CN111261528A - Antenna packaging structure and packaging method - Google Patents
Antenna packaging structure and packaging method Download PDFInfo
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- CN111261528A CN111261528A CN201811464600.8A CN201811464600A CN111261528A CN 111261528 A CN111261528 A CN 111261528A CN 201811464600 A CN201811464600 A CN 201811464600A CN 111261528 A CN111261528 A CN 111261528A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention provides an antenna packaging structure and a packaging method, wherein the antenna packaging method can form stacked antenna packages with a multilayer antenna structure, and has high efficiency and high integration; forming a first antenna structure positioned at a lower layer and a second antenna structure positioned on the first antenna structure on the second surface of the rewiring layer, forming a cavity for coating the first antenna metal main body layer through an antenna supporting cover positioned in the first antenna structure, and reducing the attenuation and loss of electromagnetic waves of the first antenna metal main body layer; therefore, the attenuation and loss of electromagnetic waves in the antenna packaging structure are reduced on the premise of not reducing the effective area of the antenna metal layer.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and relates to an antenna packaging structure and an antenna packaging method.
Background
With the popularization of high-tech electronic products and the increase of the demands of people, especially for matching with the demands of movement, most of high-tech electronic products have increased wireless communication functions.
Generally, the conventional antenna structure usually has the antenna directly fabricated on the surface of the circuit board, which causes the antenna to occupy additional area of the circuit board and has poor integration. For various high-tech electronic products, if the antenna is directly fabricated on the surface of the circuit board, a circuit board with a larger volume is required, so that the high-tech electronic products also occupy a larger volume, which is contrary to the requirements of people for miniaturization and convenience of the high-tech electronic products.
With the rapid development of communication information, 5G (5th Generation), i.e., fifth Generation mobile communication, has become a major research point. In a 5G high-frequency antenna, since the frequency of electromagnetic waves of the antenna is very high, the communication wavelength is in the millimeter level (millimeter wave), the size of the antenna is also reduced to several millimeters, the propagation attenuation of high-frequency electromagnetic waves is also large, and particularly in the aspect of antenna packaging, the selection of antenna packaging materials is particularly important because the antenna packaging materials cause the attenuation and loss of the frequency of the electromagnetic waves of the antenna. In order to reduce the attenuation and loss of the electromagnetic wave of the high-frequency antenna, a novel antenna packaging structure and a novel packaging method are developed, and it is particularly important to reduce the attenuation and loss of the electromagnetic wave of the antenna.
Therefore, there is a need for a novel antenna package structure and a novel antenna package method for reducing the attenuation and loss of electromagnetic waves in the antenna package material.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides an antenna package structure and a packaging method, which are used to solve the problems of attenuation and loss of electromagnetic waves in the packaging material of the prior art antenna.
To achieve the above and other related objects, the present invention provides an antenna packaging method, including the steps of:
providing a support substrate, and forming a separation layer on the support substrate;
forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface and an opposite second surface, and the first surface is in contact with the separation layer;
forming a first metal connecting column on the second surface of the rewiring layer, wherein the first metal connecting column is electrically connected with the rewiring layer;
covering the first metal connecting column and the second surface of the rewiring layer by using a first packaging layer, wherein the first metal connecting column is exposed on the top surface of the first packaging layer;
forming a first antenna metal layer on the surface of the first packaging layer, wherein the first antenna metal layer is electrically connected with the first metal connecting column; the first antenna metal layer comprises a first antenna metal body layer;
forming an antenna support cover on the first antenna metal body layer, wherein the antenna support cover comprises an antenna support cover bottom, an antenna support cover side wall which is formed by extending outwards from the antenna support cover bottom and surrounds the edge of the antenna support cover bottom, and an antenna support cover cavity formed by the antenna support cover bottom and the antenna support cover side wall; forming a cavity for coating the first antenna metal main body layer through the antenna support cover cavity;
forming a second metal connecting column on the first antenna metal layer, wherein the horizontal plane of the top surface of the second metal connecting column protrudes out of the horizontal plane of the top surface of the cavity;
covering the second metal connecting column and the first antenna metal layer by using a second packaging layer, wherein the second metal connecting column is exposed on the top surface of the second packaging layer; the second packaging layer coats the side wall of the antenna support cover;
forming a second antenna metal layer on the surface of the second packaging layer, wherein the second antenna metal layer is electrically connected with the second metal connecting column;
removing the separation layer and the support substrate;
forming a metal bump on the first surface of the rewiring layer; and
providing a semiconductor chip, and bonding the semiconductor chip on the first surface of the rewiring layer.
Optionally, the second surface of the redistribution layer includes N layers of antenna structures, where N ≧ 3.
Optionally, the second antenna metal layer includes a second antenna metal body layer, and the second antenna metal body layer is located above the antenna support cover.
Optionally, the top surface of the second encapsulation layer exposes the bottom of the antenna support cover.
Optionally, the top surface of the second encapsulation layer covers the bottom of the antenna support cover.
