CN111592620A - 用于3d打印的光固化材料 - Google Patents
用于3d打印的光固化材料 Download PDFInfo
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- CN111592620A CN111592620A CN202010483089.7A CN202010483089A CN111592620A CN 111592620 A CN111592620 A CN 111592620A CN 202010483089 A CN202010483089 A CN 202010483089A CN 111592620 A CN111592620 A CN 111592620A
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- Prior art keywords
- acrylate
- printing
- modified carbon
- vacuum
- filtering
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- 239000000463 material Substances 0.000 title claims abstract description 48
- 238000010146 3D printing Methods 0.000 title claims abstract description 41
- 238000000016 photochemical curing Methods 0.000 title claims abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 59
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000011575 calcium Substances 0.000 claims abstract description 32
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 32
- 239000002131 composite material Substances 0.000 claims abstract description 31
- 230000009974 thixotropic effect Effects 0.000 claims abstract description 7
- 239000003085 diluting agent Substances 0.000 claims abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 30
- 238000001914 filtration Methods 0.000 claims description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 25
- 239000000243 solution Substances 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 21
- 238000005406 washing Methods 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 15
- 239000002041 carbon nanotube Substances 0.000 claims description 14
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 14
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 12
- 229910021641 deionized water Inorganic materials 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000002202 Polyethylene glycol Substances 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229920001223 polyethylene glycol Polymers 0.000 claims description 9
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 7
- 229910002090 carbon oxide Inorganic materials 0.000 claims description 7
