CN111149059B

CN111149059B - Substrate carrying apparatus, exposure apparatus, substrate carrying method, exposure method, flat panel display, and device manufacturing method

Info

Publication number: CN111149059B
Application number: CN201780095240.6A
Authority: CN
Inventors: 青木保夫
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2017-09-29
Filing date: 2017-09-29
Publication date: 2022-08-26
Anticipated expiration: 2037-09-29
Also published as: TWI722320B; TW201919968A; WO2019064576A1; CN111149059A

Abstract

A substrate transfer apparatus, an exposure apparatus, a substrate transfer method, a substrate exposure method, a flat panel display, and a device manufacturing method are provided to shorten the time required for substrate replacement. A substrate conveying device (100A) conveys a substrate (P2) to a holding surface (TS) of a holding device capable of holding the substrate (P2). A substrate transfer device (100A) is provided with: a first holding section (161A) having a substrate holding surface for holding a substrate (P2) above the holding device; a second holding portion (184a) for holding a part of the substrate (P2) held by the first holding portion (161A) at a position between the vertical holding surface (TS) and the substrate holding surface; and a drive unit (164) which moves the holding device and the second holding unit (184a) relative to the first holding unit (161A) in a state where the second holding unit (184a) holds a part of the substrate (P2) in such a manner that the first holding unit (161A) is retracted from above the holding device.

Description

Substrate transfer apparatus, exposure method, flat panel display, and device manufacturing method

Technical Field

The present invention relates to a substrate transfer apparatus, an exposure apparatus, a method of manufacturing a flat panel display (flat panel display), a method of manufacturing a device, a substrate transfer method, and an exposure method.

Background

In a photolithography process for manufacturing electronic components such as liquid crystal display devices and semiconductor devices, an exposure apparatus has been used which transfers a pattern formed on a mask (or a photomask (reticle)) onto a substrate (a substrate made of glass, plastic, or the like, a semiconductor wafer (wafer), or the like) by an energy beam.

In such an exposure apparatus, the substrate subjected to exposure on the stage device holding the substrate is carried out, and a new substrate is carried into the stage device. As a method for conveying a substrate, for example, a method described in patent document 1 is known.

Documents of the prior art

Patent document

Patent document 1: international publication No. 2013/150787

Disclosure of Invention

According to a first embodiment, there is provided a substrate transport apparatus that transports a substrate to a holding surface of a holding device capable of holding the substrate, the apparatus including: a first holding portion having a substrate holding surface for holding the substrate above the holding device; a second holding portion that holds a part of the substrate held by the first holding portion at a position between the holding surface and the substrate holding surface in the vertical direction; and a driving unit configured to move the holding device and the second holding unit relative to the first holding unit while the second holding unit holds the part of the substrate, such that the first holding unit is retracted from above the holding device.

According to a second embodiment, there is provided an exposure apparatus including: the substrate carrying device; and an optical system that irradiates the substrate transferred to the holding device with an energy beam and exposes the substrate.

According to a third embodiment, there is provided a flat panel display manufacturing method, including: exposing a substrate using the exposure apparatus; and developing the exposed substrate.

According to a fourth embodiment, there is provided an element manufacturing method including: exposing a substrate using the exposure apparatus; and developing the exposed substrate.

According to a fifth embodiment, there is provided a substrate transfer method of transferring a substrate to a holding surface of a holding device capable of holding the substrate, the method comprising: holding the substrate by a first holding portion and a second holding portion above the holding device; and relatively moving the holding device and the second holding portion with respect to the first holding portion in a state where the second holding portion holds a part of the substrate in such a manner that the first holding portion is retracted from above the holding device, wherein the second holding portion holds the part of the substrate held by the first holding portion at a position between the holding surface and the substrate holding surface in the vertical direction.

According to a sixth embodiment, there is provided an exposure method including: conveying the substrate to the holding device by the substrate conveying method; and irradiating the substrate with an energy beam to expose the substrate.

According to a seventh embodiment, there is provided a flat panel display manufacturing method, including: exposing the substrate using the exposure method; and developing the exposed substrate.

According to an eighth embodiment, there is provided an element manufacturing method including: exposing the substrate using the exposure method; and developing the exposed substrate.

Further, the structure of the following embodiment may be appropriately modified, and at least a part thereof may be replaced with another structure. Further, the arrangement is not particularly limited, and the arrangement is not limited to the arrangement disclosed in the embodiment, and may be arranged at a position where the function can be achieved.

Drawings

Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to a first embodiment.

Fig. 2 is a plan view of a stage device and a substrate transfer device included in the exposure apparatus (partially omitted) of fig. 1.

Fig. 3 (a) is a plan view of the stage device according to the first embodiment, fig. 3 (b) is a side view, and fig. 3 (c) is a sectional view taken along line a-a of fig. 3 (a).

Fig. 4 (a) to 4 (c) are (a) side views of the exposure apparatus for explaining the substrate replacement operation according to the first embodiment.

Fig. 5 (a) to 5 (c) are side views (two) of the exposure apparatus for explaining the substrate replacement operation according to the first embodiment.

Fig. 6 (a) to 6 (c) are side views (the third view) of the exposure apparatus for explaining the substrate replacement operation according to the first embodiment.

Fig. 7 (a) to 7 (c) are side views (the fourth) of the exposure apparatus for explaining the substrate replacement operation according to the first embodiment.

Fig. 8 (a) to 8 (c) are side views of the exposure apparatus for explaining the substrate replacement operation according to the first embodiment (the fifth embodiment).

Fig. 9 (a) to 9 (c) are side views of the exposure apparatus for explaining the substrate replacement operation according to the first modification of the first embodiment.

Fig. 10 (a) is a perspective view of a substrate carrying-in hand according to a second modification of the first embodiment, and fig. 10 (b) is a side view.

Fig. 11 (a) and 11 (b) are side views of the exposure apparatus for explaining the substrate replacement operation according to the third modification of the first embodiment.

Fig. 12(a) is a plan view of a substrate carry-in hand according to a fourth modification of the first embodiment, and fig. 12 (b) is a sectional view taken along line a-a of fig. 12 (a).

Fig. 13 (a) and 13 (b) are diagrams for explaining a substrate carrying-in operation using the substrate carrying-in hand according to the fourth modification of the first embodiment.

Fig. 14 (a) and 14 (b) are sectional views schematically showing a substrate loading hand according to a fifth modification of the first embodiment.

Fig. 15 (a) and 15 (b) are a plan view and a side view of an exposure apparatus according to the second embodiment, respectively.

Fig. 16 (a) and 16 (b) are perspective views of the substrate carrying-in hand according to the second embodiment.

Fig. 17 (a) and 17 (b) are (one of) a plan view and a side view of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment.

Fig. 18 (a) and 18 (b) are a plan view and a side view (the second) of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment, respectively.

Fig. 19 (a) and 19 (b) are a plan view and a side view (the third) of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment.

Fig. 20 (a) and 20 (b) are a plan view and a side view (the fourth) of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment.

Fig. 21 (a) and 21 (b) are a plan view and a side view (the fifth) of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment, respectively.

Fig. 22 (a) and 22 (b) are a plan view and a side view (sixth view), respectively, of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment.

Fig. 23 (a) and 23 (b) are a plan view and a side view (seventh) of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment, respectively.

Fig. 24 (a) and 24 (b) are a plan view and a side view (eighth) of the exposure apparatus for explaining the substrate replacement operation according to the second embodiment, respectively.

Fig. 25 (a) and 25 (b) are diagrams for explaining advantages of the substrate loading device according to the second embodiment, respectively.

Fig. 26 (a) and 26 (b) are a plan view and a side view of the exposure apparatus for explaining the substrate replacement operation according to the first modification of the second embodiment, respectively.

Fig. 27 (a) and 27 (b) are (one) of a plan view and a side view of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment.

Fig. 28 (a) and 28 (b) are a plan view and a side view (the second view) of the exposure apparatus for explaining the substrate replacement operation according to the second modification of the second embodiment, respectively.

Fig. 29 (a) and 29 (b) are a plan view and a side view (the third) of the exposure apparatus for explaining the substrate replacement operation according to the second modification of the second embodiment.

Fig. 30 (a) and 30 (b) are a plan view and a side view (the fourth) of the exposure apparatus for explaining the substrate replacement operation according to the second modification of the second embodiment.

Fig. 31 (a) and 31 (b) are side views of the substrate transfer apparatus for explaining transfer of a substrate from the beam unit to the substrate carry-in hand in the third modification of the second embodiment.

Fig. 32 (a) and 32 (b) are (one) of a plan view and a side view of an exposure apparatus for explaining transfer of a substrate from a beam unit to a substrate carry-in hand in accordance with a fourth modification of the second embodiment.

Fig. 33 (a) and 33 (b) are a plan view and a side view (the second view) of the exposure apparatus for explaining transfer of a substrate from the beam unit to the substrate carry-in hand in the fourth modification of the second embodiment, respectively.

Fig. 34 (a) and 34 (b) are (one of) a top view and a side view of an exposure apparatus for explaining substrate transfer from an external transfer device to a substrate carry-in hand in accordance with a fifth modification of the second embodiment.

Fig. 35 (a) and 35 (b) are a plan view and a side view (the second) of the exposure apparatus for explaining the transfer of the substrate from the external transfer apparatus to the substrate carry-in hand in the fifth modification of the second embodiment, respectively.

Fig. 36 is a perspective view showing a substrate carry-in hand according to a sixth modification of the second embodiment.

Fig. 37 (a) and 37 (b) are diagrams illustrating a configuration example of a substrate carry-in hand.

Fig. 38 is a diagram for explaining a configuration example of the substrate conveying unit.

Fig. 39 is a diagram illustrating a configuration example of the surface plate.

Fig. 40 (a) and 40 (b) are a plan view and a side view showing the configuration of the stage device according to the first and second embodiments and the modification thereof, respectively.

Fig. 41 a) is a plan view showing another example of the stage device, and fig. 41 (b) and 41 (c) are sectional views taken along line a-a of fig. 41 (a).

Fig. 42 (a) is a plan view showing another example of the stage device, and fig. 42 (b) is a sectional view taken along line a-a of fig. 42 (a).

Fig. 43 (a) to 43 (c) are side views for explaining the substrate placement on the stage device shown in fig. 42 (a) and 42 (b).

[ description of symbols ]

10A to 10L: exposure device

20A, 20G, 20M, 20N: platform device

28A, 28G, 28M, 28N: substrate holder

100A to 100L: substrate conveying device

160A-160L: substrate conveying part

161A-161L: substrate moving-in hand

164: x-axis driving device

182A, 182G, 182M: substrate carrying-in supporting device

184 a: retaining pad

P, P1, P2, P3: substrate board

Detailed Description

First embodiment

First, a first embodiment of the present invention will be described with reference to fig. 1 to 8 (c).

Fig. 1 schematically shows the configuration of an exposure apparatus 10A according to a first embodiment. Fig. 2 is a plan view of a stage device 20A and a substrate transfer device 100A included in the exposure apparatus 10A (partially omitted) of fig. 1. Fig. 3 (a) is a plan view of the stage device 20A, fig. 3 (b) is a side view of the stage device 20A, and fig. 3 (c) is a sectional view taken along line a-a of fig. 3 (a).

The exposure apparatus 10A is, for example, a step and scan type projection exposure apparatus, a so-called scanner, which uses a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) or the like as an exposure object.

As shown in fig. 1, the exposure apparatus 10A includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, a stage apparatus 20A that holds a substrate P whose surface (surface facing the + Z side in fig. 1) is coated with a resist (a sensitive agent), a substrate transfer apparatus 100A, and control systems for these. Hereinafter, as shown in fig. 1, the exposure apparatus 10A is described in which X, Y, and Z axes (the optical axes AX of the illumination system 12 and the projection optical system 16) orthogonal to each other are set, the mask M and the substrate P are relatively scanned in the X axis direction with respect to the projection optical system 16 during exposure, and the Y axis is set in a horizontal plane. The directions of rotation (inclination) about the X, Y, and Z axes are referred to as θ X, θ Y, and θ Z directions, respectively. The positions in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, U.S. Pat. No. 5,729,331, and irradiates the mask M with exposure illumination light (illumination light) IL. The illumination light IL may include at least one wavelength of i-rays (365 nm wavelength), g-rays (436 nm wavelength), and h-rays (405 nm wavelength), for example. The wavelength of the light source used in the illumination system 12 and the illumination light IL emitted from the light source are not particularly limited, and may be ultraviolet light such as ArF excimer laser (wavelength 193nm) and KrF excimer laser (wavelength 248nm) or F ₂ Vacuum ultraviolet light such as laser light (wavelength 157 nm).

