Nothing Special   »   [go: up one dir, main page]

CN111477610B - Alignment structure - Google Patents

Alignment structure Download PDF

Info

Publication number
CN111477610B
CN111477610B CN202010315379.0A CN202010315379A CN111477610B CN 111477610 B CN111477610 B CN 111477610B CN 202010315379 A CN202010315379 A CN 202010315379A CN 111477610 B CN111477610 B CN 111477610B
Authority
CN
China
Prior art keywords
alignment
substrate
extension portion
extension
alignment structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010315379.0A
Other languages
Chinese (zh)
Other versions
CN111477610A (en
Inventor
陈彦烨
杨翔甯
吴志凌
彭钰雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PlayNitride Inc
Original Assignee
PlayNitride Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PlayNitride Inc filed Critical PlayNitride Inc
Priority to CN202010315379.0A priority Critical patent/CN111477610B/en
Publication of CN111477610A publication Critical patent/CN111477610A/en
Application granted granted Critical
Publication of CN111477610B publication Critical patent/CN111477610B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54426Marks applied to semiconductor devices or parts for alignment

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention provides an alignment structure, which comprises a substrate, an alignment part and an extension part. The alignment part is arranged on the substrate, the extension part is arranged on the substrate, at least part of the extension part surrounds the alignment part, and a gap is formed between the extension part and the alignment part. Wherein one side of the extension part close to the alignment part and one side of the alignment part close to the extension part are conformal with each other.

Description

对准结构Alignment structure

技术领域technical field

本发明涉及一种对准结构。The present invention relates to an alignment structure.

背景技术Background technique

对准结构(Alignment structure或Alignment key)在制程中,例如光刻(photolithography)对位,扮演着重要的角色,一般都是以直接镀金属或是蚀刻一个图形的方式来制作对准结构,但是,在经过一些制程后,将看不到此金属或图形,或是会因为对准结构与其周边结构之间的高度差导致对准结构周边光阻涂布较薄,涂布不均的状况引起色差,使得对准结构的识别失准,进而造成良率不佳的问题。Alignment structure (Alignment structure or Alignment key) plays an important role in the process, such as photolithography (photolithography) alignment, generally by direct metal plating or etching a pattern to make the alignment structure, but , After some processes, the metal or pattern will not be visible, or the photoresist coating around the alignment structure will be thinner due to the height difference between the alignment structure and its surrounding structures, resulting in uneven coating. The chromatic aberration makes the identification of the alignment structure inaccurate, thereby causing the problem of poor yield.

发明内容SUMMARY OF THE INVENTION

本发明是针对一种对准结构,利用延伸部来避免光阻涂布不均的问题。The present invention is directed to an alignment structure that utilizes an extension to avoid the problem of uneven coating of photoresist.

根据本发明一实施例,提供一种对准结构,包括基板、对准部以及延伸部。对准部设置于基板上,延伸部设置于基板上,延伸部至少部分环绕对准部,并且与对准部间隔空隙。其中延伸部靠近对准部的一侧与对准部靠近延伸部的一侧彼此为共形(conformal)。According to an embodiment of the present invention, an alignment structure is provided, including a substrate, an alignment portion, and an extension portion. The alignment portion is arranged on the substrate, the extension portion is arranged on the substrate, and the extension portion at least partially surrounds the alignment portion and is spaced from the alignment portion by a gap. The side of the extension part close to the alignment part and the side of the alignment part close to the extension part are conformal to each other.

基于上述,相较于现有的对准结构,本发明实施例提供的对准结构进一步包含了延伸部,目的是让用于光刻对位的对准部周边不会出现光阻较薄的状况,避免色差在该处产生,影响对准部的识别。Based on the above, compared with the existing alignment structure, the alignment structure provided by the embodiment of the present invention further includes an extension part, in order to prevent the thin photoresist from appearing around the alignment part used for lithography alignment. condition, to avoid the occurrence of chromatic aberration, which affects the identification of the alignment part.

附图说明Description of drawings

图1A是根据本发明第一实施例的对准结构涂布光阻后的平面图。FIG. 1A is a plan view of the alignment structure after coating a photoresist according to the first embodiment of the present invention.

