CN111541002A - Missile-borne communication system active phased array antenna - Google Patents
Missile-borne communication system active phased array antenna Download PDFInfo
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- CN111541002A CN111541002A CN202010233552.2A CN202010233552A CN111541002A CN 111541002 A CN111541002 A CN 111541002A CN 202010233552 A CN202010233552 A CN 202010233552A CN 111541002 A CN111541002 A CN 111541002A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
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Abstract
The invention discloses an active phased array antenna of a missile-borne communication system, and aims to provide a phased array antenna with high transmission code rate and high-efficiency heat dissipation characteristic. The invention is realized by the following technical scheme: the microstrip antenna array and the tile type T/R component adopt a tile type framework and are divided into a plurality of independent sub-array modules, and each sub-array module is horizontally distributed on the upper part of the antenna to form a transmitting array and a receiving array; the transmitting signal enters the tile type T assembly through the micro-strip power divider through the power distribution network, each multifunctional integrated chip divides the input radio frequency signal into multiple paths, the multiple paths of the input radio frequency signal are respectively sent to a final amplifier core and then transmitted to the micro-strip antenna array, the receiving signal enters the tile type R assembly through the micro-strip antenna array, the multiple paths of the signals enter the multifunctional chip for synthesis, the multiple paths of the signals are output to the power synthesis network through the micro-strip power divider synthesis path, and 1 path of the full array signal output through the radio frequency output interface and one path of the sub-array signal output through the radio frequency output interface are formed.
Description
Technical Field
The invention relates to an active phased array antenna of an missile-borne communication system, which has high-density integration, high transmission code rate and high-efficiency heat dissipation in the technical field of electronics.
Background
The phased array antenna has the characteristics of fast beam scanning, flexible waveform change, large power aperture area, easiness in full solid state, light and small size, high reliability and the like, is easy to realize antenna common design and has low interception probability and excellent anti-interference performance, and is a main antenna mode of a plurality of radars, communication, navigation, identification and the like. The existing conformal array schemes mainly comprise a cylindrical shape, a curved surface and a spherical shape. The unit coverage area of the cylindrical array antenna and the conical array antenna is large, the number of units is large, and the total power is large. However, the spatial layout of the unit bodies of the conformal array is more complicated than that of the planar array, the pointing axes of each unit have angular differences, the beam differences formed by the T/R spatial positions of each unit on the curved surface must be eliminated by software, the errors of reflected signals are eliminated in signal processing, the signal processing software is complex in design, and the technical difficulty is very high. The whole antenna of the AESA is a 'hot' plate formed by the T/R components, and the antenna is located in a closed antenna housing, so that the heat dissipation difficulty is high. The phased array antennas disclosed in the prior art have the disadvantage that they are heavy and occupy a large space, and the shape of the radome is limited by the space in which the antenna rotates. Due to the technical characteristics that the coverage range of mechanical scanning of the antenna is large and the wave-proof of the antenna array surface is realized, the integration of different guiding modes is limited. And the volume and the weight of the traditional phase shifter are too large to be integrated into a flying body.
Considering the maneuvering performance of the aircraft platform at a high Mach rate, the antenna needs to have a certain gain value in a corresponding beam coverage range so as to meet the requirement of a communication rate; meanwhile, as an aircraft flying at high speed, the missile is limited by strict aerodynamics, mechanical structure and strength, and the dynamic performance of the missile cannot be influenced, and the mechanical strength of the missile cannot be damaged. At present, a missile-borne antenna is generally realized by adopting a microstrip antenna or a microstrip array mode, for example, in 2013, zheng feng celery and the like disclose a 'missile-borne telemetry system antenna design' article, and a microstrip patch antenna with a circularly polarized conformal structure is reported in the article. In 2016, an article of 'design of missile-borne conformal array antenna' is published in Chen Xiyang and the like, and a missile-borne microstrip conformal array antenna is reported, so that the surface strength and the mechanical structure of an aircraft are not damaged while the H-plane omnidirectional radiation characteristic is realized, and an object can rapidly move in the air and simultaneously can continuously keep better aerodynamic performance. In 2017, Li Ming et al published an article of "design of missile-borne array antenna", and reported herein is a conformal array antenna for an aircraft, which is composed of three single-frequency antennas and a dual-frequency antenna, has the characteristics of high temperature resistance, wide beam and the like, and provides a design idea for missile-borne array antennas. However, these passive antennas or antenna arrays have relatively low antenna gain and can be applied to low transmission rate communication basically.
Along with the development of the missile-borne platform technology, the data rate required to be transmitted shows a trend of higher and higher development, and for this reason, the missile-borne communication device needs to have high Equivalent Isotropic Radiated Power (EIRP) value and high reception Gain/Equivalent temperature ratio (G/T) value so as to meet the electrical performance use requirement of high communication rate. Meanwhile, as an antenna working on a missile, the antenna needs to be designed in a miniaturized, light-weight and low-power consumption manner so as to meet the installation and use requirements of a platform. In order to meet the requirement of high performance, the main technical approach is to adopt a high-gain active phased array antenna, in the antenna implementation, a plurality of T/R components form a sub-array, and the T/R component of each sub-array is connected to the same SPI bus. Each T/R component receives the corresponding wave control code, and the wave control code takes effect when the synchronous signal arrives, so that wave number scanning of the phased array antenna is completed. For example: 2013, Clifton e.cole J published an article "missile-borne communication link", which introduced an overview of the missile-borne communication links currently used by standard missiles, and discussed an enhanced link still in the product pre-research stage, which is a novel data link developed for both standard missiles and improved navy sparrow missiles still used on part of the U.S. navy warships. In 2016, an article of shallow analysis of application technical characteristics of satellite communication on a missile weapon system is published by the worship department and the like, and the application technical characteristics of the article are analyzed according to the application requirements of the satellite communication on the missile weapon system. These documents mainly provide a feasibility demonstration of missile-borne communication using phased array antennas, but do not discuss related implementations of phased array antennas.
In summary, the missile-borne communication antennas reported in domestic and foreign documents at present are mainly implemented by passive antennas or antenna arrays, but can only be applied to the transmission of data such as simple telemetry, control and the like. The high-transmission-rate missile-borne communication can be realized by adopting a high-gain phased array antenna scheme, but no determined technical scheme exists in the aspect of high-transmission-rate missile-borne communication for long-time communication work.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the missile-borne communication system active phased-array antenna which has the characteristics of small volume, light weight, low cost, high engineering practicability, small quantity of control signals, high control precision, short system response time, high transmission code rate and high efficiency heat dissipation.
