CN111223630A - Laminated ferrite magnetic bead and manufacturing method thereof - Google Patents
Laminated ferrite magnetic bead and manufacturing method thereof Download PDFInfo
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- CN111223630A CN111223630A CN202010038786.1A CN202010038786A CN111223630A CN 111223630 A CN111223630 A CN 111223630A CN 202010038786 A CN202010038786 A CN 202010038786A CN 111223630 A CN111223630 A CN 111223630A
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- ferrite
- green ceramic
- chip
- interlayer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/02—Cores, Yokes, or armatures made from sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
- H01F41/024—Manufacturing of magnetic circuits made from deformed sheets
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Abstract
The application discloses a laminated ferrite bead and a manufacturing method thereof. The method comprises the following steps: respectively manufacturing a ferrite material and a nonmagnetic middle interlayer material into a ferrite green ceramic chip and a middle interlayer green ceramic chip; opening holes in the ferrite green ceramic chip and the middle interlayer green ceramic chip; arranging an inner electrode coil and upper and lower lead-out parts on the perforated ferrite green ceramic chip and the perforated middle interlayer green ceramic chip; filling the ferrite green ceramic chips with the inner electrode coils and the upper and lower lead-out parts and the middle interlayer green ceramic chips with ferrite to obtain filled ferrite green ceramic chips and filled middle interlayer green ceramic chips; laminating the ferrite-filled green ceramic chip and the intermediate interlayer-filled green ceramic chip to obtain a blank block; forming the blank block into a single laminated chip component; and manufacturing a terminal electrode for the single laminated sheet type component. The magnetic bead is manufactured by the method. The magnetic bead has higher current resistance and saturation current.
Description
Technical Field
The application relates to the technical field of magnetic beads, in particular to a laminated ferrite magnetic bead and a manufacturing method thereof.
Background
At present, with the increase of the running speed of digital products, the requirement on the response speed of the products is higher and higher. In addition to the signal lines, the high frequency noise signals from the dc power lines also cause emi problems. For high-frequency noise signals brought by a direct-current power supply circuit, the characteristics of electromagnetic interference filters used are also different, the electromagnetic interference filters used by the direct-current power supply circuit have to bear higher current, and under higher current load, the common magnetic beads have smaller effect on eliminating electromagnetic interference.
The above background disclosure is only for the purpose of assisting in understanding the inventive concepts and technical solutions of the present application and does not necessarily pertain to the prior art of the present application, and should not be used to assess the novelty and inventive step of the present application in the absence of explicit evidence to suggest that such matter has been disclosed at the filing date of the present application.
Disclosure of Invention
The application provides a lamination type ferrite bead and a manufacturing method thereof, which can enable common ferrite beads with the same size to have higher current resistance and saturation current, so that the beads can still play a larger role in eliminating electromagnetic interference.
In a first aspect, the present application provides a method for manufacturing a laminated ferrite bead, including:
respectively manufacturing a ferrite material and a nonmagnetic middle interlayer material into a ferrite green ceramic chip and a middle interlayer green ceramic chip, wherein the thickness of the ferrite green ceramic chip is the same as that of the middle interlayer green ceramic chip;
opening holes in the ferrite green ceramic chip and the middle interlayer green ceramic chip;
arranging an inner electrode coil and an upper and lower lead-out part on the perforated ferrite green ceramic chip and the perforated middle interlayer green ceramic chip;
filling the ferrite green ceramic chips provided with the inner electrode coils and the upper and lower lead-out parts and the middle interlayer green ceramic chips with ferrite, and keeping the filling height equal to the height of the inner electrode coils to obtain the filled ferrite green ceramic chips and the filled middle interlayer green ceramic chips;
laminating the specified number of the ferrite-filled green ceramic chips and the specified number of the middle interlayer-filled green ceramic chips to obtain a blank block;
forming the blank block into a single laminated chip component;
and manufacturing an end electrode for the single laminated sheet type component to obtain a single laminated sheet type magnetic bead finished product component.
In some preferred embodiments, the non-magnetic interlayer material is a material that is suitable for chip components and that is capable of forming a cofire with ferrite material.
In some preferred embodiments, the nonmagnetic interleaf material is a nonmagnetic ferrite material.