图1B是沿着图1A的虚线II-II’截取的截面图。Fig. 1B is a cross-sectional view taken along the dotted line II-II' of Fig. 1A.

图1C是根据本发明一实施例的对准结构涂布光阻后的平面图。1C is a plan view of an alignment structure after coating a photoresist according to an embodiment of the present invention.

图1D是根据本发明一实施例的对准结构涂布光阻后的截面图。1D is a cross-sectional view of an alignment structure after coating a photoresist according to an embodiment of the present invention.

图1E是示意根据本发明一实施例的对准部及延伸部的配置平面图。FIG. 1E is a plan view illustrating the arrangement of an alignment portion and an extension portion according to an embodiment of the present invention.

图2是根据本发明第二实施例的对准结构的截面图。2 is a cross-sectional view of an alignment structure according to a second embodiment of the present invention.

图3是根据本发明第三实施例的对准结构的截面图。3 is a cross-sectional view of an alignment structure according to a third embodiment of the present invention.

附图标记说明:Description of reference numbers:

100,200,300,400:对准结构;100,200,300,400: Alignment structure;

101,201,301,401:基板;101, 201, 301, 401: substrates;

205:光阻;205: photoresist;

102,202,302,402,502,602:对准部;102, 202, 302, 402, 502, 602: Alignment section;

103,203,303,403,503,603:延伸部;103,203,303,403,503,603: extensions;

104,204,304,404:空隙;104,204,304,404: voids;

206:延伸部外侧。206: Outside of the extension.

具体实施方式Detailed ways

现将详细地参考本发明的示范性实施例,示范性实施例的实例说明于附图中。只要有可能,相同元件符号在附图和描述中用来表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.

请参照图1A及图1B,图1A是根据本发明第一实施例的对准结构涂布光阻后的平面图,图1B是沿着图1A的虚线II-II’截取的截面图。Please refer to FIGS. 1A and 1B. FIG. 1A is a plan view of an alignment structure after coating a photoresist according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the dotted line II-II' of FIG. 1A.

根据本发明第一实施例,对准结构200包括基板201、对准部202以及延伸部203。对准部202设置于基板201上,延伸部203设置于基板201上,延伸部203至少部分环绕对准部202,并且与对准部202间隔空隙204。其中延伸部203靠近对准部202的一侧与对准部202靠近延伸部203的一侧彼此为共形(conformal),也就是说,如图1A所示,对准部202靠近延伸部203的一侧呈现十字形状,延伸部203靠近对准部202的一侧也是呈现十字形状。According to the first embodiment of the present invention, the alignment structure 200 includes a substrate 201 , an alignment portion 202 and an extension portion 203 . The alignment portion 202 is disposed on the substrate 201 , and the extension portion 203 is disposed on the substrate 201 . The extension portion 203 at least partially surrounds the alignment portion 202 and is spaced from the alignment portion 202 by a gap 204 . The side of the extension portion 203 close to the alignment portion 202 and the side of the alignment portion 202 close to the extension portion 203 are conformal to each other, that is, as shown in FIG. 1A , the alignment portion 202 is close to the extension portion 203 One side of the extension portion 203 is in the shape of a cross, and the side of the extension portion 203 close to the alignment portion 202 is also in the shape of a cross.