The mask stage 14 holds a light-transmissive mask M. The mask stage 14 is driven by a mask stage driving system (not shown) including a linear motor, for example, at least in the scanning direction (X-axis direction) by a predetermined stroke (stroke). The mask stage 14 is driven by a micro-motion drive system that moves the X position or the Y position thereof by a stroke in order to adjust the relative position with respect to at least one of the illumination system 12, the stage device 20A, and the projection optical system 16. The positional information of the mask stage 14 is obtained by a mask stage position measurement system (not shown) including a linear encoder system or an interferometer system, for example.

The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in U.S. Pat. No. 6,552,775 and the like, and includes, for example, a plurality of optical systems each having a telecentric (telecentric) side for forming an erect image. Further, the projection optical system 16 may not be a multi-lens type. The projection optical system may be a single projection optical system used in a semiconductor exposure apparatus.

In the exposure apparatus 10A, when the mask M positioned in a predetermined illumination region of the illumination light IL from the illumination system 12 is illuminated, a projection image (image of a partial pattern) of the pattern of the mask M in the illumination region is formed in the exposure region by the projection optical system 16. Then, the mask M is moved relatively in the scanning direction with respect to the illumination region (illumination light IL) and the substrate P is moved relatively in the scanning direction with respect to the exposure region, whereby scanning exposure is performed on the substrate P, and a pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

(platform device 20A)

The stage device 20A includes a surface plate 22, a substrate table 24, a holding device 26, and a substrate holder 28A.

The surface plate 22 is a plate-like member having a rectangular shape in plan view (viewed from the + Z side) and arranged such that the upper surface (+ Z surface) is parallel to the XY plane, and is provided on the floor surface F via a vibration isolation device (not shown). The support device 26 is mounted on the surface plate 22 in a non-contact state, and supports the substrate stage 24 from below in a non-contact manner. The substrate holder 28A is disposed on the substrate table 24, and the substrate table 24 and the substrate holder 28A are integrally driven by a not-shown table driving system included in the table device 20A. The platform driving system includes: a coarse movement system, for example, including a linear motor, which drives the substrate stage 24 in the X-axis and Y-axis directions (along the upper surface of the surface plate 22) by a predetermined stroke; and an inching system including, for example, a voice coil motor, and minutely driving the substrate stage 24 in directions of 6 degrees of freedom (X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z). The stage device 20A includes a stage measurement system including, for example, an optical interferometer system, an encoder system, or the like, and obtains positional information of the substrate stage 24 in the 6-degree-of-freedom direction.

As shown in fig. 3 (a), the substrate holder 28A has a rectangular upper surface TS (+ Z-side surface) in a plan view, and a substrate P is placed thereon. The aspect ratio of the upper surface TS is substantially the same as the substrate P. For example, the lengths of the long side and the short side of the upper surface TS are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively.

The upper surface TS of the substrate holder 28A is processed to be flat over the entire surface. Further, a plurality of micro holes (not shown) for air blowing and a plurality of micro holes (not shown) for vacuum suction are formed in the upper surface of the substrate holder 28A. Further, the micro-hole for air blowing and the micro-hole for vacuum suction may be used in common. The substrate holder 28A can suck air between the upper surface and the substrate P through the plurality of holes by using a vacuum suction force supplied from a vacuum apparatus (not shown) to cause the substrate P to be adsorbed on the upper surface TS (to perform surface leveling). The substrate holder 28A is a so-called pin clamp type holder, and a plurality of pins (very small pins having a diameter of, for example, about 1 mm) are arranged at substantially equal intervals. By providing the plurality of pins, the substrate holder 28A can reduce the possibility of supporting the substrate P by sandwiching dust or foreign matter between the back surfaces of the substrates P, and can reduce the possibility of deformation of the substrates P due to sandwiching of the foreign matter. The substrate P is held (supported) on the upper surfaces of the plurality of pins. An XY plane formed by the upper surfaces of the plurality of pins is set as the upper surface of the substrate holder 28A. The substrate holder 28A can supply a pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) between the upper surface TS and the substrate P through the hole (supply air), thereby separating the back surface of the substrate P adsorbed on the substrate holder 28A from the upper surface TS (floating up the substrate P). Further, by generating a time difference in timing of supplying the pressurized gas by each of the plurality of holes formed in the substrate holder 28A, by appropriately replacing the hole portion for performing vacuum suction and the hole portion for supplying the pressurized gas, or by appropriately changing the air pressure during suction and supply, the ground state of the substrate P can be controlled (for example, by preventing air accumulation from occurring between the back surface of the substrate P and the upper surface of the substrate holder 28A).

Further, the substrate holder 28A may perform the planar alignment of the substrate in a state of being supported in a floating manner without causing the substrate to be adsorbed to the upper surface TS. In this case, the substrate holder 28A supplies a pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) to the back surface of the substrate P through the hole portion (supply gas), thereby interposing the gas between the lower surface of the substrate P and the upper surface of the substrate holder 28A (i.e., forming a gas film). In addition, the substrate holder 28A sucks the gas between the substrate holder 28A and the substrate P through the hole portion for vacuum suction by using the vacuum suction device, and applies a downward force (preload) in the gravity direction to the substrate P, thereby imparting rigidity in the gravity direction to the gas film. The substrate holder 28A may apply a force for controlling the flatness (for example, a force for correcting or correcting the flatness) to the substrate P while floating the substrate P in the Z-axis direction through a small gap by balancing the pressure and flow rate of the pressurized gas and the vacuum suction force to hold (support) the substrate P in a non-contact manner. Further, each hole portion may be formed by processing the substrate holder 28A, or air may be supplied or sucked by forming the substrate holder 28A with a porous material. The upper surface TS of the substrate holder 28A for supporting the substrate P in a floating manner is not a surface on which a hole is formed, and an imaginary surface located above the surface by the gap, that is, a lower surface of the substrate having been corrected in a plane is set as the upper surface TS.

As shown in fig. 3 (a), for example, two notches 28b are formed at the + X side end of the upper surface TS of the substrate holder 28A so as to be spaced apart in the Y axis direction. As shown in fig. 3 (c), the notches 28b are open on the upper surface TS and the + X side surfaces of the substrate holder 28A, respectively.

(substrate transport apparatus 100A)

As shown in fig. 1, the substrate transport apparatus 100A includes a port (port) unit 150A, a substrate transport unit 160A, and a transport apparatus 180A. The port unit 150A and the substrate transfer unit 160A are provided on the + X side with respect to the stage device 20A. For example, the substrate transfer apparatus 100A transfers the substrate P between an external apparatus (not shown) such as a coater/developer and an exposure apparatus. The substrate transfer portion 160A is used to transfer the exposed substrate P from the substrate holder 28A to the port portion 150A (P1), and transfer a new substrate P to be exposed from the port portion 150A to the substrate holder 28A (P2). The substrate P2 may be an unexposed (both primary and unexposed) substrate, or a substrate to which the second and subsequent exposures are applied.

The transfer of the substrate P between the external apparatus and the exposure apparatus 10A is performed by an external transfer apparatus 300, and the external transfer apparatus 300 is disposed outside a chamber (chamber) not shown in the drawings, which houses the illumination system 12, the mask stage 14, the projection optical system 16, the stage apparatus 20A, the substrate transfer apparatus 100A, and the like. The external transfer device 300 has a fork-shaped robot, and can transfer the substrate P placed thereon from an external apparatus to the port portion 150A in the exposure apparatus 10A. As described above, the substrate transfer unit 160A transfers the substrate P from the port unit 150A to the substrate holder 28A. The external transfer apparatus 300 can transfer the exposed substrate P transferred from the substrate transfer apparatus 100A to the port portion 150A from the chamber to the external apparatus.

As shown in fig. 2, the port portion 150A includes a beam unit 152, and the beam unit 152 is configured by a plurality of (for example, 8 beams in the first embodiment) beams 153 arranged at predetermined intervals in the Y axis direction. A plurality of micro holes (not shown) for blowing air are formed in the upper surface of each cross member 153. The beam unit 152 can move the back surface of the substrate P away from the upper surface of the beam unit 152 (float the substrate P) by supplying a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the back surface of the substrate P and the upper surface of the beam unit 152 through the hole (supply air). The intervals in the Y-axis direction of the plurality of cross members 153 are set as follows: the substrate P can be supported from below by the beam unit 152, and when the robot hand of the external transfer device 300 and the beam unit 152 are arranged at the same height, the plurality of finger portions 310 of the robot hand can be arranged (inserted and removed) between the plurality of beams 153.

The length of each beam 153 in the longitudinal direction (X-axis direction) is slightly longer than the length of the substrate P in the longitudinal direction, and the length in the width direction (Y-axis direction) is set to be about 1/50, for example, or about 10 to 50 times the thickness of the substrate P, for example, of the length of the substrate P in the width direction.

As shown in fig. 1, the plurality of beams 153 (which overlap in the depth direction of the paper plane in fig. 1) are supported from below by a plurality of (e.g., 2) rod-shaped legs 154 at positions inward of both ends in the X-axis direction. The lower ends of the plurality of legs 154 supporting the respective cross members 153 are connected to the base 157 via joint portions 155a, and the upper ends are connected to the cross members 153 via joint portions 155 b. In the substrate transport apparatus 100A, the positions of the beam unit 152 in the X-axis direction and the Z-axis direction can be integrally changed by a link mechanism including the beam 153, the legs 154, the joint 155a, the joint 155b, and the base 157. The link mechanism is constituted as follows: when the beam unit 152 stops at the substrate transfer position to the substrate holder 28A, the upper surface TS of the substrate holder 28A, the upper surface of an offset beam 185a described later, and the upper surface of the beam unit 152 are substantially included in the same plane.

Referring back to fig. 2, the substrate transfer unit 160A has a fork-shaped hand 161A (hereinafter referred to as a substrate loading hand 161A) similar to the external transfer device 300 (see fig. 1 and 2). The substrate carrying-in hand 161A includes a plurality of (for example, 7 in the first embodiment) finger parts 162A, and the plurality of finger parts 162A form a holding surface (hereinafter, referred to as a substrate holding surface) for holding the substrate P.

The vicinities of the + X-side ends of the plurality of finger parts 162A are connected to each other by a connecting member 163A. On the other hand, the end portions of the plurality of finger portions 162A on the-X side (the substrate holder 28A (see fig. 2 and the like)) are free ends, and the adjacent finger portions 162A are spaced apart on the substrate holder 28A side.

As shown in fig. 1, the substrate holding surface formed by the plurality of finger portions 162A is inclined with respect to a holding surface (hereinafter referred to as a holder substrate holding surface) on which the substrate is held by the substrate holder 28A. That is, the substrate carry-in hand 161A has a substrate holding surface that is inclined with respect to the substrate holding surface of the substrate holder 28A and holds the substrate P (P2). Therefore, the substrate carry-in hand 161A holds the + X-side end of the substrate P2 at a position higher than the-X-side end of the substrate P2 (+ Z side). Regarding the Z position of the substrate carry-in hand 161A, the-X side end of the substrate carry-in hand 161A is closer to the substrate holder 28A than the + X side end. In the vicinity of the distal ends (-X side) of the plurality of finger parts 162A, the thickness of the finger parts 162A becomes thinner as the distance from the distal ends becomes closer. In other words, the finger 162A is tapered at the front end, having a conical shape. Since the plurality of fingers 162A have a conical shape, the-X side end of the substrate P2 can be brought closer to the upper surface TS of the substrate holder 28A than in the case where the fingers 162A are uniform in thickness. In addition, since the area of the substrate carry-in hand 161A at the Z position close to the substrate holder 28A can be reduced, the possibility of the substrate carry-in hand 161A contacting the substrate holder 28A can be reduced.