Optionally, the antenna support cover includes one or a combination of a glass antenna support cover, a semiconductor antenna support cover, a metal antenna support cover, an epoxy antenna support cover, and a ceramic antenna support cover.
Optionally, the method for forming the first metal connection post and the second metal connection post includes one or a combination of wire bonding, electroplating and chemical plating.
Optionally, the method further includes the step of filling an underfill layer between the semiconductor chip and the first surface of the re-wiring layer, where the underfill layer includes an epoxy layer.
Optionally, the support substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
Optionally, the rewiring layer includes a dielectric layer and a metal wiring layer, and the dielectric layer is made of one or a combination of more than two of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass; the material of the metal wiring layer comprises one of copper, aluminum, nickel, gold, silver and titanium.
Optionally, the first metal connecting column and the second metal connecting column include one or a combination of a gold wire, a silver wire, a copper wire and an aluminum wire; the first metal connecting column and the second metal connecting column further comprise one or a combination of a gold column, a silver column, a copper column and an aluminum column.
Optionally, the material of the first encapsulation layer includes one or a combination of polyimide, silica gel, and epoxy resin; the material of the second packaging layer comprises one or a combination of polyimide, silica gel and epoxy resin.
Optionally, the material of the metal bump includes one or a combination of tin solder, silver solder and gold-tin alloy solder.
The invention also provides an antenna packaging structure, which comprises:
a rewiring layer including a first side and an opposing second side;
a first metal connection post formed on a second side of the rewiring layer and electrically connected to the rewiring layer;
the first packaging layer covers the first metal connecting column and the second surface of the rewiring layer, and the first metal connecting column is exposed on the top surface of the first packaging layer;
a first antenna metal layer formed on the first package layer, the first antenna metal layer being electrically connected to the first metal connection stud, the first antenna metal layer comprising a first antenna metal body layer;
an antenna support cover comprising an antenna support cover bottom, antenna support cover sidewalls extending outwardly from the antenna support cover bottom surrounding the edges of the antenna support cover bottom, and an antenna support cover cavity formed by the antenna support cover bottom and the antenna support cover sidewalls; the side wall of the antenna supporting cover is formed on the first antenna metal layer, and a cavity for coating the first antenna metal main body layer is formed through the cavity of the antenna supporting cover;
a second metal connection post formed on the first antenna metal layer, wherein the horizontal surface of the top surface of the second metal connection post protrudes out of the horizontal surface of the top surface of the cavity;
the second packaging layer covers the second metal connecting column and the first antenna metal layer, and the top surface of the second packaging layer exposes the second metal connecting column; the second packaging layer coats the side wall of the antenna support cover;
the second antenna metal layer is formed on the surface of the first packaging layer and is electrically connected with the second metal connecting column;
a metal bump formed on a first surface of the rewiring layer; and
and a semiconductor chip bonded on the first surface of the re-wiring layer.
Optionally, the second surface of the redistribution layer includes N layers of antenna structures, where N ≧ 3.
Optionally, the second antenna metal layer includes a second antenna metal body layer, and the second antenna metal body layer is located above the antenna support cover.
Optionally, the top surface of the second encapsulation layer exposes the bottom of the antenna support cover.
Optionally, the top surface of the second encapsulation layer covers the bottom of the antenna support cover.
Optionally, the antenna support cover includes one or a combination of a glass antenna support cover, a semiconductor antenna support cover, a metal antenna support cover, an epoxy antenna support cover, and a ceramic antenna support cover.
Optionally, an underfill layer is further included between the semiconductor chip and the first side of the redistribution layer, and the underfill layer includes an epoxy layer.
Optionally, the rewiring layer includes a dielectric layer and a metal wiring layer, and the dielectric layer includes one or a combination of more than two of an epoxy resin layer, a silica gel layer, a PI layer, a PBO layer, a BCB layer, a silicon oxide layer, a phosphosilicate glass layer and a fluorine-containing glass layer; the metal wiring layer comprises one or the combination of more than two of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.
Optionally, the first metal connecting column and the second metal connecting column include one or a combination of a gold wire, a silver wire, a copper wire and an aluminum wire; the first metal connecting column and the second metal connecting column further comprise one or a combination of a gold column, a silver column, a copper column and an aluminum column.
Optionally, the bottom of the first metal connecting column and the bottom of the second metal connecting column are further connected with metal connecting blocks, the cross-sectional areas of which are respectively larger than those of the first metal connecting column and the second metal connecting column.
Optionally, the first encapsulation layer includes one or a combination of a polyimide layer, a silicone layer, and an epoxy resin layer; the second packaging layer comprises one or a combination of a polyimide layer, a silica gel layer and an epoxy resin layer.
Optionally, the metal bump includes one or a combination of a tin metal bump, a silver metal bump, and a gold-tin alloy metal bump.
As described above, the antenna package structure and the antenna package method of the present invention can form an antenna package with a stacked antenna structure, and have high efficiency and high integration; the cavity for coating the first antenna metal main body layer is formed through the antenna supporting cover, so that the attenuation and loss of electromagnetic waves of the first antenna metal main body layer can be reduced, and the effective area of the second antenna metal layer can be reduced when the second antenna metal layer positioned on the upper layer is formed through the support of the antenna supporting cover; therefore, the attenuation and loss of electromagnetic waves in the antenna packaging structure are reduced on the premise of not reducing the effective area of the antenna metal layer.