参照图1B,可以看出,光阻205在对准部202与延伸部203之间的空隙204上方并未出现光阻涂布较薄的状况,而是仅在延伸部203外侧(如图1B虚线处)出现光阻205较薄的状况。相对地,在没有延伸部203的情况下,对准部202外侧会出现光阻涂布较薄的状况,进行光刻对位时,会在该涂布较薄处出现色差,造成无法精确对位的状况。因此,当以平面图(图1A)观看本实施例提供的对准结构200,与空隙204相邻的对准部202的侧边以及延伸部203的侧边处不会出现色差,而是仅会在延伸部外侧206出现色差(在图1A中延伸部外侧206以黑点表示该处呈现色差),特别在共形的情况下,可以让对准部202外侧光阻涂布更均匀,对准部202靠近延伸部203一侧的形状(在平面图上观看时,此形状即对准部202的”轮廓”)得以清楚显示,而得以精确地进行对位。特别说明的是,基板201可以为临时基板,例如是硅基板、塑料基板、玻璃基板或蓝宝石基板(sapphire substrate)等的临时基板。让对准结构200在半导体组件的制程过程中,提供光刻制程的对准识别。其中,对准部和延伸部与基板间可具有黏着层,使得因黏着层而使对准部有所不清的情况下,延伸部也可以作为辅助而得以使对准部精确地被对位。Referring to FIG. 1B , it can be seen that the photoresist 205 does not have a thin photoresist coating above the gap 204 between the alignment portion 202 and the extension portion 203 , but only on the outside of the extension portion 203 (as shown in FIG. 1B ). In the dotted line), the photoresist 205 is thinner. On the other hand, in the absence of the extension portion 203, the photoresist coating will be thin on the outside of the alignment portion 202. When performing photolithography alignment, a color difference will occur at the thin coating, resulting in inability to accurately align the photoresist. bit status. Therefore, when viewing the alignment structure 200 provided in this embodiment in a plan view ( FIG. 1A ), the side edges of the alignment portion 202 and the side edges of the extension portion 203 adjacent to the gap 204 will not appear chromatic aberration, but only There is a chromatic aberration on the outer side 206 of the extension portion (in FIG. 1A , the outer side 206 of the extension portion is represented by a black point where there is a chromatic aberration), especially in the case of conformal, the photoresist coating on the outer side of the alignment portion 202 can be more uniform, and the alignment The shape of the side of the portion 202 close to the extension portion 203 (when viewed in plan view, this shape is the "outline" of the alignment portion 202 ) is clearly displayed, allowing accurate alignment. Specifically, the substrate 201 may be a temporary substrate, such as a silicon substrate, a plastic substrate, a glass substrate, or a sapphire substrate. The alignment structure 200 is used to provide alignment recognition for the photolithography process during the process of the semiconductor device. Wherein, there may be an adhesive layer between the alignment portion and the extension portion and the substrate, so that when the alignment portion is unclear due to the adhesive layer, the extension portion can also be used as an auxiliary to enable the alignment portion to be accurately aligned .

应当注意,虽然在图1A中的延伸部203完整环绕对准部202设置,但是本发明不以此为限,延伸部可以仅部分环绕对准部,如图1C所示,对准结构100包括基板101、对准部102以及延伸部103,延伸部103部分环绕对准部102,可以看到,虽然在延伸部103外围以及对准部102的部分轮廓出现了以黑点表示的色差,对准部102的其他部分轮廓与延伸部103之间形成空隙104,使得这部分的轮廓得以清楚呈现而未出现色差,便能够避免对位错误。It should be noted that although the extension portion 203 in FIG. 1A completely surrounds the alignment portion 202 , the present invention is not limited thereto, and the extension portion may only partially surround the alignment portion. As shown in FIG. 1C , the alignment structure 100 includes The substrate 101 , the alignment portion 102 and the extension portion 103 , and the extension portion 103 partially surrounds the alignment portion 102 . It can be seen that although the chromatic aberration represented by black dots appears around the periphery of the extension portion 103 and the partial outline of the alignment portion 102 , the A gap 104 is formed between the outline of other parts of the alignment part 102 and the extension part 103 , so that the outline of this part can be clearly presented without chromatic aberration, and alignment errors can be avoided.