As with the robot hand of the external transfer device 300 (see fig. 2), each of the finger portions 162A of the substrate carrying-in hand 161A is disposed so as not to overlap the beam 153 of the beam unit 152 in a position in a plan view in the Y-axis direction. A plurality of support pads 164A for supporting the back surface of the substrate P are attached to the respective finger portions 162A, and a substrate holding surface of the substrate carry-in hand 161A is formed by the support pads 164A. The entire back surface of the substrate P may not be supported by the support pad 164A. The substrate holding surface is formed by virtually connecting the support surfaces of the support pads 164A.

As shown in fig. 2, the connecting member 163A is formed of a hollow member having a rectangular shape and a thin thickness when viewed from above, and extends in the Y-axis direction, which is a direction in which the plurality of cross members 153 are arranged. Both ends of the coupling member 163A in the Y axis direction are coupled to a pair of X axis driving devices 164 for moving the substrate carry-in hand 161A in the X axis direction. Further, the pair of X-axis driving devices 164 may be driven independently of each other, or may be mechanically coupled by a gear or a belt (belt) and driven simultaneously by one driving motor. Alternatively, the coupling member 163A may be configured as follows: the X-axis driving device 164 is not limited to a pair but only one-sided in the Y-axis direction. The pair of X-axis driving units 164 are vertically movable by a Z-axis driving unit, not shown. Thus, the substrate carrying-in hand 161A can move between a position higher than the upper surface of the beam unit 152 (+ Z side) and a position lower than the beam unit 152 (-Z side).

The substrate transfer unit 160A includes one or more (two, for example, in the first embodiment) substrate carry-out hands 170A. In the first embodiment, the two substrate carrying-out hands 170A are disposed apart from each other in the Y-axis direction.

Each substrate carrying-out hand 170A includes a holding pad 171A. The holding pad 171A can hold the lower surface of the substrate P by suction by a vacuum suction force supplied from a vacuum device not shown.

The substrate carrying-out hand 170A is configured, for example, in the form of a multi-joint robot or a parallel link robot (parallel link robot), and can change the X position, the Y position, and the Z position of the holding pad 171A.

(carrying device 180A)

The transfer device 180A is a device that cooperates with the substrate transfer unit 160A at the time of substrate exchange. In other words, in the exposure apparatus 10A, the substrate P is carried into and out of the substrate holder 28A by using the substrate carrying section 160A and the carrying device 180A. In addition, the transfer device 180A is also used for positioning the substrate P when the substrate P is placed on the substrate holder 28A. The conveying device 180A will be described in detail with reference to fig. 3 (a) to 3 (c).

As shown in fig. 3 (a) to 3 (c), the transfer device 180A includes a pair of substrate carry-in and holding devices 182A, a pair of substrate carry-out and holding devices 183A, and an offset beam portion 185.

As shown in fig. 3 (b), the substrate carrying-in holding device 182A includes a holding pad 184a, an X actuator 186X, and a Z actuator 186Z.

The holding pad 184a is formed of a plate-shaped member having a rectangular shape in a plan view, and can suction and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum apparatus not shown. In addition, as shown in fig. 3 (b), the holding pad 184a may be driven in the Z-axis direction by a Z actuator 186Z. The holding pads 184a and the Z actuator 186Z can be integrally driven in the X-axis direction by an X actuator 186X attached to the substrate stage 24.

As shown in fig. 3 (c), the substrate carry-out and holding apparatus 183A includes a holding pad 184b, an X actuator 186X, and a Z actuator 186Z. As shown in fig. 3 (c), a part of the holding pad 184b of one of the (+ Y side) substrate carry-out jigs 183A is inserted into one of the (+ Y side) notches 28b formed in, for example, the two notches 28b of the substrate holder 28A. In addition, a part of the holding pad 184b of the other (-Y side) substrate carry-out and holding device 183A is inserted into the other (-Y side) notch 28 b.

The holding pad 184b is a plate-shaped member having a rectangular shape in a plan view, and can hold the lower surface of the substrate P by suction by a vacuum suction force supplied from a vacuum apparatus not shown.

As shown in fig. 3 (c), the holding pad 184b may be driven in the Z-axis direction by the Z actuator 186Z. In addition, the holding pad 184b and the Z actuator 186Z may be integrally driven in the X-axis direction by an X actuator 186X attached to the substrate stage 24. The Z actuator 186Z includes posts supporting the holding pads 184b, which are arranged outside the substrate holder 28A. The holding pad 184b is driven by the Z actuator 186Z in the notch 28b, and is movable between a position where it can be held in contact with the lower surface of the substrate P and a position away from the lower surface of the substrate P. In addition, the holding pad 184b is movable by the Z actuator 186Z between a position where a part thereof is housed in the notch 28b and a position higher than the upper surface of the substrate holder 28A. The holding pad 184b is driven by the X actuator 186X integrally with the Z actuator 186Z, and is movable in the X axis direction.

The offset beam portion 185 has a plurality of (for example, 8 in the first embodiment) offset beams 185a arranged at predetermined intervals in the Y-axis direction. The offset beam 185a is supported by a support member 185b mounted on the substrate stage 24, and is arranged such that its upper surface is substantially contained in the same plane as the upper surface TS of the substrate holder 28A. A plurality of micro holes (not shown) for blowing air are formed in the upper surface of the offset beam 185 a. The offset beam 185a supplies the pressurized gas (air) supplied from the pressurized gas supply device (not shown) between the upper surface of the offset beam 185a and the back surface of the substrate P through the hole (supply air). This makes it possible to separate the rear surface of the substrate P from the upper surface of the offset beam 185a (to float the substrate P).

The operation of the carrying device 180A will be described in detail below.

The configurations of the substrate carry-in and carrying device 182A and the substrate carry-out and carrying device 183A may be changed as appropriate. For example, in the present embodiment, the holding

devices

182A and 183A are mounted on the substrate stage 24, but the present invention is not limited thereto, and may be mounted on the substrate holder 28A or an XY stage device (not shown) for driving the substrate stage 24 in an XY plane, for example. The positions and the number of the

holders

182A and 183A are not limited to this, and may be attached to the side surfaces on the + Y side and the-Y side of the substrate table 24, for example.

In the exposure apparatus 10A (see fig. 1) configured as described above, the mask M on the mask stage 14 is loaded by a mask loader (not shown) under the management of a main control device (not shown), and the substrate P on the substrate holder 28A is carried in by the substrate transfer device 100A. Then, the main controller executes alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, the main controller successively performs a step-and-scan exposure operation on a plurality of shot (shot) regions set on the substrate P. Since the exposure operation is the same as the step-and-scan exposure operation performed in the past, the X direction is assumed to be the scanning direction. Further, the detailed description of the step-and-scan type exposure operation will be omitted. Then, the substrate P (P1) whose exposure process has been completed is carried out from the substrate holder 28A by the substrate transfer apparatus 100A, and another substrate P (P2) to be exposed is carried into the substrate holder 28A, whereby the substrate P on the substrate holder 28A is replaced, and a series of exposure operations for a plurality of substrates P is performed.

(substrate replacement action)

Hereinafter, an operation of replacing the substrate P on the substrate holder 28A of the exposure apparatus 10A will be described with reference to fig. 4 to 8. The following substrate replacement operation is controlled by a main controller, not shown. In the side views of fig. 4 to 8 for describing the substrate replacing operation, the X-axis drive device 164 and the like are not shown as appropriate in order to facilitate understanding of the operation of the substrate transfer unit 160A.

In the following description, a carrying-in operation in which the exposed substrate P1 is mounted in advance on the substrate holder 28A of the stage device 20A, the exposed substrate P1 is carried out, and the substrate P2 different from the substrate P1 is mounted on the substrate holder 28A will be described. In each of fig. 4 to 8, the operation direction of the constituent elements is schematically indicated by a blank arrow for easy understanding. The state of the suction gas or the supply gas (supply gas) is schematically indicated by a group of black arrows.

As shown in fig. 4 (a) and 4 (b), before the substrate P2 is conveyed to the port unit 150A by the external conveyance device 300, the substrate carry-in hand 161A moves so that the upper surface of the substrate carry-in hand 161A is positioned below the beam unit 152. At this time, the port 150A rotationally drives the leg 154 in the θ y direction. Thus, the substrate carry-in hand 161A is disposed below the beam unit 152 in the Z direction, and the robot of the external transfer device 300 can be disposed between the beam unit 152 and the substrate carry-in hand 161A.

The position of the port section 150A is a substrate transfer position to the external transfer device 300.

The robot of the external transport apparatus 300 holding the substrate P2 moves in the-X direction so that the substrate P2 is positioned above the beam unit 152 (+ Z side). At this time, the Y positions of the robot hand of the external transport apparatus 300 and the beam unit 152 are positioned so that the respective finger portions of the fork-shaped robot hand included in the external transport apparatus 300 are positioned in the gap between the beam units 152 adjacent in the Y-axis direction in plan view.

Then, as shown in fig. 4 (c), the hand of the external transfer device 300 is driven downward, and the finger portions of the hand pass through the gaps between the plurality of beams of the beam unit 152, whereby the external transfer device 300 transfers the substrate P2 to the beam unit 152. The Z position of the robot hand of the external transfer device 300 is controlled so as not to contact the substrate transfer unit 160A waiting below the beam unit 152. Then, the robot hand of the external carrying device 300 is driven in the + X direction, and thereby retreats from the inside of the exposure device 10A.

The substrate transfer unit 160A moves upward (moves in the + Z direction), and the holding pad 171A of the substrate carry-out hand 170A sucks and holds the lower surface of the substrate P2 on the beam unit 152. Then, as shown in fig. 5 (a), the plurality of beams 153 included in the beam unit 152 of the port portion 150A are supplied with pressurized gas from the upper surfaces of the plurality of beams 153 to the lower surface of the substrate P2, respectively. As a result, the substrate P2 is sucked and supported by the substrate transfer unit 160A, and the substrate P2 floats with a slight gap (for example, several tens of micrometers to several hundreds of micrometers) from the beam unit 152. The leg 154 of the port portion 150A is rotationally driven in the θ y direction, whereby the beam unit 152 is moved in the-X direction and the-Z direction.

The holding pad 171A of the substrate carry-out hand 170A which sucks and holds the lower surface of the substrate P2 is finely driven appropriately in the X-axis, Y-axis, and θ z-direction (3-degree-of-freedom direction in the horizontal plane), whereby the position of the substrate P2 with respect to the substrate carry-in hand 161A is adjusted (aligned). Since the substrate P2 is supported by the beam unit 152 in a non-contact manner, the position of the substrate P2 can be adjusted (moved a minute amount) in 3 degrees of freedom within the horizontal plane in a low-friction state. Further, the position adjustment (alignment) of the substrate P2 described herein may be omitted, and may be controlled as needed.

Then, the substrate transfer unit 160A is driven to move up in the + Z direction to the position shown in fig. 5 (b). Thereby, the substrate P2 on the beam unit 152 is transferred to the substrate carry-in hand 161A. In other words, the substrate P2 on the beam unit 152 is scooped from below by the substrate carry-in hand 161A.

By further rotationally driving the legs 154 in the θ y direction, the beam unit 152 is further driven in the-X direction and moved to a substrate transfer position (position shown in fig. 5 c) with the substrate holder 28A to carry out the substrate P1 from the substrate holder 28A.

In addition, in the stage device 20A, the substrate stage 24 is moved in the + X direction so that the substrate holder 28A on which the exposed substrate P1 is placed is arranged at a predetermined substrate replacement position (and the substrate transfer position of the port 150A) simultaneously with the transfer operation (including the alignment operation as appropriate) of the substrate P2 from the external transfer device 300 to the substrate carry-in hand 161A via the port 150A. In the first embodiment, the substrate replacement position of the substrate holder 28A is located on the-X side with respect to the port portion 150A. In addition, although the substrate holder 28A is shown in the same position in fig. 4 (a) to 5 (b) for easy understanding, the substrate holder 28A is appropriately moved in the X direction and the Y direction when the exposure apparatus 10A performs the exposure operation on the substrate P1 simultaneously with the transfer operation of the substrate P2 from the external transfer apparatus 300 to the substrate carry-in hand 161A at the time of normal operation.

