CN111511180A - Wave-absorbing material with embossed surface and manufacturing method thereof - Google Patents
Wave-absorbing material with embossed surface and manufacturing method thereof Download PDFInfo
- Publication number
- CN111511180A CN111511180A CN202010216948.6A CN202010216948A CN111511180A CN 111511180 A CN111511180 A CN 111511180A CN 202010216948 A CN202010216948 A CN 202010216948A CN 111511180 A CN111511180 A CN 111511180A
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- China
- Prior art keywords
- sensitive adhesive
- adhesive layer
- soft magnetic
- embossed surface
- absorbing material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Hard Magnetic Materials (AREA)
Abstract
The invention relates to a wave absorbing material with an embossed surface, which is prepared by laminating a soft magnetic layer and a pressure sensitive adhesive layer, wherein the soft magnetic layer is composed of a soft magnetic powder material and an organic adhesive, one surface of the pressure sensitive adhesive layer, which is far away from the soft magnetic layer, is provided with a first structured surface, communication grooves are formed among structures of the first structured surface, and the communication grooves reach the peripheral edge of the pressure sensitive adhesive layer. The path created by the communication groove allows air to flow between the adherend and the pressure-sensitive adhesive layer, and finally, the communication groove communicates with the outside, thereby preventing air from being trapped between the absorbent material having an embossed surface and the adherend. Can avoid the phenomenon of local bubbles, thereby achieving the effect of electromagnetic wave inhibition of the whole body of the attached object. The electromagnetic interference suppression sheet can be adhered to an adherend in a simple operation procedure without requiring a special jig for operation.
Description
Technical Field
The invention relates to a wave-absorbing material with an embossed surface, in particular to a connecting structure between the wave-absorbing material with the embossed surface and an adherend.
Background
Generally, when the existing electromagnetic interference absorbing material adherend is used, a part of air bubbles cannot be discharged between the adherend and the absorbing material having an embossed surface, and generally, since the air bubbles are locally generated, the distance on the whole attaching surface becomes uneven, the present inventors found that such a situation has a problem that the electromagnetic interference inhibiting effect is deviated on the whole attaching surface.
Disclosure of Invention
The invention aims to provide a wave-absorbing material with an embossed surface, which is convenient for discharging air bubbles between an adherend and the wave-absorbing material with the embossed surface.
In order to achieve the purpose, the invention provides the following technical scheme: a wave absorbing material with an embossed surface is prepared by laminating a soft magnetic layer and a pressure sensitive adhesive layer together; the soft magnetic layer is composed of a soft magnetic powder material and an organic binder, the side of the pressure sensitive adhesive layer facing away from the soft magnetic layer has a first structured surface, and communication grooves are formed between the structures of the first structured surface, and reach the peripheral edge of the pressure sensitive adhesive layer.
Further, the soft magnetic layer contains dielectric powder.
The dielectric powder is barium titanate ceramic powder, zirconate titanate ceramic powder, and/or perovskite lead ceramic powder.
Further, the via pattern is an orthogonal lattice, an inclined lattice and/or a hexagonal lattice, and a pitch of adjacent two lattices is less than 0.4 mm.
Further, the cross section of the communicating groove is V-shaped, U-shaped, rectangular and/or trapezoidal.
Further, the shape of the structures of the first structured surface is hemispheres, prisms, pyramids and/or ellipses.
Further, a reinforcing material is provided inside the pressure-sensitive adhesive layer or between the pressure-sensitive adhesive layer and the soft magnetic layer.
Further, the reinforcing material is a PET film.
Further, the wave-absorbing material with the embossed surface further comprises a release film, the release film is provided with a second structured surface, and the second structured surface is provided with convex strips which are complementary with the communication grooves.
Further, in the two-dimensional plane of the pressure-sensitive adhesive layer, each 500 μm diameter range is obtained by carrying out um transportation through-1 × 10 with the volume of the connecting grooves being 1 × 107um³。
The invention has the beneficial effects that: communication grooves are formed between the structures of the first structured surface and reach the peripheral edge of the pressure-sensitive adhesive layer. The path created by the communication groove allows air to flow between the adherend and the pressure-sensitive adhesive layer, and the communication groove communicates with the outside, thereby preventing air from being trapped between the absorbent material having the embossed surface and the adherend. Can avoid the phenomenon of local bubbles, thereby achieving the effect of electromagnetic wave inhibition of the whole body of the attached object. The electromagnetic interference suppression sheet can be adhered to an adherend in a simple operation procedure without using a special jig during operation.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of a wave-absorbing material with an embossed surface according to an embodiment of the invention;
FIG. 2 is a schematic structural view of the first structured surface of FIG. 1;
FIG. 3 is a side view of the pressure sensitive adhesive layer of FIG. 1;
FIG. 4 is a schematic structural view of the structure of FIG. 2;
FIG. 5 is a schematic structural view of the alternative construction of FIG. 2;
FIG. 6 is a schematic structural view of another wave-absorbing material with an embossed surface according to the present invention;
FIG. 7 is a schematic structural view of another wave-absorbing material with an embossed surface according to the present invention;
FIG. 8 is a schematic structural view of another wave-absorbing material with an embossed surface according to the present invention;
fig. 9 is a schematic view of the structure of the second structured surface of fig. 8.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Figure 1 shows a cross-sectional view of a wave absorbing material 10 having an embossed surface according to one embodiment of the invention. The wave absorbing material 10 with an embossed surface comprises a soft magnetic layer 20 and a pressure sensitive adhesive layer 30 with a first structured surface 31. The soft magnetic layer 20 and the pressure-sensitive adhesive layer 30 are laminated so as to be combined together. The side of the pressure-sensitive adhesive layer 30 facing away from the soft magnetic layer 20 has a first structured surface 31, and the first structured surface 31 is formed with a communication groove 32, the communication groove 32 reaching the peripheral edge of the pressure-sensitive adhesive layer 30.
The pressure sensitive adhesive layer 30 is adhered to the soft magnetic layer 20 on one side and on the other side is a first structured surface 31, and the communication grooves 32 on the first structured surface 31 are continuously open channels or elongated grooves. The depth of the communication groove 32 may be constant or not, and a plurality of the communication grooves 32 may be different from each other, these communication grooves 32 reaching the peripheral edge of the pressure-sensitive adhesive layer 30 or communicating with other communication grooves 32 reaching the peripheral portion of the pressure-sensitive adhesive layer 30. The path created by the communication groove 32 allows air to flow between the adherend and the pressure-sensitive adhesive layer 30, and finally, the communication groove 32 communicates with the outside, thereby preventing air from being trapped between the absorbent material 10 having an embossed surface and the adherend. Can avoid the phenomenon of local bubbles, thereby achieving the effect of electromagnetic wave inhibition of the whole body of the attached object. Therefore, when the microwave absorbing material 10 having the embossed surface is manually attached, the electromagnetic interference suppression sheet can be attached to the adherend in a simple operation procedure without requiring a special jig for operation, and the generation of air bubbles can be avoided. The wave absorbing material 10 having the embossed surface can be arranged at a substantially constant distance from the surface of the adherend, and finally, a uniform electromagnetic interference suppression effect can be stably obtained over the entire attachment surface.
The soft magnetic layer 20 includes soft magnetic material powder 21 and an organic binder 23 to suppress and/or absorb unnecessary electromagnetic wave interference. The soft magnetic material powder 21 contained in the soft magnetic layer is preferably a material having a high relative permeability, particularly in a high frequency region, to enhance the effect of suppressing electromagnetic interference. Materials having a high relative magnetic permeability include carbonyl iron, iron-aluminum-silicon alloys, iron-nickel alloys (permalloy), and the like. The soft magnetic material powder 21 may have any shape, and in order to further enhance the effect of suppressing electromagnetic interference, it is preferably in a flaky or needle-like shape, and has an aspect ratio of 5: 1 or more. The soft magnetic material powder 21 is preferably a soft magnetic material having a coercive force of 100A/m or less, more preferably 10A/m or less.
The soft magnetic layer 20 also includes a dielectric powder 22 as an optional component. The dielectric powder 22 is mixed with the soft magnetic material powder 21 to prevent the soft magnetic material powder 21 from contacting with each other, and it is preferable to use a dielectric magnetic powder having a large dielectric constant in a high frequency region and a relatively flat frequency characteristic of the dielectric constant, for example: barium titanate-based ceramics, zirconate titanate-based ceramics, perovskite lead-based ceramics, and the like.
The organic binder 23 contained in the soft magnetic layer 20 disperses the soft magnetic material powder 21 and dielectric powder in an electrically insulated state in the soft magnetic layer, while ensuring the mechanical strength of the interference suppression layer. Such an organic binder 23 may be a thermoplastic resin, such as a polyolefin, polyethylene or polypropylene, polystyrene, chlorinated polyethylene, polyester, polyvinyl chloride, polyvinyl butyral, polyurethane, cellulose, nitrile-butadiene or styrene-butadiene. And may be a thermosetting resin such as epoxy resin, phenolic resin, polyamide, polyimide, polyolefin, polystyrene or chlorinated polyethylene.
For the convenience of explanation of the present invention, referring to fig. 1, the soft magnetic material powder 21 is shown as an oval shape and the dielectric powder 22 is shown as a square shape, but the magnetic powder 21 and the dielectric powder 22 used in practice are naturally formed in various shapes and the shapes are not limited.
The shape of the communication grooves 32 formed in the first structured surface 31 may vary depending on the processing method, and preferably has a V-shaped, U-shaped, rectangular, or trapezoidal cross section when viewed in the lateral direction. As a preferred embodiment, fig. 2 shows a partial plan view of a first structured surface 31; fig. 3 shows a cross-sectional view of a pressure-sensitive adhesive layer 30 having this first structured surface 31. In fig. 2 and 3, a trapezoidal groove 32 in the pressure sensitive adhesive layer 30 is shown, the side walls 34 of the structures 33 define the side walls of the groove 32, and the trapezoidal groove 32 and the corresponding structures 33 are formed in the pressure sensitive adhesive layer 30.
The shape of the structures of the first structured surface 31 may be selected from hemispheres, prisms, pyramids or ellipses. But is not limited thereto. Combinations of different structural shapes may also be used. As an example suitable for the present invention, a square pyramid 35 is shown in fig. 4. As another example of this structure, FIG. 5 shows truncated square pyramids 36 that may be embossed into the pressure sensitive adhesive layer.
The communication grooves 32 may be regular and irregular, and examples of a group of patterns of the communication grooves 32 arranged in a regular pattern include an orthogonal lattice shape, an inclined lattice shape, and a hexagonal lattice shape, and when a group of structures are arranged in a regular pattern, the smaller the average value of the distance between adjacent structures, the easier the bubbles are to be discharged. The spacing between two adjacent lattices is preferably less than 0.4 mm. Further, the communication groove 32 may be a combination of a plurality of patterns, for example, a combination of a concentric circle centered at a certain point and a radial pattern extending outward from the central point, the communication groove 32 arranged in this manner reaching the outer peripheral edge of the pressure-sensitive adhesive layer, or communicating directly or indirectly with another communication groove 32 reaching the outer peripheral portion, and thus the air bubbles may be discharged to the outside of the electromagnetic interference suppression sheet through the communication groove 32 regardless of the air bubble generation position.
The communication grooves 32 have a predetermined volume per unit area of the first structured surface 31 the greater the volume of the communication grooves 32, the more readily air flows out from the interface between the adhesive layer and the adherend, thus the volume of the grooves is preferably grown above 1 × um diameter per 500 μm diameter circle in the two-dimensional plane of the pressure-sensitive adhesive layer 307um et seq.
Fig. 6 shows another embodiment, in order to enhance the toughness of the wave absorbing material 10 with an embossed surface, a reinforcing material 40 is added between the soft magnetic layer 20 and the pressure sensitive adhesive layer 30; fig. 7 shows another embodiment, in which the reinforcing material 40 is mounted between the soft magnetic layer 20 and the pressure-sensitive adhesive layer 30 through an adhesive layer 50. The adhesive layer 50 may be a pressure sensitive adhesive or a permanent adhesive. The layer of reinforcing material 40 is preferably a PET film. The wave-absorbing material 10 with the embossed surface has very thin thickness and good flexibility. The breaking strength of the wave absorbing material 10 with the embossed surface is less than 14MPa, preferably less than 7MPa, but the lower the breaking strength, the more difficult the production and the manufacture, the poor attaching effect and the best breaking strength of 1MPa-3 MPa.
Figure 8 shows another embodiment in which the pressure sensitive adhesive layer 30 of the absorbent material 10 having an embossed surface is attached with a release film 60, and a plurality of ribs 62 are orthogonally disposed on the release film 60 to form a second structured surface 61. The second structured surface 61 is complementary in structure to the first structured surface 31 of the pressure sensitive adhesive layer 30. For example, in the case where a certain portion of the first structured surface 31 forms a V-shaped groove, there is a protrusion 62 having a pointed top at a corresponding portion of the second structured surface 61. Fig. 9 illustrates one embodiment of an orthogonal configuration of the tabs 62. For example, in the case where the release film 60 is used to form the first structured surface 31 of the pressure-sensitive adhesive layer 30, the protruding strips form V-shaped grooves on the first structured surface 31. The first structured surface 31 of the pressure sensitive adhesive layer 30 is formed during the manufacture of the absorbent material 10 having an embossed surface and is used to maintain the shape of the surface of the pressure sensitive adhesive layer 30 during storage, maintain the adhesiveness of the pressure sensitive adhesive layer 30, and protect the first structured surface 31. The release film 60 is peeled from the pressure-sensitive adhesive layer when the electromagnetic interference suppression sheet is adhered to an adherend.
The release film 60 may be made of various substrates. For example: plastic materials such as paper and thermoplastic film, coated paper or laminated paper of plastic materials such as polyethylene, polypropylene, polyester, cellulose acetate, polyvinyl chloride, and polyvinylidene fluoride. The thickness of the release film 60 is generally 30 to 300 μm. The release film 60 may be used as it is, but is preferably used after being treated with silicone or by other methods to improve the release characteristics. For example, a polyethylene coating layer is painted on both sides of a paper base material, and a silicone solution is painted on the polyethylene coating layer to perform a peeling treatment. Then, on the polyethylene coating layer after the mold release treatment, a plurality of trapezoidal ridges 62 are formed by embossing using a master mold. The surface pattern of the embossing roll is transferred onto the polyethylene coating and a release film 60 with a second structured surface 61 is obtained.
The wave absorbing material 10 having an embossed surface of the present invention has sufficient toughness and can be made thinner than conventional wave absorbing materials having an embossed surface, and therefore, the electromagnetic interference suppression sheet of the present invention is effective in small electronic devices in which the installation position and the occupied space of the electromagnetic interference suppression sheet are strictly restricted, and further, the electromagnetic interference suppression sheet can be attached to the inner wall of a case of an electronic device or the like and used for absorbing electromagnetic waves propagating by reflection inside the case, and further, the electromagnetic interference suppression sheet can be more flexibly applied to electronic devices of different shapes, for example, an integrated circuit (L SI) in electronic devices of a mobile phone, a digital video recorder, a digital camera, and a portable audio device, and it exerts a particularly excellent effect when it is pasted on a bus extending from L SI or on a wiring of an FPC.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A wave absorbing material with an embossed surface is prepared by laminating a soft magnetic layer and a pressure sensitive adhesive layer together; the soft magnetic layer is composed of a soft magnetic powder material and an organic binder, and is characterized in that one side of the pressure sensitive adhesive layer, which faces away from the soft magnetic layer, is provided with a first structured surface, and communication grooves are formed between structures of the first structured surface and reach the peripheral edge of the pressure sensitive adhesive layer.
2. The absorbing material with an embossed surface as claimed in claim 1, wherein the soft magnetic layer further comprises dielectric powder.
3. The absorbing material with an embossed surface according to claim 2, wherein the dielectric powder is barium titanate-based ceramic powder, zirconate titanate-based ceramic powder and/or perovskite lead-based ceramic powder.
4. The absorbent material with embossed surface according to claim 1, wherein the interconnected channels are patterned into orthogonal, slanted and/or hexagonal lattices and the spacing between two adjacent lattices is less than 0.4 mm.
5. The wave-absorbing material with an embossed surface according to claim 1, wherein the cross section of the communication grooves is V-shaped, U-shaped, rectangular and/or trapezoidal.
6. The absorbent material with an embossed surface according to claim 1, wherein the shape of the structure of the first structured surface is a hemisphere, a prism, a pyramid and/or an ellipse.
7. The absorbing material with embossed surface of claim 1, wherein a reinforcing material is arranged inside the pressure sensitive adhesive layer or between the pressure sensitive adhesive layer and the soft magnetic layer.
8. The absorbing material with an embossed surface as claimed in claim 4, wherein the reinforcing material is a PET film.
9. The absorbent material with an embossed surface according to any of claims 1-8, further comprising a release film, wherein the release film has a second structured surface, and the second structured surface has ribs complementary to the communication grooves.
10. The absorbing material with an embossed surface according to any one of claims 1 to 5, wherein the volume of the connecting grooves is 1 × 10 um thin film year-1 × 10 um thin film year in every 500 μm diameter range in the two-dimensional plane of the pressure sensitive adhesive layer7um³。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010216948.6A CN111511180A (en) | 2020-03-25 | 2020-03-25 | Wave-absorbing material with embossed surface and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010216948.6A CN111511180A (en) | 2020-03-25 | 2020-03-25 | Wave-absorbing material with embossed surface and manufacturing method thereof |
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| CN111511180A true CN111511180A (en) | 2020-08-07 |
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| CN202010216948.6A Pending CN111511180A (en) | 2020-03-25 | 2020-03-25 | Wave-absorbing material with embossed surface and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111526705A (en) * | 2020-04-20 | 2020-08-11 | 无锡睿穗电子材料科技有限公司 | Electromagnetic interference suppression wave-absorbing material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050109457A1 (en) * | 2003-11-26 | 2005-05-26 | Toshiyuki Amimoto | Manufacturing method and manufacturing apparatus of display device |
| JP2006179901A (en) * | 2005-12-14 | 2006-07-06 | Tdk Corp | Electromagnetic wave absorbing sheet |
| CN108370086A (en) * | 2015-12-08 | 2018-08-03 | 3M创新有限公司 | Magnetic isolation device and its manufacturing method and the device for including the Magnetic isolation device |
-
2020
- 2020-03-25 CN CN202010216948.6A patent/CN111511180A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050109457A1 (en) * | 2003-11-26 | 2005-05-26 | Toshiyuki Amimoto | Manufacturing method and manufacturing apparatus of display device |
| JP2006179901A (en) * | 2005-12-14 | 2006-07-06 | Tdk Corp | Electromagnetic wave absorbing sheet |
| CN108370086A (en) * | 2015-12-08 | 2018-08-03 | 3M创新有限公司 | Magnetic isolation device and its manufacturing method and the device for including the Magnetic isolation device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111526705A (en) * | 2020-04-20 | 2020-08-11 | 无锡睿穗电子材料科技有限公司 | Electromagnetic interference suppression wave-absorbing material |
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