The above object of the present invention can be achieved by the following means. An active phased array antenna of a missile-borne communication system, comprising: set up microstrip antenna array 1 and tile formula T/R subassembly 2 of below in 3 upper portion box bodys of high heat conduction metal box body, be located 3 bottoms of high heat conduction metal box body, range upon range of beam controller 4, power distribution/synthetic network 5 on power module 6 in proper order, its characterized in that: the high-heat-conductivity metal box body 3 is used as a universal thermal interface 8 and an external installation interface to fixedly connect the phase-change heat storage device 7 at two ends of the high-heat-conductivity metal box body 3, the microstrip antenna array 1 and the tile type T/R component 2 adopt tile type structures and are divided into a plurality of independent sub-array modules, each sub-array module is horizontally distributed at the upper part of the antenna to form a transmitting array and a receiving array, the transmitting array and the receiving array are distributed separately, and the common-aperture integrated beam controller 4, the power distribution/synthesis network 5 and the power supply module 6 are sequentially arranged at the bottom of the antenna; the transmitting signal enters the tile type T assembly 2 through the micro-strip power divider through the radio frequency input interface 24 of the power distribution/synthesis network 5, the transmitting signal enters the multifunctional integrated chips 18 through the micro-strip power divider in the tile type T assembly 2, each multifunctional integrated chip 18 divides the input radio frequency signal into multiple paths, the multiple paths of the input radio frequency signal are respectively sent to the final amplifier core 17 and then transmitted to the micro-strip antenna array 1, the receiving signal enters the tile type R assembly 2 through the micro-strip antenna array 1, the multiple paths of the signals in the tile type R assembly enter the multifunctional chips 18 for synthesis, the multiple paths of the signals are synthesized by the micro-strip power divider and output to the power distribution/ synthesis network 5, 1 path of full array signals are formed in the power distribution/synthesis network 5, and each path of the sub-array signals are output through a plurality of radio.
Compared with the prior art, the invention has the following beneficial effects.
The invention adopts a set of high heat conduction metal box body 3, power distribution/synthesis network 4, beam controller 5 and power module 6 shared by all subarrays, all modules are installed on the high heat conduction metal box body 3, and the high heat conduction metal box body 3 is used as a universal thermal interface 8 and an external installation interface, has the advantages of small volume and light weight, and can better meet the requirements of missile-borne narrow space and light load. The tile type T/R component adopts a multifunctional integrated chip, integrates chip functions of an amplifier, a phase shifter, an attenuator, serial-parallel signal conversion, power management and other controls, improves the integration level and the comprehensive performance of the tile type T/R component 2, reduces the chip number of the active phased array antenna, and reduces the design cost.
The invention adopts a multifunctional integrated chip design to realize the key circuit of a tile-type T/R component 2, the tile-type T component adopts an eight-channel T component multifunctional integrated chip and integrates chip functions of a driving amplifier, a phase shifter, an attenuator, serial-parallel signal conversion, power management and other control, the tile-type R component adopts a four-channel R component multifunctional integrated chip and integrates chip functions of a low noise amplifier, a phase shifter, an attenuator, serial-parallel signal conversion, power management and other control, meanwhile, the design of a high-density integrated tile-type architecture is adopted, a microstrip antenna array 1 and the tile-type T/R component 2 are divided into a plurality of independent sub-array modules, each sub-array module is horizontally distributed at the upper part of an antenna to form a transmitting array and a receiving array, the transmitting array and the receiving array are distributed separately and integrated in a common aperture, the method has the advantages of small quantity of control signals, high control precision and short system response time.
The invention adopts the sub-array modular design, takes the metal upper cavity 11 of the tile type T/R component 2 as the metal ground of the microstrip antenna array 1, directly mounted on the metal upper cavity 11 of the tile type T/R component by crimping, the active circuit of the tile type T/R component 2 is integrated on the medium substrate 12, directly welded on the metal lower cavity 13 of the tile-type T/R component in a soldering mode, a feed probe 14 of the microstrip antenna array 1 is interconnected with a radio frequency circuit of the tile-type T/R component through a radio frequency fuzz button connector 15, the integrated integration of the sub-array modules is realized by the soldering tin groove 16 in a soldering mode, and compared with the traditional scheme that an SSMP connector is adopted by an antenna array surface, an SSMP is adopted by a transceiving component, compared with the mode of realizing radio frequency signal transmission through KK connector connection, the longitudinal dimension can be reduced by about 10%, and the connection loss is reduced by about 0.6 dB. Meanwhile, in order to meet the requirement of high transmission code rate, the phased array antenna has high EIRP and large array element scale, the subarray module is used as a basic unit, large-scale array integration is easy to assemble through subarray expansion, each subarray module is relatively independent and can be independently debugged, if a fault occurs, any subarray is conveniently disassembled to test and maintain, and the replacement and maintenance of an external field at a component level are achieved.
According to the invention, the phase-change material is filled in the metal cavity of the phase-change heat storage device 7, and the heat of the antenna is stored by utilizing the characteristic of larger phase-change latent heat of the phase-change material, so that the working temperature of the antenna is controlled, and the long-time reliable work of the missile-borne communication system active phased-array antenna is ensured. The temperature equalizing plate technology is adopted as a reinforced heat conduction measure, a plurality of temperature equalizing plates 34 are embedded in the bottom plate of the box body, the phase change and capillary flow principles of the temperature equalizing plates are utilized to quickly diffuse the high heat of the tile type T/R component 2 to the whole flat plate, and the temperature of each point on the flat plate is rapidly and uniformly realized, the purpose of reducing the internal thermal resistance is achieved, and the heat is rapidly led out through the thermal interface 8 and transferred to the phase-change heat storage device 7, the phase-change heat storage device 7 is characterized in that the phase-change material is filled in the metal cavity, the cavity is internally provided with the reinforced heat conduction fins and the foam metal to improve the heat conduction capability of the cavity, the heat of the antenna is stored by utilizing the characteristic of large phase-change latent heat of the phase-change material, the working temperature of the antenna is controlled, the advantages of rapid heat conduction and efficient heat dissipation are achieved, and the problem of heat dissipation of the active phased array antenna of the missile-borne communication system during long-time working can be well solved. Meanwhile, the phased-array antenna is divided into two relatively independent parts, namely an electric function part and a heat dissipation component, the electric function part and the heat dissipation component are connected through a universal heat interface, the electric function part can be directly installed with different heat dissipation components without any modification, and the phased-array antenna is suitable for requirements of different platforms.
