CN111640849A - LED display device, preparation method thereof and display equipment - Google Patents
LED display device, preparation method thereof and display equipment Download PDFInfo
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- CN111640849A CN111640849A CN202010486569.9A CN202010486569A CN111640849A CN 111640849 A CN111640849 A CN 111640849A CN 202010486569 A CN202010486569 A CN 202010486569A CN 111640849 A CN111640849 A CN 111640849A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 230000000903 blocking effect Effects 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 23
- 238000005538 encapsulation Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an LED display device, a preparation method thereof and display equipment, wherein the LED display device comprises a substrate, a plurality of pixel points arranged on the substrate, and packaging adhesive covering the pixel points, the pixel points comprise at least one LED chip, and the LED display device further comprises a light blocking wall which is arranged in an extending manner along the surface of the packaging adhesive towards the direction of the substrate and is positioned between two adjacent pixel points. The LED display device provided by the invention has the advantages that the light blocking wall is arranged between the two adjacent pixel points, so that the plurality of pixel points are isolated from one another, the crosstalk phenomenon between any two adjacent pixel points can be effectively avoided, the mutual interference between different light rays is avoided, the contrast and sharpness of the finally formed image are improved, and the image definition is ensured.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to an LED display device, a preparation method thereof and display equipment adopting the LED display device.
Background
At present, because the LED display screen has the advantages of bright color, wide dynamic range, high brightness, low power consumption, long service life, impact resistance, stability, reliability, etc., it has become the most advantageous new generation of display media, and is widely applied to large squares, commercial advertisements, stadiums, etc.
The LED display screen is mainly formed by assembling a plurality of LED display devices, and each LED display device is packaged with one or more pixel points. As shown in fig. 1, for an LED display device packaged with a plurality of pixel points, the conventional packaging structure generally arranges a plurality of LED chips 200 on a substrate 100 to form the pixel points, and then manufactures a packaging layer 300 covering the LED chips 200 on the substrate 100. This structure is simply all encapsulated together a plurality of pixel, can lead to its light that sends can mutual interference when adjacent pixel is luminous simultaneously, and then the image that leads to final formation appears the color poor, contrast and acutance not enough, the not good scheduling problem of display effect.
Disclosure of Invention
The primary object of the present invention is to provide an LED display device in which the light emission of adjacent pixel points does not interfere with each other.
The invention also aims to provide a preparation method of the LED display device, which is suitable for preparing the LED display device.
It is still another object of the present invention to provide a display apparatus employing the above LED display device.
In order to achieve the purpose, the invention provides the following technical scheme:
as a first aspect, the present invention relates to an LED display device, including a substrate, a plurality of pixel points arranged on the substrate, and an encapsulation adhesive covering the pixel points, where the pixel points include at least one LED chip, and the LED display device further includes a light blocking wall extending from a surface of the encapsulation adhesive toward the substrate and located between two adjacent pixel points.
Preferably, the packaging adhesive is provided with a mounting groove between two adjacent pixel points, and the light blocking wall is filled in the mounting groove.
Preferably, the light blocking wall has a distance from the substrate, and the distance is smaller than the height of the LED chip from the substrate.
Preferably, the light blocking wall is made of a black material.
Preferably, the side wall of the light blocking wall is coated with a light reflecting material.
Furthermore, four pixel points are arranged, the four pixel points are in a rectangular array, and the light blocking wall is in a cross-shaped structure arranged among the four pixel points.
Further, the pixel point comprises a red light LED chip, a green light LED chip and a blue light LED chip.
As a second aspect, the present invention further relates to a method for manufacturing an LED display device, which is suitable for manufacturing the LED display device, and includes the following steps: arranging a plurality of groups of LED chips on a substrate to form a plurality of pixel points; coating packaging glue for covering the pixel points on the substrate, wherein a mounting groove positioned between two adjacent pixel points is formed in the surface of the packaging glue; and filling a light-proof material in the mounting groove to form a light-blocking wall.
Preferably, coating covers on the base plate the encapsulation of pixel is glued, the surface that the encapsulation was glued is equipped with the mounting groove that is located between two adjacent pixels, specifically includes: coating packaging glue for covering the pixel points on the substrate; and cutting the surface of the packaging adhesive to form a mounting groove between two adjacent pixel points.
Further, lay multiunit LED chip on the base plate and form a plurality of pixel, specifically include: coating solder on the top pad of the substrate; and placing a plurality of groups of LED chips on the top bonding pads corresponding to the substrate and fixedly welding the LED chips relative to the substrate through the welding materials.