Further, simultaneously with the movement of the substrate holder 28A to the substrate replacement position, the holding pads 184b of the pair of substrate carry-out and support devices 183A are driven to be raised. The holding pad 184b holds, by suction, a part of the substrate P1 held by vacuum suction on the upper surface of the substrate holder 28A (a part disposed in the notch 28b (see fig. 3a and 3 c)).

Then, as shown in fig. 5 (c), the substrate carrying-in hand 161A supporting the substrate P2 is moved in the-X direction. Thereby, the substrate carry-in hand 161A moves above the substrate holder 28A positioned at the substrate replacement position. On the other hand, the Z position of the upper surface of the beam unit 152 and the Z position of the upper surface of the substrate holder 28A are set to be substantially the same height. When these heights are set to be substantially the same, the substrate holder 28A may be driven in the Z-axis direction to adjust the height.

In the offset beam portion 185, pressurized gas is ejected from the upper surface of the offset beam 185 a.

In the stage device 20A, a pressurized gas is supplied (ejected) from the upper surface of the substrate holder 28A to the lower surface of the substrate P1. Thereby, the substrate P1 floats upward from the upper surface TS of the substrate holder 28A, and the friction between the lower surface of the substrate P1 and the upper surface TS of the substrate holder 28A is in a low friction state.

Further, in the stage device 20A, the holding pad 184b of the substrate carry-out and support device 183A is slightly driven to ascend in the + Z direction so as to follow the floating operation of the substrate P1, and moves in the + X direction (port portion 150A side) by a predetermined stroke in a state where a part of the substrate P1 is sucked and held. The amount of movement of the holding pad 184b (i.e., the board P1) is set to, for example, about 50mm to 100 mm. Thus, the end of the substrate P1 on the + X side is supported by the shift beam 185a in a non-contact manner, and the position of the substrate P1 is shifted from the substrate holder 28A in the X direction by a predetermined amount toward the + X direction side.

Further, in the stage device 20A, the holding pads 184a of the pair of substrate carrying-in supporters 182A are moved in the + X direction by a predetermined stroke.

As shown in fig. 6 (a), the substrate carrying-in hand 161A supporting the substrate P2 is disposed at a predetermined position above the substrate holder 28A. Thereby, the substrate P2 is located substantially directly above the substrate holder 28A positioned at the substrate replacement position. At this time, the substrate carry-in hand 161A and the substrate holder 28A are positioned so that the Y position of the substrate P1 substantially coincides with the Y position of the substrate P2. On the other hand, the substrate P1 and the substrate P2 are disposed at different positions in the X direction. Specifically, since the substrate P1 is offset from the substrate holder 28A to the + X side as described above, the X positions of the substrates P1 and P2 are relatively different, and the end of the substrate P2 on the-X side is disposed (protrudes) further to the-X side than the end of the substrate P1 on the-X side. At this time, the substrate P2 on the substrate carrying-in hand 161A may be held by suction by the substrate carrying-out hand 170A on its lower surface, by suction by the finger part 162A, or held by friction. Further, the notch 28b may not be formed in the substrate holder 28A. As described above, when the lengths of the long and short sides of the upper surface of the substrate holder 28A are set to be slightly shorter than the lengths of the long and short sides of the substrate P, respectively, the notch 28b may not be formed in the substrate holder 28A as long as the substrate P is moved in the + X-axis direction while the holding pad 184b holds the substrate P protruding from the substrate holder 28A and is displaced to the + X side from the upper surface TS of the substrate holder 28A. In this case, the flatness correction on the substrate holder 28A may also be performed at the end of the substrate P.

Thereafter, as shown in fig. 6 (b), the substrate carry-in hand 161A is driven in the-Z direction to a position where it does not contact the substrate holder 28A. The substrate carry-in hand 161A brings the-X-side end of the substrate P2 (a part of the substrate P2) into contact with the holding pad 184a of the substrate carry-in holding device 182A. Then, the holding pads 184a suction-hold a part of the substrate P2 on the substrate carry-in hand 161A from below. The position of the holding pad 184a in the Z-axis direction is a position between the upper surface of the substrate holder 28A and the substrate holding surface of the substrate carry-in hand 161A, and a part of the substrate P2 is sucked and held. When the holding pad 184a holds the substrate P2 by suction, the X position and the Y position of the substrate P2 are restricted. This prevents the substrate P2 from moving out of the substrate carry-in hand 161A. The substrate carrying in and holding device 182A holds the narrow area of the-X-side end of the substrate P2. More specifically, the area is such that the entire substrate P2 cannot be supported only by the substrate loading device 182A. Although the X-direction dimension of the finger portion of the substrate carrying-in hand 161A is described as being shorter than the X-direction dimension of the substrate P2, the X-direction dimension of the finger portion of the substrate carrying-in hand 161A may be the same or longer. In this case, the holding pads 184a may hold the regions between the finger portions of the substrate carry-in hand 161A.

Simultaneously with the suction holding operation of the holding pad 184a to the substrate P2, the substrate carry-out hand 170A released from the suction holding of the substrate P2 is driven to suction-hold the lower surface of the portion of the substrate P1 shifted to the + X side from the substrate holder 28A. In addition, the beam unit 152 ejects pressurized gas.

Then, as shown in fig. 6 (c), the substrate transport unit 160A is moved in the carry-out direction (+ X direction) while the holding pad 184a of the substrate carrying-in holding device 182A holds a part of the substrate P2 by suction (the (-X side end). At this time, pressurized gas may be supplied (ejected) from the finger portion 162A of the substrate carrying-in hand 161A to the lower surface of the substrate P2 to reduce contact friction.

The substrate transfer unit 160A is driven in the carrying-out direction (+ X direction), and the substrate carrying-out hand 170A holding the substrate P1 is driven in the + X direction. Thereby, the substrate P1 moves from above the substrate holder 28A onto the port portion 150A (the beam unit 152). At this time, since the pressurized gas is ejected from the upper surfaces of the cross beams 153 of the cross beam unit 152, the substrate P1 is carried out of the substrate holder 28A in a non-contact state (floating state) with respect to the substrate holder 28A and the port portion 150A. The holding pads 184b of the pair of substrate carry-out holders 183A are driven in the-Z direction and the-X direction so as to be partially accommodated in the notches 28b (see fig. 3 (a) and 3 (c)) of the substrate holder 28A.

As shown in fig. 6 (c) and fig. 7 (a) to 7 (c), the substrate carry-in hand 161A is moved in the + X direction, and thereby the substrate carry-in hand 161A is moved in the X direction relative to the substrate P2, a part of which is held by the holding pad 184 a. Then, as shown in fig. 7 (c), the substrate carry-in hand 161A is moved in the X direction to the + X side of the substrate holder 28A, and thereby the substrate carry-in hand 161A is retracted from the upper space of the substrate holder 28A (the space on the + Z side) and the lower space of the substrate P2 (the space on the (-Z side). In other words, by moving the substrate carry-in hand 161A to the + X side of the substrate holder 28A, the substrate P2 partially held by the holding pad 184a is evacuated from the space between the substrate holder 28A and the substrate P2. When the substrate carry-in hand 161A moves to the + X side of the substrate holder 28A, it moves above the substrate holder 28A, that is, at a position higher than the upper surface of the substrate holder 28A at the Z position. In this manner, by retracting the substrate carry-in hand 161A from the space between the substrate P2 and the substrate holder 28A, the substrate P2 is transferred from the substrate carry-in hand 161A to the substrate holder 28A. That is, the substrate P2 is loaded from the substrate loading hand 161A into the substrate holder 28A. In the substrate P2, the region between the substrate carry-in hand 161A and the holding pad 184a is held by the substrate holder 28A.

Here, the holding pad 184a holds a part of the substrate P2 by suction, thereby fixing the relative position of the substrate P2 with respect to the substrate holder 28A in the X direction and the Y direction or restricting the relative position within a predetermined small movable range. The predetermined movable range is set by a drive range of the holding pad 184a with respect to the substrate holder 28A (or the substrate table 24). The holding pad 184a may not necessarily be provided on the substrate table 24 (or the substrate holder 28A) as long as it has a function of setting the relative position (relative movable range) of the substrate P2 with respect to the substrate holder 28A in at least one of the X direction and the Y direction, and may be configured to be provided on a structure such as a column (column) not shown in the exposure apparatus 10A and suspended from above the substrate holder 28A, for example. In this case, the holding pad 184a may hold the upper surface of the substrate P2.

As described above, the substrate carry-in hand 161A is relatively moved in the + X direction with respect to the substrate holder 28A, that is, in the direction along the substrate holding surface of the substrate holder 28A and in the direction parallel to the substrate holding surface of the substrate holder 28A, thereby retreating from below the substrate P2, and along with this, a part of the substrate P2 is gradually mounted on the substrate holder 28A from the-X side in order. At this time, the area of the substrate P2 held by the substrate carry-in hand 161A decreases, and the area of the substrate P2 supported by the substrate holding surface of the substrate holder 28A increases. Thus, during at least a part of the period until the-X-side tip of the substrate carry-in hand 161A moves to the + X side of the substrate holder 28A (i.e., until the substrate carry-in hand 161A completely retracts from the space between the substrate holder 28A and the substrate P2), the substrate carry-in hand 161A, the substrate holder 28A, and the holding pads 184a simultaneously support (or hold) different portions of the substrate P2. In other words, during the at least a part of the period, substantially the entire surface of the substrate P2 is supported by the substrate carry-in hand 161A, the substrate holder 28A, and the holding pad 184a (any part of the substrate P2 is supported by any one of the substrate carry-in hand 161A, the substrate holder 28A, and the holding pad 184 a). The substrate loading hand 161A and the substrate holder 28A may support (or hold) the substrate P2 not only in a contact state but also in a non-contact state with a gas (air gap) interposed therebetween.

In addition, while the front end portion on the-X side of the substrate carry-in hand 161A moves to the + X side of the substrate holder 28A as described above, the position (Z position) in the Z axis direction (direction perpendicular to the holder substrate holding surface of the substrate holder 28A) of the portion of the substrate P2 supported by the substrate carry-in hand 161A is higher than the Z position of the portion of the substrate P2 held by the holding pads 184 a. As the substrate carry-in hand 161A is retreated in the + X direction from the space between the substrate P2 and the substrate holder 28A as described above, the position (Z position) in the Z axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A gradually decreases. When the substrate P2 has low flexibility (has rigidity and is hard to bend), the substrate loading hand 161A is retracted and the substrate P2 is landed on the substrate holder 28A so as to draw a circle in the θ y direction about the portion held by the holding pad 184a, but in this case, the Z position of the portion of the substrate P2 held by the substrate loading hand 161A is gradually lowered. Further, the position (X position) in the X axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A gradually moves in the + X direction.

As the substrate carry-in hand 161A is retracted from below the substrate P2 as described above, when the substrate P2 is sequentially placed on the substrate holder 28A from the-X side, the position of the substrate P2 with respect to the substrate holder 28A is measured by a position measuring device, not shown. Based on the measurement result, the holding pads 184a of the pair of substrate carrying-in/supporting devices 182A are driven in at least one of the X-axis direction and the Y-axis direction. Thereby, the angles of the substrate P2 with respect to the X-axis direction position, the Y-axis direction position, and the θ z direction of the substrate holder 28A are adjusted. When the rotation adjustment in the θ z direction is performed, the holding pads 184a may be driven by different amounts. The position measuring device (not shown) may be disposed on at least one of the stage device 20A (e.g., the substrate holder 28A and the substrate stage 24) and a structure such as a cylinder (not shown) provided in the exposure apparatus 10A.