The invention adopts the design of receiving 1 path of full array signals and 4 paths of sub-array signals of a link, inputs the signal direction through a program, and directly aligns the one path of full array signals of the receiving link to a target; meanwhile, the arrival direction of a target transmitting signal is automatically measured by utilizing the phase difference of 4 paths of molecular array signals, the automatic alignment of one path of full array signals of a receiving link to a target is realized, a program and automatic target alignment mode is provided, a mutually complementary application mode for performing real-time alignment on the target is formed, and the reliability of a missile communication link system is improved.
Drawings
Fig. 1 is a schematic view of an exploded structure of an active phased array antenna of a missile-borne communication system according to the invention.
Fig. 2 is a block diagram of the circuit of fig. 1.
Fig. 3 is an exploded view of the individual subarray module of fig. 1.
Fig. 4 is a top view of the individual subarray module of fig. 1.
Fig. 5 is a schematic view of the high thermal conductivity cavity of fig. 1.
Fig. 6 is a schematic diagram of the beam controller of fig. 1.
Fig. 7 is a schematic diagram of the power distribution/combining network of fig. 1.
Fig. 8 is a schematic diagram of the power supply of fig. 1.
Fig. 9 is a schematic view of the phase-change heat storage device of fig. 1.
Fig. 10 is a top view of an active phased array antenna of the missile-borne communication system of the present invention.
Fig. 11 is a beam scanning pattern of a transmit chain of an active phased array antenna of the missile-borne communication system of the present invention.
Fig. 12 is a beam scanning pattern of the receive chain of the active phased array antenna of the missile-borne communication system of the present invention.
In the figure: 1 microstrip antenna array, 2 tile type T/R component, 3 high heat conduction metal box body, 4 wave beam controller, 5 power distribution/synthesis network, 6 power supply, 7 phase change heat storage device, 8 universal heat interface, 9 rectangular patch, 10 antenna medium substrate, 11 metal upper cavity, 12 medium substrate, 13 metal lower cavity, 14 feed probe, 15 radio frequency fuzz button connector, 16 soldering tin groove, 17 amplifier chip, 18 multifunctional integrated chip, 19 SSMP radio frequency connector, 20 KK radio frequency socket, 21 round metal via hole, 22 shielding via hole, 23 SSMP radio frequency socket, 24 radio frequency input interface, 25-29 radio frequency output interface, 30 power supply input socket, 31 low frequency power supply socket, 32 wave beam control signal input socket, 33 low frequency elastic pin, 34 temperature equalizing plate, 35 low frequency metal contact, 36 rectangular metal via hole, 37 high frequency metal contact, the antenna comprises a 38 screw hole, a 39 polytetrafluoroethylene substrate, a 40 low-frequency control socket, a 41 low-frequency socket, a 42 non-metalized through hole, a 43 transmitting radio frequency interface socket, 44-48 receiving radio frequency interface sockets and 49 external mounting holes.
Detailed Description
See fig. 1-2. In a preferred embodiment described below, an missile-borne communication system active phased array antenna includes: set up microstrip antenna array 1 and tile formula T/R subassembly 2 below in 3 upper portion box bodys of high heat conduction metal box body slots, be located 3 bottoms of high heat conduction metal box body, range upon range of beam controller 4, power distribution/synthetic network 5 on power module 6 in proper order, wherein: the high-heat-conductivity metal box body 3 is used as a universal thermal interface 8 and an external installation interface to fixedly connect the phase-change heat storage device 7 at two ends of the high-heat-conductivity metal box body 3, the microstrip antenna array 1 and the tile type T/R component 2 adopt tile type structures and are divided into a plurality of independent sub-array modules, each sub-array module is horizontally distributed at the upper part of the antenna to form a transmitting array and a receiving array, the transmitting array and the receiving array are distributed separately, and the common-aperture integrated beam controller 4, the power distribution/synthesis network 5 and the power supply module 6 are sequentially arranged at the bottom of the antenna;
the transmitting signal enters the tile type T assembly 2 through the micro-strip power divider through the radio frequency input interface 24 of the power distribution/synthesis network 5, the transmitting signal enters the multifunctional integrated chips 18 through the micro-strip power divider in the tile type T assembly 2, each multifunctional integrated chip 18 divides the input radio frequency signal into multiple paths, the multiple paths of the input radio frequency signal are respectively sent to the final amplifier core 17 and then transmitted to the micro-strip antenna array 1, the receiving signal enters the tile type R assembly 2 through the micro-strip antenna array 1, the multiple paths of the signals in the tile type R assembly enter the multifunctional chips 18 for synthesis, the multiple paths of the signals are synthesized through the micro-strip power divider and output to the power distribution/ synthesis network 5, and 1 path of full array signals are formed in the power distribution/synthesis network 5 and output through the radio frequency output interface 25 and 4 paths of sub-array signals are output through the radio frequency.
The microstrip antenna array 1 takes a rectangular patch 9 as a radiation array element, adopts a rectangular grid array layout on an antenna medium substrate 10 taking a subarray module as a basic structure, takes a metal upper cavity 11 of a tile-type T/R component 2 as a metal ground, is directly arranged on the metal upper cavity 11 of the tile-type T/R component in a crimping mode, an active circuit of the tile-type T/R component 2 is integrated on a medium substrate 12, is directly welded on a metal lower cavity 13 of the tile-type T/R component in a soldering mode, a feed probe 14 of the microstrip antenna array 1 is interconnected with a radio frequency circuit of the tile-type T/R component through a radio frequency fuzz button connector 15, realizes the integration of the subarray module in a welding mode through a groove 16, and each subarray module integrates a plurality of amplifier chips 17 and a plurality of multifunctional integrated chips 18, the SSMP radio frequency connector 19 is connected to the SSMP radio frequency socket 23 of the power distribution/synthesis network 5 by passing the KK radio frequency socket 20 down through the circular metal via 21 on the high thermal conductivity metal box 3 and the shielding via 22 on the beam controller 4.