Drawings
Fig. 1 is a flow chart illustrating an antenna packaging method according to the present invention.
Fig. 2 to 16 are schematic structural diagrams of steps of an antenna packaging method according to the first embodiment, wherein fig. 16 is a schematic structural diagram of an antenna packaging structure according to the first embodiment.
Fig. 17 is a schematic structural diagram of another antenna package structure in the second embodiment.
Description of the element reference numerals
101 supporting substrate
102 separating layers
103 rewiring layer
113 dielectric layer
123 metal wiring layer
104 first antenna structure
114 first metal connecting block
124 first metal connection post
134 first encapsulation layer
144 first antenna metal layer
154 first antenna metal body layer
164 adhesive
174 antenna support cover
184 cavity
105 second antenna structure
115 second metal connecting block
125 second metal connecting column
135 second encapsulation layer
145 second antenna metal layer
155 second antenna metal body layer
106 metal bump
107 semiconductor chip
108 underfill layer
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 17. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Example one
Referring to fig. 1, the present embodiment provides an antenna packaging method, which can form an antenna package with a stacked antenna structure, and has high efficiency and high integration; the cavity for coating the first antenna metal main body layer is formed through the antenna supporting cover, so that the attenuation and loss of electromagnetic waves of the first antenna metal main body layer can be reduced, and the effective area of the second antenna metal layer can be reduced when the second antenna metal layer positioned on the upper layer is formed through the support of the antenna supporting cover; therefore, the attenuation and loss of electromagnetic waves in the antenna packaging structure are reduced on the premise of not reducing the effective area of the antenna metal layer.
Specifically, as shown in fig. 2 to fig. 16, schematic structural diagrams presented in each step of the antenna packaging method in this embodiment are illustrated.
As shown in fig. 2, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101.
As a further example of this embodiment, the supporting substrate 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate, and the separation layer 102 includes an LTHC photothermal conversion layer.
Specifically, the supporting substrate 101 is preferably a glass substrate, and the separation layer 102 is preferably an LTHC light-to-heat conversion layer. The glass substrate is low in cost, the LTHC light-heat conversion layer is easy to form on the surface of the glass substrate, and the difficulty of a subsequent separation process of the LTHC light-heat conversion layer can be reduced, for example, the LTHC light-heat conversion layer is heated based on laser so that the LTHC light-heat conversion layer is separated from the LTHC light-heat conversion layer.
As shown in fig. 3, a redistribution layer 103 is formed on the separation layer 102, and the redistribution layer 103 includes a first surface in contact with the separation layer 102 and an opposite second surface.
As a further embodiment of this embodiment, the redistribution layer 103 includes a dielectric layer 113 and a metal routing layer 123, and the material of the dielectric layer 113 includes one or a combination of two or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass; the material of the metal wiring layer 123 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.
Specifically, the manufacturing of the redistribution layer 103 includes the following steps: forming the dielectric layer 113 on the surface of the separation layer 102 by adopting a physical vapor deposition process or a chemical vapor deposition process, and etching the dielectric layer 113 to form the patterned dielectric layer 113; and forming the metal wiring layer 123 on the surface of the patterned dielectric layer 113 by adopting a physical vapor deposition process, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or a chemical plating process, and etching the metal wiring layer 123 to form the patterned metal wiring layer 123. The material, the number of layers and the distribution morphology of the dielectric layer 113 and the metal wiring layer 123 may be selected according to specific needs, and are not limited herein.
As shown in fig. 4 to fig. 13, a stacked 2-layer antenna structure is formed on the second surface of the redistribution layer 103, including a first antenna structure 104 and a second antenna structure 105 located on the first antenna structure 104.
As shown in fig. 4 to 9, schematic structural diagrams of steps of forming the first antenna structure 104 are illustrated.
As shown in fig. 4, a first metal connection stud 124 is formed on a second side of the redistribution layer 103, the first metal connection stud 124 being electrically connected to the redistribution layer 103.
Specifically, in this embodiment, the bottom of the first metal connection pillar 124 may further include a first metal connection pad 114 having a cross-sectional area larger than that of the first metal connection pillar 124, so as to increase a contact area between the first metal connection pillar 124 and the metal wiring layer 123, thereby improving electrical stability.
As a further embodiment of this embodiment, the first metal connecting pillar 124 includes one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column can also comprise one or a combination of a gold column, a silver column, a copper column and an aluminum column; the method of forming the first metal connection post 124 includes one or a combination of wire bonding, electroplating and electroless plating.
Specifically, the first metal connecting pillar 124 may be made of a copper wire by using a wire bonding process, such as one or a combination of a thermocompression bonding process, an ultrasonic bonding process, and a thermocompression ultrasonic bonding process, and the type and the making method of the first metal connecting pillar 124 may also be selected according to the requirement, which is not limited herein.
