CN111650765A - Method for improving water-gel adhesion reliability and yield of display substrate group - Google Patents
Method for improving water-gel adhesion reliability and yield of display substrate group Download PDFInfo
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- CN111650765A CN111650765A CN202010385017.9A CN202010385017A CN111650765A CN 111650765 A CN111650765 A CN 111650765A CN 202010385017 A CN202010385017 A CN 202010385017A CN 111650765 A CN111650765 A CN 111650765A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A method for improving the water glue laminating reliability and the yield of a display substrate group comprises the steps of water glue flattening treatment of a first substrate, water glue flattening treatment of a second substrate, alignment laminating of the first substrate and the second substrate and basic solidification of the substrate group; the substrate group comprises a first substrate and a second substrate below the first substrate, and is characterized in that the water glue flattening treatment of the first substrate and the second substrate comprises the following steps: firstly, positioning a first substrate or a second substrate on a bonding base station after the bonding surface of the first substrate or the second substrate is upwards and laterally limited; then, adjusting the gluing and attaching surface of the first substrate or the second substrate to be in a horizontal state; secondly, coating the surface of the first substrate or the second substrate with glue until the glue surface is flat, and finally, precuring the glue layer. The invention eliminates the hidden danger of lamination bubbles generated by the unevenness of the substrate, reduces the control risk of lamination glue overflow and glue shortage, improves the yield and reliability of the lamination product and saves the production cost.
Description
Technical Field
The invention relates to a display technology, in particular to a reinforced display technology, and specifically relates to a method for improving the water-gel adhesion reliability and yield of a display substrate group.
Background
The display screen of the display is attached to the multifunctional window glass panel, the touch screen and the like by adopting a water glue process, so that the method is an effective technical measure for improving the environmental adaptability of the display.
The optical bonding includes: dry film lamination represented by an optically transparent pressure-sensitive adhesive film or the like; and glue coating methods such as pattern dispensing, screen printing, slit-coating and the like are used for glue coating. Due to the factors of unevenness and the like of the substrate, the water glue attaching method is superior to dry film attaching in avoiding bubble defects.
As shown in fig. 1, in general, the glue bonding of the substrate group is performed by aligning a first substrate 1 (i.e., an upper substrate) to a second substrate 3 (i.e., a lower substrate) positioned on a bonding stage. The first substrate 1 and the second substrate 3 may be a multi-function panel, a display panel, a framed display panel, a display, or a touch screen panel. The adhesive layer 2 is usually formed on the second substrate 3, i.e. before the two substrates are aligned and bonded, the second substrate 3 is coated with an adhesive. Or coating the water gel on the first substrate and then attaching the first substrate to the second substrate. For example, in the method of bonding a touch panel and a display panel of CN102991092A, glue is directly coated on the first substrate 1 on which the sealant is formed, and then the first substrate is bonded to the second substrate 3.
Under the ideal condition of flattening the substrate, after glue coating flattening such as slit-coating, screen printing, in-frame blade coating, graphic glue dispensing and the like, the edge of the substrate group which is laminated again can not generate a lamination gap, namely a bubble defect, due to local defects.
However, the actual display substrate glass may have some unevenness such as warpage and surface unevenness without being subjected to a special flattening and polishing treatment. Particularly, when the second substrate 3 is a display or a framed display, unevenness of the bonded surface is more likely to occur. Fig. 2 is a schematic view showing that the edge of the bonding surface of the first substrate 1 is warped and directly bonded to the flat adhesive layer 2 of the second substrate 3. In this case, although the first substrate 1 and the second substrate 3 can be bonded by using the apparatus, the substrate group can be forcibly bonded temporarily, and the following results are easily obtained:
firstly, before the glue layer 2 is not cured, the equipment is pressed on or sucked into the substrate by force, even if the glue amount before the gluing is measured, the flowing glue is always caused by the measures of measuring the thickness of the layer and the like, which are convenient for calculating and controlling the glue amount, and the glue overflow (or glue shortage) occurs because the substrate is uneven.
Secondly, the laminating or the suction force of the equipment is removed before or after the glue layer 2 is pre-cured, and because the glue layer is not originally solid, originally uneven or edge warped base plate, in the rebound and deformation recovery process of the base plate, the attaching layer 2 can retract due to the water glue which is not completely cured, or the rebound force of the base plate is larger than the adhesive force of the pre-cured glue layer 2 between the base plates, so that the phenomena of glue shortage or degumming can be caused.