External direct current power supply is input from a socket 30, input voltage is converted into power supply voltage required by a beam controller 4 and a tile type T/R component 2 through a power supply module 6, the power supply voltage is output to the beam controller 4 through a low-frequency power supply socket 31, meanwhile, an external beam control signal is input from a socket 32 and is input to the beam controller 4 through a low-frequency cable, wiring is carried out in the beam controller 4 through a plurality of layers of low-frequency circuits, and finally power supply and amplitude and phase code control of the tile type T/R component 2 are realized through a low-frequency elastic contact pin 33, so that space power synthesis and directional diagram scanning of the missile-borne communication system active phased array antenna are realized; the high heat conduction metal box body 3 is a part embedded into the high heat conduction temperature equalizing plate 34 and is closely connected with the tile type T/R assembly 2, the high heat of the tile type T/R assembly 2 is rapidly diffused to the whole flat plate, the temperature of each point on the flat plate is rapidly uniform, and the heat interface 8 on two sides is rapidly transmitted to the phase change heat storage device 7, the phase change heat storage device 7 is basically in a structure form that phase change materials are filled in a metal cavity, the heat of an antenna is stored by utilizing the characteristic that the phase change latent heat of the phase change materials is large, the working temperature of the antenna is controlled, and the long-time reliable working of the active phased array antenna of the missile-borne communication system is ensured.
In an alternative embodiment, the transmit antenna array may have a size of 336 array elements, the sub-array module may have a size of 4 × 4 array, and mainly includes 16 final amplifier chips 19 and 2 8-channel T-component multifunctional integrated chips, which are arranged in a 20 × 20 rectangular array, and four vertex angles are respectively cut by the 4 × 4 array, and the array is composed of 21 sub-arrays, the operating frequency is 28.0GHz, the right-hand circular polarization is realized, and the beam scanning range is ± 60 °. The scale of the receiving antenna array is 128 array elements, the scale of the sub-array module is 4 multiplied by 4 arrays, the main chip comprises 4 multi-functional integrated chips of 4-channel R components, the chips are distributed according to 8 multiplied by 16 rectangles, the chips are formed by 8 sub-arrays, the working frequency is 22.0GHz, the left-hand circular polarization is realized, and the beam scanning range is +/-60 degrees.
The missile-borne communication system active phased-array antenna mainly comprises an electric function module and a phase-change heat storage device 7, wherein the electric function module comprises a microstrip antenna array 1, a tile type T/R component 2, a high-heat-conductivity metal box body 3, a beam controller 4, a power distribution/synthesis network 5, a power supply module 6 and the like. The microstrip antenna array 1 uses a rectangular patch 9 as a radiation array element, is arranged on an antenna medium substrate 10 by adopting a rectangular grid array, and in order to meet the wave beam scanning range of +/-60 degrees, the radiation unit spacing d of a transmitting array and a receiving arrayx＝dyThe antenna comprises a metal upper cavity 14, a metal lower cavity 14, a metal upper cavity 14, a metal lower cavity 14, a metal upper cavity 14, a metal upper cavity 14, a metal upper cavityThe circuit is integrated on the medium substrate 12, and is directly welded on the metal lower cavity 13 of the tile type T/R component in a soldering mode, and the integrated integration of the upper cavity and the lower cavity of the sub-array module is realized in a soldering mode through the soldering tin groove 16. The power distribution/synthesis network 5 mainly realizes the power distribution of the transmitting link and the power synthesis of the receiving link, the 1 transmitting signal output by the signal control terminal is input by the radio frequency input interface 24 of the power distribution/synthesis network 5, and is output to the tile type T component 2 through the SSMP radio frequency socket 23 after passing through the microstrip power distribution network formed by the one-to-twenty-one Wilkinson power divider, and simultaneously, the 8 paths of radio frequency signals input from the tile type R component 2 through the SSMP radio frequency socket 23 form the 1 path of full-array signals and the 4 paths of sub-array signals to be output to the signal control terminal after passing through the microstrip power distribution network formed by the one-to-two and one-to-eight Wilkinson power divider. The power module 6 supplies power to the phased array antenna, external direct current power is input from the socket 30, and the +28V voltage is converted into power supply voltage required by the beam controller 4 and the tile type T/R component 2 through processing such as DC-DC conversion, input/output filtering, power-on sequence and the like in the power module 6 and is output to the beam controller 4 through the socket 31. The wave beam controller 4 provides wave beam control for the phased array antenna, external wave beam control signals are input from the socket 32 and input into the wave beam controller 4 through the low-frequency cable, wave beam pointing directions of the phased array antenna are obtained through FPGA real-time calculation according to azimuth angle and pitch angle information of an antenna array surface provided by a signal processing terminal in real time in the wave beam controller 4 and are converted into phase data required by each array element, power signals and control signals are distributed through multilayer low-frequency circuit wiring, and finally power supply and amplitude code control of the tile type T/R component 2 are achieved through the low-frequency elastic contact pin 33. Each group of wave control data is sent to the controlled T/R component using a high speed serial bus. And the antenna unit coordinate information, the channel calibration data and the amplitude weighting data used in the wave control data decoding are all stored in an off-chip FLASH chip, and the data are moved to an on-chip memory of the wave control FPGA after being electrified. In order to meet the requirement of parallel operation, the data are converted and stored in different storage areas in the chip according to wave bands through a wave control data forming and sending block diagram. The wave is to shorten the transmission time of the wave control code,the wave control system formed by the wave beam controller 4 adopts a plurality of high-speed serial buses, each bus transmits wave control codes in parallel, one SPI bus wave control code sends a timing diagram, a plurality of T/R components are connected to one SPI bus, and the buses output a plurality of groups of data in sequence along with the switching of addresses. And the wave control equipment of the wave front decodes the address, and selects one T/R component to receive the corresponding wave control code each time. When one SPI bus finishes wave control code transmission, other buses finish wave control code transmission, and the wave control host outputs a LOAD signal at certain intervals to enable the wave control code transmitted in the front to take effect, so that the transmission time of the wave control code is reduced.