- 239000002071 nanotube Substances 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 7
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- 239000004115 Sodium Silicate Substances 0.000 claims description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 6
- 238000001354 calcination Methods 0.000 claims description 6
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 6
- 229910000388 diammonium phosphate Inorganic materials 0.000 claims description 6
- 235000019838 diammonium phosphate Nutrition 0.000 claims description 6
- 235000019441 ethanol Nutrition 0.000 claims description 6
- 239000000706 filtrate Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001291 vacuum drying Methods 0.000 claims description 6
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910021485 fumed silica Inorganic materials 0.000 claims description 5
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- FZSHSWCZYDDOCK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;oxolane Chemical compound C1CCOC1.CC(=C)C(O)=O FZSHSWCZYDDOCK-UHFFFAOYSA-N 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- PCLLJCFJFOBGDE-UHFFFAOYSA-N (5-bromo-2-chlorophenyl)methanamine Chemical compound NCC1=CC(Br)=CC=C1Cl PCLLJCFJFOBGDE-UHFFFAOYSA-N 0.000 claims description 3
- ZANRHLGMHYOWQU-UHFFFAOYSA-N 1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)C(=O)C(C)CC1=CC=C(OCCO)C=C1 ZANRHLGMHYOWQU-UHFFFAOYSA-N 0.000 claims description 3
- PWMWNFMRSKOCEY-UHFFFAOYSA-N 1-Phenyl-1,2-ethanediol Chemical compound OCC(O)C1=CC=CC=C1 PWMWNFMRSKOCEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- HLJYBXJFKDDIBI-UHFFFAOYSA-N O=[PH2]C(=O)C1=CC=CC=C1 Chemical compound O=[PH2]C(=O)C1=CC=CC=C1 HLJYBXJFKDDIBI-UHFFFAOYSA-N 0.000 claims description 3
- 244000028419 Styrax benzoin Species 0.000 claims description 3
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 3
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 claims description 3
- 150000001251 acridines Chemical class 0.000 claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 claims description 3