Thirdly, after the adhesive layer 2 is solidified, although the product is temporarily checked to be qualified, the adhesive layer has adhesive stress, and in a subsequent product examination test or a use process, the adhesive layer 2 still has the potential problem that the potential reliability of degumming bubbles is caused due to the adhesive force of the adhesive layer 2 which is greater than the rebound strength and the deformation recovery strength of the substrate, so that display color spots (mura) of the LCD screen can be directly caused, and the quality and the reliability of the product are also reduced.
In order to avoid a large number of unqualified attaching products caused by attaching bubbles due to uneven substrates, in an industrial chain for manufacturing smart phones, a large number of pieces of equipment, plants and other hardware are added to the cover plate before attaching, and a large amount of manpower added in the later period is matched to carry out flattening processes such as grinding and polishing of the cover plate. However, for glass such as a display panel and ITO, due to unevenness such as warpage caused by various thermal stresses and film-attaching mounting compressive stress in the manufacturing process, the leveling measure of the smart phone panel glass cannot be adopted, so that the phenomenon of unevenness of the attaching surface commonly occurs in the upper and lower substrates to be attached. And for a large-size or even dozens of inches of oversized substrates, secondary grinding by equipment is not practical. Therefore, before the substrates are attached, the substrates are subjected to leveling treatment through water glue coating, and the method is an effective measure for improving the attachment yield, saving the production cost and improving the economic benefit.
As shown in fig. 3a and 3b, the first substrate 1 having unevenness is coated with the glue layer 2, and thus the planarization can be effectively performed. The first substrate 1 after the leveling of the water glue layer 2 is attached to the second substrate 3 with the flat surface, so that the hidden troubles of attachment bubbles and attachment stress existing in the attachment of the uneven substrate can be eliminated, as shown in fig. 4a and 4 b. Similarly, when the surface of the first substrate 1 is flat and the surface of the second base electrode 3 is not flat, the adhesive bubble and the hidden danger of the adhesive stress between the two substrates can be eliminated by only coating the second substrate 3 with the water glue.
However, in the conventional bonding technology, for example, the patent (publication No. CN 102991092A) discloses "a bonding method of a touch panel and a display panel", which relates to a glue bonding method of a touch panel and a display panel; U.S. Pat. Nos. (US 8462301B2, US2006/0159867A 1) "High-stretch optical bonding method using optical silicon a bonding medium and pressure sensitive adhesive as an interlayer", disclose a display screen frame bonding technique for a display. These existing glue coating and attaching technologies have one common point: the water glue is coated on one of the substrates, and then the two substrates are aligned and bonded.
The invention patent of "a display and its attaching method" with publication number CN103203949A, adopts a suitable size and process design of solid glue (dry film) to flatten a substrate with a protrusion on the periphery, and then attaches the substrate with another substrate having a flat surface by water glue. The method has complex process, easily introduces stress to the substrate, and can not avoid the risks of attaching bubbles and glue leakage when the other substrate is not flat.
The invention patent with application number 201710977403.5 relates to a method for improving the bonding strength of a bonding assembly, which adopts a method of respectively gluing upper and lower substrates and then bonding the substrates, so as to improve the bonding strength. However, there are reliability concerns such as bonding stress caused by the bonding surface being out of level, and the bonding yield is affected. Later applications may cause quality problems such as degumming, color spots, etc. If the uneven substrate is positioned by negative pressure adsorption, solidified by water-coating glue and attached again. After the negative pressure is removed, the glued binding surface is still in an uneven state.
Obviously, the bonding method of coating the water glue on the surface of only one substrate by adopting the prior art, or bonding two substrates after coating the water glue without adopting a leveling treatment measure, inevitably generates bonding bubble defects caused by warping and unevenness of the substrates, and control risks of glue overflow and glue shortage, and is also an important factor for improving the production cost of products and reducing the quality of the products.
Disclosure of Invention
The invention aims to solve the problem that the warpage of a substrate cannot be solved by the existing single substrate gluing and bonding process, and provides a method for improving the water glue bonding reliability and yield of a display substrate group.