In some preferred embodiments, the forming the blank block into a single laminated chip component specifically includes: and cutting, removing glue and sintering the blank block, so that the blank block forms a single laminated chip component.
In some preferred embodiments, the manufacturing the terminal electrode for the single laminated chip component specifically includes: and carrying out silver dipping, silver burning and electroplating on the single laminated chip component, thereby forming a terminal electrode on the single laminated chip component.
In some preferred embodiments, the drilling the holes on both the ferrite green ceramic pieces and the interlayer green ceramic pieces specifically comprises: and drilling holes on the ferrite green ceramic chip and the middle interlayer green ceramic chip by laser.
In a second aspect, the present application provides a lamination piece formula ferrite bead, including ferrite lower substrate layer, ferrite layer, nonmagnetic intermediate interlayer or interior electrode coil on the ferrite layer with draw forth portion from top to bottom, be used for filling up setting of interior electrode coil thickness and be in nonmagnetic intermediate interlayer or ferrite on the ferrite layer is filled, substrate layer and end electrode on the ferrite.
In some preferred embodiments, the material of the nonmagnetic intermediate interlayer is a material that is suitable for chip components and that is capable of forming a cofire with ferrite material.
In some preferred embodiments, the saturation current of the laminated ferrite bead is 4.5A; the direct current resistance of the laminated ferrite bead is less than or equal to 0.018 omega; the impedance of the laminated ferrite bead is 100 omega in a high-frequency environment of 100 MHz.
In some preferred embodiments, the terminal electrode is a silver electrode.
Compared with the prior art, the beneficial effects of the embodiment of the application are as follows:
through adding the middle intermediate layer material of nonmagnetic, prolong the magnetic bead magnetic circuit, make the magnetic bead under the heavy current load condition, can also keep 70% to 80% impedance value and inductance value under the no load condition, make it have super large resistant current nature, in order to continuously play the effect of filtering high frequency signal, can make the ordinary ferrite bead of the same size have higher resistant current nature and saturation current, make the magnetic bead still can exert great effect to eliminating electromagnetic interference, be applicable to the TV set, D class power amplifiers such as intelligent stereo set need bear the scene of heavy current.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a laminated ferrite bead according to an embodiment of the present application;
FIG. 2 shows green ferrite and interlayer green tiles of an embodiment of the present application;
FIG. 3 shows an open ferrite green chip and an open interlayer green chip according to one embodiment of the present application;
FIG. 4 illustrates how an inner electrode coil is provided in one embodiment of the present application;
FIG. 5 illustrates how one embodiment of the present application is filled with ferrite;
FIG. 6 illustrates a portion of a structure of a laminated ferrite bead according to an embodiment of the present application;
FIG. 7 is a schematic diagram of an overall structure of a laminated ferrite bead according to an embodiment of the present application;
fig. 8 is a spectrum diagram of an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present application more clearly apparent, the present application is further described in detail below with reference to fig. 1 to 8 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixation or for circuit connection.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description of the embodiments and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the application.
Referring to fig. 1, the present embodiment provides a method for manufacturing a laminated ferrite bead, including steps a1 to a 7.
Step A1, adopting a tape casting process, referring to fig. 2, respectively manufacturing the ferrite material and the nonmagnetic intermediate interlayer material into a ferrite green ceramic chip 20 and an intermediate interlayer green ceramic chip 30, wherein the thickness of the ferrite green ceramic chip 20 is the same as that of the intermediate interlayer green ceramic chip 30. Thus, corresponding carriers are provided for the subsequent arrangement of the inner electrode coil 4, the arrangement of the lead-out portion 5 and the filling.
The non-magnetic interlayer material is not limited to non-magnetic ferrite material, but also includes any material suitable for chip components and capable of forming a co-fired with ferrite material.
In the present embodiment, the initial permeability of the ferrite material is 180 to 220; the main component of the non-magnetic intermediate layer material comprises Fe2O3NiO and Bi2O3。
And step A2, opening holes in the ferrite green ceramic chips 20 and the middle interlayer green ceramic chips 30.