As shown in fig. 5-6, the first metal connection stud 124 and the second side of the redistribution layer 103 are covered by a first encapsulation layer 134, and the first metal connection stud 124 is exposed from the top surface of the first encapsulation layer 134.
As a further embodiment of this embodiment, the material of the first encapsulation layer 134 includes one or a combination of polyimide, silicone, and epoxy; the method of forming the first encapsulation layer 134 includes one of compression molding, transfer molding, liquid encapsulation molding, vacuum lamination, and spin coating.
Specifically, as shown in fig. 6, after the first encapsulation layer 134 is formed, a grinding or polishing method may be used to act on the upper surface of the first encapsulation layer 134 to provide a flat first encapsulation layer 134, so as to improve the product quality.
As shown in fig. 7, a first antenna metal layer 144 is formed on the surface of the first package layer 134, the first antenna metal layer 144 is electrically connected to the first metal connection stud 124, and the first antenna metal layer 144 includes a first antenna metal body layer 154.
As a further embodiment of the embodiment, the method for forming the first antenna metal layer 144 includes one of a physical vapor deposition process, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process, or an electroless plating process.
Specifically, the first antenna metal layer 144 is formed on the upper surface of the first package layer 134, and then the first antenna metal layer 144 with a desired pattern is formed by using an etching process, including the first antenna metal body layer 154.
As shown in fig. 8-9, an antenna supporting cover 174 is formed on the first antenna metal body layer 154, wherein the antenna supporting cover 174 includes an antenna supporting cover bottom, an antenna supporting cover sidewall extending outward from the antenna supporting cover bottom and surrounding the edge of the antenna supporting cover bottom, and an antenna supporting cover cavity formed by the antenna supporting cover bottom and the antenna supporting cover sidewall; a cavity 184 is formed through the antenna support cap cavity that encapsulates the first antenna metal body layer 154, thereby forming the first antenna structure 104 including the first metal connection stud 124, the first encapsulation layer 134, the first antenna metal layer 144, and the antenna support cap 174.
As a further embodiment of this embodiment, the antenna support cover 174 includes one or a combination of a glass antenna support cover, a semiconductor antenna support cover, a metal antenna support cover, an epoxy antenna support cover, and a ceramic antenna support cover.
Specifically, the method for forming the antenna support cover 174 on the first antenna metal layer 144 includes one or a combination of a method for adhering the adhesive 164 by using an adhesive tape, or a method for soldering the adhesive 164 by using a metal solder. The horizontal cross-sectional shape of the antenna support cover 174 is not limited herein and may be selected according to the shape of the first sub-antenna metal 154, including regular polygon, rectangle, circle, ellipse, etc. The cavity 184 is formed through the antenna support cap 174 to encapsulate the first antenna metal body layer 154, thereby reducing attenuation and loss of the first antenna metal body layer 154.
As shown in fig. 10 to 13, the structure diagrams of the steps of the second antenna structure 105 are illustrated.
As shown in fig. 10, a second metal connection pillar 125 is formed on the first antenna metal layer 144, and the horizontal surface of the top surface of the second metal connection pillar 125 protrudes from the horizontal surface of the top surface of the cavity 184.
Specifically, in this embodiment, the bottom of the second metal connection pillar 125 may further include a second metal connection block 115 having a cross-sectional area larger than that of the second metal connection pillar 125, so as to increase a contact area between the second metal connection pillar 125 and the first antenna metal layer 144, thereby improving electrical stability. The kind and manufacturing method of the second metal connecting pillar 125 are the same as those of the first metal connecting pillar 124, and are not described herein again. The horizontal plane of the top surface of the second metal connecting column 125 may protrude from, be equal to, or be lower than the horizontal plane of the bottom of the antenna supporting cover, and may be selected according to specific needs.
As shown in fig. 11 to 12, a second packaging layer 135 is used to cover the second metal connection pillar 125 and the first antenna metal layer 144, and the top surface of the second packaging layer 135 exposes the second metal connection pillar 125; the second encapsulant layer 135 encapsulates the antenna support cap sidewalls.
Specifically, the kind and the preparation method of the second encapsulation layer 135 are the same as those of the first encapsulation layer 134, and are not described herein again. As shown in fig. 12, after the second encapsulation layer 135 is formed, a grinding or polishing method may be used to act on the upper surface of the second encapsulation layer 135 to provide a flat second encapsulation layer 135, thereby improving the product quality.
As a further embodiment of this embodiment, the top surface of the second encapsulation layer 135 exposes the antenna support cover bottom or the top surface of the second encapsulation layer 135 covers the antenna support cover bottom.
Specifically, in this embodiment, the top surface of the second encapsulation layer 135 is exposed to the top surface of the second metal connection pillar 125, and the bottom of the antenna support cover is exposed at the same time, in another embodiment, the top surface of the second encapsulation layer 135 may also cover the bottom of the antenna support cover, and only the second metal connection pillar 125 is exposed, which is not limited herein.
As shown in fig. 13, a second antenna metal layer 145 is formed on the surface of the second packaging layer 135, and the second antenna metal layer 145 is electrically connected to the second metal connection stud 125, so as to form the second antenna structure 105 including the second metal connection stud 125, the second packaging layer 135 and the second antenna metal layer 145.
As a further embodiment of this embodiment, the second antenna metal layer 145 includes a second antenna metal body layer 155, and the second antenna metal body layer 155 is located above the antenna support cover 174.
Specifically, the method for forming the second antenna metal layer 145 is the same as the first antenna metal layer 144, and details are not repeated here. The second antenna metal body layer 155 includes one or a combination of a surface contacting the second packaging layer 135 and a bottom contacting the antenna support cover, depending on whether the antenna support cover 174 is exposed from the surface of the second packaging layer 135, and is not limited herein. By the support of the antenna support cover 174, the second antenna metal body layer 155 can be formed above the antenna support cover 174 without reducing the effective area of the second antenna metal layer 145 when the second antenna metal layer 145 located on the upper layer is formed.
As a further embodiment of this embodiment, the second surface of the redistribution layer 103 may include N layers of antenna structures, where N ≧ 3, so as to further improve the integration level and the integration performance of the antenna package structure.
Specifically, in this embodiment, N is 2, that is, the first antenna structure 104 and the second antenna structure 105 are stacked, and in another embodiment, the second surface of the redistribution layer 103 may also include N ≧ 3 stacked antenna structures, such as 4 layers, 5 layers, and the like, which is not limited herein.
As shown in fig. 14, the separation layer 102 and the supporting substrate 101 are removed, and the first surface of the rewiring layer 103 is exposed.
Specifically, the LTHC light-to-heat conversion layer may be heated based on laser light to separate the redistribution layer 103 and the LTHC light-to-heat conversion layer.
As shown in fig. 15, a metal bump 106 is formed on the first surface of the redistribution layer 103.
As a further embodiment of this embodiment, the material of the metal bump 106 includes one or a combination of tin solder, silver solder and gold-tin alloy solder.
As shown in fig. 16, a semiconductor chip 107 is provided, and the semiconductor chip 107 is bonded on the first face of the re-wiring layer 103.
Specifically, the metal bumps 106 and the semiconductor chips 107 are electrically connected to the metal wiring layer 123, and the type, number and distribution of the semiconductor chips 107 can be selected according to specific needs. The order of bonding the metal bump 106 and the semiconductor chip 107 on the first surface of the redistribution layer 103 may also be selected according to specific needs, and is not limited herein, and it is preferable to bond the metal bump 106 in advance, so as to reduce the contamination to the semiconductor chip 107 and improve the product quality.
As a further embodiment of this embodiment, the method further includes the step of filling an underfill layer 108 between the semiconductor chip 107 and the first surface of the redistribution layer 103 to improve the bonding strength between the semiconductor chip 107 and the redistribution layer 103 and protect the redistribution layer 103 and the semiconductor chip 107, where the underfill layer 108 includes an epoxy resin layer.
Example two
As shown in fig. 16 to 17, this embodiment illustrates a schematic structural diagram of an antenna package structure in the present invention, where the package structure includes:
a rewiring layer 103, the rewiring layer 103 including a first side and an opposing second side;
a first metal connection stud 124 formed on a second side of the redistribution layer 103 in electrical connection with the redistribution layer 103;
a first encapsulation layer 134 covering the first metal connection stud 124 and the second side of the redistribution layer 103, and a top surface of the first encapsulation layer 134 exposing the first metal connection stud 124;
a first antenna metal layer 144 formed on the first package layer 134, the first antenna metal layer 144 electrically connected to the first metal connection stud 124, the first antenna metal layer 144 including a first antenna metal body layer 154;
an antenna support cover 174, the antenna support cover 174 comprising an antenna support cover bottom, antenna support cover sidewalls extending outwardly from the antenna support cover bottom surrounding the edges of the antenna support cover bottom, and an antenna support cover cavity formed by the antenna support cover bottom and the antenna support cover sidewalls; the antenna support cover sidewall is formed on the first antenna metal layer 144 and forms a cavity 184 for covering the first antenna metal body layer 154 through the antenna support cover cavity; thereby forming the first antenna structure 104 including the first metal connection stud 124, the first encapsulation layer 134, the first antenna metal layer 144, and the antenna support cap 174;
a second metal connection pillar 125 formed on the first antenna metal layer 144, wherein a horizontal surface of a top surface of the second metal connection pillar 125 protrudes above a horizontal surface of a top surface of the cavity 184;
a second encapsulation layer 135 covering the second metal connection pillar 125 and the first antenna metal layer 144, and the second metal connection pillar 125 is exposed from the top surface of the second encapsulation layer 135; the second encapsulation layer 135 wraps the antenna support cover sidewall;
a second antenna metal layer 145 formed on the surface of the first package layer 135, the second antenna metal layer 145 being electrically connected to the second metal connection stud 125; thereby forming the second antenna structure 105 including the second metal connection stud 125, the second encapsulation layer 135, and the second antenna metal layer 145;
a metal bump 106 formed on a first surface of the rewiring layer 103; and
and a semiconductor chip 107 bonded to the first surface of the rewiring layer 103.
The antenna package with the multilayer antenna structure can be formed in a stacked mode, and is high in efficiency and integration; the cavity for coating the first antenna metal main body layer is formed through the antenna supporting cover, so that the attenuation and loss of electromagnetic waves of the first antenna metal main body layer can be reduced, and the effective area of the second antenna metal layer can be reduced when the second antenna metal layer positioned on the upper layer is formed through the support of the antenna supporting cover; therefore, the attenuation and loss of electromagnetic waves in the antenna packaging structure are reduced on the premise of not reducing the effective area of the antenna metal layer.
As a further embodiment of this embodiment, the top surface of the second encapsulation layer 135 exposes the antenna support cover bottom or the top surface of the second encapsulation layer 135 covers the antenna support cover bottom.
Specifically, in this embodiment, the top surface of the second encapsulation layer 135 is exposed to the top surface of the second metal connection pillar 125, and the bottom of the antenna support cover is exposed at the same time, in another embodiment, the top surface of the second encapsulation layer 135 may also cover the bottom of the antenna support cover, and only the second metal connection pillar 125 is exposed, as shown in fig. 17, which is not limited herein.
As a further embodiment of this embodiment, the second antenna metal layer 145 includes a second antenna metal body layer 155, and the second antenna metal body layer 155 is located above the antenna support cover 174.
Specifically, the second antenna metal body layer 155 includes one or a combination of a surface of the second packaging layer 135 and a bottom of the antenna supporting cover, and is determined according to whether the surface of the second packaging layer 135 exposes the antenna supporting cover 174, which is not limited herein. By the support of the antenna support cover 174, the second antenna metal body layer 155 can be formed above the antenna support cover 174 without reducing the effective area of the second antenna metal layer 145 when the second antenna metal layer 145 located on the upper layer is formed.
As a further embodiment of this embodiment, the antenna support cover 174 includes one or a combination of a glass antenna support cover, a semiconductor antenna support cover, a metal antenna support cover, an epoxy antenna support cover, and a ceramic antenna support cover.
Specifically, the method for forming the antenna support cover 174 on the first antenna metal layer 144 includes one or a combination of a method for adhering the adhesive 164 by using an adhesive tape, or a method for soldering the adhesive 164 by using a metal solder. The horizontal cross-sectional shape of the antenna support cover 174 is not limited herein and may be selected according to the shape of the first sub-antenna metal 154, including regular polygon, rectangle, circle, ellipse, etc. The cavity 184 is formed through the antenna support cap 174 to encapsulate the first antenna metal body layer 154, thereby reducing attenuation and loss of the first antenna metal body layer 154.
As a further embodiment of this embodiment, the redistribution layer 103 includes a dielectric layer 113 and a metal routing layer 123, where the dielectric layer 113 includes one or a combination of two or more of an epoxy resin layer, a silica gel layer, a PI layer, a PBO layer, a BCB layer, a silicon oxide layer, a phosphosilicate glass layer, and a fluorine-containing glass layer; the metal wiring layer 123 includes one or a combination of two or more of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer, and a titanium layer.
As a further embodiment of this embodiment, the first metal connection post 124 and the second metal connection post 125 comprise one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting pillar 124 and the second metal connecting pillar 125 may further include one or a combination of a gold pillar, a silver pillar, a copper pillar, and an aluminum pillar.
As a further embodiment of this embodiment, the bottom portions of the first metal connecting column 124 and the second metal connecting column 125 are further connected with metal connecting blocks having cross-sectional areas larger than that of the first metal connecting column 124 and the second metal connecting column 125, respectively.
Specifically, the first metal connection block 114 located between the first metal connection post 124 and the metal wiring layer 123 and the second metal connection block 115 located between the second metal connection post 125 and the first antenna metal layer 144 increase the contact area and improve the electrical stability.
As a further embodiment of this embodiment, the first encapsulation layer 134 includes one or a combination of a polyimide layer, a silicone layer, and an epoxy layer; the second encapsulation layer 135 includes one or a combination of a polyimide layer, a silicone layer, and an epoxy layer.
As a further embodiment of this embodiment, the second surface of the redistribution layer 103 may include N layers of antenna structures, where N ≧ 3, so as to further improve the integration level and the integration performance of the antenna package structure.
Specifically, in this embodiment, N is 2, that is, the first antenna structure 104 and the second antenna structure 105 are stacked, and in another embodiment, the second surface of the redistribution layer 103 may also include N ≧ 3 stacked antenna structures, such as 4 layers, 5 layers, and the like, which is not limited herein.
As a further embodiment of this embodiment, the metal bump 106 includes one or a combination of a tin metal bump, a silver metal bump and a gold-tin alloy metal bump, and the metal bump 106 is electrically connected to the metal wiring layer 123.
As a further embodiment of this embodiment, an underfill layer 108 is further included between the semiconductor chip 107 and the first side of the redistribution layer 103, and the underfill layer 108 includes an epoxy resin layer to improve the bonding strength between the semiconductor chip 107 and the redistribution layer 103 and protect the redistribution layer 103 and the semiconductor chip 107. The semiconductor chips 107 are electrically connected to the metal wiring layer 123, and the type, number and distribution of the semiconductor chips 107 can be selected according to specific needs.
In summary, the antenna package structure and the antenna package method of the present invention can form an antenna package with a stacked antenna structure, and have high efficiency and high integration; the cavity for coating the first antenna metal main body layer is formed through the antenna supporting cover, so that the attenuation and loss of electromagnetic waves of the first antenna metal main body layer can be reduced, and the effective area of the second antenna metal layer can be reduced when the second antenna metal layer positioned on the upper layer is formed through the support of the antenna supporting cover; therefore, the attenuation and loss of electromagnetic waves in the antenna packaging structure are reduced on the premise of not reducing the effective area of the antenna metal layer. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (25)
1. An antenna packaging method, comprising the steps of:
providing a support substrate, and forming a separation layer on the support substrate;
forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface and an opposite second surface, and the first surface is in contact with the separation layer;
forming a first metal connecting column on the second surface of the rewiring layer, wherein the first metal connecting column is electrically connected with the rewiring layer;
covering the first metal connecting column and the second surface of the rewiring layer by using a first packaging layer, wherein the first metal connecting column is exposed on the top surface of the first packaging layer;
forming a first antenna metal layer on the surface of the first packaging layer, wherein the first antenna metal layer is electrically connected with the first metal connecting column; the first antenna metal layer comprises a first antenna metal body layer;
forming an antenna support cover on the first antenna metal body layer, wherein the antenna support cover comprises an antenna support cover bottom, an antenna support cover side wall which is formed by extending outwards from the antenna support cover bottom and surrounds the edge of the antenna support cover bottom, and an antenna support cover cavity formed by the antenna support cover bottom and the antenna support cover side wall; forming a cavity for coating the first antenna metal main body layer through the antenna support cover cavity;
forming a second metal connecting column on the first antenna metal layer, wherein the horizontal plane of the top surface of the second metal connecting column protrudes out of the horizontal plane of the top surface of the cavity;
covering the second metal connecting column and the first antenna metal layer by using a second packaging layer, wherein the second metal connecting column is exposed on the top surface of the second packaging layer; the second packaging layer coats the side wall of the antenna support cover;
forming a second antenna metal layer on the surface of the second packaging layer, wherein the second antenna metal layer is electrically connected with the second metal connecting column;
removing the separation layer and the support substrate;
forming a metal bump on the first surface of the rewiring layer; and
providing a semiconductor chip, and bonding the semiconductor chip on the first surface of the rewiring layer.
2. The antenna packaging method of claim 1, wherein: the second surface of the rewiring layer comprises N layers of antenna structures, wherein N is larger than or equal to 3.
3. The antenna packaging method of claim 1, wherein: the second antenna metal layer includes a second antenna metal body layer located above the antenna support cover.
4. The antenna packaging method of claim 1, wherein: the top surface of the second packaging layer exposes the bottom of the antenna support cover.
5. The antenna packaging method of claim 1, wherein: the top surface of the second encapsulation layer covers the bottom of the antenna support cover.
6. The antenna packaging method of claim 1, wherein: the antenna support cover comprises one or a combination of a glass antenna support cover, a semiconductor antenna support cover, a metal antenna support cover, an epoxy antenna support cover and a ceramic antenna support cover.
7. The antenna packaging method of claim 1, wherein: the method for forming the first metal connecting column and the second metal connecting column comprises one or a combination of wire bonding, electroplating and chemical plating.
8. The antenna packaging method of claim 1, wherein: further comprising the step of filling an underfill layer between the semiconductor chip and the first face of the re-wiring layer, the underfill layer comprising an epoxy layer.
9. The antenna packaging method of claim 1, wherein: the support substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
10. The antenna packaging method of claim 1, wherein: the rewiring layer comprises a dielectric layer and a metal wiring layer, and the dielectric layer is made of one or a combination of more than two of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphorosilicate glass and fluorine-containing glass; the material of the metal wiring layer comprises one or the combination of more than two of copper, aluminum, nickel, gold, silver and titanium.
11. The antenna packaging method of claim 1, wherein: the first metal connecting column and the second metal connecting column comprise one or a combination of a gold wire, a silver wire, a copper wire and an aluminum wire; the first metal connecting column and the second metal connecting column further comprise one or a combination of a gold column, a silver column, a copper column and an aluminum column.
12. The antenna packaging method of claim 1, wherein: the material of the first packaging layer comprises one or a combination of polyimide, silica gel and epoxy resin; the material of the second packaging layer comprises one or a combination of polyimide, silica gel and epoxy resin.
13. The antenna packaging method of claim 1, wherein: the metal bump material comprises one or a combination of tin solder, silver solder and gold-tin alloy solder.
14. An antenna package, comprising:
a rewiring layer including a first side and an opposing second side;
a first metal connection post formed on a second side of the rewiring layer and electrically connected to the rewiring layer;
the first packaging layer covers the first metal connecting column and the second surface of the rewiring layer, and the first metal connecting column is exposed on the top surface of the first packaging layer;
a first antenna metal layer formed on the first package layer, the first antenna metal layer being electrically connected to the first metal connection stud, the first antenna metal layer comprising a first antenna metal body layer;
an antenna support cover comprising an antenna support cover bottom, antenna support cover sidewalls extending outwardly from the antenna support cover bottom surrounding the edges of the antenna support cover bottom, and an antenna support cover cavity formed by the antenna support cover bottom and the antenna support cover sidewalls; the side wall of the antenna supporting cover is formed on the first antenna metal layer, and a cavity for coating the first antenna metal main body layer is formed through the cavity of the antenna supporting cover;
a second metal connection post formed on the first antenna metal layer, wherein the horizontal surface of the top surface of the second metal connection post protrudes out of the horizontal surface of the top surface of the cavity;
the second packaging layer covers the second metal connecting column and the first antenna metal layer, and the top surface of the second packaging layer exposes the second metal connecting column; the second packaging layer coats the side wall of the antenna support cover;
the second antenna metal layer is formed on the surface of the first packaging layer and is electrically connected with the second metal connecting column;
a metal bump formed on a first surface of the rewiring layer; and
and a semiconductor chip bonded on the first surface of the re-wiring layer.
15. The antenna package structure of claim 14, wherein: the second surface of the rewiring layer comprises N layers of antenna structures, wherein N is larger than or equal to 3.
16. The antenna package structure of claim 14, wherein: the second antenna metal layer includes a second antenna metal body layer located above the antenna support cover.
17. The antenna package structure of claim 14, wherein: the top surface of the second packaging layer exposes the bottom of the antenna support cover.
18. The antenna package structure of claim 14, wherein: the top surface of the second encapsulation layer covers the bottom of the antenna support cover.
19. The antenna package structure of claim 14, wherein: the antenna support cover comprises one or a combination of a glass antenna support cover, a semiconductor antenna support cover, a metal antenna support cover, an epoxy antenna support cover and a ceramic antenna support cover.
20. The antenna package structure of claim 14, wherein: an underfill layer is also included between the semiconductor chip and the first side of the re-routing layer, the underfill layer including an epoxy layer.
21. The antenna package structure of claim 14, wherein: the rewiring layer comprises a dielectric layer and a metal wiring layer, wherein the dielectric layer comprises one or more of an epoxy resin layer, a silica gel layer, a PI layer, a PBO layer, a BCB layer, a silicon oxide layer, a phosphorosilicate glass layer and a fluorine-containing glass layer; the metal wiring layer comprises one or the combination of more than two of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.
22. The antenna package structure of claim 14, wherein: the first metal connecting column and the second metal connecting column comprise one or a combination of a gold wire, a silver wire, a copper wire and an aluminum wire; the first metal connecting column and the second metal connecting column further comprise one or a combination of a gold column, a silver column, a copper column and an aluminum column.
23. The antenna package structure of claim 14, wherein: the bottom parts of the first metal connecting column and the second metal connecting column are also connected with metal connecting blocks with cross sectional areas respectively larger than those of the first metal connecting column and the second metal connecting column.
24. The antenna package structure of claim 14, wherein: the first packaging layer comprises one or a combination of a polyimide layer, a silica gel layer and an epoxy resin layer; the second packaging layer comprises one or a combination of a polyimide layer, a silica gel layer and an epoxy resin layer.
25. The antenna package structure of claim 14, wherein: the metal bump comprises one or a combination of a tin metal bump, a silver metal bump and a gold-tin alloy metal bump.
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CN108511400A (en) * | 2018-03-16 | 2018-09-07 | 中芯长电半导体(江阴)有限公司 | The encapsulating structure and packaging method of antenna |
CN207852667U (en) * | 2018-01-05 | 2018-09-11 | 中芯长电半导体(江阴)有限公司 | Fan-out-type antenna packages structure with electromagnetic protection |
CN108550570A (en) * | 2018-04-25 | 2018-09-18 | 成都聚利中宇科技有限公司 | The high-frequency integrated circuit module and its packaging method of integrated vertical radiation antenna |
CN209087816U (en) * | 2018-12-03 | 2019-07-09 | 中芯长电半导体(江阴)有限公司 | Antenna packages structure |
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CN108417559A (en) * | 2017-02-08 | 2018-08-17 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and its manufacturing method |
CN207852667U (en) * | 2018-01-05 | 2018-09-11 | 中芯长电半导体(江阴)有限公司 | Fan-out-type antenna packages structure with electromagnetic protection |
CN108511400A (en) * | 2018-03-16 | 2018-09-07 | 中芯长电半导体(江阴)有限公司 | The encapsulating structure and packaging method of antenna |
CN108550570A (en) * | 2018-04-25 | 2018-09-18 | 成都聚利中宇科技有限公司 | The high-frequency integrated circuit module and its packaging method of integrated vertical radiation antenna |
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