CN111151911A - Corrosion-resistant high-strength low-temperature welding material and preparation method thereof - Google Patents
Corrosion-resistant high-strength low-temperature welding material and preparation method thereof Download PDFInfo
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- CN111151911A CN111151911A CN202010141875.9A CN202010141875A CN111151911A CN 111151911 A CN111151911 A CN 111151911A CN 202010141875 A CN202010141875 A CN 202010141875A CN 111151911 A CN111151911 A CN 111151911A
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- 239000000463 material Substances 0.000 title claims abstract description 24
- 238000005260 corrosion Methods 0.000 title claims abstract description 20
- 230000007797 corrosion Effects 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 229910052745 lead Inorganic materials 0.000 claims abstract description 12
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 9
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 230000008018 melting Effects 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 19
- 229910000905 alloy phase Inorganic materials 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 3
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 4
- 238000009776 industrial production Methods 0.000 abstract 1
- 239000011575 calcium Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005336 cracking Methods 0.000 description 11
- 229910052761 rare earth metal Inorganic materials 0.000 description 8
- 239000011572 manganese Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910001152 Bi alloy Inorganic materials 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910017086 Fe-M Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005495 investment casting Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001868 water Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Continuous Casting (AREA)
Abstract
The invention provides a corrosion-resistant high-strength welding material which is characterized by comprising the following components in percentage by mass: 50-70% of Sn, 15-25% of Bi, 5-10% of Pb, Mn: 0.1-1%, La: 0.1-0.5%, Ca: 0.1-2%, Cu 0.25-0.5%, Al 0.1-0.5%, wherein the ratio of Bi to Pb is 2:1-3: 1. The welding material has the advantages of outstanding corrosion resistance, excellent mechanical property, simple preparation and few components, and is suitable for industrial production.
Description
Technical Field
The invention relates to a metal welding material and a preparation method thereof.
Background
Electronic components and electronic materials incorporated in electronic devices are deteriorated and destroyed when exposed to high temperatures without heat resistance. Such electronic parts and electronic materials must be soldered at low temperature, and for this purpose, a solder having a low melting point, that is, a low-temperature solder must be used. The low-temperature solder is not specifically defined, but generally means a solder having a solidus temperature and a liquidus temperature (melting point) lower than 183 ℃ which is a eutectic temperature of Pb-63 Sn. Among conventional low-temperature solders, there are Sn-52Bi-32Pb (melting point: 95 ℃ C.), Sn-54Bi-20Cd (melting point: 103 ℃ C.), Sn-40Pb-40Bi (melting point: 113 ℃ C.), Sn-51In (melting point: 117 ℃ C.), Sn-58Bi (melting point: 139 ℃ C.), Sn-32Pb-18Cd (melting point: 143 ℃ C.), and Sn-32Cd (melting point: 175 ℃ C.). . Since the solidus temperature and the liquidus temperature can be adjusted by adding Pb and Cd in appropriate amounts, low-temperature solders having various melting points can be obtained. However, low-temperature solders containing Pb and Cd have a public hazard that adversely affects human bodies, and thus their use is regulated. Thus, low temperature solders containing no or low amounts of Pb and Cd are required.
In addition, the solder material also needs to have excellent mechanical properties (tensile strength, bending, elongation, etc.) in the soldered portion. That is, when a tensile force is applied to the soldered base material, the soldered portion is easily torn off, and the function of the electronic device is completely damaged. Similarly, when a bending force is applied to the base material of the brazed portion, the solder must have ductility to the extent that the solder can be easily bent and does not crack. In addition, the solder is required to have corrosion resistance. When the soldered electronic device is used only indoors, there is no difference in cooling and heating, and no corrosion problem is involved because of the good environment. However, electronic devices used in devices for data communication offices, automobiles, military devices, space-related devices, outdoor entertainment devices, and the like are often installed outdoors, and corrosion of solder becomes a problem.
Disclosure of Invention
Aiming at the problems, the invention provides a corrosion-resistant high-strength low-temperature welding material which is characterized by comprising the following components in percentage by mass:
50-70% of Sn, 15-25% of Bi, 5-10% of Pb, Mn: 0.1-1%, La: 0.1-0.5%, Ca: 0.1-2%, Cu 0.25-0.5%, Al 0.1-0.5%, wherein the ratio of Bi to Pb is 2:1-3: 1.