The technical scheme of the invention is as follows:
a method for improving the water glue laminating reliability and the yield of a display substrate group comprises the steps of water glue flattening treatment of a first substrate, water glue flattening treatment of a second substrate, alignment laminating of the first substrate and the second substrate and basic solidification of the substrate group; the substrate group comprises a first substrate and a second substrate below the first substrate, and is characterized in that the water glue flattening treatment of the first substrate and the second substrate comprises the following steps:
firstly, positioning a first substrate and a second substrate on a bonding base station after the bonding surfaces of the first substrate and the second substrate face upwards and are laterally limited;
then, adjusting the gluing and attaching surfaces of the first substrate and the second substrate to be in a horizontal state;
thirdly, coating the surface of the first substrate and the surface of the second substrate with glue until the glue surfaces are flat;
fourthly, pre-curing the adhesive layers on the surfaces of the first substrate and the second substrate.
Fifthly, attaching the first substrate and the second substrate after the adhesive layer is pre-cured to obtain a substrate group;
and finally, carrying out the curing treatment on the substrate group.
In the specific implementation:
and (3) positioning the first substrate or the second substrate on the laminating table, not adopting vacuum negative pressure direct adsorption, and adopting a leaning grid and a tool clamp to carry out lateral limiting positioning.
The surface of the first substrate or the second substrate is coated with the water glue by slit-coating (slit-coating), in-frame blade coating and screen printing, wherein the slit-coating has a blade coating and leveling function on the coated glue layer.
The water glue can be a heat-curing glue or an ultraviolet-curing glue.
The first substrate or the second substrate in the substrate group is a display screen, a framed display screen or a display, a multifunctional panel, an optical transparent substrate or a conductive substrate or a touch screen panel.
And aligning and bonding the first substrate and the second substrate, preferably adopting a vacuum bonding method.
The invention has the beneficial effects that:
the two substrates to be bonded are respectively subjected to glue leveling treatment, so that bonding stress caused by factors such as substrate warping, unevenness and the like possibly existing in the original substrate is eliminated, hidden danger caused by bonding bubbles and control risks of glue overflow and glue shortage are improved, the yield and reliability of bonded products are improved, and the production cost is saved.
Drawings
FIG. 1 is a schematic view of a substrate and a bonding layer;
FIG. 2 is a schematic diagram showing the bonding effect between the uneven substrate and the flat bonding surface;
FIG. 3 is a schematic view of the leveling effect of the glue on the bonding surface of the uneven substrate;
FIG. 4 is a schematic view of the bonding effect of the uneven substrate bonding surface coated with the water gel and the flat bonding surface;
FIG. 5 is a schematic view of the glue layer after the upper and lower substrates are completely planarized;
FIG. 6 is a schematic view showing the bonding effect of the upper and lower substrates after being completely flattened.
Detailed Description
The invention is further described below with reference to the figures and examples.
Referring to fig. 1, the device includes a first substrate 1, a bonding adhesive layer 2, and a second substrate 3.
Referring to fig. 2, an air gap may be generated by the uneven first substrate 1 directly attached to the flat attaching layer 2 of the second substrate 3.
Referring to fig. 3, the first substrate 1 has a concave (as shown in fig. 3 a) and convex (as shown in fig. 3 b) uneven bonding surface, and has a planarized effect by the glue bonding layer 2.
Referring to fig. 4, the flat bonding surface of the first substrate 1 is concave (fig. 4 a) and convex (fig. 4 b), and the flat bonding surface of the second substrate has a bonding effect.
Referring to fig. 5, the glue on the first substrate coats a smooth glue layer 21 and the glue on the second substrate coats a glue layer 22.
Referring to fig. 6, the first substrate 1 is coated and planarized by the glue layer 21; the second substrate 3 is coated by the glue layer 22 to achieve the actual bonding effect.
Examples are given.
For the actual display of the uneven state of the substrate bonding surface, in this practical example, a method of pre-coating the first substrate and the second substrate with water for leveling and then bonding is adopted, as shown in fig. 5, the adhesive layer 21 is coated on the first substrate 1, and the adhesive layer 22 is coated on the second substrate 3. The bonding method comprises the following steps: carrying out water glue leveling treatment on the first substrate 1; carrying out water glue leveling treatment on the second substrate 3; aligning and bonding the first substrate 1 and the second substrate 3 to obtain a substrate group; and curing the substrate assembly.
The water glue planarization treatment of the first substrate and the second substrate comprises the following steps:
first, the substrate is positioned on the bonding stage with the bonding surface facing upward. The substrate positioning method does not adopt a vacuum adsorption method, and preferentially adopts a leaning grid and a tool clamp to carry out lateral limiting positioning.