As a third aspect, the present invention also relates to a display apparatus comprising a mounting structure and a plurality of the above-described LED display devices arranged on the mounting structure.
Compared with the prior art, the scheme of the invention has the following advantages:
1. the LED display device provided by the invention has the advantages that the light blocking wall is arranged between every two adjacent pixel points, so that the plurality of pixel points are isolated from one another, the crosstalk phenomenon between any two adjacent pixel points can be effectively avoided, the mutual interference between different light rays is avoided, the contrast and sharpness of the finally formed image are improved, and the image definition is ensured.
2. In the LED display device provided by the invention, the light blocking wall has a distance from the substrate, so that the phenomenon of light crosstalk between two adjacent LED chips is effectively avoided, the two adjacent LED chips can be ensured to be still separated by the packaging adhesive, and the protection effect of the packaging adhesive on the LED chips is not influenced.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic side view of a conventional LED display device;
fig. 2 is a schematic side view of an LED display device according to an embodiment of the present invention;
fig. 3 is a schematic front view of the LED display device shown in fig. 2;
FIG. 4 is a flow chart of the fabrication of the LED display device shown in FIG. 2;
fig. 5 is a step diagram of a method for manufacturing an LED display device according to the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
It will be understood by those within the art that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
Fig. 2 and fig. 3 jointly show the LED display device provided by the embodiment of the present invention, in which a plurality of pixel points are encapsulated, and light rays emitted by adjacent pixel points do not interfere with each other, so that the display effect can be greatly improved, the contrast and sharpness of the finally formed image can be improved, and the image is ensured to be clear.
Specifically, the LED display device 1 includes a substrate 11, a plurality of pixel points 12 arranged on the substrate 11, an encapsulation adhesive 13 covering the pixel points 12, and a light blocking wall 14 extending along a surface of the encapsulation adhesive 13 toward the substrate 11 and located between two adjacent pixel points 12, where the pixel points 12 include at least one LED chip 121.
Referring to fig. 2, the arrows in the figure indicate the transmission directions of light, and since the light-blocking wall 14 is disposed between two adjacent pixels 12, the light-blocking wall 14 can block the light to effectively prevent the pixel 12 from emitting the light to another adjacent pixel 12, so that the light emitted by each pixel 12 can be emitted to the outside independently, and no interference is caused between the light and the other pixels.
Specifically, the surface of the encapsulation adhesive 13 is provided with an installation groove 131 (shown in fig. 4) located between two adjacent pixels 12, the light blocking wall 14 is filled in the installation groove 131, the depth of the installation groove 131 is set according to the height requirement of the light blocking wall 14, the light blocking wall 14 can be directly filled in the installation groove 131 after the installation groove 131 is formed on the cured encapsulation adhesive 13 by cutting, and the processing procedure is simple, which is beneficial to improving the processing efficiency.
Preferably, the distance between the light-blocking wall 14 and the substrate 11 is smaller than the height of the LED chip 121 relative to the substrate 11, that is, the light-blocking wall 14 is completely blocked at the side of the light-emitting surface of the LED chip 121, so that the phenomenon of crosstalk between two adjacent LED chips 121 is effectively avoided. Meanwhile, the light blocking walls 14 have a distance from the substrate 11, so that two adjacent LED chips 121 are still separated by the packaging adhesive 13, and the protection effect of the packaging adhesive 13 on the LED chips 121 is not affected.
Preferably, the light-blocking wall 14 is made of a black material to ensure that it has a light-tight characteristic and does not change the color of the light emitted by the pixel 12, and the light-blocking wall 14 may be made of a black rubber material through an injection molding or a molding process.
More preferably, the lateral wall of light-blocking wall 14 is coated with the reflecting material (not shown in the figure, the same below) that is used for the reflection pixel 12 sends light, through reflecting material further promotes light-blocking wall 14's the effect of being in the light and can play the effect of assembling light, promptly through reflecting material can with the light that pixel 12 distributed out carries out spotlight to the luminance and the color saturation of reinforcing light promote user experience.
With reference to fig. 3, further, four pixel points 12 are provided, and are in a rectangular array, that is, the LED display device 1 adopts a "four-in-one" integrated package scheme, which can better control the cost, is beneficial to optimizing the terminal manufacturing process, and reduces the number of solder joints. Correspondingly, the light blocking wall 14 is a cross-shaped structure disposed between the four pixel points 12.