- 229960002130 benzoin Drugs 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 235000019382 gum benzoic Nutrition 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 3
- RZFODFPMOHAYIR-UHFFFAOYSA-N oxepan-2-one;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1CCCCCO1 RZFODFPMOHAYIR-UHFFFAOYSA-N 0.000 claims description 3
- 150000002988 phenazines Chemical class 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 150000003252 quinoxalines Chemical class 0.000 claims description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 3
- RZLXRFDFCORTQM-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O RZLXRFDFCORTQM-UHFFFAOYSA-N 0.000 claims description 2
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 9
- 238000012360 testing method Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000000844 anti-bacterial effect Effects 0.000 description 3
- 230000001580 bacterial effect Effects 0.000 description 3
- 238000000498 ball milling Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 235000011837 pasties Nutrition 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 2
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical compound OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 2
- 241000588724 Escherichia coli Species 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000001963 growth medium Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- PDGQDNBBPDKZRE-UHFFFAOYSA-N (1-aminocyclohexa-2,4-dien-1-yl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(N)CC=CC=C1 PDGQDNBBPDKZRE-UHFFFAOYSA-N 0.000 description 1
- VVKZEEWRYIIUOF-UHFFFAOYSA-N (1-hydroxycyclohexa-2,4-dien-1-yl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CC=CC=C1 VVKZEEWRYIIUOF-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZCILGMFPJBRCNO-UHFFFAOYSA-N 4-phenyl-2H-benzotriazol-5-ol Chemical compound OC1=CC=C2NN=NC2=C1C1=CC=CC=C1 ZCILGMFPJBRCNO-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical compound [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/065—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to unsaturated polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
