating plate 4 and arranging the semiconductor refrigeration sheet 3 in the installation groove, the installation of the semiconductor refrigeration sheet 3 is more convenient and stable; the heat cannot pass through the heat insulation. The plate 4 and the heat sink plate 51 form heat accumulation to actively dissipate heat through the semiconductor refrigeration sheet 3, thereby improving the heat dissipation efficiency.

The above-mentioned embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the above-mentioned embodiments, and any other changes, modifications, substitutions, combinations, The simplification should be equivalent replacement manners, which are all included in the protection scope of the present invention.

Claims (10)

1. A vacuum heat-conducting cavity soaking plate and an air-cooled heat sink, characterized in that it comprises a soaking plate module and an air-cooling module; the soaking plate module is arranged on a heat source to absorb the heat of the heat source; The cold module is installed on the vapor chamber module to help the vapor chamber module dissipate heat; The soaking plate module includes a phase change liquid, a bottom plate, a heat sink plate, a sealing ring, a support column, and a raised structure; the bottom plate is arranged on the heat source, and is provided with a cavity for accommodating the phase change liquid; the The heat sink plate is arranged on the bottom plate, and its edge is sealed with the bottom plate through the sealing ring to form a heat conduction cavity for the vaporization and liquefaction of the phase change liquid; The bottom of the sink plate abuts; the protruding structure is arranged at the bottom of the heat sink plate and extends toward the bottom plate, and its position is staggered from the support column; the phase change liquid is filled in the heat conduction cavity formed by the bottom plate and the heat sink plate , to help the heat source dissipate quickly. 2 . The vacuum heat-conducting chamber soaking plate and air-cooled heat sink according to claim 1 , wherein the air-cooled module comprises a heat shield, a cooling sheet, a heat-conducting silica gel, a heat-dissipating fin, and a heat pipe; 3 . The heat insulation plate is arranged on the heat sink plate and is fixedly connected with the heat sink plate and the bottom plate, and an installation gap for installing the cooling sheet is arranged in the middle; The heat sink is connected and contacted with the heat sink plate; the heat dissipation fins are arranged on the cooling fins and are connected to the heat dissipation ends of the cooling fins through thermal conductive silica gel; the heat dissipation fins are provided with heat pipe mounting holes on the sides, and the heat pipe mounting holes penetrate through the heat dissipation fins Fins; the heat pipes are arranged in the heat dissipation fins, and are connected and contacted with the heat dissipation fins through the installation holes of the heat pipes. 3 . The vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device according to claim 2 , wherein the heat insulating plate is further provided with through holes for the wires of the cooling fins to pass through; the through holes It is arranged on the side of the heat shield and penetrates into the installation gap. 4 . The vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device according to claim 2 , wherein the refrigerating sheet is a semiconductor refrigerating sheet. 5 . 5 . The vacuum heat conduction chamber soaking plate and the air-cooled heat dissipation device according to claim 2 , wherein the heat pipe adopts a sintered copper rod heat pipe. 6 . 6 . The vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device according to claim 1 , wherein the protruding structure is made of copper powder. 7 . 7 . The vacuum heat-conducting chamber soaking plate and the air-cooled heat dissipation device according to claim 1 , wherein the air-cooled modules are arranged in several groups, and the several groups of air-cooled modules are stacked upward to improve the heat dissipation effect. 8 . 8 . The vacuum heat-conducting chamber soaking plate and the air-cooled heat sink according to claim 1 , wherein the bottom plate is further provided with an injection port for injecting phase change liquid; the injection port is provided on the bottom of the bottom plate. One end of the side is communicated with the cavity of the bottom plate, and the other end is communicated with the outside. 9 . The vacuum heat conduction chamber soaking plate and the air-cooled heat dissipation device according to claim 1 , wherein the filling rate of the phase change liquid is 35% to 50%. 10 . 10. The vacuum heat-conducting chamber soaking plate and air-cooled heat sink according to claim 1, wherein the convex structure adopts a conical convex structure design, the bottom of which is fixed with the bottom of the heat sink plate, and the conical part is Extends downward, its height is less than the height of the support column.

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