CN111477610B - Alignment structure - Google Patents
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- CN111477610B CN111477610B CN202010315379.0A CN202010315379A CN111477610B CN 111477610 B CN111477610 B CN 111477610B CN 202010315379 A CN202010315379 A CN 202010315379A CN 111477610 B CN111477610 B CN 111477610B
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- 239000000758 substrate Substances 0.000 claims abstract description 45
- 230000007423 decrease Effects 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 20
- 230000004075 alteration Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种对准结构。The present invention relates to an alignment structure.
背景技术Background technique
对准结构(Alignment structure或Alignment key)在制程中,例如光刻(photolithography)对位,扮演着重要的角色,一般都是以直接镀金属或是蚀刻一个图形的方式来制作对准结构,但是,在经过一些制程后,将看不到此金属或图形,或是会因为对准结构与其周边结构之间的高度差导致对准结构周边光阻涂布较薄,涂布不均的状况引起色差,使得对准结构的识别失准,进而造成良率不佳的问题。Alignment structure (Alignment structure or Alignment key) plays an important role in the process, such as photolithography (photolithography) alignment, generally by direct metal plating or etching a pattern to make the alignment structure, but , After some processes, the metal or pattern will not be visible, or the photoresist coating around the alignment structure will be thinner due to the height difference between the alignment structure and its surrounding structures, resulting in uneven coating. The chromatic aberration makes the identification of the alignment structure inaccurate, thereby causing the problem of poor yield.
发明内容SUMMARY OF THE INVENTION
本发明是针对一种对准结构,利用延伸部来避免光阻涂布不均的问题。The present invention is directed to an alignment structure that utilizes an extension to avoid the problem of uneven coating of photoresist.
根据本发明一实施例,提供一种对准结构,包括基板、对准部以及延伸部。对准部设置于基板上,延伸部设置于基板上,延伸部至少部分环绕对准部,并且与对准部间隔空隙。其中延伸部靠近对准部的一侧与对准部靠近延伸部的一侧彼此为共形(conformal)。According to an embodiment of the present invention, an alignment structure is provided, including a substrate, an alignment portion, and an extension portion. The alignment portion is arranged on the substrate, the extension portion is arranged on the substrate, and the extension portion at least partially surrounds the alignment portion and is spaced from the alignment portion by a gap. The side of the extension part close to the alignment part and the side of the alignment part close to the extension part are conformal to each other.
基于上述,相较于现有的对准结构,本发明实施例提供的对准结构进一步包含了延伸部,目的是让用于光刻对位的对准部周边不会出现光阻较薄的状况,避免色差在该处产生,影响对准部的识别。Based on the above, compared with the existing alignment structure, the alignment structure provided by the embodiment of the present invention further includes an extension part, in order to prevent the thin photoresist from appearing around the alignment part used for lithography alignment. condition, to avoid the occurrence of chromatic aberration, which affects the identification of the alignment part.
附图说明Description of drawings
图1A是根据本发明第一实施例的对准结构涂布光阻后的平面图。FIG. 1A is a plan view of the alignment structure after coating a photoresist according to the first embodiment of the present invention.
图1B是沿着图1A的虚线II-II’截取的截面图。Fig. 1B is a cross-sectional view taken along the dotted line II-II' of Fig. 1A.
图1C是根据本发明一实施例的对准结构涂布光阻后的平面图。1C is a plan view of an alignment structure after coating a photoresist according to an embodiment of the present invention.
图1D是根据本发明一实施例的对准结构涂布光阻后的截面图。1D is a cross-sectional view of an alignment structure after coating a photoresist according to an embodiment of the present invention.
图1E是示意根据本发明一实施例的对准部及延伸部的配置平面图。FIG. 1E is a plan view illustrating the arrangement of an alignment portion and an extension portion according to an embodiment of the present invention.
图2是根据本发明第二实施例的对准结构的截面图。2 is a cross-sectional view of an alignment structure according to a second embodiment of the present invention.
图3是根据本发明第三实施例的对准结构的截面图。3 is a cross-sectional view of an alignment structure according to a third embodiment of the present invention.
附图标记说明:Description of reference numbers:
100,200,300,400:对准结构;100,200,300,400: Alignment structure;
101,201,301,401:基板;101, 201, 301, 401: substrates;
205:光阻;205: photoresist;
102,202,302,402,502,602:对准部;102, 202, 302, 402, 502, 602: Alignment section;
103,203,303,403,503,603:延伸部;103,203,303,403,503,603: extensions;
104,204,304,404:空隙;104,204,304,404: voids;
206:延伸部外侧。206: Outside of the extension.
具体实施方式Detailed ways
现将详细地参考本发明的示范性实施例,示范性实施例的实例说明于附图中。只要有可能,相同元件符号在附图和描述中用来表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.