As shown in fig. 8 (a), the substrate P2 transferred from the substrate carrying-in hand 161A to the substrate holder 28A is placed on the substrate holder 28A except for a portion sucked and held by the holding pad 184 a. Further, the holding pads 184a may be driven in the Z-axis direction to assist the transfer of the substrate P2 to the substrate holder 28A. At this time, the supply (ejection) of the pressurized gas from the substrate holder 28A becomes air resistance, and the substrate P2 can be prevented from directly hitting the substrate holder 28A, and the substrate P2 can be prevented from being damaged. Even if the pressurized gas is not supplied (ejected) from the substrate holder 28A, the air between the upper surface of the substrate holder 28A and the substrate P2 becomes air resistance, and the above-described effect can be obtained. Then, the supply (ejection) of the pressurized gas from the substrate holder 28A is stopped, and the substrate P2 lands on the upper surface TS of the substrate holder 28A and comes into contact with the upper surface TS. Thus, the angles of the substrate P2 with respect to the X-axis direction position, the Y-axis direction position, and the θ z direction of the substrate holder 28A do not change.

Further, the beam unit 152 stops the ejection of the pressurized gas to the substrate P1. The substrate carry-out hand 170A releases the hold of the substrate P1.

After the substrate carrying-out hand 170A releases the hold of the substrate P1, the substrate carrying part 160A is driven to be raised. The beam unit 152 on which the substrate P1 is placed moves to the substrate transfer position with the external transfer device 300.

As shown in fig. 8 (b), when the substrate P2 is placed on the substrate holder 28A, the holding pad 184a releases the suction holding of the substrate P2 and moves in the-X direction so as to retract from below the substrate P2. Thus, the portion of the substrate P2 held by the holding pad 184a is placed on the upper surface of the substrate holder 28A.

The robot hand of the external carrying device 300 is driven in the-X direction at a lower Z position than the beam unit 152, and is disposed below the beam unit 152.

Then, as shown in fig. 8 (c), the stage device 20A moves to a predetermined exposure start position while the substrate P2 is held by suction by the substrate holder 28A. The operation of the stage device 20A during the exposure operation of the substrate P2 will not be described.

On the other hand, the hand of the external carrying device 300 moves upward, and picks up the board P1 on the beam unit 152 from below. The robot hand of the external transport apparatus 300 holding the exposed substrate P1 moves in the + X direction and exits from the exposure apparatus 10A.

Then, in the port portion 150A, the beam unit 152 is moved in the-X direction to avoid contact with the substrate carry-in hand 161A, and the substrate carry-in hand 161A is moved in the + X direction.

After the exposed substrate P1 is transferred to an external apparatus (not shown) such as a coater/developer, the robot hand of the external transfer apparatus 300 holds a predetermined substrate P3 to be exposed following the substrate P2 and moves to the port unit 150A.

Then, as illustrated in fig. 4a, before a new substrate P3 is conveyed to the port 150A by the external conveyance device 300, the substrate conveyance unit 160A is moved downward (moved in the-Z direction) so that the upper surface of the substrate loading hand 161A is positioned below the lower surface of the beam unit 152. By repeating the operations shown in fig. 4 (a) to 8 (c), the exposure operation and the like can be continuously performed on the plurality of substrates P.

As described above in detail, the substrate P2 is held by the substrate carry-in hand 161A and the holding pads 184a from the state of being held only by the substrate carry-in hand 161A. Then, as the substrate loading hand 161A moves relative to the substrate holder 28A, the substrate P2 is held by the substrate loading hand 161A, the substrate loading and holding device 182A, and the substrate holder 28A. Then, as shown in fig. 7 (c), when the substrate carrying-in hand 161A moves to a position where the X-axis direction position of the substrate carrying-in hand 161A does not overlap the substrate holder 28A, the substrate P2 is held by the substrate carrying-in carrier 182A and the substrate holder 28A, and finally is supported only by the substrate holder 28A. The substrate P2 is carried into the substrate holder 28A in a state of being held by any one of the substrate carry-in hand 161A, the substrate holder 28A, and the holding pads 184 a.

As described above in detail, at least a part of the movement of carrying out the substrate P1 from the substrate holder 28A and the movement of carrying in the substrate P2 to the substrate holder 28A can be performed simultaneously, and thus the substrate replacement time for the substrate holder 28A can be shortened. Further, when the substrate P2 is loaded into the substrate holder 28A, the substrate loading hand 161A moves above the substrate holder 28A (+ Z side space), and therefore the substrate loading hand 161A can be driven quickly without causing interference on the movement path. This makes it possible to quickly carry in substrate P2 to substrate holder 28A, and thus the substrate replacement time can be shortened. Further, by the movement of moving substrate carry-in hand 161A to + X side above substrate holder 28A, substrate P2 can be carried in to substrate holder 28A while substrate P1 is carried out from substrate holder 28A. That is, since a common drive system is used at the time of substrate carrying-in and the time of substrate carrying-out, it is not necessary to provide different drive systems at the time of substrate carrying-in and the time of substrate carrying-out, and the number of drive systems can be reduced.

As described above in detail, the substrate transfer apparatus 100A according to the first embodiment, which transfers the substrate P2 to the substrate holder 28A, includes: a substrate carry-in hand 161A for holding a substrate P2 above the substrate holder 28A; a substrate carrying-in holding device 182A for holding a part of the substrate P2 held by the substrate carrying-in hand 161A; and an X-axis drive device 164 that moves one of the substrate holder 28A, the substrate carry-in holding device 182A, and the substrate carry-in hand 161A relative to the other in such a manner that the substrate carry-in hand 161A is retracted from above the substrate holder 28A; the substrate holder 28A, the substrate carry-in hand 161A, and the substrate carry-in holding device 182A hold the substrate P2 during the relative movement by the X-axis driving device 164. Thus, since the substrate P2 is gradually placed on the substrate holder 28A from the end on the-X side (the side opposite to the port portion 150A), the substrate holder 28A or the substrate P2 is less likely to be damaged, and dust emission due to contact is reduced. Further, air pockets are less likely to be generated between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed. Further, the placement of the substrate holders 28A of the substrate P2 (for example, the placement may be stopped in the middle) may be controlled in accordance with the retraction state (speed, position) of the substrate carry-in hand 161A. Therefore, the friction may be reduced without blowing the pressurized gas from the substrate carry-in hand 161A to the substrate P2. Further, a mechanism for driving the substrate carrying-in supporting device 182A up and down may be omitted.

In addition, according to the first embodiment, the substrate conveying apparatus 100A that conveys the substrate P2 to the holder substrate holding surface of the substrate holder 28A includes: a substrate carry-in hand 161A provided above the holder substrate holding surface and holding a substrate P2 in which a distance between a part of the substrate P2 and the holder substrate holding surface is shorter than a distance between the other part of the substrate P2 and the holder substrate holding surface; a substrate carrying-in holding device 182A for holding the other part of the substrate P2 held by the substrate carrying-in hand 161A; and an X-axis drive device 164 that moves the substrate holder 28A and the substrate carry-in supporter 182A relative to the substrate carry-in hand 161A in a direction along the substrate holding surface of the holder so that the substrate carry-in hand 161A is retracted from above the substrate holder 28A. Thus, since the substrate P2 can be mounted on the substrate holder 28A in order from the end on the-X side (the side opposite to the port portion 150A), the substrate holder 28A or the substrate P2 is less likely to be damaged, and dust emission due to contact is reduced. In addition, air pockets are less likely to be generated between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed. Further, the placement of the substrate holder 28A of the substrate P2 can be controlled (for example, the placement can be stopped in the middle) according to the retraction state (speed, position) of the substrate carry-in hand 161A. Therefore, the substrate loading hand 161A does not need to discharge the pressurized gas to the substrate P2, and the friction may be reduced. Further, a mechanism for moving the substrate carrying-in supporting device 182A up and down may be omitted.

In addition, according to the first embodiment, the substrate conveyance device 100A that conveys the substrate P2 to the holder substrate holding surface of the substrate holder 28A that can hold the substrate P2 includes: a substrate carrying-in hand 161A having a substrate holding surface for holding the substrate P2 above the substrate holder 28A; a substrate carry-in and holding device 182A for holding a part of the substrate P2 held by the substrate carry-in hand 161A at a position between the substrate holding surface and the substrate holding surface of the holder in the vertical direction; and an X-axis drive device 164 that moves the substrate holder 28A and the substrate carry-in support device 182A relative to the substrate carry-in hand 161A in a state where the substrate carry-in hand 161A holds a part of the substrate P2 so that the substrate carry-in hand 161A is retracted from above the substrate holder 28A. Thus, since the substrate P2 can be mounted on the substrate holder 28A in order from the end on the-X side (the side opposite to the port portion 150A), the substrate holder 28A or the substrate P2 is less likely to be damaged, and dust emission due to contact is reduced. Further, air pockets are less likely to be generated between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed. Further, the placement of the substrate holder 28A of the substrate P2 can be controlled (for example, the placement can be stopped in the middle) according to the retraction state (speed, position) of the substrate carry-in hand 161A. Therefore, the friction may be reduced without blowing the pressurized gas from the substrate carry-in hand 161A to the substrate P2. Further, a mechanism for moving the substrate loading/supporting device 182A up and down may be omitted.

In addition, according to the first embodiment, the substrate conveyance device 100A that conveys the substrate P2 to the holder substrate holding surface of the substrate holder 28A includes: a substrate carrying-in hand 161A for holding a substrate P2 above the substrate holder 28A; a substrate loading/supporting device 182A for holding a part of the substrate P2 held by the substrate loading hand 161A; and an X-axis drive device 164 that moves the substrate holder 28A and the substrate carry-in supporter 182A relative to the substrate carry-in hand 161A in a predetermined direction along the holder substrate holding surface so that the substrate carry-in hand 161A is retracted from above the substrate holder 28A; the substrate carrying-in hand 161A holds the substrate P2 so that the vertical position of the region held by the substrate carrying-in hand 161A in the substrate P2 approaches the substrate holder 28A during the relative movement by the X-axis drive device 164. Thus, since the substrate P2 can be mounted on the substrate holder 28A in order from the end on the-X side (the side opposite to the port portion 150A), the substrate holder 28A or the substrate P2 is less likely to be damaged, and dust emission due to contact is reduced. Further, air pockets are less likely to be generated between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the situation in which the substrate P2 moves on the substrate holder 28A can be suppressed. Further, the placement of the substrate holders 28A of the substrate P2 (for example, the placement may be stopped in the middle) may be controlled in accordance with the retraction state (speed, position) of the substrate carry-in hand 161A. Therefore, the substrate loading hand 161A does not need to discharge the pressurized gas to the substrate P2, and the friction may be reduced. Further, a mechanism for moving the substrate loading/supporting device 182A up and down may be omitted.

In the first embodiment, the substrate holding surface of the substrate carry-in hand 161A is inclined with respect to the holder substrate holding surface. Thus, when substrate carry-in hand 161A is retreated from between substrate P2 and substrate holder 28A, substrate carry-in hand 161A is retreated in a direction away from the lower surface of inclined substrate P2 (a direction different from the wiring direction of the lower surface of substrate P2), so that contact wear can be reduced.

In the first embodiment, the X-axis driving device 164 moves one of the substrate holder 28A, the substrate carry-in supporter 182A, and the substrate carry-in hand 161A relative to the other in a direction along the holding surface of the substrate holder 28A holding the substrate P2. Thus, the substrate carrying-in hand 161A is retracted in a direction away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2), and contact wear can be reduced.

In the first embodiment, the X-axis drive device 164 moves the substrate carry-in hand 161A in a direction parallel to the substrate holding surface of the substrate holder 28A. Thus, the substrate carry-in hand 161A is retracted in a direction away from the lower surface of the inclined substrate P2 (horizontal direction different from the wiring direction of the lower surface of the substrate P2), and contact wear can be reduced.

(first modification)

The first modification is an example in which the configuration of the substrate transport apparatus is changed. Specifically, the substrate transfer apparatus 100B of the exposure apparatus 10B according to the first modification includes a drive system that switches between a state in which the upper surface of the substrate carry-in hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A and a state in which the upper surface of the substrate carry-in hand 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A.

The replacement operation of the substrate P on the substrate holder 28A of the substrate transport apparatus 100B according to the first modification will be described with reference to fig. 9 (a) to 9 (c).

The state of fig. 9 (a) shows a state in which the stage device 20A is disposed at the substrate transfer position to the port unit 150A after the state of fig. 5 (a) of the first embodiment.