接下来,请重新参照图1B,延伸部203在基板201的法线方向上的高度等于对准部202的高度,但是本发明不限于此,请对应参照图1D,在图1D中,延伸部503的高度大于对准部502的高度,对准部502光阻涂布会更均匀,不易出现色差,对准部502轮廓的清晰度更佳。较佳地,对准部以及延伸部在基板的法线方向上的高度比落在0.5至1的范围内,两者的高度差小于1μm,且延伸部203高度小于等于20μm,延伸部高度大于20um可能产生辩识错误,而当对准部以及延伸部的高度比过小,将影响对准部的识别,当高度比过大,提升光阻涂布均匀度的效果不够。1B, the height of the extension portion 203 in the normal direction of the substrate 201 is equal to the height of the alignment portion 202, but the present invention is not limited to this, please refer to FIG. 1D correspondingly, in FIG. 1D, the extension portion If the height of 503 is greater than the height of the alignment portion 502 , the photoresist coating of the alignment portion 502 will be more uniform, chromatic aberration is less likely to occur, and the definition of the outline of the alignment portion 502 will be better. Preferably, the height ratio of the alignment portion and the extension portion in the normal direction of the substrate falls within the range of 0.5 to 1, the height difference between the two is less than 1 μm, and the height of the extension portion 203 is less than or equal to 20 μm, and the height of the extension portion is greater than 1 μm. 20um may cause identification errors. When the height ratio of the alignment part and the extension part is too small, it will affect the recognition of the alignment part. When the height ratio is too large, the effect of improving the uniformity of photoresist coating is not enough.

请重新参照图1B,延伸部203在垂直于基板201的法线的方向上的宽度A小于对准部202在该方向上的宽度W,以避免延伸部203在该方向上占用太多空间并干扰对位作业。较佳地,延伸部203在该方向上与对准部202的宽度比(A/W)大于等于0.2且小于等于10。小于0.2光阻涂布均匀度的效果不够,大于10会占用太多空间。但于未示出的实施例中,延伸部203在垂直于基板201的法线的方向上的宽度A可以大于对准部202在该方向上的宽度W,在此并不为限。此外,在垂直于基板201的法线的方向上,延伸部203的宽度A以及空隙204的宽度B满足下列关系式,以在延伸部203以及空隙204不占用过多空间的条件下,提升光阻涂布的均匀度:Referring back to FIG. 1B , the width A of the extension portion 203 in the direction perpendicular to the normal of the substrate 201 is smaller than the width W of the alignment portion 202 in this direction, so as to avoid the extension portion 203 taking up too much space in this direction and Interfere with alignment work. Preferably, the width ratio (A/W) of the extension portion 203 to the alignment portion 202 in this direction is greater than or equal to 0.2 and less than or equal to 10. Less than 0.2 photoresist coating uniformity effect is not enough, more than 10 will take up too much space. However, in the embodiment not shown, the width A of the extension portion 203 in the direction perpendicular to the normal line of the substrate 201 may be greater than the width W of the alignment portion 202 in the direction, which is not limited herein. In addition, in the direction perpendicular to the normal of the substrate 201 , the width A of the extension 203 and the width B of the gap 204 satisfy the following relationship, so that the extension 203 and the gap 204 do not take up too much space to enhance the light Uniformity of resist coating:

5μm≤A;5μm≤A;

0.001μm<B<50μm0.001μm<B<50μm

此外,在图1A中,延伸部203远离对准部202的一侧是四边形,而非十字图案,即,延伸部203远离对准部202的一侧与对准部202彼此为异形,这是为了避免在进行光刻对位时,延伸部203被误认为对准部202。但是本发明不限于此,参照图1E,延伸部603靠近对准部602的一侧是四边形,而非如对准部602轮廓的十字图案,即,延伸部靠近对准部的一侧与对准部靠近延伸部的一侧也可以是异形。其中,对准部的形状不一定是十字图形,也可以是菱形、方形等多边形,足以提供对位即可,在此并不为限。In addition, in FIG. 1A , the side of the extension portion 203 away from the alignment portion 202 is a quadrilateral, rather than a cross pattern, that is, the side of the extension portion 203 away from the alignment portion 202 and the alignment portion 202 are shaped differently from each other, which is In order to avoid that the extension portion 203 is mistaken for the alignment portion 202 during photolithography alignment. However, the present invention is not limited thereto. Referring to FIG. 1E, the side of the extension portion 603 close to the alignment portion 602 is a quadrilateral, rather than a cross pattern like the outline of the alignment portion 602, that is, the side of the extension portion close to the alignment portion is opposite to the alignment portion 602. The side of the standard portion close to the extension portion may also be shaped. Wherein, the shape of the alignment portion is not necessarily a cross shape, but may also be a polygon such as a rhombus, a square, etc., which is sufficient to provide alignment, which is not limited here.

