CN111318688A - 一种铝基导电粉体的制备方法及应用 - Google Patents
一种铝基导电粉体的制备方法及应用 Download PDFInfo
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- 239000000843 powder Substances 0.000 title claims abstract description 67
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 49
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- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 9
- 239000000725 suspension Substances 0.000 claims description 27
- 238000003756 stirring Methods 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 19
- 238000005406 washing Methods 0.000 claims description 19
- 230000007935 neutral effect Effects 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 12
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- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
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- 239000002244 precipitate Substances 0.000 claims description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(I) nitrate Inorganic materials [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 229910001868 water Inorganic materials 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
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- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000276 potassium ferrocyanide Substances 0.000 claims description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 3
- 229940074439 potassium sodium tartrate Drugs 0.000 claims description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 3
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 claims description 3
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 claims description 3
- 238000011549 displacement method Methods 0.000 claims description 2
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 230000003647 oxidation Effects 0.000 abstract description 8
- 238000007254 oxidation reaction Methods 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 7
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- 238000009776 industrial production Methods 0.000 abstract description 3
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- 230000005012 migration Effects 0.000 abstract description 2
- 238000013508 migration Methods 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 description 10
- 239000000523 sample Substances 0.000 description 8
- 229910000510 noble metal Inorganic materials 0.000 description 6
- 229910018725 Sn—Al Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
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- 238000004321 preservation Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000004584 weight gain Effects 0.000 description 3
- 235000019786 weight gain Nutrition 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 description 1
- 229910021205 NaH2PO2 Inorganic materials 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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Abstract
本发明公开了一种铝基导电粉体的制备方法,该方法是以预处理铝粉为基本单元,通过化学镀还原法或化学镀置换法制得混合或包覆的X‑Al复合导电粉体,其中X为Sn、Ni、Ag、Cu、或Zn,其中X在X‑Al复合导电粉体的质量比为10~20%;本发明方法制得的X‑Al复合导电粉体使用效果稳定,抗氧化性高;采用铝基导电粉体制备的铝电极表面光滑完整,组织致密均匀,与基体结合力好,与纯银电极相比不会出现离子迁移现象,本发明材料制得的电极浆料与纯铝浆相比,方阻明显降低,可作为优异的导电铝浆进行使用,铝浆烧结后形成的电极与基体结合力好,长期放置时具有优异的抗氧化性能和抗老化性能;适用于工业化生产和市场推广应用。
Description
技术领域
本发明属于电极材料制备领域,具体涉及一种铝基导电粉体的制备方法和该铝基导电粉体在金属电极上的应用。
背景技术
传统的电极浆料多涉及贵金属,尤其是银电极浆料,使用范围广,使用频率高。但近年来,随着贵金属价格的提高及对低成本生产的追求,以纯银电极为代表的贵金属浆料受到较大限制。以贱金属代替贵金属用于电子浆料中已经得到较大发展,尤其是铜电极浆料和铝电极浆料。铜电极浆料在使用时会出现烧结无氧化环境的要求,在使用方面有一定限制,而铝电极可以在空气中烧结,使用较为方便。但铝电极与银电极相比电阻较大且会出现长时间放置易氧化的现象。因此开发抗氧化铝基复合材料制备金属电极有较好的发展前景。本发明通过不同的包覆手段制备铝基导电粉体及制备铝金属电极,电极性能较好,抗氧化能力较强。
发明内容
针对现有技术存在的不足,本发明提供了一种铝基导电粉体的制备方法,该方法以预处理铝粉为基本单元,通过化学镀还原法或化学镀置换法制得混合或包覆的X-Al复合导电粉体,其中X为Sn、Ni、Ag、Cu、或Zn,其中X在X-Al复合导电粉体的质量比为10~20%;本发明产品制备的铝基导电粉体能满足工业生产制备低阻率高抗氧化性铝电极的需求,以此替代纯银电极等贵金属电极,降低成本。
本发明方法中预处理铝粉是将粒径2~3μm的铝粉置于0.002~0.0025mol/L的碱溶液中处理1~2min,然后取出用去离子水洗涤至中性,再放入粉体体积2~3倍的体积浓度5~7%的稀盐酸中,加热至40~50℃处理10~15min,取出沉淀,用水洗涤至洗液为中性,干燥备用。
所述碱溶液中的碱为NaOH或KOH。
当X为Ag时,采用化学镀置换法将Ag包覆在Al表面,具体步骤如下:
(1)将预处理铝粉配制成质量浓度40~60%的铝粉悬浮液,在超声搅拌、40~50℃条件下,以25~35滴/min的速度将铝粉悬浮液滴加到镀Cu液中,同时滴加质量浓度10~15%的PVP分散液;
(2)待铝粉悬浮液滴加完后,继续超声搅拌25~35min,超声完成后静置,倒去上清液,将粉体用去离子水洗涤至上清液pH为中性,干燥后得到Cu-Al复合导电粉体;
(3)将Cu-Al复合导电粉体配制成质量浓度40~50%的悬浮液,在超声搅拌、45~55℃条件下,以15~25滴/min滴加到镀Ag溶液中,同时滴加质量浓度10~15%的PVP分散液;
(4)待步骤(3)悬浮液滴加完后,继续超声搅拌25~35min,取出固体,静置洗涤至上清液pH为中性,干燥后得到Ag-Al复合导电粉体。
所述镀铜液的组成物为五水合硫酸铜5g/200mL、乙二胺四乙酸6g/200mL、酒石酸钾钠2g/200mL、亚铁氰化钾0.0004g/200mL、甲醇1.27mL/200mL、甲醛1.66mL/200mL、氢氧化钠8g/200mL;镀铜液pH值为9~10。