Preferably, the welding material comprises the following components: 67.1% of Sn, 20% of Bi, 10% of Pb, Mn: 0.5%, La: 0.4 percent; ca: 1%, Cu 0.5%, and Al 0.5%.
Preferably, the welding material comprises the following components: 67.1% of Sn, 22.5% of Bi, 7.5% of Pb, Mn: 0.5%, La: 0.4 percent; ca: 1%, Cu 0.5%, and Al 0.5%.
Preferably, the alloy phase includes a Sn-Pb-Bi ternary phase, a Pb-Bi-La-Ca quaternary phase and a Pb-Bi, Sn-Bi binary phase.
The present invention also provides a method for manufacturing the above-described welding material, characterized in that the manufacturing method comprises:
a. putting the raw materials into a crucible for melting, heating the metal to 400 ℃, and fully stirring after the metal is melted;
b. then naturally cooling the melted metal to 330-350 ℃, and maintaining for 15-20 minutes;
c. and taking out impurities on the surface of the melted alloy, and then putting the alloy into a die.
Preferably, the four metals Pb-Bi-La-Ca are added according to a certain proportion in the step a, the Pb-Bi metal is added according to a certain proportion after melting, and finally Sn and the rest other metals are added.
Preferably, the ratio of Pb-Bi-La-Ca added is 1:1:0.1: 1.
Preferably, the ratio of Pb-Bi added is 1: 1.
Lanthanum: the rare earth element (RE) can purify the alloy solution and effectively improve the mechanical properties and corrosion resistance of the welding material at room temperature and high temperature. In addition, the rare earth element can narrow the solidification temperature range of the alloy so as to improve the casting performance of the alloy, reduce the cracking of welding seams and improve the compactness of castings. As the rare earth element, gadolinium (Gd), yttrium (Y), neodymium (Nd), samarium (Sm), praseodymium (Pr), lanthanum (La), cerium (Ce) and the like are commonly used. However, elements such as Gd, Y, Nd, Sm and the like are expensive, and the use of these rare earth elements can greatly increase the production cost. In contrast, Pr, La and Ce are relatively economical rare earth elements, and La is a relatively easily available rare earth element among the three economical rare earth elements, so La is selected as an added alloying element. When the La element is less than 3 wt.%, the improvement effect on corrosion resistance, fluidity, and thermal conductivity is limited, and the La addition amount should not be excessively high in order to keep the production cost low. The La content in the present invention should be set in the range of 0.1 to 0.5% in consideration of the performance improvement effect and the production cost.
Bi and Pb: bi element is one of alloying elements commonly added in the alloy and has double functions of solid solution strengthening and aging strengthening. The addition of a proper amount of Bi can improve the plasticity, improve the melt fluidity, improve the casting performance and reduce the melting temperature. The addition of a small amount of Bi can improve the fluidity of the solder, and the bismuth alloy has the characteristic of no shrinkage during solidification and can produce the effect of strengthening the mechanical property of the alloy and be used for casting and printing type and high-precision casting molds. However, when the amount of Bi is too large, the fluidity of Bi alloy is rather lowered, and the weld material tends to be microscopically cracked or cracked. For this purpose, the Bi content is controlled as follows: 15 to 25 percent. Pb element is also one of common alloy additives, and lead is subjected to the action of oxygen, water and carbon dioxide in the air, and the surface of the lead is quickly oxidized to generate a protective film; under heating, lead can be combined with oxygen, sulfur and halogen quickly; lead hardly reacts with cold hydrochloric acid and cold sulfuric acid and can react with hot or concentrated hydrochloric acid and sulfuric acid; lead reacts with dilute nitric acid but not with concentrated nitric acid; lead can be slowly dissolved in a strongly alkaline solution. The Pb element can improve the fluidity of the alloy and forms an alloy phase with Bi. Because metals such as Bi in the welding material have active chemical properties, Sn-Bi-Pb forms an alloy phase of a matrix phase, and a compact oxide protective film is easily formed on the surface, so that the corrosion resistance of the welding material is improved. The invention finds that the corrosion resistance and the mechanical property can be better improved when the proportion of Bi and Pb is controlled, and is proved by the examples. It is presumed that a certain alloy phase ratio can synergistically promote the effects.