根据本发明一实施例,延伸部可以包含半导体材料、金属、介电材料、有机材料,或是由构成对准部的材料来形成以简化制程增加良率。更佳地,对准部和延伸部是在同一制程中形成。According to an embodiment of the present invention, the extension portion may include semiconductor material, metal, dielectric material, organic material, or be formed from the material constituting the alignment portion to simplify the process and increase the yield. More preferably, the alignment portion and the extension portion are formed in the same process.

在图1A及图1B中,空隙204可以填入与对准部202和延伸部203不同的材料,例如金属,在这样的情况下,可以利用空隙204中材料反射率与形成对准部202和延伸部203材料反射率不同的特性,提高对准部202轮廓的识别度。In FIGS. 1A and 1B , the voids 204 may be filled with materials different from those of the alignment portion 202 and the extension portion 203 , such as metal. In this case, the reflectivity of the material in the voids 204 may be used to form the alignment portions 202 and 203 . The characteristic of the different reflectivity of the materials of the extension portion 203 improves the recognition degree of the outline of the alignment portion 202 .

接下来请参照图2,其示出根据本发明第二实施例的对准结构300的截面图。为了便于理解本发明的概念,在第二实施例中,将只描述与第一实施例不同的部分,与第一实施例相同或类似的部分将不再赘述。Next, please refer to FIG. 2 , which shows a cross-sectional view of an alignment structure 300 according to a second embodiment of the present invention. In order to facilitate the understanding of the concept of the present invention, in the second embodiment, only the parts different from the first embodiment will be described, and the same or similar parts as the first embodiment will not be repeated.

在图2中,对准部302以及延伸部303在垂直于基板301的法线的方向上的宽度随着远离基板301而递增,皆形成为倒梯形的形状,并且,在该方向上,空隙304的宽度随着远离基板301而渐减。In FIG. 2 , the widths of the alignment portion 302 and the extension portion 303 in the direction perpendicular to the normal line of the substrate 301 increase as the distance from the substrate 301 increases, and both are formed in the shape of an inverted trapezoid, and in this direction, the gap is The width of 304 decreases away from the substrate 301 .

根据本实施例,空隙304在垂直于基板301的法线的方向上的宽度最小值B’以及宽度最大值E的比例大于等于0.3,且小于1,这是因为,空隙304宽度最小值B’如果过小,在涂布光阻时,光阻将无法稳定地填充在空隙304底部。根据本实施例,空隙304宽度最小值B’大于0.001μm,且小于50μm,以得到较佳的光阻涂布均匀度,以及对准部302的识别精准度。根据本实施例,延伸部303在垂直于基板301的法线的方向上的宽度最小值A”以及宽度最大值A’满足下列条件式:According to the present embodiment, the ratio of the minimum width B' and the maximum width E of the void 304 in the direction perpendicular to the normal of the substrate 301 is greater than or equal to 0.3 and less than 1, because the minimum width B' of the void 304 If it is too small, the photoresist will not be able to fill the bottom of the void 304 stably when the photoresist is applied. According to this embodiment, the minimum value B' of the width of the gap 304 is greater than 0.001 μm and less than 50 μm, so as to obtain better photoresist coating uniformity and identification accuracy of the alignment portion 302 . According to the present embodiment, the minimum width A" and the maximum width A' of the extension portion 303 in the direction perpendicular to the normal of the substrate 301 satisfy the following conditional expressions:

5μm≤A’;5μm≤A’;

0.001μm≤A”<A’;且0.001μm≤A”<A’; and

0.3≤A”/A’≤10.3≤A”/A’≤1

根据本实施例,对准部302的倒梯形结构与基板301间的角度D符合关系式30°<D<90°,以避免因角度D过小,光阻无法稳定且完整地填充在空隙304底部。According to the present embodiment, the angle D between the inverted trapezoidal structure of the alignment portion 302 and the substrate 301 conforms to the relationship 30°<D<90°, so as to avoid that the photoresist cannot be stably and completely filled in the gap 304 due to the too small angle D bottom.