As shown in fig. 9 (a), a substrate P2 is placed on the substrate carrying-in hand 161A. At this time, the upper surface of the substrate carry-in hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A.

Then, as shown in fig. 9 (b), the substrate carrying-in hand 161A that supports the substrate P2 from below is driven in the-X direction with the upper surface of the substrate carrying-in hand 161A being substantially parallel to the holder substrate holding surface of the substrate holder 28A. The operations of the stage device 20A, the substrate carry-in supporting device 182A, the substrate carry-out supporting device 183A, and the offset beam 185a are the same as those described in fig. 5 (c), and therefore the description thereof is omitted.

Then, the substrate carry-in hand 161A supporting the substrate P2 from below is disposed at a predetermined position above the substrate holder 28A.

Then, as shown in fig. 9 (c), the substrate carry-in hand 161A is driven to be raised, and the tip thereof is driven to be inclined downward. That is, the substrate carry-in hand 161A is driven so that the upper surface of the substrate carry-in hand 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A. Thus, the leading end of the substrate P2 comes into contact with the holding pad 184a of the substrate carry-in supporting device 182A. The holding pad 184a holds the substrate P2 near the end on the X-side by suction. The substrate loading hand 161A may be set as follows: even if the substrate holder is driven so that the tip thereof is inclined downward, the substrate is moved in the-X direction while being held in parallel with the holder substrate holding surface of the substrate holder 28A at the Z position where the tip thereof is not likely to contact the upper surface of the substrate holder 28A.

The subsequent operations are basically the same as those in the first embodiment, and therefore, the description thereof is omitted.

According to the first modification, when the port unit 150A is handed over to the substrate P2 of the substrate carrying-in hand 161A, the substrate P2 can be handed over from one to the other in a state where the substrate mounting surface of the port unit 150A is parallel to the upper surface of the substrate carrying-in hand 161A, and therefore the possibility of damage to the substrate P2 at the time of substrate handing over can be reduced.

Further, when the substrate carrying-in hand 161A for supporting the substrate P2 from below is moved in the-X direction, the distance between the port portion 150A and the substrate holder 28A and the substrate carrying-in hand 161A in the Z direction can be extended. As a result, when the substrate carrying-in hand 161A is moved in the-X direction, the port 150A and/or the substrate holder 28A are less likely to come into contact with the substrate carrying-in hand 161A.

Further, the substrate carry-in hand 161A may be relatively moved in the + X direction with respect to the substrate holder 28A while gradually changing the inclination angle between the upper surface of the substrate carry-in hand 161A and the holder substrate holding surface of the substrate holder 28A.

As in the first modification, the substrate holding surface of the substrate carry-in hand 161A may be inclined with respect to the holder substrate holding surface of the substrate holder 28A by inclining the substrate carry-in hand 161A.

(second modification)

The second modification is an example in which the shape of the finger portion of the substrate carrying-in hand is changed. Fig. 10 (a) is a perspective view of a substrate carrying-in hand 161C according to a second modification, and fig. 10 (b) is a side view of the substrate carrying-in hand 161C according to the second modification.

As shown in fig. 10 (a) and 10 (b), in the substrate carrying-in hand 161C according to the second modification, the finger portion 162C has an XZ sectional triangular shape in which the + X-side end portion is thick and the-X-side end portion is thinner.

Note that, the operation of replacing the substrate on the substrate holder 28A is the same as that in the first embodiment, and therefore, the description thereof is omitted.

As in the second modification, the shape of the finger portion of the substrate carry-in hand may be an XZ cross-sectional triangular shape in which the + X-side end is thick and the-X-side end is thinner. Thus, the rigidity of the finger portion of the substrate carrying-in hand is increased, so that the substrate carrying-in hand 161C is prevented from shaking when the substrate carrying-in hand 161C is moved, and the possibility that the substrate carrying-in hand 161C contacts the substrate holder 28A due to the shaking can be reduced. Further, a drive mechanism for tilting the substrate carry-in hand 161A with respect to the substrate holder 28A (see fig. 9 (c)) as in the first modification may be omitted.

(third modification)

In the first embodiment, the substrate carry-in hand is moved to a predetermined position above the substrate holder 28A, and then moved downward, whereby the tip end of the substrate P2 is brought into contact with the holding pad 184a of the substrate carry-in holding device 182A. In the third modification, the leading end of the substrate P2 is brought into contact with the holding pad 184a of the substrate carry-in holding device 182A by using the substrate carry-out hand 170A.

The replacement operation of the substrate P on the substrate holder 28A using the substrate transport apparatus 100D according to the third modification will be described with reference to fig. 11 (a) and 11 (b). Fig. 11 (a) corresponds to the state of fig. 6 (a) of the first embodiment, and fig. 11 (b) corresponds to the state of fig. 6 (b) of the first embodiment.

As shown in fig. 11 (a) and 11 (b), in a substrate transfer apparatus 100D according to a third modification, a substrate transfer unit 160D includes a substrate carry-in hand 161C and a substrate carry-out hand 170A according to the second modification.

As shown in fig. 11 (a), in the third modification, the substrate transfer position between the substrate carry-in hand 161C and the stage device 20A is on the + X side of the substrate transfer position of the substrate carry-in hand 161A in fig. 6 (a).

When the substrate carrying-in hand 161C reaches the substrate transfer position, the substrate carrying-out hand 170A that suction-holds the lower surface of the substrate P2 is driven to extend the arm as shown in fig. 11 (b). Thus, the substrate P2 slides down along the substrate carry-in hand 161C, and the tip of the substrate P2 comes into contact with the holding pad 184a of the substrate carry-in holding device 182A.

At this time, in order to smoothly move the substrate, the support pad 164D attached to the upper surface of the finger portion 162C of the substrate carrying-in hand 161C is preferably rod-shaped and extends in the extending direction of the finger portion 162C. Further, when the substrate P2 is slid, the pressurized gas may be ejected from the support pad 164D.

The substrate transfer unit 160D may include a plurality of substrate carry-out hands 170A. The front end of the substrate P2 may be brought into contact with the holding pads 184a by a part of the plurality of substrate carry-out hands 170A, and the exposed substrate P1 on the substrate holder 28A may be held by the remaining substrate carry-out hands 170A. Thus, when the front end of the substrate P2 is held by the holding pads 184a and the exposed substrate P1 is held by the remaining substrate carry-out hand 170A, the substrate carry-in hand 161C can be moved in the + X direction and the substrate carry-in operation and the substrate carry-out operation can be performed simultaneously.

According to the third modification, since only the substrate P2 is lowered by the substrate carry-out hand 170A without moving the entire substrate transfer unit 160D, positioning can be performed more easily and accurately than moving the entire substrate transfer unit 160D. Further, the stroke of the substrate conveying unit 160D in the X-axis direction can be shortened. Further, since the substrate P2 is deflected by the action of gravity, even if the moving distance of the substrate carrying-in hand 161C in the X-axis direction is made shorter than the horizontal moving distance of the substrate P2 due to the gradient of the substrate carrying-in hand 161C, the front end of the substrate P2 can be brought close to the holding pad 184a of the substrate carrying-in holding device 182A.

In the description of fig. 11 (a) and 11 (b), the substrate loading hand 161C according to the second modification is used, but the substrate loading hand 161A according to the first embodiment may be used.

(fourth modification)

The fourth modification is an example in which the configuration of the substrate loading hand is changed. Fig. 12(a) is a plan view of a substrate carry-in hand 161E according to a fourth modification, and fig. 12 (b) is a sectional view taken along line a-a of fig. 12 (a).

As shown in fig. 12(a), of the plurality of finger parts 162E of the substrate carrying-in hand 161E, the finger parts 162E1 at both ends in the Y-axis direction include the belt parts 166. As shown in fig. 12 (b), the belt portion 166 includes a belt 166a and a pair of pulleys 166 b. The tape 166a is disposed substantially parallel to the upper surface of the finger 162E1 so as to be in contact with the back surface of the board P2 and so that the upper surface thereof is substantially flush with the upper surface of the support pad 164E provided on the finger 162E 1. The belt 166a is made of a material having a high friction coefficient and being hard to slide, and is selected from a material in which urethane is coated on stainless steel, silica, rubber, and soft polyvinyl Chloride (PVC), for example.

Fig. 13 (a) and 13 (b) are diagrams showing an operation of carrying the substrate P2 into the substrate holder 28A by using the substrate carrying-in hand 161E.

As shown in fig. 13 (a), after the leading end of the substrate P2 is brought into contact with the holding pad 184a of the substrate carry-in holding device 182A, the substrate carry-in hand 161E is moved relative to the substrate holder 28A in the + X direction while the leading end of the substrate P2 is held by the holding pad 184 a. Then, since the belt 166a is made of a material having a large friction coefficient, the belt 166a in contact with the substrate P2 is circulated by the pair of pulleys 166b as the substrate P2 moves relative to the substrate loading hand 161E as shown in fig. 13 (b). Thus, the belt 166a is inclined downward on the substrate carrying-in hand 161E while keeping the position of the substrate P2 in the Y axis direction restricted. Therefore, the substrate P2 is carried into the substrate holder 28A in a state of being restrained by the belt 166a immediately before the entire substrate P2 leaves the substrate carrying-in hand 161E.

In the first embodiment and the first to third modifications, the substrate carry-in hand is moved (retracted) in the + X direction while the holding pad 184a of the substrate carry-in holding device 182A holds the-X-side end of the substrate P2 (for example, fig. 6 (c)). At this time, the portion of the substrate P2 other than the-X-side end portion is in a state in which the movement in the Y-axis direction is not restricted before being supported by the substrate holder 28A.

On the other hand, in the fourth modification, while the substrate carry-in hand 161E is moved in the + X direction with the holding pad 184a holding the-X-side end portion of the substrate P2, the substrate P2 is mounted on the substrate holder 28A while holding the + X-side end portion by the substrate carry-in hand 161E and restricting the movement in the Y axis direction. Therefore, according to the fourth modification, since the substrate P2 can be restrained immediately before the entire substrate P2 is separated from the substrate carry-in hand 161E, the placement deviation of the substrate P2 can be prevented.

The belt 166 may be fed by a motor or the like. In this case, the tape 166a may be fed out in synchronization with the timing of retracting the substrate carry-in hand 161E. In addition, in this case, the belt 166a may not be an endless belt. Further, when the belts 166a provided on the finger parts 162E1 at both ends are independently moved, the relative position of the substrate P2 with respect to the substrate holder 28A can be adjusted (aligned) by the substrate carrying-in hand 161E.

(fifth modification)

A fifth modification example changes the configuration of the finger portions of the substrate carrying-in hand. Fig. 14 (a) and 14 (b) are sectional views schematically showing a substrate loading hand 161F according to a fifth modification.

As shown in fig. 14 (a), the finger part 162F of the substrate carry-in hand 161F includes a first finger part 162F1 and a second finger part 162F 2. The first finger portions 162F1 are hollow, and a wire (wire rope)169A for moving the second finger portions 162F2 is disposed inside. The second finger 162F2 is rotatably coupled to the first finger 162F1 about the Y-axis via a pin 169B or the like. The second finger 162F2 is connected to the wire 169A. When the wire 169A is moved by a driving device not shown, the second finger 162F2 rotates about the Y axis about the pin 169B as a fulcrum. Thus, only a partial region of the substrate P2 held by the second finger 162F2 can be inclined with respect to the holder substrate holding surface of the substrate holder 28A.

The other configurations are the same as those of the first embodiment, and therefore, the description thereof is omitted.

The substrate carrying-in hand 161F may not have a driving mechanism using the wire 169A, and the second finger 162F2 may be inclined with respect to the first finger 162F 1.

According to the fifth modification, the drive mechanism for tilting the substrate carry-in hand 161A (see fig. 9 (c)) as in the first modification can be omitted. In addition, the tip end portion of the second finger portion 162F2 may be thinned.