Each subarray module is horizontally distributed on the upper portion of the antenna to form a transmitting array and a receiving array, the transmitting array and the receiving array are separated in layout and integrated in a common aperture mode, the beam controller 4, the power distribution/synthesis network 5 and the power supply module 6 are sequentially arranged at the bottom of the antenna, all the modules are installed on the high-heat-conductivity metal box body 3, and the high-heat-conductivity metal box body 3 serves as a universal thermal interface 8 and an external installation interface; the high heat conduction metal box body 3 is a part embedded into the high heat conduction temperature-uniforming plate 34 and is tightly connected with the tile type T/R component 2, the high heat of the tile type T/R component 2 is rapidly diffused to the whole flat plate by utilizing the phase change and capillary flow principle of the temperature-uniforming plate, so that the temperature of each point on the flat plate is rapidly uniformed, and is rapidly transmitted to the phase-change heat storage device 7 through the thermal interface 8, the phase-change heat storage device 7 is basically structured in a way that a phase-change material is filled in a metal cavity, the heat of the antenna is stored by utilizing the characteristic of larger phase-change latent heat of the phase-change material, and the cavity is internally provided with reinforced heat conduction fins and foam metal to improve the self heat conduction capability, so that the heat transmitted by the high heat conduction metal box body 3 is rapidly transmitted to the phase change material, the working temperature of the antenna is controlled, and the long-time reliable work of the active phased array antenna of the missile-borne communication system is ensured.
The missile-borne communication system active phased-array antenna mainly realizes the electronic control scanning of transmitting and receiving link wave beams to be in real-time alignment with a target for communication, and the basic working flow is as follows: the 1 radio frequency signal output by the signal control terminal is input by a radio frequency input interface 24 of a power distribution network 5, passes through a micro-strip power distribution network formed by a one-to-twenty-one Wilkinson power divider, finishes the output of the radio frequency signal by an SSMP radio frequency socket 23, passes through a shielding via hole 21 on a beam controller 4 and a circular metal via hole 22 on a high heat-conducting metal box body 3 by a KK radio frequency socket 20, is connected with an SSMP radio frequency connector 19 of a tile type T/R assembly 2 to realize the input of the radio frequency signal to the tile type T/R assembly 2, the 1 one-to-two Wilkinson power divider which the radio frequency signal enters in the tile type T/R assembly 2 divides the input radio frequency signal into 2 paths and sends the divided signals to 2 eight-channel T assembly multifunctional chips, and then the eight-channel T assembly multifunctional chips divide the input radio frequency signal into 8 paths, respectively sent to 16 amplifier chips 17, transmitted to the microstrip antenna array 1, radiated and transmitted to a target; a received signal returned by a target enters the tile type R component 2 after passing through the microstrip antenna array 1, in the tile type R component 2, every 4 channels share one four-channel R component multifunctional chip, every 4 four-channel R component multifunctional chips enter 1 one-to-four Wilkinson power combiner to synthesize 1-path received signals, the received signals are downwards transmitted to an SSMP radio frequency socket 23 of the power distribution synthesis network 5 through an SSMP radio frequency connector 19, then every 2-path tile type R component subarrays enter 1 one-to-two Wilkinson power combiner to be synthesized, 8-path tile type R component subarray input signals are synthesized into 4-path sub-array signals, meanwhile, 4-path molecular array signals enter 1 one-to-four Wilkinson power combiner to synthesize 1-path full-array signals, and the signals are output to a signal control terminal through radio frequency output interfaces 25-29; external direct current power supply is input from the socket 30, input voltage is converted into power supply voltage required by the beam controller 4 and the tile type T/R component 2 through the power module 6 and is output to the beam controller 4 through the socket 29, meanwhile, external beam control signals are input from the socket 32 and are input to the beam controller 4 through a low-frequency cable, power supply and amplitude and phase code control of the tile type T/R component 2 are achieved through the multilayer low-frequency circuit wiring in the beam controller 4, and finally, space power synthesis and directional diagram scanning of the missile-borne communication system active phased array antenna are achieved through the low-frequency elastic contact pin 33.
See fig. 3-4. The microstrip antenna array 1 selects rectangular patches 9 distributed on an antenna dielectric substrate 10 as radiation array elements, the rectangular patches 9 are connected downwards to a feed probe 14 penetrating through the antenna dielectric substrate 10, the feed probe 14 penetrates through a feed through hole of the antenna dielectric substrate 10 and is connected to a radio frequency fuzz button connector 15 integrated with a metal upper cavity 14 of a tile type T/R assembly in an integrated mode, and radio frequency feed for the rectangular patches 9 is formed; by adjusting the position of the feed probe 14, higher order modes having circular polarization are excited, and left hand circular polarization of the receiving unit (offset to the lower left of the position of the feed point) and right hand circular polarization of the transmitting unit (offset to the lower right of the position of the feed point) are respectively achieved. The rectangular patches 9 are based on the feed probe 14, the inter-cell distance dx is 5.5mm, no deletion lobe in the ± 60 ° beam scanning range is realized, in order to improve the circular polarization axial ratio of the array radiation circuit, 2 × 2 cells are used as a basic array, a 90 ° rotation arrangement is adopted for a single rectangular patch 9, and then the 2 × 2 basic array realizes the microstrip antenna array 1 of the sub-array module through a simple grid array layout extension. The subarray module is used as a basic structure, the dielectric substrate 10 of the microstrip antenna array 1 takes the metal upper cavity 14 of the tile type T/R assembly 2 as a metal ground, the dielectric substrate 10, the radio frequency fuzz button connector 15 and the metal upper cavity 11 of the tile type T/R assembly 2 are laminated in a vacuum hot press, the antenna array which takes the metal upper cavity 11 of the tile type T/R assembly 2 as a bearing floor, the radio frequency fuzz button connector 15 with an elastic contact as an external radio frequency signal interface and takes a mixed material of a prepreg and the dielectric substrate 10 as the dielectric substrate is formed. The feed probe 14 of the microstrip antenna array 1 is connected with the chip active circuit of the tile type T/R component 2 through a radio frequency hair button connector 15.