Further, the pixel 12 includes three LED chips 121, the three LED chips 121 are respectively a red LED chip, a green LED chip and a blue LED chip, and the pixel 12 realizes full-color light emission through the combination of three-color chips, thereby meeting the requirements of more use scenes.
It should be understood that, in other embodiments, the number of the pixel points 12 is not limited to four, and when the manufacturing process and the cost meet the requirement, the LED display device 1 may also be provided with six, eight, or even more pixel points 12, which can further improve the optical characteristics and the reliability. Secondly, in other embodiments, the pixel 12 may only include one LED chip 121 to achieve monochromatic light emission, and four or more LED chips 121 may also be provided, for example, four LED chips 121 including a red LED chip, a green LED chip, a blue LED chip, and a white LED chip, so as to further improve the color saturation of the pixel 12.
As shown in fig. 2, the substrate 11 includes a base material 111 and solder resist ink 112 disposed on the base material 111 and surrounding the pixel 12, and the base material 111 can be prevented from being damaged at a portion of the periphery of the pixel 12 that does not need to be soldered by the protective effect of the solder resist ink 112, so as to improve the soldering efficiency of the LED chip 121.
Further, the substrate 11 further includes a bottom pad 113 disposed at the bottom of the base material 111 and electrically connected to a control circuit of a display device, and a top pad 114 disposed at the top of the base material 111 and used for soldering the LED chip 121.
Referring to fig. 4 and fig. 5, as a second aspect, an embodiment of the present invention further provides a manufacturing method (hereinafter, referred to as a "manufacturing method") of an LED display device, where the manufacturing method is suitable for manufacturing the LED display device 1. Specifically, the preparation method comprises the following steps:
step S1: a plurality of groups of LED chips 121 are arranged on the substrate 11 to form a plurality of pixels 12.
Specifically, the prepared solder 151 is coated on the top pads 114 of the substrate 11, then the plurality of groups of LED chips 121 are placed on the corresponding top pads 114 one by one, and the leads 1211 of the LED chips 121 are in contact with the solder 15 and then are fixed to the top pads 114 by the solder 15, so as to complete the soldering process of the LED chips 121.
Four groups of LED chips 121 are arranged, each group of LED chips 121 forms one pixel point 12, and the four pixel points 12 are arranged on the substrate 11 in a rectangular array. To ensure the overall color balance, the arrangement order and the pitch of the different color chips in each group of LED chips 121 are the same.
Further, the top pad 114 should be cleaned prior to applying the solder 15. After the LED chip 121 is disposed, a next process is performed after the LED chip 121 is completely fixed, so as to ensure that the LED chip 121 is not loosened.
Step S2: and coating the packaging adhesive 13 covering the pixel points 12 on the substrate 11, wherein the surface of the packaging adhesive 13 is provided with a mounting groove 131 between two adjacent pixel points 12.
After the pixel points 12 are arranged, the packaging adhesive 13 for protecting the LED chip 121 is coated, and the packaging adhesive 13 can be liquid silicone rubber made of organic silicon as a main raw material, so as to have good high and low temperature resistance and electrical insulation capability, excellent dielectric property and moisture resistance, and good refractive index and light transmittance.
Further, after the encapsulation adhesive 13 is coated, the encapsulation adhesive 13 should be heated and cured, and after the encapsulation adhesive 13 is cured, the surface of the encapsulation adhesive 13 is cut to form the mounting groove 131.
In other embodiments, if the conditions are met, the packaging adhesive 13 with the mounting groove 131 can be directly formed on the substrate 11 by injection molding using a customized mold without an additional cutting process.
Step S3: the installation groove 131 is filled with a light-proof material to form the light-blocking wall 14.
After the mounting groove 131 is to be cut, the mounting groove 131 is filled with a light-proof material and is heated and fixed, so as to form the light-blocking wall 14 located between any two adjacent pixels 12. The light blocking wall 14 can be made of black material, preferably black rubber material, so that it has good light blocking effect, strong plasticity and convenient processing.
Preferably, before filling the light blocking wall 14, a reflective material may be coated on the inner wall of the installation groove 131, for example, a reflective film may be disposed on the inner wall of the installation groove 131. Finally, a light reflecting structure located on the side wall of the light blocking wall 14 is formed, so that the light condensing effect of the pixel points 12 can be realized, and the brightness and the color saturation of light can be enhanced.