接下来请参照图3,其绘示根据本发明第三实施例的对准结构400的截面图。在图3中,对准部402以及延伸部403在垂直于基板401法线的方向上的宽度随着远离基板401而递减,皆形成为梯形的形状,并且,在该方向上,空隙404的宽度随着远离基板401而渐增。Next, please refer to FIG. 3 , which shows a cross-sectional view of an alignment structure 400 according to a third embodiment of the present invention. In FIG. 3 , the widths of the alignment portion 402 and the extension portion 403 in the direction perpendicular to the normal line of the substrate 401 decrease as the distance from the substrate 401 decreases, and both are formed in a trapezoidal shape, and in this direction, the width of the gap 404 The width increases away from the substrate 401 .

根据本实施例,空隙404在垂直于基板401的法线的方向上的宽度最小值B”以及宽度最大值E’的比例大于等于0.3,且小于1,这是因为,空隙404宽度最小值B”如果过小,提升光阻涂布均匀度的效果不够。根据本实施例,空隙404的宽度最大值E’大于0.001μm,且小于50μm,空隙404的宽度最小值B”大于0.001μm,且小于宽度最大值E’,以得到较佳的光阻涂布均匀度,以及对准部402的识别精准度。根据本实施例,延伸部403在垂直于基板401法线的方向上的宽度最小值F”以及宽度最大值F’满足下列条件式:According to the present embodiment, the ratio of the minimum width B" to the maximum width E' of the void 404 in the direction perpendicular to the normal of the substrate 401 is greater than or equal to 0.3 and less than 1, because the minimum width B of the void 404 "If it is too small, the effect of improving the uniformity of photoresist coating is not enough. According to the present embodiment, the maximum width E' of the voids 404 is greater than 0.001 μm and less than 50 μm, and the minimum width B″ of the voids 404 is greater than 0.001 μm and less than the maximum width E′, in order to obtain better photoresist coating uniformity, and the recognition accuracy of the alignment portion 402. According to the present embodiment, the minimum width F″ and the maximum width F′ of the extension portion 403 in the direction perpendicular to the normal of the substrate 401 satisfy the following conditional expressions:

5μm≤F’;5μm≤F’;

0.001μm≤F”<F’;且0.001μm≤F”<F’; and

0.3≤F”/F’≤10.3≤F”/F’≤1

根据本实施例,对准部402的梯形结构与基板401间的角度D’符合关系式90°<D’≤150°,以避免因角度D过大,提升光阻涂布均匀度的效果不够。According to the present embodiment, the angle D' between the trapezoidal structure of the alignment portion 402 and the substrate 401 conforms to the relational formula 90°<D'≤150°, so as to avoid that the effect of improving the uniformity of photoresist coating is insufficient due to the excessively large angle D .

综上所述,相较于现有技术,本发明实施例提供的对准结构进一步包含了延伸部,延伸部的设置使得光阻涂布更加均匀,提升了识别对准部的精准度。To sum up, compared with the prior art, the alignment structure provided by the embodiment of the present invention further includes an extension portion, and the arrangement of the extension portion makes the photoresist coating more uniform and improves the accuracy of identifying the alignment portion.

最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (9)