In an alternative embodiment, the active circuit of the tile type T/R component 2 implemented by the tile type method is integrated on the dielectric substrate 12, a 4 × 4 sub-array module is used as a basic structure, a plurality of amplifier chips 17 and a plurality of multifunctional integrated chips 18 are mainly integrated, and based on a multilayer high-low frequency hybrid circuit layout, the dielectric substrate 12 integrates a power distribution/synthesis network, a power distribution network, and an amplitude-phase code control network. Every eight amplifier chips 17 in the T component are connected with an eight-channel T component multifunctional chip through microstrip transmission lines, the eight-channel T component multifunctional integrated chip integrates chip functions of a driving amplifier, a 6-bit phase shifter, a 6-bit attenuator, serial-parallel signal conversion, power management and other control, primary amplification and amplitude phase control of transmission link signals are achieved, enough gain is provided for a transmission channel, the transmission channel final-stage amplifier chip 17 can be guaranteed to be in saturated output, every 2 eight-channel T component multifunctional chips are connected together through a one-to-two Wilkinson power divider, and a sub-array circuit of the tile type T component 2 is formed. Every four channels in the R component share a four-channel R component multifunctional chip, a four-channel R component multifunctional integrated chip, an integrated low-noise amplifier, a 6-bit phase shifter, a 6-bit attenuator, serial-parallel signal conversion, power management and other control chip functions, low-noise amplification and amplitude phase control of receiving link signals are achieved, enough gain is provided for receiving channels, it is guaranteed that loss of each level cannot greatly affect system noise, every 4 four-channel R component multifunctional chips are connected together through a one-to-four Wilkinson power divider, and a tile type R component 2 subarray circuit is formed.
In another optional embodiment, the amplifier chip 17 and the multifunctional integrated chip 18 are surface-mounted on the top layer of the dielectric substrate 12, the power distribution/synthesis network is mainly a micro-strip Wilkinson power divider circuit, one end of the power distribution/synthesis network is connected to the input/output interface of the front chip through vertical interconnection among multiple layers of circuit layers, the other end of the power distribution/synthesis network is connected to the input interface of the back SSMP radio frequency connector 19, so that equal-amplitude and in-phase power synthesis of input signals to channels and output signals is realized, and the power distribution network and the amplitude and phase code control network connect power signals and amplitude and phase control signals input from the bottom with pins of the amplifier chip 17 and the multiple multifunctional integrated chips 18 through multilayer low-frequency layout wiring, so as to realize power supply and amplitude and phase code control of the tile-type T/R component 2.
The dielectric substrate 12 is finally formed to be connected with the radio frequency fuzz button connector 15 in a metal contact 37 mode, connected with the low-frequency elastic pin 33 in a metal contact 35 mode, connected with the KK radio frequency socket 20 in an SSMP radio frequency connector 19 mode, and connected with the feed probe 14 of the microstrip antenna array 1 upwards through the radio frequency fuzz button connector 15 to realize the radio frequency feed of the microstrip antenna array 1, connected downwards on the beam controller 4 through the low-frequency elastic pin 33 to realize the power supply and amplitude and phase code control of the tile type T/R component 2, and connected downwards through the KK radio frequency socket 20 to the SSMP radio frequency socket 23 of the power distribution/synthesis network to realize the input or output of radio frequency signals; the whole medium substrate 12 is directly welded on the tile type T/R component 2 metal lower cavity 13 in a soldering mode, the integrated integration of the sub-array module is realized in a welding mode through a soldering tin groove 16 between the tile type T/R component 2 metal upper cavity and the tile type T/R component 2 metal lower cavity, the sub-array module is installed on the high-heat-conductivity metal box body 3 through a screw hole 38 in a whole sub-module mode, the soldering tin pulling force of the soldering tin groove 16 enables a radio frequency fuzz button connector 15 of the tile type T/R component upper cavity 11 to elastically contact with a receiving and sending component active circuit board to realize radio frequency signal transmission, the SSMP connector adopted by the traditional antenna array face module is simplified, the SSMP connector adopted by the T/R component module is adopted, and the connection mode of radio frequency signal transmission is realized through the KK.
See fig. 5. The high heat conduction metal box 3 mainly solves the problem of high heat quick conduction of the plurality of amplifier chips 17 and the plurality of multifunctional integrated chips 18 of the tile type T/R component 2. The high heat conduction metal box body 3 is tightly attached to the metal lower cavity of the tile type T/R component 2, the heat generated by the chip in the tile type T/R component 2 is rapidly diffused to the high heat conduction metal box body through the heat conduction pad, a plurality of temperature equalizing plates 34 for strengthening heat conduction are embedded in the high heat conduction metal box body 3, the upper part area in the temperature equalizing plates 34 is connected with the tile type T/R component 2, the working medium is a hot area (evaporation area) and absorbs heat and changes phase into gas state, then the liquid is diffused to a condensation zone (condensation zone) of the lower part area to release heat, is condensed into liquid and flows back under the action of capillary force, therefore, high-efficiency heat conduction is realized, the whole high-heat-conduction metal box body rapidly diffuses the high heat of the tile type T/R component 2 to the whole flat plate by utilizing the phase change and capillary flow principles of the temperature-uniforming plate, so that the temperature of each point on the flat plate is rapidly uniformed, and the high heat is rapidly transferred to the phase change heat storage device 7 through the thermal interface 8. Round metal through holes 21 and rectangular metal through holes 36, the positions of which are respectively in one-to-one correspondence with the SSMP radio frequency connectors 19 and the metal contacts 35 of the tile type T/R component 2, are formed in the high heat conduction metal box body 3, the metal contacts 35 and the SSMP radio frequency connectors 19 are respectively connected with the low-frequency elastic pins 33 of the beam control 4 and the SSMP radio frequency sockets 23 of the power distribution synthesis network 5, and corresponding through holes or screw holes are formed in vacant positions for installing the tile type T/R component 2, the beam controller 4, the power distribution/synthesis network 5, the power supply module 6 and the phase change heat storage device 7.
See fig. 6. The wave beam controller 4 is integrated on a polytetrafluoroethylene substrate 39, external wave beam control signals are input from a socket 32 and input to a low-frequency control socket 40 of the wave beam controller 4 through a low-frequency cable, wave beam directions of the phased array antenna are obtained through FPGA real-time calculation in the wave beam controller 4 according to azimuth angle and pitch angle information of an antenna array surface provided by a signal processing terminal in real time, the wave beam directions are converted into phase data required by each array element, meanwhile, power supply output from a power supply is input through a low-frequency socket 41, power supply signals and control signals are distributed inside the polytetrafluoroethylene substrate 39 through multilayer low-frequency circuit wiring, and finally power supply and amplitude and phase code control of the tile type T/R assembly 2 are achieved through a low-frequency elastic contact pin 33.