所述镀Ag液的组成物为AgNO3 9.85g/300mL、三乙酸四胺32~35mL/300mL、C6H12O625~30g/300mL。
当X为Sn、Ni、Cu或Zn时,采用化学镀还原法制备X-Al复合粉体,步骤如下:
(1)将预处理铝粉配制成质量浓度40~60%的铝粉悬浮液,在超声搅拌、45~55℃条件下,以25~35滴/min的速度将铝粉悬浮液滴加到镀X液中,同时滴加质量浓度10~15%的PVP分散液,X为Sn、Ni、Cu或Zn;镀X液均采用常规配方配制;
(2)待铝粉悬浊液滴加完成后,继续超声搅拌25~35min,取出固体,静置洗涤至上清液pH为中性,干燥后得到X-Al复合导电粉体;X为Sn、Ni、Cu或Zn。
本发明另一目的是将上述铝基导电粉体的制备方法制得的铝基导电粉体应用在制备金属电极中。
本发明方法制得的X-Al复合导电粉体使用效果稳定,抗氧化性高;采用铝基导电粉体制备的铝电极表面光滑完整,组织致密均匀,与基体结合力好,与纯银电极相比不会出现离子迁移现象,本发明材料制得的电极浆料与纯铝浆相比,方阻明显降低,可作为优异的导电铝浆进行使用,铝浆烧结后形成的电极与基体结合力好,长期放置时具有优异的抗氧化性能和抗老化性能;适用于工业化生产和市场推广应用。
附图说明
图1 为实施例1中化学镀还原-置换制得Ag-Al复合导电粉体的SEM电镜图(不同放大倍数下);
图2为实施例1制得的铝电极表面铝膜SEM电镜图(不同放大倍数下);
图3为实施例2中化学镀还原法制得Sn-Al复合导电粉体的SEM电镜图(不同放大倍数下);
图4为实施例2制得的铝电极表面铝膜SEM电镜图(不同放大倍数下);
图5为对照实施例中普通铝电极的SEM电镜图(不同放大倍数下)。
具体实施方式
下面通过实施例对本发明作进一步详细说明,但本发明保护范围不局限于所述内容。
实施例1:本发明铝基导电粉体的制备方法是以预处理铝粉为基本单元,通过化学镀置换制得Ag-Al复合导电粉体,其中Ag在Ag-Al复合导电粉体的质量比为10%,方法如下:
(1)将粒径2~3μm的铝粉置于0.002mol/L的碱溶液中处理1.5min,然后取出用去离子水洗涤至中性,再放入粉体体积2倍的体积浓度5%的稀盐酸中,加热至40℃处理15min,取出沉淀,用水洗涤至洗液为中性,干燥制得预处理铝粉;
(2)将预处理铝粉配制成质量浓度50%的铝粉悬浮液,在超声搅拌、45℃条件下,以30滴/min的速度将铝粉悬浮液40mL滴加到200mL镀Cu液中,同时滴加质量浓度10%的PVP分散液(0.6g配制的溶液);其中镀Cu液的组成物为五水合硫酸铜5g/200mL、乙二胺四乙酸6g/200mL、酒石酸钾钠2g/200mL、亚铁氰化钾0.0004g/200mL、甲醇1.27mL/200mL、甲醛1.66mL/200mL、氢氧化钠8g/200mL;镀铜液pH值为9-10;
(3)待铝粉悬浮液滴加完后,继续超声搅拌30min,超声完成后静置,倒去上清液,将粉体用去离子水洗涤至上清液pH为中性,干燥后得到Cu-Al复合导电粉体;
(4)将Cu-Al复合导电粉体配制成质量浓度40%的悬浮液50mL,在超声搅拌、50℃条件下,以20滴/min滴加到300mL镀Ag溶液中,同时滴加质量浓度10%的PVP分散液;其中镀Ag液的组成物为AgNO3 9.85g/300mL、三乙酸四胺32mL/300mL、C6H12O6 25g/300mL;
(5)待步骤(4)悬浮液滴加完后,继续超声搅拌30min,取出固体,静置洗涤至上清液pH为中性,干燥后得到Ag-Al复合导电粉体;Ag-Al复合导电粉体的银粉覆盖率较高,与铝粉结合较好。结果见图1,从图中可以看出包覆效果较好;
(6)将Ag-Al复合导电粉体70%、玻璃粉15%、有机载体(乙基纤维素-松油醇系)15%混合均匀,在三辊轧机上轧至细度≤10μm;
(7)采用丝网印刷的方式将步骤(6)的铝浆印刷在基体上,丝网目数为250目,然后流平5min,经150℃红外照射烘干备用;
(8)选用管式炉对样品进行烧结,烧结温度620℃,保温时间10min,升温时间25min,降温时间25min,降温至200℃取出空气中冷却,整个烧结过程持续时间为1h,冷却后即得到铝电极;铝电极的铝膜电镜图见图2,从图中可以看出电极中导电粉体融化效果较好。
本实施例制得的电极形貌平整光滑,采用四探针电阻仪测量电极电阻,电极电阻为0.15Ω,氧化增重/30天2.81%,电阻变化率/30d为2.7%。
实施例2:本发明铝基导电粉体的制备方法是以预处理铝粉为基本单元,通过化学镀还原法制得Sn-Al复合导电粉体,其中Sn在Sn-Al复合导电粉体的质量比为15%,方法如下:
(1)将粒径2~3μm的铝粉置于0.0025mol/L的碱溶液中处理1min,然后取出用去离子水洗涤至中性,再放入粉体体积3倍的体积浓度6%的稀盐酸中,加热至50℃处理10min,取出沉淀,用水洗涤至洗液为中性,干燥制得预处理铝粉;
(2)镀Sn液是将SnCl2·2H2O 11.4g、(NH2)Cs 30.5g、NaH2PO2·H2O 24.8g、C6H5Na2O7·2H2O 6.8g分别用水溶解后,定容至250mL制得,pH为5.8-6.2;
(3)将预处理铝粉配制成质量浓度50%的铝粉悬浮液,在超声搅拌、50℃条件下,以30滴/min的速度将铝粉悬浮液50mL滴加到250mL镀Sn液中,同时滴加质量浓度10%的PVP分散液(0.6g配制);
(4)待铝粉悬浊液滴加完成后,继续超声搅拌30min,取出固体,静置洗涤至上清液pH为中性,干燥后得到Sn-Al复合导电粉体;该粉体的电镜图见图3;
(5)将Sn-Al复合导电粉体70%、玻璃粉15%、有机载体15%混合均匀,在三辊轧机上轧至细度≤10μm;
(6)采用丝网印刷的方式将步骤(5)的铝浆印刷在基体上,丝网目数为250目,然后流平5min,经150℃红外照射烘干备用;
(7)选用管式炉对样品进行烧结,烧结温度620℃,保温时间10min,升温时间25min,降温时间25min,降温至200℃取出空气中冷却,整个烧结过程持续时间为1h,冷却后即得到铝电极;铝电极的铝膜电镜图见图4,从图中看出铝电极表面有部分空洞;
本实施例制得的电极形貌平整光滑,采用四探针电阻仪方法测量电极电阻,电极电阻0.56Ω,氧化增重/30天3.2%,电阻变化率/30天 8.9%。
对照实施例:
1、将无任何处理的铝粉导电体70%、玻璃粉10%、有机载体20%,混合均匀,在三辊轧机上轧至细度≤10μm;
2、采用丝网印刷的方式将步骤1中的铝浆印刷在基体上,丝网目数为250目,然后流平5min,在150℃下干燥箱中烘干备用;
3、选用管式炉对样品进行烧结,烧结温度620℃,高温保温时间10min,升温时间25min,降温时间25min,降温至200℃取出空气中冷却,整个烧结过程持续时间为1h,冷却完成后即得到普通铝电极;铝电极表面电镜图见图5;普通铝电极的电极电阻1.23Ω,,氧化增重/30天 6.7%,电阻变化率/30天11.2%;
从以上结果可以看出采用本发明方法制得的铝基导电粉体可以制备欧姆级别电极,代替纯银电极等贵金属浆料,降低成本。
Claims (8)
1.一种铝基导电粉体的制备方法,其特征在于:以预处理铝粉为基本单元,通过化学镀还原法或化学镀置换法制得混合或包覆的X-Al复合导电粉体,其中X为Sn、Ni、Ag、Cu、或Zn,其中X在X-Al复合导电粉体的质量比为10~20%。
2.根据权利要求1所述的铝基导电粉体的制备方法,其特征在于:预处理铝粉是将粒径2~3μm的铝粉置于0.002~0.0025mol/L的碱溶液中处理1~2min,然后取出用去离子水洗涤至中性,再放入粉体体积2~3倍的体积浓度5~7%的稀盐酸中,加热至40~50℃处理10~15min,取出沉淀,用水洗涤至洗液为中性,干燥备用。
3.根据权利要求2所述的铝基导电粉体的制备方法,其特征在于:碱溶液中的碱为NaOH或KOH。
4.根据权利要求1所述的铝基导电粉体的制备方法,其特征在于,Ag采用化学镀置换法包覆在Al表面,具体步骤如下:
(1)将预处理铝粉配制成质量浓度40~60%的铝粉悬浮液,在超声搅拌、40~50℃条件下,以25~35滴/min的速度将铝粉悬浮液滴加到镀Cu液中,同时滴加质量浓度10~15%的PVP分散液;
(2)待铝粉悬浮液滴加完后,继续超声搅拌25~35min,超声完成后静置,倒去上清液,将粉体用去离子水洗涤至上清液pH为中性,干燥后得到Cu-Al复合导电粉体;
(3)将Cu-Al复合导电粉体配制成质量浓度40~50%的悬浮液,在超声搅拌、45~55℃条件下,以15~25滴/min滴加到镀Ag溶液中,同时滴加质量浓度10~15%的PVP分散液;
(4)待步骤(3)悬浮液滴加完后,继续超声搅拌25~35min,取出固体,静置洗涤至上清液pH为中性,干燥后得到Ag-Al复合导电粉体。
5.根据权利要求4所述的铝基导电粉体的制备方法,其特征在于:镀铜液的组成物为五水合硫酸铜5g/200mL、乙二胺四乙酸6g/200mL、酒石酸钾钠2g/200mL、亚铁氰化钾0.0004g/200mL、甲醇1.27mL/200mL、甲醛1.66mL/200mL、氢氧化钠8g/200mL;镀铜液pH值为9~10。
6.根据权利要求4所述的铝基导电粉体的制备方法,其特征在于:镀Ag液的组成物为AgNO3 9.85g/300mL、三乙酸四胺32~35mL/300mL、C6H12O6 25~30g/300mL。
7.根据权利要求1所述的铝基导电粉体的制备方法,其特征在于,X为Sn、Ni、Cu或Zn时,采用化学镀还原法制备X-Al复合粉体,步骤如下:
(1)将预处理铝粉配制成质量浓度40~60%的铝粉悬浮液,在超声搅拌、45~55℃条件下,以25~35滴/min的速度将铝粉悬浮液滴加到镀X液中,同时滴加质量浓度10~15%的PVP分散液,X为Sn、Ni、Cu或Zn;
(2)待铝粉悬浊液滴加完成后,继续超声搅拌25~35min,取出固体,静置洗涤至上清液pH为中性,干燥后得到X-Al复合导电粉体;X为Sn、Ni、Cu或Zn。
8.权利要求1~7任一项所述的铝基导电粉体的制备方法制得的铝基导电粉体在制备金属电极中的应用。
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