1.一种对准结构,其特征在于,包括:1. an alignment structure, is characterized in that, comprises: 基板;substrate; 对准部,设置于所述基板上;以及an alignment portion disposed on the substrate; and 延伸部,设置于所述基板上,所述延伸部至少部分环绕所述对准部,并且与所述对准部间隔空气间隙,其中an extension part disposed on the substrate, the extension part at least partially surrounding the alignment part and spaced from the alignment part by an air gap, wherein 环绕所述对准部的所述延伸部在第一方向上的高度大于所述对准部在所述第一方向上的高度,所述第一方向平行于所述基板的法线方向。A height of the extension portion surrounding the alignment portion in a first direction is greater than a height of the alignment portion in the first direction, the first direction being parallel to the normal direction of the substrate. 2.根据权利要求1所述的对准结构,其特征在于,所述对准部与所述延伸部在所述第一方向上的高度比落在大于0.5且小于1的范围内。2 . The alignment structure according to claim 1 , wherein a height ratio of the alignment portion and the extension portion in the first direction falls within a range greater than 0.5 and less than 1. 3 . 3.根据权利要求1所述的对准结构,其特征在于,所述延伸部在第二方向上与所述对准部在所述第二方向上的宽度比大于等于0.2且小于等于10,且所述第二方向垂直于所述基板的法线方向。3 . The alignment structure according to claim 1 , wherein a width ratio of the extending portion in the second direction to the alignment portion in the second direction is greater than or equal to 0.2 and less than or equal to 10, 3 . And the second direction is perpendicular to the normal direction of the substrate. 4.根据权利要求1所述的对准结构,其特征在于,所述对准部以及所述延伸部在第二方向上的宽度随着远离所述基板而递增,所述空气间隙在所述第二方向上的宽度渐减,且所述第二方向垂直于所述基板的法线方向。4 . The alignment structure according to claim 1 , wherein widths of the alignment portion and the extension portion in the second direction increase as they move away from the substrate, and the air gap is in the second direction. 5 . The width in the second direction decreases gradually, and the second direction is perpendicular to the normal direction of the substrate. 5.根据权利要求1所述的对准结构,其特征在于,所述对准部以及所述延伸部在第二方向上的宽度随着远离所述基板而递减,所述空气间隙在所述第二方向上的宽度渐增,且所述第二方向垂直于所述基板的法线方向。5 . The alignment structure according to claim 1 , wherein widths of the alignment portion and the extension portion in the second direction decrease as the distance from the substrate decreases, and the air gap is in the second direction. 6 . The width increases in a second direction, and the second direction is perpendicular to the normal direction of the substrate. 6.根据权利要求1所述的对准结构,其特征在于,所述空气间隙在第二方向上的宽度的最小值以及最大值的比例大于等于0.3,且小于等于1,且所述第二方向垂直于所述基板的法线方向。6 . The alignment structure according to claim 1 , wherein the ratio of the minimum value and the maximum value of the width of the air gap in the second direction is greater than or equal to 0.3 and less than or equal to 1, and the second The direction is perpendicular to the normal direction of the substrate. 7.根据权利要求6所述的对准结构,其特征在于,所述空气间隙的所述最小值大于0.001微米,且小于50微米。7. The alignment structure of claim 6, wherein the minimum value of the air gap is greater than 0.001 microns and less than 50 microns. 8.根据权利要求1所述的对准结构,其特征在于,所述延伸部远离所述对准部的一侧与所述对准部靠近所述延伸部的一侧彼此为异形。8 . The alignment structure according to claim 1 , wherein a side of the extension portion away from the alignment portion and a side of the alignment portion close to the extension portion are shaped differently from each other. 9 . 9.根据权利要求1所述的对准结构,其特征在于,所述延伸部靠近所述对准部的一侧与所述对准部靠近所述延伸部的一侧彼此为共形。9 . The alignment structure of claim 1 , wherein a side of the extension portion close to the alignment portion and a side of the alignment portion close to the extension portion are conformal to each other. 10 .
CN202010315379.0A 2020-04-21 2020-04-21 Alignment structure Active CN111477610B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010315379.0A CN111477610B (en) 2020-04-21 2020-04-21 Alignment structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010315379.0A CN111477610B (en) 2020-04-21 2020-04-21 Alignment structure

Publications (2)

Publication Number Publication Date
CN111477610A CN111477610A (en) 2020-07-31
CN111477610B true CN111477610B (en) 2022-07-12

Family

ID=71755376

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010315379.0A Active CN111477610B (en) 2020-04-21 2020-04-21 Alignment structure

Country Status (1)