A shielding through hole 22 is formed in the polytetrafluoroethylene substrate 39, the KK radio frequency socket 20 penetrates through the SSMP radio frequency connector 19 for realizing the tile type T/R assembly 2 and the SSMP radio frequency socket 23 of the power distribution/synthesis network 5 to be interconnected, a non-metalized through hole 42 is formed for allowing a screw to penetrate through the tile type T/R assembly 2 for installation, and finally the whole polytetrafluoroethylene substrate 39 is installed on the high-heat-conductivity metal box body 3 in a screw installation mode.
See fig. 7. The power distribution/synthesis network 5 mainly realizes the power distribution of the transmitting link and the power synthesis of the receiving link, the 1 transmitting signal output by the signal control terminal is input by the radio frequency input interface 24 of the power distribution/synthesis network 5, and is output to the tile type T component 2 through the SSMP radio frequency socket 23 after passing through the microstrip power distribution network formed by the one-to-twenty-one Wilkinson power divider, and simultaneously, the 8 paths of radio frequency signals input from the tile type R component 2 through the SSMP radio frequency socket 23 form the 1 path of full-array signal and the 4 paths of sub-array signals after passing through the microstrip power distribution network formed by the one-to-two and one-to-eight Wilkinson power divider, and are output to the signal control terminal through the radio frequency output interfaces 26-29. By adopting the design of a micro-strip-waveguide cavity hybrid circuit, the micro-strip Wilkinson power divider is embedded into the metal waveguide cavity, the advantages of the micro-strip power divider and the waveguide power divider are integrated, and finally the whole metal cavity is installed on the high-heat-conductivity metal box body 3 in a screw installation mode.
See fig. 8. The power module 6 supplies power for the phased array antenna, external direct current power is input from the socket 30, the +28V voltage is converted into power supply voltage required by the beam controller 4 and the tile type T/R component 2 through processing such as DC-DC conversion, input and output filtering, power-on time sequence and the like in the power module 6, the power supply voltage is output to the beam controller 4 through the socket 31, the bottom surface of the power supply serves as the phased array antenna to the outside, and finally the whole module is installed on the high-heat-conductivity metal box body 3 in a screw installation mode.
See fig. 9. The phase-change heat storage device 7 is basically structured in such a way that a phase-change material is filled in a metal cavity, the heat of the antenna is stored by utilizing the characteristic of large phase-change latent heat of the phase-change material, and the enhanced heat-conducting fins and the foam metal are arranged in the cavity to improve the heat-conducting capacity of the heat-conducting fins and the foam metal, so that the heat transmitted by the high-heat-conducting metal box body 3 is rapidly transmitted to the phase-change material. The whole phase-change material device is divided into two parts which are respectively arranged on the high heat-conducting metal box body 3 in a screw-mounting mode. Meanwhile, the phase-change heat storage device 7 and the phased-array antenna electrical function part (comprising the microstrip antenna array 1, the tile-type T/R component 2, the high-heat-conductivity metal box body 3, the beam controller 4, the power distribution/synthesis network 5 and the power supply module 6) are two relatively independent parts, the two parts are connected through a universal thermal interface, and the electrical function part can be directly provided with different heat dissipation components without any modification, so that the phase-change heat storage device is suitable for the requirements of different platforms.
See fig. 10. The whole phased-array antenna takes the bottom surface as an external mounting surface, the transmitting radio frequency interface socket 43, the receiving radio frequency interface sockets 44-48, the control interface socket 32 and the power interface socket 30 are all mounted on the bottom surface of a power supply, and are mounted on a missile-borne platform in a screw mounting mode through external mounting holes 49 on the high-heat-conductivity metal box body 3 and the phase-change heat storage device 7.
See fig. 11-12. The missile-borne communication system active phased-array antenna works for 1800s under the condition of high temperature of 85 ℃, and can meet the use requirement by reaching about 123.50 ℃ (shell temperature) through the chip with the highest simulation temperature. Through practical processing, the size of the active phase control antenna principle model is 230mm multiplied by 60mm, the weight is about 4.0Kg, wherein the size of the electric function part is 180mm multiplied by 120mm multiplied by 60mm, the weight is about 2.3Kg, the active phase control antenna principle model has the characteristics of light weight and miniaturization, and can well meet the requirements of small missile-borne space and light load. Through practical tests, the +/-60-degree beam scanning is realized under the control of the beam controller, the EIRP is more than or equal to 46.4dBW (normal direction), the G/T is more than or equal to-7.5 dB/K (normal direction), the electric performance is good, and the beam scanning test results are shown in fig. 11 and 12.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. An active phased array antenna of a missile-borne communication system, comprising: set up microstrip antenna array (1) and tile formula T/R subassembly (2) below in high heat conduction metal box body (3) upper portion box body groove in, be located high heat conduction metal box body (3) bottom, stack gradually beam controller (4), power distribution/synthetic network (5) on power module (6), its characterized in that: the high-heat-conductivity metal box body (3) is used as a universal heat interface (8) and an external installation interface, the phase-change heat storage device (7) is fixedly connected to two ends of the high-heat-conductivity metal box body (3), the microstrip antenna array (1) and the tile type T/R component (2) adopt a tile type framework and are divided into a plurality of independent sub-array modules, each sub-array module is horizontally distributed on the upper part of an antenna to form a transmitting array and a receiving array, the transmitting array and the receiving array are separately distributed, and the common-aperture integrated beam controller (4), the power distribution/synthesis network (5) and the power supply module (6) are sequentially arranged at the bottom of the antenna; the transmitting signal enters the tile type T component (2) through a micro-strip power divider through a radio frequency input interface (24) of a power distribution/synthesis network (5), the received signals enter the tile type R component (2) through the micro-strip power divider in the tile type T component (2), each multi-functional integrated chip (18) divides the input radio frequency signals into multiple paths, the multiple paths are respectively sent to a final amplifier core (17) and then transmitted to the micro-strip antenna array (1), the received signals enter the tile type R component (2) through the micro-strip antenna array (1), in the tile type R component (2), multi-path signals enter a multifunctional chip (18) for synthesis, and are synthesized by a micro-strip power divider into 1 path to be output to a power distribution/synthesis network (5), 1 path of full array signals are formed in the power distribution/synthesis network (5), and each path of sub array signals are output through a plurality of radio frequency output interfaces.