Second embodiment

Next, an exposure apparatus according to a second embodiment will be described with reference to fig. 15 (a) to 25 (b). The configuration of the exposure apparatus 10G according to the second embodiment is the same as that of the first embodiment except for the fact that the configuration and operation of a part of the substrate transfer apparatus are different, and therefore only different points will be described below, and elements having the same configuration and function as those of the first embodiment will be given the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

Fig. 15 (a) and 15 (b) are a plan view and a side view of an exposure apparatus 10G according to the second embodiment, respectively. Fig. 16 (a) and 16 (b) are perspective views of the substrate loading hand 161G according to the second embodiment.

(platform device 20G)

In the first embodiment, the substrate holder 28A includes the notch 28b (see fig. 3A and 3 c) for receiving the holding pad 184b of the substrate carry-out and support device 183A. As shown in fig. 15 (a), the substrate holder 28G according to the second embodiment includes a notch 28a for accommodating a holding pad 184a of the substrate carry-in supporting device 182G in addition to the notch 28 b.

(substrate transport apparatus 100G)

In the substrate transport apparatus 100G according to the second embodiment, each of the plurality of beams 153 included in the beam unit 152 is supported from below by a plurality of (for example, 2) rod-shaped legs 154 extending in the Z-axis direction at positions inward of both ends in the X-axis direction. The lower end portions of the legs 154 supporting the cross members 153 are connected to each other by a base plate 156. In the substrate transport apparatus 100G, the base plate 156 is moved in the X-axis direction by a predetermined stroke by an X actuator, not shown, and thereby the beam unit 152 is integrally moved in the X-axis direction by a predetermined stroke. Further, the base plate 156 is moved in the Z-axis direction by the Z actuator 158, whereby the beam unit 152 can be integrally moved up and down in the Z-axis direction. In fig. 15 (a) and subsequent plan views, the base plate 156 is not shown.

As shown in fig. 15 (a), the substrate transfer unit 160G of the second embodiment includes a plurality of (for example, 8 in the present embodiment) finger portions 162G of a substrate loading hand 161G. The vicinities of the-X-side ends of the plurality of finger portions 162G are connected to each other by a connecting member 163G. The coupling member 163G is configured to support the substrate P in a floating manner by supplying gas (supply gas) to the back surface of the substrate P held by the substrate carrying-in hand 161G. On the other hand, the + X-side ends of the plurality of finger parts 162G are free ends, and the adjacent finger parts 162G are open on the port part 150G side. As shown in fig. 15 (a), each of the finger portions 162G is arranged so that the position in the Y-axis direction does not overlap with the plurality of beams of the beam unit 152 in plan view.

As shown in fig. 16 a and 16 b, among the plurality of finger parts 162G, the finger parts 162G1 at both ends in the Y-axis direction have a triangular shape in which the thickness on the-X side (the substrate holder 28G side) is small and the thickness on the + X side (the port part 150G side) is large in a side view. On the other hand, inner finger 162G2 has a smaller thickness on the port side than fingers 162G1 on both ends.

As shown in fig. 16 (a) and 16 (b), the arm 168 of the substrate loading hand 161G is attached to the finger part 162G1 at both ends. As shown in fig. 15 (a), both end portions of the arm 168 are connected to the X-axis drive device 164.

As shown in fig. 15 (a) and 15 (b), the substrate carrying-in hand 161G includes a pair of substrate pickup hands 167G provided with finger portions 162G1 provided at both ends in the Y-axis direction. The substrate pickup hand 167G can be moved in the X-axis direction and the Z-axis direction by a driving device not shown in the figure by a predetermined stroke.

The substrate pickup hand 167G can suction and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum apparatus not shown.

(carrying device 180G)

The substrate carrying in and holding device 182G is different from the substrate carrying in and holding device 182A of the first embodiment in that the X actuator 186X is omitted. As shown in fig. 15 (b), the holding pad 184a of the substrate carrying-in holding device 182G is moved by the Z actuator 186Z within the notch 28a, and is thereby movable between a position in contact with the lower surface of the substrate P and a position away from the lower surface of the substrate P. In addition, the holding pad 184a is movable by the Z actuator 186Z between a position where a part thereof is housed in the notch 28a and a position higher than the upper surface of the substrate holder 28G.

(substrate replacement action)

The replacement operation of the substrate P on the substrate holder 28G of the exposure apparatus 10G according to the second embodiment will be described below with reference to fig. 17 (a) to 24 (b).

As shown in fig. 17 (a) and 17 (b), while the stage device 20G is performing the exposure process, the external transport device 300 is moved in the-Z direction to place the substrate P2 on the beam unit 152. Then, the external carrying device 300 moves in the + X direction and exits from the exposure apparatus.

The substrate carry-in hand 161G is driven in the + X direction and enters below the beam unit 152 from the-X side (substrate holder 28G side).

Then, as shown in fig. 18 (a) and 18 (b), the stage device 20G having completed the exposure process moves to the substrate transfer position to the substrate transfer unit 160G.

The beam unit 152 is driven downward (driven in the-Z direction) by the Z actuator 158 in a state of holding the substrate P2. At this time, a part of the substrate P2 on the beam unit 152 comes into contact with the substrate pickup hand 167G of the substrate carry-in hand 161G. The substrate pickup hand 167G suction-holds the lower surface of the substrate P2.

Thereafter, as shown in fig. 19 (a) and 19 (b), in the stage device 20G, the substrate P1 on the substrate holder 28G is shifted in the + X direction by the substrate carry-out and support device 183A. At this time, the substrate holder 28G and the deflecting beam 185a supply gas (supply gas) to the back surface of the substrate P1 to move the substrate P in a floated state.

Pressurized gas is ejected from each beam 153 of the beam unit 152. In addition, the beam unit 152 gradually continues to descend.

The substrate carry-in hand 161G moves gradually in the-X direction while sucking the substrate P2 on the holding beam unit 152 by the substrate pick-up hand 167G. The substrate P2 moves in the-X direction in accordance with the movement of the substrate carry-in hand 161G in the-X direction.

Then, as shown in fig. 20 (a) and 20 (b), the substrate carry-in hand 161G is moved in the-X direction to an X position where the base of the finger portion 162G and the beam unit 152 do not overlap in a plan view.

The beam unit 152 moves down to a position below the substrate loading hand 161G, and completely transfers a new substrate P2 to the substrate loading hand 161G. At this time, the relative position of the substrate P2 with respect to the substrate carry-in hand 161G may be adjusted by the pair of substrate pickup hands 167G on the substrate carry-in hand 161G.

Thereafter, as shown in fig. 21 (a) and 21 (b), the substrate carrying-in hand 161G moves in the-X direction while holding the substrate P2, and is disposed at a predetermined position above the substrate holder 28G.

In the stage device 20G, the substrate is carried into the holding pad 184a of the supporting device 182G by the Z actuator 186Z and is driven to ascend. The substrate carry-in hand 161G pushes out the substrate P2 obliquely downward by the substrate pickup hand 167G. Thereby, the-X side end of the substrate P2 comes into contact with the holding pad 184 a. Thus, the holding pads 184a come into contact with the substrate P2 on the substrate carry-in hand 161G standing by above the substrate holder 28G from below, and attract and hold the vicinity of the end portion on the-X side of the substrate P2. Further, at the timing, the substrate pickup hand 167G may also perform position adjustment of the substrate P2 with respect to the substrate holder 28G.

Simultaneously with the suction holding operation of the holding pad 184a with respect to the substrate P2, the substrate carrying-out hand 170A is moved to suction-hold the lower surface of the portion of the substrate P1 shifted to the + X side from the substrate holder 28G.

The beam unit 152 moves in the-X direction and the-Z direction, and stops at the substrate transfer position to the substrate holder 28G. In addition, pressurized gas is ejected from each beam 153 of the beam unit 152. Thus, the beam unit 152 serves as a guide (guide) for supporting the substrate P1 carried out of the substrate holder 28G.

Then, the substrate P2 is released from the substrate pickup hand 167G of the substrate carry-in hand 161G, and the substrate transport unit 160G is driven in the carry-out direction (+ X side) while the holding pad 184a of the substrate carry-in holding device 182G sucks the-X side end portion of the substrate P2 as shown in fig. 22 (a) and 22 (b). When the substrate transfer unit 160G is driven in the transfer direction (+ X side), the substrate transfer hand 170A holding the substrate P1 is also driven in the + X direction.

Thereby, the substrate P1 moves from above the substrate holder 28G to above the port portion 150G (beam unit 152). At this time, since the pressurized gas is ejected from the upper surface of the beam unit 152, the substrate P1 is floated and conveyed in a non-contact state (except for the portion held by the substrate carry-out hand 170A) on the substrate holder 28G and the port portion 150G.

Then, as shown in fig. 23 (a) and 23 (b), the substrate carry-out hand 170A releases the hold of the substrate P1 and moves in the-X direction together with the substrate carry-in hand 161G. The port portion 150G moves in the + X direction in a state where the substrate P2 is held by the beam unit 152.

In the stage device 20G, after the position of the substrate P2 with respect to the substrate holder 28G is adjusted by the substrate carry-in and support device 182G, the substrate is moved in the-Z direction by the Z actuator 186Z, and a part of the substrate is accommodated in the notch 28 a. Thereby, the substrate P2 is adsorbed to the holder substrate holding surface of the substrate holder 28G. The position adjustment (alignment) of the substrate P2 described here may be omitted, and may be controlled as needed.

Thereafter, as shown in fig. 24 (a) and 24 (b), when the substrate carry-in hand 161G moves to a position where it does not interfere with the substrate P1, the beam unit 152 moves in the + Z direction and moves to a substrate transfer position with the external transfer device 300.

The external transport apparatus 300 collects the substrate P1 on the beam unit 152 and transports a new substrate P3 to the port unit 150A.

As described above in detail, according to the second embodiment, the port portion 150G side is opened between the adjacent finger portions 162G of the substrate carry-in hand 161G. Thus, the substrate carry-in hand 161G can directly enter the lower side of the beam unit 152 from the substrate holder 28G side, and be driven to the upper side of the beam unit 152, thereby scooping up the substrate P2 on the beam unit 152 and moving to the substrate holder 28G side. Therefore, even in a state where the substrate P2 is placed on the beam unit 152, the substrate carry-in hand 161G can enter below the substrate P2 with a short movement distance in the X-axis direction. That is, even if substrate carry-in hand 161G does not move to the position on the + X side of port 150G, substrate P2 on beam unit 152 can be received. Further, substrate carry-in hand 161G can transfer exposed substrate P1 to beam unit 152 without moving it to the position on the + X side of port 150G. That is, a series of operations of carrying in the substrate P2 and carrying out the substrate P1 can be performed without changing the positional relationship in the X direction among the external transfer device 300, the port unit 150G, the substrate carrying-in hand 161G, and the substrate holder 28G. Further, since it is not necessary to provide a chamber for providing a space for the substrate carry-in hand 161G to move to the position on the + X side of the port portion 150G, the footprint (footprint) of the exposure apparatus, that is, the installation area of the exposure apparatus 10G can be reduced. In addition, when a defect occurs in the exposure apparatus, or when an operation such as initial setting is performed, even if the external transfer apparatus 300 is not present, the substrate P that has been carried out to the port 150G (the beam unit 152) can be transferred to the substrate carrying-in hand 161G again and carried into the substrate holder 28G.

In addition, according to the second embodiment, the vicinities of the ends on the-X side (substrate holder 28G side) of the plurality of finger parts 162G of the substrate carry-in hand 161G are coupled to each other by the coupling member 163G. Thus, the substrate carrying-in hand 161G of the second embodiment can set the substrate P2 on the substrate holder 28G without deformation, as compared with the substrate carrying-in hand 161A.

Specifically, as shown in fig. 25 (a), in the substrate carrying-in hand 161A according to the first embodiment, the space between the-X-side finger parts 162A is open. Therefore, the-X side edge of the substrate P2 immediately before the substrate holder 28A may have a region supported by the finger parts 162A and a region unsupported, as shown in fig. 25 (a), and thus, the substrate P2 may not be easily mounted on the substrate holder 28A without deformation due to a slight amount of undulation. On the other hand, as shown in fig. 16 (a) and 16 (b), in the substrate carrying-in hand 161G according to the second embodiment, the-X side end of the substrate P2 can be supported in a planar manner without being opened continuously between the finger portions 162G adjacent to the-X side. As a result, as shown in fig. 25 (b), the-X-side edge of the substrate P2 immediately before the substrate holder 28G is less likely to undulate. Therefore, the substrate carrying-in hand 161G of the second embodiment can dispose the substrate P2 on the substrate holder 28G without deformation, as compared with the substrate carrying-in hand 161A.