And finally, after the light blocking wall 14 is heated and cured, cutting the redundant substrate 11 and the packaging adhesive 13 at the edge according to requirements to form the LED display device 1.
Preferably, a plurality of LED display devices 1 may be simultaneously prepared on one large substrate, and finally, a single LED display device 1 is formed by dicing.
As a third aspect, the embodiment of the present invention further relates to a display device (not shown, the same applies to the following), which may be an LED display, an LED billboard, or the like, and includes a mounting structure and a plurality of the above-mentioned LED display devices 1 arranged on the mounting structure, where the mounting structure includes a mounting bracket and a driving circuit, a control circuit, and the like of the LED display devices 1.
Due to the adoption of the LED display device 1, the light blocking wall 14 in the LED display device 1 can effectively avoid the phenomenon of light crosstalk between any two adjacent pixel points 12, so that the contrast, sharpness and other parameters of the final image of the display equipment are improved, and the image is clear.
The foregoing is only a partial embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The LED display device comprises a substrate, a plurality of pixel points arranged on the substrate, and packaging adhesive covering the pixel points, wherein each pixel point comprises at least one LED chip.
2. The LED display device as claimed in claim 1, wherein the packaging adhesive has a mounting groove disposed between two adjacent pixels, and the light-blocking wall is filled in the mounting groove.
3. The LED display device as claimed in claim 1, wherein the light blocking wall has a distance from the substrate, and the distance is smaller than a height of the LED chip from the substrate.
4. The LED display device of claim 1, wherein the light blocking wall is made of a black material.
5. The LED display device as claimed in claim 1 or 4, wherein the side walls of the light blocking walls are coated with a light reflecting material.
6. The LED display device of claim 1, wherein four of said pixel points are arranged in a rectangular array, and said light-blocking wall is a cross-shaped structure arranged between said four pixel points.
7. A method for manufacturing an LED display device, suitable for manufacturing an LED display device according to any one of claims 1 to 6, comprising the steps of:
arranging a plurality of groups of LED chips on a substrate to form a plurality of pixel points;
coating packaging glue for covering the pixel points on the substrate, wherein a mounting groove positioned between two adjacent pixel points is formed in the surface of the packaging glue;
and filling a light-proof material in the mounting groove to form a light-blocking wall.
8. The method according to claim 7, wherein a substrate is coated with an encapsulation adhesive covering the pixels, and a mounting groove is formed in a surface of the encapsulation adhesive and located between two adjacent pixels, and the method specifically includes:
coating packaging glue for covering the pixel points on the substrate;
and cutting the surface of the packaging adhesive to form a mounting groove between two adjacent pixel points.
9. The method according to claim 7, wherein the step of arranging a plurality of groups of LED chips on the substrate to form a plurality of pixels includes:
coating solder on the top pad of the substrate;
and placing a plurality of groups of LED chips on the top bonding pads corresponding to the substrate and fixedly welding the LED chips relative to the substrate through the welding materials.
10. A display device comprising a mounting structure and a plurality of display devices arranged on the mounting structure, characterized in that the display devices are LED display devices according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486569.9A CN111640849A (en) | 2020-06-01 | 2020-06-01 | LED display device, preparation method thereof and display equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486569.9A CN111640849A (en) | 2020-06-01 | 2020-06-01 | LED display device, preparation method thereof and display equipment |
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| Publication Number | Publication Date |
|---|---|
| CN111640849A true CN111640849A (en) | 2020-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010486569.9A Pending CN111640849A (en) | 2020-06-01 | 2020-06-01 | LED display device, preparation method thereof and display equipment |
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| CN (1) | CN111640849A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394327A (en) * | 2021-06-11 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Packaging method and packaging structure of LED display screen and LED display screen |
| CN114447192A (en) * | 2022-01-20 | 2022-05-06 | 东莞市中麒光电技术有限公司 | Display module manufacturing method, display module and display screen |
-
2020
- 2020-06-01 CN CN202010486569.9A patent/CN111640849A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394327A (en) * | 2021-06-11 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Packaging method and packaging structure of LED display screen and LED display screen |
| CN114447192A (en) * | 2022-01-20 | 2022-05-06 | 东莞市中麒光电技术有限公司 | Display module manufacturing method, display module and display screen |
| CN114447192B (en) * | 2022-01-20 | 2023-09-19 | 东莞市中麒光电技术有限公司 | Display module manufacturing method, display module and display screen |
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