请参照图1A及图1B,图1A是根据本发明第一实施例的对准结构涂布光阻后的平面图,图1B是沿着图1A的虚线II-II’截取的截面图。Please refer to FIGS. 1A and 1B. FIG. 1A is a plan view of an alignment structure after coating a photoresist according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the dotted line II-II' of FIG. 1A.
根据本发明第一实施例,对准结构200包括基板201、对准部202以及延伸部203。对准部202设置于基板201上,延伸部203设置于基板201上,延伸部203至少部分环绕对准部202,并且与对准部202间隔空隙204。其中延伸部203靠近对准部202的一侧与对准部202靠近延伸部203的一侧彼此为共形(conformal),也就是说,如图1A所示,对准部202靠近延伸部203的一侧呈现十字形状,延伸部203靠近对准部202的一侧也是呈现十字形状。According to the first embodiment of the present invention, the
参照图1B,可以看出,光阻205在对准部202与延伸部203之间的空隙204上方并未出现光阻涂布较薄的状况,而是仅在延伸部203外侧(如图1B虚线处)出现光阻205较薄的状况。相对地,在没有延伸部203的情况下,对准部202外侧会出现光阻涂布较薄的状况,进行光刻对位时,会在该涂布较薄处出现色差,造成无法精确对位的状况。因此,当以平面图(图1A)观看本实施例提供的对准结构200,与空隙204相邻的对准部202的侧边以及延伸部203的侧边处不会出现色差,而是仅会在延伸部外侧206出现色差(在图1A中延伸部外侧206以黑点表示该处呈现色差),特别在共形的情况下,可以让对准部202外侧光阻涂布更均匀,对准部202靠近延伸部203一侧的形状(在平面图上观看时,此形状即对准部202的”轮廓”)得以清楚显示,而得以精确地进行对位。特别说明的是,基板201可以为临时基板,例如是硅基板、塑料基板、玻璃基板或蓝宝石基板(sapphire substrate)等的临时基板。让对准结构200在半导体组件的制程过程中,提供光刻制程的对准识别。其中,对准部和延伸部与基板间可具有黏着层,使得因黏着层而使对准部有所不清的情况下,延伸部也可以作为辅助而得以使对准部精确地被对位。Referring to FIG. 1B , it can be seen that the
应当注意,虽然在图1A中的延伸部203完整环绕对准部202设置,但是本发明不以此为限,延伸部可以仅部分环绕对准部,如图1C所示,对准结构100包括基板101、对准部102以及延伸部103,延伸部103部分环绕对准部102,可以看到,虽然在延伸部103外围以及对准部102的部分轮廓出现了以黑点表示的色差,对准部102的其他部分轮廓与延伸部103之间形成空隙104,使得这部分的轮廓得以清楚呈现而未出现色差,便能够避免对位错误。It should be noted that although the
接下来,请重新参照图1B,延伸部203在基板201的法线方向上的高度等于对准部202的高度,但是本发明不限于此,请对应参照图1D,在图1D中,延伸部503的高度大于对准部502的高度,对准部502光阻涂布会更均匀,不易出现色差,对准部502轮廓的清晰度更佳。较佳地,对准部以及延伸部在基板的法线方向上的高度比落在0.5至1的范围内,两者的高度差小于1μm,且延伸部203高度小于等于20μm,延伸部高度大于20um可能产生辩识错误,而当对准部以及延伸部的高度比过小,将影响对准部的识别,当高度比过大,提升光阻涂布均匀度的效果不够。1B, the height of the
请重新参照图1B,延伸部203在垂直于基板201的法线的方向上的宽度A小于对准部202在该方向上的宽度W,以避免延伸部203在该方向上占用太多空间并干扰对位作业。较佳地,延伸部203在该方向上与对准部202的宽度比(A/W)大于等于0.2且小于等于10。小于0.2光阻涂布均匀度的效果不够,大于10会占用太多空间。但于未示出的实施例中,延伸部203在垂直于基板201的法线的方向上的宽度A可以大于对准部202在该方向上的宽度W,在此并不为限。此外,在垂直于基板201的法线的方向上,延伸部203的宽度A以及空隙204的宽度B满足下列关系式,以在延伸部203以及空隙204不占用过多空间的条件下,提升光阻涂布的均匀度:Referring back to FIG. 1B , the width A of the
5μm≤A;5μm≤A;
0.001μm<B<50μm0.001μm<B<50μm
此外,在图1A中,延伸部203远离对准部202的一侧是四边形,而非十字图案,即,延伸部203远离对准部202的一侧与对准部202彼此为异形,这是为了避免在进行光刻对位时,延伸部203被误认为对准部202。但是本发明不限于此,参照图1E,延伸部603靠近对准部602的一侧是四边形,而非如对准部602轮廓的十字图案,即,延伸部靠近对准部的一侧与对准部靠近延伸部的一侧也可以是异形。其中,对准部的形状不一定是十字图形,也可以是菱形、方形等多边形,足以提供对位即可,在此并不为限。In addition, in FIG. 1A , the side of the
根据本发明一实施例,延伸部可以包含半导体材料、金属、介电材料、有机材料,或是由构成对准部的材料来形成以简化制程增加良率。更佳地,对准部和延伸部是在同一制程中形成。According to an embodiment of the present invention, the extension portion may include semiconductor material, metal, dielectric material, organic material, or be formed from the material constituting the alignment portion to simplify the process and increase the yield. More preferably, the alignment portion and the extension portion are formed in the same process.