- C08F283/124—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes on to polysiloxanes having carbon-to-carbon double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
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Abstract
本发明提供了一种用于3D打印的光固化材料,其按重量百分比包含:光固化低聚物20‑40wt%、活性稀释剂5‑30wt%、光引发剂0.1‑1wt%、触变促进剂1‑10wt%、改性碳纳米管/磷硅酸钙复合粉体20‑50wt%。本发明的光固化材料能顺利实现SLA/DLP原理的3D打印工艺,制作的产品具有0.1~0.2%的低体积收缩率,机械强度高,韧性好,拉伸强度100~120MPa,弯曲强度在120~130MPa,断裂伸长15~20%,户外耐候性测试六个月,机械性能指标保持在98~100%,可以作为终端产品材料使用。
Description
技术领域
本发明涉及3D打印材料,具体涉及一种用于3D打印的光固化材料。
背景技术
3D打印是借助于计算机辅助设计与控制,将液体(粉末)材料通过层层叠加的方式来制造固体三维物体的成型方法,该技术发展至今,以立体光刻(SLA)和数字光处理技术(DLP)成型精度最好。SLA/DLP 3D成型技术所用材料均为液体光固化树脂,在特定波长的光能量下辐射固化,液体光敏树脂变成固体交联结构,材料本质上属于热固性塑胶材料,且具有比传统热固性交联结构材料更高的交联密度,具有硬而脆的天然缺陷,耐疲劳性能差,抗老化性能差,无法应用于终端产品。
发明内容
鉴于背景技术中存在的问题,本发明的目的在于提供一种用于3D打印的光固化材料,该光固化材料具有特有的触变性,触变性赋予其具有适用于3D打印工艺的特性,经光固化成型后的产品,具有收缩率小、耐高温性、耐磨性、耐久性以及其他相应的性能,可用于军工、航天、汽车、生物医疗、电子电路等领域。
为了实现上述目的,本发明提供了一种用于3D打印的光固化材料,按重量百分比,包含:
进一步地,所述改性碳纳米管/磷硅酸钙复合粉体的制备方法包括以下步骤:1)将硝酸钙、摩尔浓度为0.1-1mol/L的硅酸钠溶液、摩尔浓度为0.1-1mol/L的磷酸氢二胺溶液和改性碳纳米管依次投入反应釜中,重量比为1:10:10:0.1;2)启动反应釜的搅拌装置,计量器以0.5L/min的速度滴加氨水,保持溶液的pH为8-9,并继续搅拌16-17小时,然后过滤去除滤液,并依次用去离子水和无水乙醇充分洗涤残余固体,滤干后再真空100℃烘干,得到胚料;3)将所述胚料放入真空炉中,真空度1Mpa,600-700℃锻烧2-2.5小时,自然冷却后研磨,得到改性碳纳米管/磷硅酸钙复合粉体。
进一步地,所述改性碳纳米管/磷硅酸钙复合粉体粒径为1-
5μm。
进一步地,所述改性碳纳米管的制备方法为:1)将碳纳米管浸入浓硝酸中加热10h,温度150℃,过滤,去离子水洗涤至pH为6-7,100℃真空干燥3h,自然冷却,研磨后得到氧化碳纳米管;2)将所述氧化碳纳米管加入到乙醇溶液中,再滴加3-胺丙基三乙氧基硅烷,80℃下搅拌2-5h,经Φ0.45μm聚四氟乙烯膜过滤,无水乙醇洗涤,120℃真空干燥,得到改性碳纳米管。
进一步地,所述光固化低聚物包括聚丙烯酸酯、有机硅丙烯酸酯、环氧丙烯酸酯、聚酯丙烯酸酯、聚醚丙烯酸酯和聚氨酯丙烯酸酯中的一种或者组合。
进一步地,所述活性稀释剂为二环戊二烯甲基丙烯酸酯、四氢呋喃甲基丙烯酸酯、二苯氧基乙基丙烯酸酯、甲基丙烯酸异冰片酯、丙烯酸己内酯、环三羟甲基丙烷缩甲醛丙烯酸酯、环己烷二甲醇二丙烯酸酯、聚乙二醇二甲基丙烯酸酯、(丙氧化)新戊二醇二甲基丙烯酸酯、三环癸烷二甲醇二丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、季戊四醇三丙烯酸酯中的至少一种。
进一步地,所述光引发剂为安息香、苯乙酮、联苯酰缩酮、蒽醌、三苯基膦、苯甲酰基氧化膦、双酰基氧化膦、苯甲酮、噻吨酮、氧杂蒽酮、吖啶衍生物、吩嗪衍生物、喹喔啉衍生物、1-苯基-1,2-丙二酮-2-O-苯甲酰肟、4-(2-羟基乙氧基)苯基-(2-丙基)酮、1-氨基苯酮和1-羟基苯酮中的至少一种。
进一步地,所述触变促进剂为聚乙二醇、聚丙二醇、聚四氢呋喃以及气相二氧化硅中的一种或几种。
进一步地,还包括1-10wt%的强度促进剂,所述强度促进剂为羟基官能团丙烯酸酯、羧基官能团丙烯酸酯、环氧基官能团丙烯酸酯中的一种或几种。
进一步地,所述触变促进剂和强度促进剂附着于改性碳纳米管/磷硅酸钙复合粉体的表面。
本发明的有益技术效果如下:
(1)本发明创造性地将独特的改性碳纳米管/磷硅酸钙复合粉体加入3D打印用光敏树脂体系中,不仅赋予光敏树脂合适的触变性,而且光固化后制得的产品高尺寸稳定性、耐高温性、高模量、高硬度、高耐磨性、较好的阻尼性、生物相容性以及极好的抗老化等综合性能,尤其是利用了碳纳米管的杀菌性和磷硅酸钙的生物相容性,使3D打印产品更加适用于医疗领域。
(2)强度促进剂改善改性碳纳米管/磷硅酸钙复合粉体与光敏树脂中的相容性和分散性,提高机械强度,而且协同改性碳纳米管/磷硅酸钙复合粉体以改善光固化材料的触变性---剪切变稀,使得3D打印平台下落时对光固化材料施加的力促使其粘度变小,利于3D打印工艺顺利进行。
(3)本发明的光固化材料能顺利实现SLA/DLP原理的3D打印工艺,制作的产品具有0.1~0.2%的低体积收缩率,机械强度高,韧性好,拉伸强度100~120MPa,弯曲强度在120~130MPa,断裂伸长15~20%,户外耐候性测试六个月,机械性能指标保持在98~100%,可以作为终端产品材料使用。
具体实施方式
为使发明的上述目的、特征和优点能够更加明显易懂,下面对本发明的具体实施方式做详细的说明。
在下面的描述中阐述了很多具体细节以便于充分理解本发明,但是本发明还可以采用其它不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本发明内涵的情况下做类似推广,因此本发明不受下面公开的具体实施例的限制。
根据本发明的用于3D打印的光固化材料按重量百分比包含:
在根据本发明的用于3D打印的光固化材料中,所述改性碳纳米管/磷硅酸钙复合粉体的制备方法可包括以下步骤:1)将硝酸钙、摩尔浓度为0.1-1mol/L的硅酸钠溶液、摩尔浓度为0.1-1mol/L的磷酸氢二胺溶液和改性碳纳米管依次投入反应釜中,重量比为1:10:10:0.1;2)启动反应釜的搅拌装置,计量器以0.5L/min的速度滴加氨水,保持溶液的pH为8-9,并继续搅拌16-17小时,然后过滤去除滤液,并依次用去离子水和无水乙醇充分洗涤残余固体,滤干后再真空100℃烘干,得到胚料;3)将所述胚料放入真空炉中,真空度1Mpa,600-700℃锻烧2-2.5小时,自然冷却后研磨,得到改性碳纳米管/磷硅酸钙复合粉体。
在根据本发明的用于3D打印的光固化材料中,所述改性碳纳米管/磷硅酸钙复合粉体粒径可为1-5μm。
在根据本发明的用于3D打印的光固化材料中,所述改性碳纳米管的制备方法可为:1)将碳纳米管浸入浓硝酸中加热10h,温度150℃,过滤,去离子水洗涤至pH为6-7,100℃真空干燥3h,自然冷却,研磨后得到氧化碳纳米管;2)将所述氧化碳纳米管加入到乙醇溶液中,再滴加3-胺丙基三乙氧基硅烷,80℃下搅拌2-5h,经Φ0.45μm聚四氟乙烯膜过滤,无水乙醇洗涤,120℃真空干燥,得到改性碳纳米管。
在根据本发明的用于3D打印的光固化材料中,所述光固化低聚物可包括聚丙烯酸酯、有机硅丙烯酸酯、环氧丙烯酸酯、聚酯丙烯酸酯、聚醚丙烯酸酯和聚氨酯丙烯酸酯中的一种或者组合。
在根据本发明的用于3D打印的光固化材料中,所述活性稀释剂可为二环戊二烯甲基丙烯酸酯、四氢呋喃甲基丙烯酸酯、二苯氧基乙基丙烯酸酯、甲基丙烯酸异冰片酯、丙烯酸己内酯、环三羟甲基丙烷缩甲醛丙烯酸酯、环己烷二甲醇二丙烯酸酯、聚乙二醇二甲基丙烯酸酯、(丙氧化)新戊二醇二甲基丙烯酸酯、三环癸烷二甲醇二丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、季戊四醇三丙烯酸酯中的至少一种。
在根据本发明的用于3D打印的光固化材料中,所述光引发剂可为安息香、苯乙酮、联苯酰缩酮、蒽醌、三苯基膦、苯甲酰基氧化膦、双酰基氧化膦、苯甲酮、噻吨酮、氧杂蒽酮、吖啶衍生物、吩嗪衍生物、喹喔啉衍生物、1-苯基-1,2-丙二酮-2-O-苯甲酰肟、4-(2-羟基乙氧基)苯基-(2-丙基)酮、1-氨基苯酮和1-羟基苯酮中的至少一种。
在根据本发明的用于3D打印的光固化材料中,还可包括0.1-10wt%的光吸收剂,所述光吸收剂为羟基二苯甲酮、羟苯基苯并三唑、草酰替苯胺、二苯甲酮、羟苯基三嗪或苯并三唑中的至少一种。
在根据本发明的用于3D打印的光固化材料中,所述触变促进剂可为聚乙二醇、聚丙二醇、聚四氢呋喃以及气相二氧化硅中的一种或几种。
在根据本发明的用于3D打印的光固化材料中,还可包括1-
10wt%的强度促进剂,所述强度促进剂为羟基官能团丙烯酸酯、羧基官能团丙烯酸酯、环氧基官能团丙烯酸酯中的一种或几种。
在根据本发明的用于3D打印的光固化材料中,所述触变促进剂和强度促进剂可附着于改性碳纳米管/磷硅酸钙复合粉体的表面。
在根据本发明的用于3D打印的光固化材料中,还可包含0.1-5wt%的抗氧剂,所述抗氧剂为受阻胺、受阻酚中的一种或者组合。
以下,结合具体实施例对本发明的用于3D打印的光固化材料进行具体说明。
实施例一
1)将碳纳米管浸入浓硝酸中加热10h,温度150℃,过滤,