Specifically, according to the design requirement, referring to fig. 3, the ferrite green ceramic sheets 20 and the interlayer green ceramic sheets 30 are perforated by laser at the set position, and then used for connection between the inner electrode coils 4 and the upper and lower lead-out portions 5 in each layer of the magnetic beads, so as to ensure interconnection between the inner electrode coils 4 and the upper and lower lead-out portions 5 in each layer.
Step A3, arranging the inner electrode coil 4 and the upper and lower lead-out parts 5 on the perforated ferrite green ceramic sheet 20 and the perforated middle interlayer green ceramic sheet 30.
Referring to fig. 4, the inner electrode coil 4 and the upper and lower lead-out portions 5 may be formed on the perforated ferrite green sheet 20 and the perforated interlayer green sheet 30 by printing, so as to form a complete coil structure.
Step A4, the raw ceramic pieces 20 of ferrite and the raw ceramic pieces 30 of middle interlayer which are provided with the inner electrode coil 4 and the upper and lower leading-out parts 5 are filled with ferrite, so that the filling height is equal to the height of the inner electrode coil 4, no gap exists, and the raw ceramic pieces 200 of filled ferrite and the raw ceramic pieces 300 of middle interlayer are obtained.
Referring to fig. 5, the ferrite can be filled in the ferrite green ceramic sheets 20 and the interlayer green ceramic sheets 30 by printing, which facilitates the subsequent lamination and sintering process. Wherein ferrite is used as filler.
Step A5, laminating the specified number of the ferrite filled green tiles 200 and the specified number of the middle interlayer filled green tiles 300 to obtain a blank block.
According to the product requirements, the middle interlayer green ceramic sheets 30 and ferrite green ceramic sheets 20 printed with the inner electrode coils 4 and fillers in different quantities are laminated in a specific thickness and subjected to warm water isostatic pressing to realize high-pressure lamination, and a blank block such as a Bar block is manufactured.
And step A6, forming the blank block into a single laminated chip component.
Specifically, the manufactured blank block can be cut according to the designed size to form a single laminated sheet element blank. And then carrying out procedures such as glue discharging, sintering and the like on the prepared single laminated chip component blank to form a single laminated chip component. Wherein, the single laminated sheet type component is a semi-finished product, namely a laminated sheet type magnetic bead semi-finished product.
And A7, manufacturing a terminal electrode 8 for the single laminated sheet type component to obtain a single laminated sheet type magnetic bead finished product component.
Carrying out silver dipping, silver burning and electroplating treatment on the sintered single laminated sheet type component, namely the magnetic bead semi-finished product, so as to form a terminal electrode 8 on the single laminated sheet type component and obtain a single laminated sheet type magnetic bead finished product component; the silver paste used for silver dipping mainly comprises Ag, and the resistivity is 3.1 mu omega/cm. Thus, referring to fig. 6, the terminal electrode 8 is a silver electrode. The saturation current of the finally obtained magnetic bead finished product is improved.
Referring to fig. 7, the laminated ferrite bead obtained by the manufacturing method of this embodiment includes a ferrite lower substrate layer 1, a ferrite layer 2, a nonmagnetic intermediate interlayer 3, an inner electrode coil 4 and upper and lower lead-out portions 5 on the nonmagnetic intermediate interlayer or the ferrite layer, a ferrite filler 6 disposed on the nonmagnetic intermediate interlayer 3 or the ferrite layer 2 for filling the thickness of the inner electrode coil, a ferrite upper substrate layer 7, and a terminal electrode 8.
In the present embodiment, the materials of the ferrite lower substrate layer 1 and the ferrite upper substrate layer 7 are both ferrite; the ferrite layer 2 is a ferrite green ceramic chip 20; the nonmagnetic middle interlayer 3 is a middle interlayer green ceramic sheet 30; the material of the ferrite filler 6 is ferrite.
The laminated ferrite bead of the embodiment is an ultra-large current bead, and the parameters thereof are as follows: the size (length and width) is 2.0 x 1.6mm, the saturation current can reach 4.5A, the Direct Current Resistance (DCR) is less than or equal to 0.018 omega, and the impedance under the high-frequency environment of 100MHz is 100 omega; wherein the error of the impedance value is + -25%. The test data of the laminated ferrite bead of the present embodiment is as follows.
Table magnetic bead test data
| Serial number | Impedance value/omega | Direct current resistance (max)/omega | Saturation current/A |
| |
100±25％ | <0.018Ω | Current reduced by 30% in Z/L |
| 1 | 91 | 0.011 | 4.46 |
| 2 | 95 | 0.013 | 4.48 |
| 3 | 97 | 0.014 | 4.50 |
| 4 | 101 | 0.015 | 4.53 |
| 5 | 94 | 0.013 | 4.43 |
| 6 | 93 | 0.013 | 4.40 |
| 7 | 96 | 0.014 | 4.45 |
| 8 | 100 | 0.015 | 4.51 |
| 9 | 92 | 0.012 | 4.42 |
| 10 | 98 | 0.014 | 4.45 |
In fig. 8, a curve Z represents the impedance as a whole, a curve R represents the resistance component of the impedance, and a curve X represents the reactance component; in short, the Z value indicates the combined squelch performance, the R value indicates the performance of absorbing noise by magnetic loss, and the X value indicates the performance of bouncing back noise by an impedance component. As can be seen from the analysis of the test data in table i and the spectrogram in fig. 8, the performance of the magnetic bead manufactured in this embodiment meets the original parameter requirements, and the common ferrite bead with the same size has higher current resistance and saturation current. Specifically, the saturation current of the original magnetic bead product with the same size can only be maintained between 2.5A and 3A; from the results of this example, the saturation current was substantially stabilized at 4.4A to 4.5A; compared with the original magnetic bead product with the same size, the saturation current of the magnetic bead product of the embodiment is improved by about 50%. Therefore, the saturation current performance and the current resistance performance of the magnetic bead product can be improved.
Because the common magnetic beads are small in size, poor in current resistance and easy to heat, the requirement of bearing a large current load cannot be met, a certain impedance value and inductance cannot be maintained, and the effect of eliminating electromagnetic interference is smaller. In the embodiment, the printing carrier of the internal electrode of the magnetic bead is changed, and the magnetic path of the magnetic bead is prolonged by adding the nonmagnetic intermediate interlayer material, so that the magnetic bead can also keep 70-80% of impedance value and inductance value under the condition of no load under the condition of heavy current load, and has overlarge current resistance so as to continuously play a role in filtering high-frequency signals; the embodiment can enable the common ferrite bead with the same size to have higher current resistance and saturation current, and is suitable for scenes that D-type power amplifiers such as televisions, intelligent sound equipment and the like need to bear large current.
The embodiment solves the problems of low saturation current, low current resistance, low reliability and the like of the conventional chip ferrite bead with the same size, and provides a scheme for improving the saturation current of the chip ferrite bead with any size.
The laminated ferrite bead of the embodiment is a laminated ferrite bead product with ultrahigh saturation current, and can cope with the trend of improving the current resistance of the bead.
The foregoing is a further detailed description of the present application in connection with specific/preferred embodiments and is not intended to limit the present application to that particular description. For a person skilled in the art to which the present application pertains, several alternatives or modifications to the described embodiments may be made without departing from the concept of the present application, and these alternatives or modifications should be considered as falling within the scope of the present application.
Claims (10)
1. A method for manufacturing a laminated ferrite bead is characterized by comprising the following steps:
respectively manufacturing a ferrite material and a nonmagnetic middle interlayer material into a ferrite green ceramic chip and a middle interlayer green ceramic chip, wherein the thickness of the ferrite green ceramic chip is the same as that of the middle interlayer green ceramic chip;
opening holes in the ferrite green ceramic chip and the middle interlayer green ceramic chip;
arranging an inner electrode coil and an upper and lower lead-out part on the perforated ferrite green ceramic chip and the perforated middle interlayer green ceramic chip;
filling the ferrite green ceramic chips provided with the inner electrode coils and the upper and lower lead-out parts and the middle interlayer green ceramic chips with ferrite, and keeping the filling height equal to the height of the inner electrode coils to obtain the filled ferrite green ceramic chips and the filled middle interlayer green ceramic chips;
laminating the specified number of the ferrite-filled green ceramic chips and the specified number of the middle interlayer-filled green ceramic chips to obtain a blank block;
forming the blank block into a single laminated chip component;
and manufacturing an end electrode for the single laminated sheet type component to obtain a single laminated sheet type magnetic bead finished product component.
2. The method of claim 1, further comprising: the non-magnetic interlayer material is a material which is suitable for a chip element and can form co-firing with a ferrite material.
3. The method of claim 1, further comprising: the non-magnetic middle interlayer material is a non-magnetic ferrite material.
4. The method of claim 1, wherein forming the slug blocks into single laminated chip components specifically comprises: and cutting, removing glue and sintering the blank block, so that the blank block forms a single laminated chip component.
5. The method according to claim 1, wherein the step of manufacturing the terminal electrode for the single laminated chip component specifically comprises: and carrying out silver dipping, silver burning and electroplating on the single laminated chip component, thereby forming a terminal electrode on the single laminated chip component.
6. The method of claim 1, wherein said drilling both said green ferrite tiles and said green interlayer tiles specifically comprises: and drilling holes on the ferrite green ceramic chip and the middle interlayer green ceramic chip by laser.
7. The utility model provides a lamination formula ferrite bead which characterized in that: including base plate layer, ferrite layer, nonmagnetic intermediate interlayer in the bottom of the ferrite interior electrode coil and upper and lower extraction portion on nonmagnetic intermediate interlayer or the ferrite layer, be used for filling up setting up of interior electrode coil thickness in nonmagnetic intermediate interlayer or ferrite on the ferrite layer fills, base plate layer and termination electrode on the ferrite.
8. The laminated ferrite bead as claimed in claim 7, wherein: the material of the nonmagnetic intermediate interlayer is a material which is suitable for the chip element and can form co-firing with ferrite material.
9. The laminated ferrite bead as claimed in claim 7, wherein: the saturation current of the laminated sheet type ferrite bead is 4.5A; the direct current resistance of the laminated ferrite bead is less than or equal to 0.018 omega; the impedance of the laminated ferrite bead is 100 omega in a high-frequency environment of 100 MHz.
10. The laminated ferrite bead as claimed in claim 7, wherein: the terminal electrode is a silver electrode.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010038786.1A CN111223630A (en) | 2020-01-14 | 2020-01-14 | Laminated ferrite magnetic bead and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010038786.1A CN111223630A (en) | 2020-01-14 | 2020-01-14 | Laminated ferrite magnetic bead and manufacturing method thereof |
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| US20060152325A1 (en) * | 2003-07-24 | 2006-07-13 | Fdk Corporation | Magnetic core type laminated inductor |
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| CN103515052A (en) * | 2012-06-14 | 2014-01-15 | 三星电机株式会社 | Multi-layered chip electronic component |
| CN103951403A (en) * | 2014-04-07 | 2014-07-30 | 深圳市力磁电子有限公司 | Low-temperature matching cofired method of non-magnetic material and NiCuZn ferrite material |
| CN106373712A (en) * | 2016-10-27 | 2017-02-01 | 深圳振华富电子有限公司 | Laminated chip inductor and manufacturing method thereof |
| CN108630407A (en) * | 2018-04-17 | 2018-10-09 | 江西国创产业园发展有限公司 | A kind of laminated inductive and its preparation process |
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2020
- 2020-01-14 CN CN202010038786.1A patent/CN111223630A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060152325A1 (en) * | 2003-07-24 | 2006-07-13 | Fdk Corporation | Magnetic core type laminated inductor |
| JP2008130736A (en) * | 2006-11-20 | 2008-06-05 | Hitachi Metals Ltd | Electronic component and its manufacturing method |
| CN103515052A (en) * | 2012-06-14 | 2014-01-15 | 三星电机株式会社 | Multi-layered chip electronic component |
| CN103951403A (en) * | 2014-04-07 | 2014-07-30 | 深圳市力磁电子有限公司 | Low-temperature matching cofired method of non-magnetic material and NiCuZn ferrite material |
| CN106373712A (en) * | 2016-10-27 | 2017-02-01 | 深圳振华富电子有限公司 | Laminated chip inductor and manufacturing method thereof |
| CN108630407A (en) * | 2018-04-17 | 2018-10-09 | 江西国创产业园发展有限公司 | A kind of laminated inductive and its preparation process |
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