在图1A及图1B中,空隙204可以填入与对准部202和延伸部203不同的材料,例如金属,在这样的情况下,可以利用空隙204中材料反射率与形成对准部202和延伸部203材料反射率不同的特性,提高对准部202轮廓的识别度。In FIGS. 1A and 1B , the
接下来请参照图2,其示出根据本发明第二实施例的对准结构300的截面图。为了便于理解本发明的概念,在第二实施例中,将只描述与第一实施例不同的部分,与第一实施例相同或类似的部分将不再赘述。Next, please refer to FIG. 2 , which shows a cross-sectional view of an
在图2中,对准部302以及延伸部303在垂直于基板301的法线的方向上的宽度随着远离基板301而递增,皆形成为倒梯形的形状,并且,在该方向上,空隙304的宽度随着远离基板301而渐减。In FIG. 2 , the widths of the
根据本实施例,空隙304在垂直于基板301的法线的方向上的宽度最小值B’以及宽度最大值E的比例大于等于0.3,且小于1,这是因为,空隙304宽度最小值B’如果过小,在涂布光阻时,光阻将无法稳定地填充在空隙304底部。根据本实施例,空隙304宽度最小值B’大于0.001μm,且小于50μm,以得到较佳的光阻涂布均匀度,以及对准部302的识别精准度。根据本实施例,延伸部303在垂直于基板301的法线的方向上的宽度最小值A”以及宽度最大值A’满足下列条件式:According to the present embodiment, the ratio of the minimum width B' and the maximum width E of the void 304 in the direction perpendicular to the normal of the
5μm≤A’;5μm≤A’;
0.001μm≤A”<A’;且0.001μm≤A”<A’; and
0.3≤A”/A’≤10.3≤A”/A’≤1
根据本实施例,对准部302的倒梯形结构与基板301间的角度D符合关系式30°<D<90°,以避免因角度D过小,光阻无法稳定且完整地填充在空隙304底部。According to the present embodiment, the angle D between the inverted trapezoidal structure of the
接下来请参照图3,其绘示根据本发明第三实施例的对准结构400的截面图。在图3中,对准部402以及延伸部403在垂直于基板401法线的方向上的宽度随着远离基板401而递减,皆形成为梯形的形状,并且,在该方向上,空隙404的宽度随着远离基板401而渐增。Next, please refer to FIG. 3 , which shows a cross-sectional view of an
根据本实施例,空隙404在垂直于基板401的法线的方向上的宽度最小值B”以及宽度最大值E’的比例大于等于0.3,且小于1,这是因为,空隙404宽度最小值B”如果过小,提升光阻涂布均匀度的效果不够。根据本实施例,空隙404的宽度最大值E’大于0.001μm,且小于50μm,空隙404的宽度最小值B”大于0.001μm,且小于宽度最大值E’,以得到较佳的光阻涂布均匀度,以及对准部402的识别精准度。根据本实施例,延伸部403在垂直于基板401法线的方向上的宽度最小值F”以及宽度最大值F’满足下列条件式:According to the present embodiment, the ratio of the minimum width B" to the maximum width E' of the void 404 in the direction perpendicular to the normal of the
5μm≤F’;5μm≤F’;
0.001μm≤F”<F’;且0.001μm≤F”<F’; and
0.3≤F”/F’≤10.3≤F”/F’≤1
根据本实施例,对准部402的梯形结构与基板401间的角度D’符合关系式90°<D’≤150°,以避免因角度D过大,提升光阻涂布均匀度的效果不够。According to the present embodiment, the angle D' between the trapezoidal structure of the
综上所述,相较于现有技术,本发明实施例提供的对准结构进一步包含了延伸部,延伸部的设置使得光阻涂布更加均匀,提升了识别对准部的精准度。To sum up, compared with the prior art, the alignment structure provided by the embodiment of the present invention further includes an extension portion, and the arrangement of the extension portion makes the photoresist coating more uniform and improves the accuracy of identifying the alignment portion.
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.
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