Calcium: the addition of the alkaline earth element Ca can advantageously improve the metallurgical quality, and at the same time, the addition cost of the Ca element is low, and the reason for adding the Ca is that: 1) the ignition temperature of the alloy melt is increased, the oxidation of the alloy during melting and heat treatment is reduced, and particularly, the small amount of Ca (for example, the content of Ca is 0.1 wt.%) can improve the oxidation resistance and heat resistance of the solder; 2) ca can refine solder grains and improve the corrosion resistance and creep resistance of the solder. In view of this, the Ca content of the low-cost high-thermal-conductivity die-casting solder of the present invention needs to be designed to be 0.1-2%.
Manganese: a small amount of Mn can form Fe-M compound with Fe element, thereby improving the corrosion resistance of the alloy. The Mn content in the high thermal conductive welding material according to the present invention should be set to 0.1 to 1%.
The alloy phase comprises Sn-Bi-Pb as a matrix phase, a small amount of Pb-Bi-La-Ca quaternary phase and Pb-Bi phase and other possible phase states. In the technical scheme, compared with the traditional Sn-Pb or Sn-Bi solder, the solder taking Sn-Bi-Pb as the matrix phase has better ductility and fluidity and higher thermal conductivity and corrosion resistance. The Pb-Bi-La-Ca quaternary phase can effectively improve the mechanical property and the creep resistance of the alloy, and the Pb-Bi phase can further improve the heat-conducting property, reduce the influence of other alloy elements on the heat-conducting property and improve the mechanical property of the alloy. Different alloy phases with different proportions are mutually promoted and have synergistic effect, and finally, the corrosion resistance, the mechanical property and other properties of the solder are enhanced, and the unexpected technical effect is achieved. Therefore, the solder with the microstructure has better mechanical property and corrosion resistance.
Detailed Description
Preparation of examples 1-2 and comparative examples 1-5
a. Putting four metals of Pb-Bi-La-Ca which are added according to the ratio of 1:1:0.1:1 into a crucible for melting, heating to 400 ℃, adding the Pb-Bi metal according to the ratio of 1:1 after the metals are melted, stirring and melting while keeping the temperature, finally adding Sn and the rest other metals, and fully stirring, wherein the specific addition amount is shown in the following table;
b. then naturally cooling the melted metal to 330-350 ℃, and maintaining for 15-20 minutes;
c. and taking out impurities on the surface of the melted alloy, and then putting the alloy into a die.
| Example 1 | Example 2 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | |
| Sn | 67.1% | 67.1% | 72.1% | 67.1% | 67.1% | 71.1% | 68.1% |
| Bi | 20% | 22.5% | 25% | 15% | 25% | 20% | 20% |
| Pb | 10% | 7.5% | 0 | 15% | 5% | 10% | 10% |
| Mn | 0.5％ | 0.5％ | 0.5％ | 0.5％ | 0.5％ | 0.5％ | 0.5％ |
| La | 0.4％ | 0.4％ | 0.4％ | 0.4％ | 0.4％ | 0 | 0.4％ |
| Ca | 1％ | 1％ | 1％ | 1％ | 1％ | 1％ | 0 |
| Cu | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% |
| Al | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% |
| Bi：Pb | 2：1 | 3:1 | - | 1：1 | 5：1 | 2：1 | 2：1。 |
Example 3
a. Putting all the formulations shown in the example 1 into a crucible for melting, heating to 400 ℃, and fully stirring after the metal is melted;
b. then naturally cooling the melted metal to 330-350 ℃, and maintaining for 15-20 minutes;
c. and taking out impurities on the surface of the melted alloy, and then putting the alloy into a die.
The workability of each solder was evaluated. The processed solder (thickness: 1.5mm) was repeatedly rolled and annealed, and when cracking and breaking occurred, the processing was completed, and when cracking and breaking did not occur, the processing was performed until the thickness reached 50 μm.
Using the pressed 0.1mm thick plate, in a vacuum atmosphere at 830 degrees C10 mm x 20mm alumina between brazing, 3mm x 4mm x 40mm test piece, through four-point bending test according to JIS R1601 determination of 10 point breaking strength. (test method was carried out according to JIS R1601).