Country Link
CN (1) CN111477610B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305139A (en) * 2001-04-06 2002-10-18 Seiko Epson Corp Pattern exposure alignment mark, alignment method and exposure apparatus
CN1567096A (en) * 2003-07-03 2005-01-19 中国科学院微电子中心 Marking graph for X-ray photoetching alignment
CN200983364Y (en) * 2006-06-19 2007-11-28 上海集成电路研发中心有限公司 A testing structure for improving calibration precision in integrated circuit making
TW200907608A (en) * 2007-08-02 2009-02-16 Winbond Electronics Corp Electronic device and alignment mark
CN101840886A (en) * 2009-02-19 2010-09-22 索尼公司 Manufacturing method of semiconductor device
CN110349874A (en) * 2018-04-04 2019-10-18 中芯国际集成电路制造(上海)有限公司 A kind of detection method of overlay alignment
CN110908255A (en) * 2019-11-04 2020-03-24 深圳莱宝高科技股份有限公司 Alignment mark structure, exposure device and exposure method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112301A (en) * 1992-09-25 1994-04-22 Toshiba Corp Alignment mark construction
CN102280437B (en) * 2011-07-13 2016-04-06 旭曜科技股份有限公司 Calibration mark and method of manufacture
US9812364B2 (en) * 2015-10-28 2017-11-07 Samsung Electronics Co., Ltd. Method of fabricating semiconductor device with an overlay mask pattern
US10020265B2 (en) * 2015-12-17 2018-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure and fabricating method thereof
US10504852B1 (en) * 2018-06-25 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional integrated circuit structures

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305139A (en) * 2001-04-06 2002-10-18 Seiko Epson Corp Pattern exposure alignment mark, alignment method and exposure apparatus
CN1567096A (en) * 2003-07-03 2005-01-19 中国科学院微电子中心 Marking graph for X-ray photoetching alignment
CN200983364Y (en) * 2006-06-19 2007-11-28 上海集成电路研发中心有限公司 A testing structure for improving calibration precision in integrated circuit making
TW200907608A (en) * 2007-08-02 2009-02-16 Winbond Electronics Corp Electronic device and alignment mark
CN101840886A (en) * 2009-02-19 2010-09-22 索尼公司 Manufacturing method of semiconductor device
CN110349874A (en) * 2018-04-04 2019-10-18 中芯国际集成电路制造(上海)有限公司 A kind of detection method of overlay alignment
CN110908255A (en) * 2019-11-04 2020-03-24 深圳莱宝高科技股份有限公司 Alignment mark structure, exposure device and exposure method

Also Published As

Publication number Publication date
CN111477610A (en) 2020-07-31

Similar Documents

Publication Publication Date Title
WO2020199651A1 (en) Display substrate, display apparatus, and method of fabricating display substrate
US10151041B2 (en) Manufacturing method of metal mask and mask for deposition using said method
US20120060756A1 (en) Mask for organic electroluminescence device
CN111477610B (en) Alignment structure
US12176352B2 (en) Electronic device
CN106206426B (en) Array substrate and its manufacturing method, display device
US20190302500A1 (en) Display device and manufacturing method for display device
WO2021030927A1 (en) Display backplane and manufacturing method therefor, and display device
CN110114882A (en) Display base plate, display device, mask plate and manufacturing method
TWI736226B (en) Alignment structure
WO2022198650A1 (en) Display substrate, preparation method therefor, and display device
CN109935623B (en) display device
CN111199981B (en) Array substrate, preparation method thereof and display device
CN111128965B (en) Array substrate and display panel
CN110098200B (en) Pixel structure and manufacturing method thereof
US20240145644A1 (en) Display substrate, display panel, display apparatus, and method of fabricating display substrate
WO2022183498A1 (en) Display panel and preparation method therefor, and display device
CN113745242B (en) Array substrate, display panel, display device and manufacturing method of array substrate
TWI805984B (en) Metal mask
TWI835336B (en) Electronic device and manufacturing method thereof
US20230317498A1 (en) Light-emitting element panel
US20240292665A1 (en) Display Panel and Manufacturing Method Thereof, and Display Device
CN115763351A (en) Light emitting element array substrate and method for manufacturing same
EP4089748A1 (en) Optical substrate and manufacturing method thereof
US10483223B2 (en) Semiconductor device having a large area interconnect or pad

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant