CN111289169B - Passive wireless temperature and pressure integrated sensor based on LC resonance and preparation method thereof - Google Patents
Passive wireless temperature and pressure integrated sensor based on LC resonance and preparation method thereof Download PDFInfo
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- CN111289169B CN111289169B CN202010090844.5A CN202010090844A CN111289169B CN 111289169 B CN111289169 B CN 111289169B CN 202010090844 A CN202010090844 A CN 202010090844A CN 111289169 B CN111289169 B CN 111289169B
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000009774 resonance method Methods 0.000 title description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000002490 spark plasma sintering Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/007—Transmitting or indicating the displacement of flexible diaphragms using variations in inductance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/34—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using capacitative elements
- G01K7/343—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using capacitative elements the dielectric constant of which is temperature dependant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a passive wireless temperature and pressure integrated sensor based on LC resonance and a preparation method thereof, wherein the sensor comprises: a temperature sensing unit for sensing temperature and a pressure sensing unit for sensing pressure; the temperature sensing unit comprises an opening resonant ring, the outside of the opening resonant ring is wrapped with a dielectric ceramic material, and the dielectric ceramic material has a dielectric constant which linearly changes along with the temperature; the pressure sensing unit comprises an opening resonance ring I and a flexible diaphragm, the opening resonance ring I is adhered to the center of the flexible diaphragm, and the flexible diaphragm is made of high-temperature-resistant rubber material; the temperature sensing unit and the pressure sensing unit are connected through a sleeve to form an integrated sensor; the sensor is calibrated at different temperatures and pressures, so that the temperature and the pressure can be simultaneously monitored; the sensor of the invention has a very simple structure and is easy to realize low-cost manufacture.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a passive wireless temperature and pressure integrated sensor based on LC resonance and a preparation method thereof.
Background
In the fields of aerospace, thermal power generation, nuclear industry and the like, real-time monitoring on temperature and pressure intensity is generally required at the same time. Conventional temperature or pressure sensors often require leads for connection, but the use of wired sensors becomes relatively difficult under special conditions of rotation, corrosion, containment, etc. At this point, a sensor that does not require power from a power source and does not require leads would be of significant advantage. On the other hand, a single parameter sensor can only measure one parameter, and if a plurality of parameters are to be measured simultaneously, a plurality of sensors are required, which is not favorable for system integration.
Disclosure of Invention
According to the problems existing in the prior art, the invention discloses a passive wireless temperature and pressure integrated sensor based on LC resonance; the method comprises the following steps: the temperature sensing unit is used for sensing temperature and the pressure sensing unit is used for sensing pressure, and the temperature sensing unit and the pressure sensing unit are connected through a sleeve to form an integrated sensor; the temperature sensing unit comprises an opening resonant ring, the outside of the opening resonant ring is wrapped with a dielectric ceramic material, and the dielectric ceramic material has a dielectric constant which linearly changes along with the temperature;
the pressure sensing unit comprises an opening resonance ring I and a flexible diaphragm, the opening resonance ring I is adhered to the center of the flexible diaphragm, and the flexible diaphragm is made of high-temperature-resistant rubber material;
the sleeve is sleeved outside the temperature sensing unit, the flexible diaphragm is adhered to the upper surface of the sleeve, and when the external pressure changes in a working state, the flexible diaphragm deforms to change the distance between the opening resonance ring I on the diaphragm and the dielectric ceramic material below the opening resonance ring I, so that the resonance frequency of the opening resonance ring I correspondingly changes, and the pressure is sensed.
Further, when the temperature T changes, the resonant frequency of the temperature sensing unit and the resonant frequency of the pressure sensing unit both change; when the pressure P changes, only the resonance frequency of the pressure induction unit changes;
fT=c1·T+c2
fP=c3·T+c4·P+c5
by controlling temperature and pressureCalibrating and determining each coefficient in the above formula to realize simultaneous measurement of temperature and pressure, wherein fTAnd fPThe resonant frequencies of the temperature sensing unit and the pressure sensing unit are respectively.
Further, the size of the split resonance ring is the same as that of the split resonance ring I, but the resonance frequency is different due to the difference of surrounding media.
Further, the sleeve is slightly higher than the height of the temperature sensing unit.
A preparation method of a passive wireless temperature and pressure integrated sensor based on LC resonance comprises the following steps:
manufacturing an open resonant ring by adopting mechanical stamping or laser cutting;
manufacturing a temperature sensing unit: adopting a spark plasma sintering technology, firstly pouring a proper amount of ceramic powder into a grinding tool and compacting, then horizontally placing an open resonant ring at a central position, then pouring an equal amount of ceramic powder, and sintering and molding at high temperature and high pressure;
manufacturing a pressure induction unit: sticking the split resonant ring I on the flexible membrane by using high-temperature glue, coating the high-temperature glue on the upper surface of the sleeve, tensioning and sticking the flexible membrane on the sleeve, wherein the split resonant ring I faces downwards and is positioned at the central position of the sleeve, and cutting off redundant flexible membrane;
the pressure intensity sensing unit is sleeved outside the temperature sensing unit.
Due to the adoption of the technical scheme, the passive wireless temperature and pressure integrated sensor based on LC resonance provided by the invention comprises a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping a split resonant ring by dielectric ceramic materials. The pressure sensing unit consists of a sleeve, a flexible diaphragm adhered to the upper surface of the sleeve and an opening resonant ring I adhered to the center of the diaphragm. The sleeve is sleeved outside the ceramic substrate to form the temperature and pressure integrated sensor. The sensor is calibrated at different temperatures and pressures, so that the temperature and the pressure can be simultaneously monitored; the sensor of the invention has a very simple structure and is easy to realize low-cost manufacture.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a split resonant ring and its equivalent LC circuit diagram;
FIG. 2 is a schematic diagram of a passive wireless temperature and pressure integrated sensor based on LC resonance;
fig. 3 is a schematic diagram of electromagnetic inductive coupling of the sensor shown in fig. 2 during measurement.
In the figure: 1. split ring resonator, 2, dielectric ceramic material, 3, sleeve, 4, split ring resonator I, 5, flexible diaphragm.
Detailed Description
In order to make the technical solutions and advantages of the present invention clearer, the following describes the technical solutions in the embodiments of the present invention clearly and completely with reference to the drawings in the embodiments of the present invention:
a passive wireless temperature and pressure integrated sensor based on LC resonance as shown in fig. 1 and 2 comprises two parts, namely a temperature sensing unit and a pressure sensing unit.
The temperature sensing unit is composed of a dielectric ceramic material 2 and an opening resonant ring 1 wrapped by the dielectric ceramic material. The dielectric ceramic material 2 has a dielectric constant linearly changing with temperature, such as alumina, barium titanate, etc. The opening resonance ring 1 is made of metal materials such as aluminum and copper, the diameter of the opening resonance ring is 6-8 mm, and the width of the opening resonance ring is 1-1.5 mm. The split ring resonator 1 can be equivalent to an LC resonance circuit with a resonance frequency ofWhere the inductance L is determined by the size of the loop and the capacitance C is determined by the size of the opening and the dielectric constant of the substrate material. When the temperature changes, the dielectric constant of the matrix material will occurThe change causes the resonance frequency of the split resonant ring 1 to shift correspondingly, thereby realizing the temperature induction.
The pressure sensing unit consists of a flexible diaphragm 5 and another split resonant ring I4 adhered to the center of the flexible diaphragm. The flexible membrane 5 is made of high-temperature resistant rubber materials, such as fluororubber, silicon rubber and the like. The split resonant ring I4 is the same as the temperature sensing unit.
The temperature sensing unit and the pressure sensing unit are combined into an integrated sensor through the sleeve 3, the diameter of the sleeve 3 is 2-3 cm, the height of the sleeve is 5-8 mm, the sleeve 3 sleeved outside the temperature sensor is 1-1.5 mm higher than the temperature sensing unit, and the flexible diaphragm 5 is adhered to the upper surface of the sleeve 3. When the external pressure changes, the flexible diaphragm 5 deforms, so that the distance between the open resonant ring I4 on the flexible diaphragm 5 and the dielectric material below the open resonant ring I4 changes, the resonant frequency of the open resonant ring I4 changes correspondingly, and the pressure is sensed.
As shown in fig. 3, the two split resonant rings of the temperature sensing unit and the pressure sensing unit have the same size, but have different resonant frequencies due to the difference of surrounding media. The two resonant frequencies can be read by the network analyzer through electromagnetic coupling between the antenna and the two split resonant rings. When the temperature T changes, the resonant frequency of the temperature sensing part and the resonant frequency of the pressure sensing part both change; when the pressure P changes, only the resonance frequency of the pressure sensitive part changes.
fT=c1·T+c2
fP=c3·T+c4·P+c5
By calibrating the temperature and the pressure, each coefficient in the above formula can be determined, and the temperature and the pressure can be measured simultaneously.
A preparation method of a passive wireless temperature and pressure integrated sensor based on LC resonance comprises the following steps:
(1) and manufacturing an open resonant ring. Mechanical stamping or laser cutting processes can be used.
(2) And manufacturing a temperature sensing part. By adopting a spark plasma sintering technology, firstly, a proper amount of ceramic powder is poured into a grinding tool and slightly compacted, then the open resonant ring 1 is horizontally placed at the central position, and then the same amount of ceramic powder is poured into the open resonant ring, and the open resonant ring is sintered and molded under high temperature and high pressure.
(3) And manufacturing a pressure induction part. The split resonant ring I4 is adhered to the rubber film 5 by high-temperature glue, the upper surface of the sleeve 3 is coated with the high-temperature glue, the flexible diaphragm 5 is tightly adhered to the sleeve 3 (the split resonant ring I4 faces downwards and is located at the center of the sleeve), and then the redundant flexible diaphragm 5 is cut off.
(4) And combining into an integrated sensor. The pressure sensing unit is sleeved outside the temperature sensor.
Example 1:
the passive wireless temperature and pressure integrated sensor of the embodiment comprises a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping an open resonant ring 1 by alumina ceramic. The diameter of the split ring resonator 1 is 6mm, the split width is 1mm, and the material is copper. The pressure sensing unit consists of a sleeve 3, a flexible diaphragm 5 adhered to the upper surface of the sleeve 3 and an open resonant ring I4 adhered to the center of the flexible diaphragm 5, wherein the flexible diaphragm 5 is made of silicon rubber. The sleeve 3 has a diameter of 2cm and a height of 5 mm. The sleeve 3 is sleeved outside the alumina ceramic to form the temperature and pressure integrated sensor. The height of the sleeve 3 is 1mm higher than that of the alumina ceramics.
Example 2
The passive wireless temperature and pressure integrated sensor of the embodiment comprises a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping a split resonant ring 1 by barium titanate ceramic. The diameter of the split ring resonator 1 is 6mm, the split width is 1mm, and the material is aluminum. The pressure sensing unit consists of a sleeve 3, a flexible diaphragm 5 adhered to the upper surface of the sleeve 3 and an open resonant ring I4 adhered to the center of the flexible diaphragm 5, wherein the flexible diaphragm 5 is made of fluororubber. The sleeve 3 has a diameter of 2cm and a height of 5 mm. The sleeve 3 is sleeved outside the barium titanate ceramic to form the temperature and pressure integrated sensor. The height of the sleeve 3 is 1mm higher than that of the barium titanate ceramic.
Example 3:
the passive wireless temperature and pressure integrated sensor of the embodiment comprises a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping an open resonant ring 1 by alumina ceramic. The diameter of the split ring resonator 1 is 8mm, the split width is 1.2mm, and the material is copper. The pressure sensing unit consists of a sleeve 3, a flexible diaphragm 5 adhered to the upper surface of the sleeve 3 and an opening resonant ring I4 adhered to the center of the diaphragm, wherein the flexible diaphragm 5 is made of silicon rubber. The sleeve 3 has a diameter of 3cm and a height of 8 mm. The sleeve 3 is sleeved outside the alumina ceramic to form the temperature and pressure integrated sensor. The height of the sleeve 3 is 1.5mm higher than that of the alumina ceramics.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (4)
1. A passive wireless temperature, pressure integrated sensor based on LC resonance, characterized by comprising: a temperature sensing unit for sensing temperature and a pressure sensing unit for sensing pressure;
the temperature sensing unit comprises an open resonant ring (1), the outside of the open resonant ring (1) is wrapped with a dielectric ceramic material (2), and the dielectric ceramic material (2) has a dielectric constant which linearly changes with temperature;
the pressure sensing unit comprises an opening resonance ring I (4) and a flexible diaphragm (5), the opening resonance ring I (4) is adhered to the center of the flexible diaphragm (5), and the flexible diaphragm (5) is made of high-temperature-resistant rubber materials;
the temperature sensing unit and the pressure sensing unit are connected through a sleeve (3) to form an integrated sensor; the sleeve (3) is sleeved outside the temperature sensing unit, the flexible diaphragm (5) is adhered to the upper surface of the sleeve (3), and when the external pressure changes in a working state, the flexible diaphragm (5) deforms to change the distance between the opening resonance ring I (4) on the diaphragm and the dielectric ceramic material (2) below the opening resonance ring I (4), so that the resonance frequency of the opening resonance ring I (4) changes correspondingly to realize the pressure sensing;
when the temperature T changes, the resonant frequency of the temperature sensing unit and the resonant frequency of the pressure sensing unit both change; when the pressure P changes, only the resonance frequency of the pressure induction unit changes;
fT=c1·T+c2
fP=c3·T+c4·P+c5
and calibrating the temperature and the pressure to determine each coefficient in the formula, so as to realize simultaneous measurement of the temperature and the pressure, wherein fT and fP are the resonance frequencies of the temperature sensing unit and the pressure sensing unit respectively.
2. The integrated sensor of claim 1, further characterized by: the size of the split resonance ring (1) is the same as that of the split resonance ring I (4), but the resonance frequency is different due to the difference of surrounding media.
3. The integrated sensor of claim 1, further characterized by: the sleeve (3) is slightly higher than the height of the temperature sensing unit.
4. A method of manufacturing an integrated sensor according to any of claims 1 to 3, wherein: the method comprises the following steps:
the method comprises the following steps: manufacturing an open resonant ring by adopting mechanical stamping or laser cutting;
step two: manufacturing a temperature sensing unit, specifically: adopting a spark plasma sintering technology, firstly pouring a proper amount of ceramic powder into a grinding tool and compacting, then horizontally placing an open resonant ring at a central position, then pouring an equal amount of ceramic powder, and sintering and molding at high temperature and high pressure;
step three: manufacturing a pressure induction unit, specifically: sticking the split resonant ring I (4) on the flexible membrane (5) by using high-temperature glue, coating the high-temperature glue on the upper surface of the sleeve (3), tensioning and sticking the flexible membrane (5) on the sleeve (3), wherein the split resonant ring I (4) is downward and positioned at the central position of the sleeve (3), and cutting off the redundant flexible membrane (5);
step four: the pressure intensity sensing unit is sleeved outside the temperature sensing unit.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4025912A (en) * | 1976-07-19 | 1977-05-24 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for remotely transducing and transmitting pressure and temperature changes |
US5339051A (en) * | 1991-12-09 | 1994-08-16 | Sandia Corporation | Micro-machined resonator oscillator |
CN1947302A (en) * | 2004-04-26 | 2007-04-11 | 传感技术有限公司 | Split-ring coupler incorporating dual resonant sensors |
CN103698060A (en) * | 2013-12-25 | 2014-04-02 | 中北大学 | Wireless passive high-temperature pressure sensor with temperature compensation and temperature compensation algorithm thereof |
CN104064840A (en) * | 2014-07-09 | 2014-09-24 | 南京师范大学 | Miniaturization band elimination type frequency selective surface |
CN109728441A (en) * | 2018-12-20 | 2019-05-07 | 西安电子科技大学 | A kind of restructural universal Meta Materials |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7863907B2 (en) * | 2007-02-06 | 2011-01-04 | Chevron U.S.A. Inc. | Temperature and pressure transducer |
JP5715951B2 (en) * | 2008-09-02 | 2015-05-13 | クリスチャン エム パットリッツ コンサルティング エルエルシーChristian M. Puttlitz Consulting, LLC | Bio MEMS sensor and apparatus and method thereof |
US9823209B2 (en) * | 2010-10-05 | 2017-11-21 | Anpac Bio-Medical Science Co., Ltd. | Micro-devices for disease detection |
US9712894B2 (en) * | 2014-04-29 | 2017-07-18 | General Electric Company | Passive wireless sensors |
JP2017534873A (en) * | 2014-10-30 | 2017-11-24 | スリーエム イノベイティブ プロパティズ カンパニー | Capacitive temperature detection of electrical conductors |
CN206422238U (en) * | 2016-12-28 | 2017-08-18 | 华南理工大学 | A kind of three frequency filter antennas with high-frequency selectivity |
EP3566035B1 (en) * | 2017-01-06 | 2022-03-09 | Florida State University Research Foundation, Inc. | Temperature and pressure sensors and methods |
CN109616724B (en) * | 2018-12-11 | 2019-11-08 | 四川众为创通科技有限公司 | Miniaturization frequency-selective surfaces based on dual openings resonant ring |
-
2020
- 2020-02-13 CN CN202010090844.5A patent/CN111289169B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4025912A (en) * | 1976-07-19 | 1977-05-24 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for remotely transducing and transmitting pressure and temperature changes |
US5339051A (en) * | 1991-12-09 | 1994-08-16 | Sandia Corporation | Micro-machined resonator oscillator |
CN1947302A (en) * | 2004-04-26 | 2007-04-11 | 传感技术有限公司 | Split-ring coupler incorporating dual resonant sensors |
CN103698060A (en) * | 2013-12-25 | 2014-04-02 | 中北大学 | Wireless passive high-temperature pressure sensor with temperature compensation and temperature compensation algorithm thereof |
CN104064840A (en) * | 2014-07-09 | 2014-09-24 | 南京师范大学 | Miniaturization band elimination type frequency selective surface |
CN109728441A (en) * | 2018-12-20 | 2019-05-07 | 西安电子科技大学 | A kind of restructural universal Meta Materials |
Non-Patent Citations (2)
Title |
---|
Robust and sensitive frost and ice detection via planar microwave resonator sensor;Benjamin Wiltshire 等;《Sensors and Actuators B: Chemical》;20191231;第301卷;第126881页 * |
基于开口环谐振器超材料的薄膜型微波传感器的设计与研究;卢凤翔;《中国优秀硕士学位论文全文数据库工程科技Ⅰ辑》;20190915(第9期);第B014-1031页 * |
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