After 6 hours of testing in acid salt spray, the resulting 0.1mm thick plates were tested for breaking strength according to the GB T10125-1997 standard, and the degree of breaking strength reduction was calculated as a percentage in comparison with the non-corroded.
| Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | |
| Rolling process | Thickness of 50um Cracking of | Thickness of 50um Cracking of | Thickness of 200mm Cracking of | Thickness of 1mm Cracking of | The thickness is 200um Cracking of | The thickness is 500um Cracking of | The thickness is 500um Cracking of | The thickness is 100um Cracking of |
| Post braze fracture strength | 400Mpa | 380Mpa | 324Mpa | 251Mpa | 365Mpa | 298Mpa | 275Mpa | 291Mpa |
| Fracture strength after corrosion Decrease by% | 5% | 5% | 9% | 20% | 14% | 18% | 32% | 26% |
From the above results, it can be seen that the different alloy phases mutually promote and cooperate to finally realize the enhancement of other performances of the solder, such as corrosion resistance, mechanics and the like, and have unexpected technical effects.
Claims (8)
1. The corrosion-resistant high-strength low-temperature welding material is characterized by comprising the following components in percentage by mass:
50-70% of Sn, 15-25% of Bi, 5-10% of Pb, Mn: 0.1-1%, La: 0.1-0.5%, Ca: 0.1-2%, Cu 0.25-0.5%, Al 0.1-0.5%, wherein the ratio of Bi to Pb is 2:1-3: 1.
2. The soldering material according to claim 1, wherein the soldering material comprises the following components: 67.1% of Sn, 20% of Bi, 10% of Pb, Mn: 0.5%, La: 0.4 percent; ca: 1%, Cu 0.5%, and Al 0.5%.
3. The soldering material according to claim 1, wherein the soldering material comprises the following components: 67.1% of Sn, 22.5% of Bi, 7.5% of Pb, Mn: 0.5%, La: 0.4 percent; ca: 1%, Cu 0.5%, and Al 0.5%.
4. The low-temperature solder material according to claim 1, wherein the alloy phase includes a ternary Sn-Pb-Bi phase, a quaternary Pb-Bi-La-Ca phase, and a binary Pb-Bi, Sn-Bi phase.
5. A manufacturing method of manufacturing the low-temperature solder material according to claim 1, characterized by comprising:
a. putting the raw materials into a crucible for melting, heating the metal to 400 ℃, and fully stirring after the metal is melted;
b. then naturally cooling the melted metal to 330-350 ℃, and maintaining for 15-20 minutes;
c. and taking out impurities on the surface of the melted alloy, and then putting the alloy into a die.
6. The method of claim 5, wherein the four metals Pb-Bi-La-Ca are added in a predetermined ratio in the step a, the Pb-Bi metal is added in a predetermined ratio after melting, and finally Sn and the remaining metals are added.
7. The method according to claim 6, wherein the ratio of Pb-Bi-La-Ca is 1:1:0.1: 1.
8. The method according to claim 6, wherein the ratio of Pb-Bi added is 1: 1.
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|---|---|---|---|---|
| SU1500455A1 (en) * | 1987-11-24 | 1989-08-15 | Институт Электросварки Им.Е.О.Патона | Solder for low-temperature soldering |
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| CN108705222A (en) * | 2018-04-04 | 2018-10-26 | 史国民 | A kind of corrosion-resistant low temperature solder materials and preparation method thereof |
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| CN108994479A (en) * | 2018-08-24 | 2018-12-14 | 温州市星峰新材料有限公司 | A kind of welding material of anti-corrosion and high strength and preparation method thereof |
-
2020
- 2020-03-04 CN CN202010141875.9A patent/CN111151911A/en active Pending
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|---|---|---|---|---|
| SU1500455A1 (en) * | 1987-11-24 | 1989-08-15 | Институт Электросварки Им.Е.О.Патона | Solder for low-temperature soldering |
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Non-Patent Citations (1)
| Title |
|---|
| 樊融融: "《现代电子装联焊接技术基础及其应用》", 31 December 2015 * |
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Application publication date: 20200515 |