去离子水洗涤至pH为6,100℃真空干燥3h,自然冷却,研磨后得到氧化碳纳米管;2)将所述氧化碳纳米管加入到乙醇溶液中,再滴加3-胺丙基三乙氧基硅烷,80℃下搅拌2h,经Φ0.45μm聚四氟乙烯膜过滤,无水乙醇洗涤,120℃真空干燥,得到改性碳纳米管。
2)将硝酸钙、摩尔浓度为0.1mol/L的硅酸钠溶液、摩尔浓度为0.1mol/L的磷酸氢二胺溶液和改性碳纳米管依次投入反应釜中,重量比为1:10:10:0.1;启动反应釜的搅拌装置,计量器以0.5L/min的速度滴加氨水,保持溶液的pH为8,并继续搅拌16小时,然后过滤去除滤液,并依次用去离子水和无水乙醇充分洗涤残余固体,滤干后再真空100℃烘干,得到胚料;将所述胚料放入真空炉中,真空度1Mpa,600℃锻烧2小时,自然冷却后研磨,得到改性碳纳米管/磷硅酸钙复合粉体。
3)准备以下物料:聚丙烯酸酯20wt%,二环戊二烯甲基丙烯酸酯5wt%,安息香乙醚0.1wt%,聚乙二醇1wt%,丙烯酸羟丙酯1wt%,改性碳纳米管/磷硅酸钙复合粉体20wt%和羟苯基三嗪0.1wt%。
首先,聚乙二醇,丙烯酸羟丙酯和改性碳纳米管/磷硅酸钙复合粉体提前放置于球磨机中进行120℃的球磨,干燥后得到促进剂附着的改性的碳纳米管/磷硅酸钙复合粉体。
最后,按配比在反应釜中混合均匀促进剂改性的碳纳米管/磷硅酸钙复合粉体以及其他原料,逐渐升温至65℃,同时抽真空至负压0.2MPa,于1200转/分钟条件下,分散搅拌2小时,自然冷却和过滤,即得到膏状的到用于3D打印的光固化材料。
实施例二
1)将碳纳米管浸入浓硝酸中加热10h,温度150℃,过滤,去离子水洗涤至pH为7,100℃真空干燥3h,自然冷却,研磨后得到氧化碳纳米管;2)将所述氧化碳纳米管加入到乙醇溶液中,再滴加3-胺丙基三乙氧基硅烷,80℃下搅拌5h,经Φ0.45μm聚四氟乙烯膜过滤,无水乙醇洗涤,120℃真空干燥,得到改性碳纳米管。
2)将硝酸钙、摩尔浓度为1mol/L的硅酸钠溶液、摩尔浓度为1mol/L的磷酸氢二胺溶液和改性碳纳米管依次投入反应釜中,重量比为1:10:10:0.1;启动反应釜的搅拌装置,计量器以0.5L/min的速度滴加氨水,保持溶液的pH为9,并继续搅拌17小时,然后过滤去除滤液,并依次用去离子水和无水乙醇充分洗涤残余固体,滤干后再真空100℃烘干,得到胚料;将所述胚料放入真空炉中,真空度1Mpa,700℃锻烧2.5小时,自然冷却后研磨,得到改性碳纳米管/磷硅酸钙复合粉体。
3)准备以下物料:有机硅丙烯酸酯40wt%,四氢呋喃甲基丙烯酸酯30wt%,苯乙酮1wt%,聚四氢呋喃10wt%,甲基丙烯酸10wt%,改性碳纳米管/磷硅酸钙复合粉体50wt%和苯甲酸(2,
2,6,6-四甲基-4-羟基哌啶)酯5wt%。
首先,聚四氢呋喃,甲基丙烯酸和改性碳纳米管/磷硅酸钙复合粉体提前放置于球磨机中进行120℃的球磨,干燥后得到促进剂附着的改性的碳纳米管/磷硅酸钙复合粉体。
最后,按配比在反应釜中混合均匀促进剂改性的碳纳米管/磷硅酸钙复合粉体以及其他原料,逐渐升温至70℃,同时抽真空至负压0.2MPa,于2000转/分钟条件下,分散搅拌2小时,自然冷却和过滤,即得到膏状的到用于3D打印的光固化材料。
实施例三
1)将碳纳米管浸入浓硝酸中加热10h,温度150℃,过滤,去离子水洗涤至pH为6.5,100℃真空干燥3h,自然冷却,研磨后得到氧化碳纳米管;2)将所述氧化碳纳米管加入到乙醇溶液中,再滴加3-胺丙基三乙氧基硅烷,80℃下搅拌3h,经Φ0.45μm聚四氟乙烯膜过滤,无水乙醇洗涤,120℃真空干燥,得到改性碳纳米管。
2)将硝酸钙、摩尔浓度为0.1-1mol/L的硅酸钠溶液、摩尔浓度为0.5mol/L的磷酸氢二胺溶液和改性碳纳米管依次投入反应釜中,重量比为1:10:10:0.1;启动反应釜的搅拌装置,计量器以0.5L/min的速度滴加氨水,保持溶液的pH为8.5,并继续搅拌16.5小时,然后过滤去除滤液,并依次用去离子水和无水乙醇充分洗涤残余固体,滤干后再真空100℃烘干,得到胚料;将所述胚料放入真空炉中,真空度1Mpa,650℃锻烧2.2小时,自然冷却后研磨,得到改性碳纳米管/磷硅酸钙复合粉体。
3)按配比在反应釜中先依次添加和搅拌混合均匀以下物料:聚醚丙烯酸酯30wt%,聚乙二醇二甲基丙烯酸酯20wt%,1-氨基苯酮0.5wt%,粒径10-20nm的气相二氧化硅5wt%,甲基丙烯酸8wt%和改性碳纳米管/磷硅酸钙复合粉体30wt%;
首先,气相二氧化硅,甲基丙烯酸和改性碳纳米管/磷硅酸钙复合粉体提前放置于球磨机中进行120℃的球磨,干燥后得到促进剂附着的改性的碳纳米管/磷硅酸钙复合粉体。
最后,按配比在反应釜中混合均匀促进剂附着的改性的碳纳米管/磷硅酸钙复合粉体以及其他原料,逐渐升温至70℃,同时抽真空至负压0.2MPa,于2000转/分钟条件下,分散搅拌2小时,自然冷却和过滤,即得到膏状的到用于3D打印的光固化材料。
对比例一