2. The missile-borne communication system active phased array antenna of claim 1, wherein: the microstrip antenna array (1) uses a rectangular patch (9) as a radiation array element, adopts a rectangular grid array layout on an antenna medium substrate (10) which uses a subarray module as a basic structure, and uses a metal upper cavity (11) of a tile type T/R component (2) as a metal ground, an active circuit is integrated on the medium substrate (12), the microstrip antenna array is directly installed on the metal upper cavity (11) of the tile type T/R component in a crimping mode, a feed probe (14) is interconnected with a radio frequency circuit of the tile type T/R component through a radio frequency fuzz button connector (15), and the integration of the subarray module is realized in a welding mode through a soldering tin groove (16).
3. The missile-borne communication system active phased array antenna of claim 1, wherein: active circuit integration in dielectric substrate (12) of tile formula T/R subassembly (2), the lug weld is on cavity (13) under tile formula T/R subassembly metal, every subarray module integration a plurality of amplifier chips (17) and a plurality of multi-functional integrated chip (18), through SSMP radio frequency connector (19), adopt KK radio frequency socket (20) down to pass circular metal via hole (21) on high heat conduction metal box body (3) and shielding via hole (22) on beam controller (4), link to each other with SSMP radio frequency socket (23) of power distribution/synthetic network (5).
4. The missile-borne communication system active phased array antenna of claim 1, wherein: the power supply module (6) converts input voltage into power supply voltage required by the beam controller (4) and the tile type T/R component (2), the power supply voltage is output to the beam controller (4) through the low-frequency power supply socket (31), meanwhile, external beam control signals are input from the socket (32), the external beam control signals are input to the beam controller (4) through a low-frequency cable, wiring is carried out in the beam controller (4) through a plurality of layers of low-frequency circuits, and finally power supply and amplitude-phase code control of the tile type T/R component (2) are achieved through the low-frequency elastic contact pin (33).
5. The missile-borne communication system active phased array antenna of claim 1, wherein: in the tile type T/R assembly (2), low-frequency control signals connected with an amplifier chip (17) and a plurality of multifunctional integrated chips (18) are connected with low-frequency elastic pins (33) on a beam controller (4) which upwards penetrate through rectangular metal through holes (36) on a high-heat-conductivity metal box body (3) in a metal contact (35) mode.
6. The missile-borne communication system active phased array antenna of claim 1, wherein: the power distribution/synthesis network (5) realizes the power distribution of a transmitting link and the power synthesis of a receiving link, 1 transmitting signal output by the signal control terminal is input by a radio frequency input interface (24) of the power distribution/synthesis network (5), and is output to the tile type T component (2) through an SSMP radio frequency socket (23) after passing through a micro-strip power distribution network formed by a one-to-twenty-one Wilkinson power divider, and meanwhile, 8 paths of radio frequency signals input from the tile type R component (2) through the SSMP radio frequency socket (23) form 1 path of full-array signals and 4 paths of sub-array signals after passing through a micro-strip power distribution network formed by a one-to-two and one-to-eight Wilkinson power divider, and are output to the signal control terminal.
7. The missile-borne communication system active phased array antenna of claim 1, wherein: the wave beam controller (4) provides wave beam control for the phased array antenna, external wave beam control signals are input from the socket (32), the external wave beam control signals are input into the wave beam controller (4) through a low-frequency cable, the wave beam direction of the phased array antenna is obtained through FPGA real-time calculation according to azimuth angle and pitch angle information of an antenna array surface provided by the signal processing terminal in real time in the wave beam controller (4), the wave beam direction is converted into phase data required by each array element, power signals and control signals are distributed through multilayer low-frequency circuit wiring, and finally power supply and amplitude and phase code control of the tile type T/R assembly (2) are achieved through the low-frequency elastic contact pin (33).
8. The missile-borne communication system active phased array antenna of claim 1, wherein: the microstrip antenna array 1 selects rectangular patches (9) distributed on an antenna dielectric substrate (10) as radiation array elements, the rectangular patches (9) are connected with a feed probe (14) penetrating through the antenna dielectric substrate (10) downwards, the feed probe (14) penetrates through a feed through hole of the antenna dielectric substrate (10) and is connected with a radio frequency fuzz button connector 15 integrated with a metal upper cavity (14) of a tile type T/R assembly, and radio frequency feed for the rectangular patches (9) is formed; by adjusting the position of the feed probe (14), a higher order mode with circular polarization is excited, and left-hand circular polarization with offset left-hand lower position of the feed point of the receiving unit and right-hand circular polarization with offset right-hand lower position of the feed point of the transmitting unit are respectively realized.
9. The missile-borne communication system active phased array antenna of claim 1, wherein: every eight amplifier chips (17) in the tile type T component are connected with an eight-channel T component multifunctional chip through a microstrip transmission line, the eight-channel T component multifunctional integrated chip integrates chip functions such as a driving amplifier, a 6-bit phase shifter, a 6-bit attenuator, serial-parallel signal conversion, power management and other control, primary amplification and amplitude phase control of a transmission link signal are realized, enough gain is provided for a transmission channel, the final amplifier chip (17) of the transmission channel can be ensured to be in saturation output, every 2 eight-channel T component multifunctional chips are connected together through a one-to-two Wilkinson power divider, and a sub-array circuit of the tile type T component (2) is formed; every four channels in the tile type R component share a four-channel R component multifunctional chip, the four-channel R component multifunctional integrated chip integrates a low noise amplifier, a 6-bit phase shifter, a 6-bit attenuator, serial-parallel signal conversion, power management and other control chip functions, low noise amplification and amplitude phase control of receiving link signals are achieved, enough gain is provided for receiving channels, and every 4 four-channel R component multifunctional chips are connected together through a one-to-four Wilkinson power divider to form a sub-array circuit of a tile type R component 2.
10. The missile-borne communication system active phased array antenna of claim 1, wherein: the tile type T/R component amplifier chip (17) and the multifunctional integrated chip (18) are attached to the top layer of the dielectric substrate (12) in a surface mode, one end of a power distribution/synthesis network is connected with an input/output interface of the front chip through vertical interconnection among multiple layers of circuit layers, the other end of the power distribution/synthesis network is connected with an input interface of the back SSMP radio frequency connector (19) to achieve equal-amplitude and same-phase power synthesis of input signals distributed to channels and output signals, the power distribution network and the amplitude and phase code control network are wired through multilayer low-frequency layout, power signals and amplitude and phase control signals input from the bottom are connected with pins of the amplifier chip (17) and the multifunctional integrated chips (18), and power supply and amplitude and phase code control of the tile type T/R component (2) are achieved.
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