And then, adjusting the gluing and attaching surface of the substrate to be in a horizontal state. Such as laser thickness measurement.
Secondly, coating the water glue on the surface of the substrate until the water glue surface is flat. The substrate surface is coated with the water gel by using water gel coating methods such as slit-coating, screen printing, in-frame blade coating, pattern dispensing and the like. After the glue is coated, the substrate can be properly kept stand until the glue on the surface of the substrate is leveled. However, in order to save the leveling time of the adhesive layer, a coating method having a blade coating leveling function for the coated adhesive layer, such as slit-coating (slit-coating), in-frame blade coating, screen printing, etc., is preferably used. If a graphic dispensing method is adopted, dispensing and curing are needed at the periphery, and a surrounding frame for preventing glue overflow is established.
Finally, precuring the adhesive layer;
the substrate in the substrate group may be a display screen, a framed display screen or display, a multifunctional panel, an optically transparent substrate or a conductive substrate, or a touch screen panel.
The water glue can be a heat-curing glue or an ultraviolet-curing glue.
In the water-gel planarization treatment of the first substrate 1 and the second substrate 3, the pre-curing of the gel layer of one of the substrates may be changed to the curing-only process.
By adopting the method, although the joint surfaces of the upper substrate and the lower substrate have unevenness such as concave-convex, after the joint, the adhesive layer and the space between the adhesive layer and the substrate do not have joint stress caused by unevenness of the joint surfaces. As shown in fig. 6, the hidden trouble of bubble defect caused by the unevenness of the substrate is eliminated to the maximum extent, and the bonding yield and the use reliability of the product are remarkably improved.
The foregoing embodiments are merely illustrative of the principles of this invention and its efficacy, and all equivalent modifications or changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.
The present invention is not concerned with parts which are the same as or can be implemented using prior art techniques.
Claims (6)
1. A method for improving the water glue laminating reliability and the yield of a display substrate group comprises the steps of water glue flattening treatment of a first substrate, water glue flattening treatment of a second substrate, alignment laminating of the first substrate and the second substrate and basic solidification of the substrate group; the substrate group comprises a first substrate and a second substrate below the first substrate, and is characterized in that the water glue flattening treatment of the first substrate and the second substrate comprises the following steps:
firstly, positioning a first substrate and a second substrate on a bonding base station after the bonding surfaces of the first substrate and the second substrate face upwards and are laterally limited;
then, adjusting the gluing and attaching surfaces of the first substrate and the second substrate to be in a horizontal state;
secondly, coating the surface of the first substrate and the surface of the second substrate with glue until the glue surfaces are flat;
and finally, pre-curing the adhesive layer.
2. The method as claimed in claim 1, wherein the first substrate or the second substrate is positioned on the bonding stage by lateral positioning using a fence or a work fixture without direct vacuum suction.
3. The method as claimed in claim 1, wherein the step of coating the surface of the first substrate or the second substrate with the water glue is slot-coating (slit-coating), in-frame coating, or screen printing.
4. The method as claimed in claim 1, wherein the aqueous glue is a heat-curable glue or an ultraviolet-curable glue.
5. The method of claim 1, wherein the first or second substrate in the set of substrates is a display screen, a framed display screen or display, a multifunction panel, an optically transparent substrate or a conductive substrate, or a touch screen panel.
6. The method of claim 1, wherein the first substrate and the second substrate are bonded together by vacuum bonding.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010385017.9A CN111650765A (en) | 2020-05-09 | 2020-05-09 | Method for improving water-gel adhesion reliability and yield of display substrate group |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010385017.9A CN111650765A (en) | 2020-05-09 | 2020-05-09 | Method for improving water-gel adhesion reliability and yield of display substrate group |
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| WO2019246060A1 (en) * | 2018-06-19 | 2019-12-26 | Corning Incorporated | Optically clear resins for thin glass laminates |
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2020
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| CN103635493A (en) * | 2011-10-21 | 2014-03-12 | 日本化药株式会社 | Method for producing optical member and use of ultraviolet ray cured resin composition for same |
| CN103403784A (en) * | 2012-01-25 | 2013-11-20 | 迪睿合电子材料有限公司 | Image display device fabrication method |
| CN102896873A (en) * | 2012-10-26 | 2013-01-30 | 东莞宇龙通信科技有限公司 | Fitting jig for display screen and touch screen, fitting device and method |
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Application publication date: 20200911 |