除不包含改性碳纳米管/磷硅酸钙复合粉体以外,其他与实施一相同。
对比例二
除在混合前不提前制备促进剂附着的改性的碳纳米管/磷硅酸钙复合粉体外,而是直接混合各原料,其他具体的工艺参数或步骤与实施例二相同。
对比例三
除不经过任何处理的碳纳米管替换改性碳纳米管/磷硅酸钙复合粉体以外,其他与实施一相同。
性能测试
1、机械性能
分别用上述实施例及对比例所配制的光固化材料,3D打印厚度2mm,长100mm,宽10mm的片状样条,进行按照树脂的标准测试方法测试各项机械性能。
2、杀菌率
将大肠杆菌溶解分散在质量分数为0.9%的氯化钠溶液中制成细菌悬浮液。将样条完全浸没于细菌悬浮液中,置于37℃的恒温培养箱中进行培养24h。再取20μL细菌悬浮液涂布在平板培养基上,将平板培养基37℃培养24h,对平板上的菌落进行计数,计算得出杀菌率。参照HG/T3950-2007进行抗菌率测试,供试菌种为大肠杆菌。
性能测试结果如下表所示:
从表中可以看出,实施例相比对比例具有更好的综合性能,如较好的机械性能,较小的收缩率、耐候性以及杀菌性。
上述实施例为本发明较佳的实施方式,但本发明的实施方式并不受上述实施例的限制,其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化,均应为等效的置换方式,都包含在本发明的保护范围之内。
Claims (10)
2.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,所述改性碳纳米管/磷硅酸钙复合粉体的制备方法包括以下步骤:
1)将硝酸钙、摩尔浓度为0.1-1mol/L的硅酸钠溶液、摩尔浓度为0.1-1mol/L的磷酸氢二胺溶液和改性碳纳米管依次投入反应釜中,重量比为1:10:10:0.1;
2)启动反应釜的搅拌装置,计量器以0.5L/min的速度滴加氨水,保持溶液的pH为8-9,并继续搅拌16-17小时,然后过滤去除滤液,并依次用去离子水和无水乙醇充分洗涤残余固体,滤干后再真空100℃烘干,得到胚料;
3)将所述胚料放入真空炉中,真空度1Mpa,600-700℃锻烧2-2.5小时,自然冷却后研磨,得到改性碳纳米管/磷硅酸钙复合粉体。
3.根据权利要求1或2所述的用于3D打印的光固化材料,其特征在于,所述改性碳纳米管/磷硅酸钙复合粉体粒径为1-5μm。
4.根据权利要求2所述的用于3D打印的光固化材料,其特征在于,所述改性碳纳米管的制备方法为:1)将碳纳米管浸入浓硝酸中加热10h,温度150℃,过滤,去离子水洗涤至pH为6-7,100℃真空干燥3h,自然冷却,研磨后得到氧化碳纳米管;2)将所述氧化碳纳米管加入到乙醇溶液中,再滴加3-胺丙基三乙氧基硅烷,80℃下搅拌2-5h,经Φ0.45μm聚四氟乙烯膜过滤,无水乙醇洗涤,120℃真空干燥,得到改性碳纳米管。
5.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,所述光固化低聚物包括聚丙烯酸酯、有机硅丙烯酸酯、环氧丙烯酸酯、聚酯丙烯酸酯、聚醚丙烯酸酯和聚氨酯丙烯酸酯中的一种或者组合。
6.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,所述活性稀释剂为二环戊二烯甲基丙烯酸酯、四氢呋喃甲基丙烯酸酯、二苯氧基乙基丙烯酸酯、甲基丙烯酸异冰片酯、丙烯酸己内酯、环三羟甲基丙烷缩甲醛丙烯酸酯、环己烷二甲醇二丙烯酸酯、聚乙二醇二甲基丙烯酸酯、(丙氧化)新戊二醇二甲基丙烯酸酯、三环癸烷二甲醇二丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、季戊四醇三丙烯酸酯中的至少一种。
7.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,所述光引发剂为安息香、苯乙酮、联苯酰缩酮、蒽醌、三苯基膦、苯甲酰基氧化膦、双酰基氧化膦、苯甲酮、噻吨酮、氧杂蒽酮、吖啶衍生物、吩嗪衍生物、喹喔啉衍生物、1-苯基-1,2-丙二酮-2-O-苯甲酰肟、4-(2-羟基乙氧基)苯基-(2-丙基)酮、1-氨基苯酮和1-羟基苯酮中的至少一种。
8.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,所述触变促进剂为聚乙二醇、聚丙二醇、聚四氢呋喃以及气相二氧化硅中的一种或几种。
9.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,还包括1-10wt%的强度促进剂,所述强度促进剂为羟基官能团丙烯酸酯、羧基官能团丙烯酸酯、环氧基官能团丙烯酸酯中的一种或几种。
10.根据权利要求1所述的用于3D打印的光固化材料,其特征在于,所述触变促进剂和强度促进剂附着于改性碳纳米管/磷硅酸钙复合粉体的表面。
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