In addition, according to the second embodiment, the substrate carrying-in hand 161G is retracted from between the substrate P2 and the substrate holder 28G by moving the substrate carrying part 160G (substrate carrying-in hand 161G) and the stage device 20G (substrate holder 28G) in opposite directions. This can shorten the time required for loading the substrate P2 into the substrate holder 28G.

In addition, according to the second embodiment, among the finger parts 162G of the substrate carrying-in hand 161G, the inner finger parts 162G2 other than the finger parts 162G1 at both ends are thinner on the port side than the finger parts 162G1 at both ends (see, for example, (b) of fig. 16). This reduces the weight of the substrate carry-in hand 161G.

Further, according to the second embodiment, since the arm 168 of the substrate carrying-in hand 161G is attached to the finger parts 162G1 at both ends, the substrate carrying-in hand 161G can support the central part of the substrate P2, and the substrate carrying-in hand 161G can be reduced in size. Further, since the arm 168 of the substrate carrying-in hand 161G is attached to the finger parts 162G1 at both ends, the center of gravity of the entire substrate carrying-in hand 161G is supported, and thus the substrate carrying-in hand 161G can be suppressed from being deflected.

(first modification)

In the second embodiment, the Z position (pass line) at which the substrate is handed over between the external transfer device 300 and the beam unit 152 of the port portion 150G is set at a position higher than the upper surface of the substrate holder 28G, but the height of the pass line can be freely set (without limitation).

Fig. 26 (a) and 26 (b) are diagrams for explaining the substrate replacement operation according to the first modification.

As shown in fig. 26 (a) and 26 (b), the external transport apparatus 300 places the substrate P2 on the beam unit 152 stopped at a position lower than the upper surface TS of the substrate holder 28G.

Then, as shown in fig. 17 (a) and 17 (b) of the second embodiment, when the beam unit 152 is raised to a position higher than the highest portion of the substrate carrying-in hand 161G, the substrate P2 can be transferred to the substrate carrying-in hand 161G even when there is no driving device for moving the substrate carrying-in hand 161G up and down. Thus, for example, when a defect occurs in the exposure apparatus or when an operation such as initial setting is performed, even if the external transfer device 300 is not present, the substrate carried out to the port 150G (the beam unit 152) can be transferred to the substrate carrying-in hand 161G again and carried into the substrate holder 28G.

(second modification)

The second modification is an example in which the configuration of the substrate transport apparatus is changed.

In the substrate transport apparatus 100I according to the second modification, the substrate transport unit 160I includes a drive system for rotating the substrate carrying-in hand 161I about the Y axis. That is, the substrate carry-in hand 161I can tilt the substrate holding surface around the Y axis by the drive system.

In the second modification, as shown in fig. 27 (a), the stroke of the substrate pickup hand 167I provided in the substrate carrying-in hand 161I is longer than that of the substrate pickup hand 167G of the second embodiment. In the second modification, as shown in fig. 27 (a), the distance from the-X-side end of the substrate carrying-in hand 161I to the base of the finger 162I, that is, the width of the connecting member 163I in the X-axis direction is longer than the connecting member 163G of the second embodiment.

A substrate replacement operation using the substrate transport apparatus 100I according to the second modification will be described with reference to fig. 27 (a) to 30 (b). The states of fig. 27 (a) and 27 (b) correspond to the states of fig. 17 (a) and 17 (b) of the second embodiment, respectively.

As shown in fig. 27 (a) and 27 (b), while the stage device 20G is performing the exposure process, the external transport device 300 moves in the-Z direction to place a new substrate P2 on the beam unit 152, and then moves in the + X direction to exit from the exposure apparatus 10I.

The substrate carry-in hand 161I moves in the + X direction and enters below the beam unit 152 from the-X side (substrate holder 28G side). The base of the finger 162I of the substrate carry-in hand 161I and the-X-side end of the beam unit 152 stop at positions not overlapping in a plan view.

Then, as shown in fig. 28 (a) and 28 (b), the stage device 20G having completed the exposure process moves to the substrate transfer position to the port unit 150G.

The substrate carry-in hand 161I is rotationally driven around the Y axis so that the substrate holding surface of the substrate carry-in hand 161I is substantially parallel to the substrate P2 on the beam unit 152. The beam unit 152 moves down (moves in the-Z direction) while holding the substrate P2, and stops at a position where a part of the substrate P2 on the beam unit 152 contacts the substrate pickup hand 167I of the substrate carry-in hand 161I. The substrate pickup hand 167I suction-holds the back surface of the substrate P2.

Then, as shown in fig. 29 (a) and 29 (b), in the stage device 20G, the substrate P1 on the substrate holder 28G is shifted in the + X direction by the substrate carry-out and support device 183A.

The substrate pickup hand 167I of the substrate carry-in hand 161I moves in the-X direction while holding the substrate P2 on the beam unit 152. Thus, the substrate P2 moves onto the substrate loading hand 161I while being held by the substrate loading hand 161I and the beam unit 152. At this time, the pressurized gas is ejected from the beam unit 152 and the substrate carrying-out hand 161I. Since the substrate pickup hand 167I holds the substrate P2 by suction, there is no fear that the substrate P2 falls from the top of the beam unit 152 or the substrate carrying-out hand 161I. Since the substrate P2 is held by the substrate loading hand 161I and the beam unit 152, the load on the substrate P2 is smaller than in the case where the substrate loading hand 161I moves in the + Z direction with respect to the beam unit 152 and the substrate P2 is placed on the substrate loading hand 161I from the beam unit 152. Therefore, when transferring the substrate P2 between the substrate loading hand 161I and the beam unit 152, the possibility of damage to the substrate P2 can be reduced.

Then, as shown in fig. 30 (a) and 30 (b), the beam unit 152 is lowered and driven below the substrate loading hand 161I, and the substrate P2 is completely transferred to the substrate loading hand 161I. When the substrate P2 is placed on the substrate carrying-in hand 161I, the substrate carrying-in hand 161I is driven to rotate about the Y axis, and the substrate holding surface of the substrate carrying-in hand 161I is inclined with respect to the substrate holding surface of the substrate holder 28G (the state of fig. 27 (b)).

The subsequent operations are the same as those in the second embodiment, and therefore, the description thereof is omitted.

According to the second modification, after the substrate carry-in hand 161I is rotationally driven around the Y axis so that the substrate holding surface of the substrate carry-in hand 161I is substantially parallel to the substrate P2 on the beam unit 152, the substrate P2 on the beam unit 152 is transferred to the substrate carry-in hand 161I. This allows the substrate P2 to be reliably transferred to the substrate loading hand 161I without being bent.

In addition, according to the second modification, the width of the coupling member 163I in the X axis direction is wide. This can shorten the length of the finger portion 162I of the substrate carrying-in hand 161I, thereby improving the rigidity of the entire substrate carrying-in hand 161I.

(third modification)

In the second modification, the substrate P2 is moved from the beam unit 152 to the substrate loading hand 161I by tilting the substrate loading hand 161I, but in the third modification, the substrate P2 is moved from the beam unit 152 to the substrate loading hand 161I by tilting the beam unit 152.

As shown in fig. 31 (a), in the substrate transport apparatus 100J according to the third modification, the port portion 150J includes

legs

154a and 154b whose upper ends are connected to the beam 153 of the beam unit 152. The port 150J includes

Z actuators

158a and 158b that can independently extend and contract the

legs

154a and 154b in the Z-axis direction. The tilt of the upper surface of the beam unit 152 can be changed by changing the amount of expansion and contraction of the

legs

154a and 154b by the Z actuators 158a and 158 b. Fig. 31 (a) shows beam unit 152 disposed between finger part 162I1 at both ends and inner finger part 162I 2.

Next, the transfer of substrate P2 from beam unit 152 to substrate carry-in hand 161I will be described.

Fig. 31 (a) shows a state in which the substrate P2 has been set on the beam unit 152 by the external transport apparatus 300. At this time, the substrate carry-in hand 161I moves from the-X side of the beam unit 152 to the + X direction, and stops at a position where the base of the finger portion 162G and the-X side end of the beam unit 152 do not overlap in a plan view.

Then, as shown in fig. 31 (b), the amount of expansion and contraction of the

legs

154a and 154b is changed by the Z actuators 158a and 158b, and the beam unit 152 is tilted so that the upper surface of the beam unit 152 is substantially flush with the substrate holding surface of the substrate carry-in hand 161I.

Then, as the beam unit 152 moves down, the substrate P2 held by the beam unit 152 is gripped by the substrate pickup hand 167I, and is transferred to the substrate carry-in hand 161I while the substrate position is shifted by the movement of the substrate pickup hand 167I.

As in the third modification, the substrate P2 may be moved from the beam unit 152 to the substrate loading hand 161I by tilting the beam unit 152.

(fourth modification)

The fourth modification is an example in which the configuration of the finger portion of the substrate carrying-in hand is changed.

As shown in fig. 32 (a) and 33 (a), the substrate carry-in hand 161K of the fourth modification includes a finger portion 162K having a length substantially equal to the substrate size in the X-axis direction. As shown in fig. 32 (b), the substrate loading hand 161K has a rhombic shape with sharp front ends in a side view, and an arm 168 is attached to a thick portion at the center.

The transfer of the substrate from the beam unit 152 to the substrate carry-in hand 161K according to the fourth modification will be described with reference to fig. 32 (a) to 33 (b).

As shown in fig. 32 (a) and 32 (b), the substrate carry-in hand 161K is disposed at a position where the base of the finger portion 162K and the-X-side end of the beam unit 152 do not overlap in a plan view.

When the external carrying apparatus 300 transfers the substrate P2 to the beam unit 152, the beam unit 152 moves in the-Z direction as shown in fig. 33 (a) and 33 (b). Since the length of the finger part 162K of the substrate carrying-in hand 161K is substantially the same as the length of the substrate P2, the substrate P2 is placed on the substrate carrying-in hand 161K by the movement of the beam unit 152 in the-Z axis direction. Thereafter, the substrate P2 is slid to the inclined surface side by the substrate pickup hand 167K. Thereby, a part of the substrate P2 is inclined with respect to the substrate holding surface of the substrate holder 28G. The subsequent operations are basically the same as those of the second embodiment, and thus detailed descriptions thereof are omitted.

According to the fourth modification, since the length (the length in the X axis direction) of the finger portion 162K of the substrate carry-in hand 161K is substantially the same as the length of the substrate, when the substrate P2 placed on the beam unit 152 is received by the substrate carry-in hand 161K, the substrate P2 can be picked up only by passing the substrate carry-in hand 161K downward from the beam unit 152. Therefore, the operation is simple, and the damage and dust emission of the board P2 are not easily caused.

(fifth modification)

The fifth modification is an example in which the substrate is directly transferred from the external transfer device 300 to the substrate carry-in hand 161K.

In the fifth modification, as shown in fig. 34 (a), the forks of the external carrying device 300 are arranged so that the positions in the Y-axis direction do not overlap the finger parts 162K of the substrate carrying-in hand 161K in a plan view. The cross member 153 of the cross member unit 152 is disposed so as not to overlap the fork of the external carrying device 300 in a plan view. As a result, in the fifth modification, the finger portion 162K of the substrate carry-in hand 161K and the beam 153 of the beam unit 152 are disposed at positions overlapping in a plan view.

Hereinafter, a substrate transfer from the external transfer device 300 to the substrate loading hand 161K according to a fifth modification will be described with reference to fig. 34 (a) to 35 (b).

As shown in fig. 34 (a) and 34 (b), the substrate carry-in hand 161K is driven in the + X direction to be disposed at the substrate transfer position to the external transfer device 300. The external transfer device 300 moves in the-X direction while holding the substrate P2 until it reaches the substrate transfer position with the substrate carry-in hand 161K.

Then, as shown in fig. 35 (a) and 35 (b), the stage device 20G having completed the exposure process moves to the substrate transfer position to the beam unit 152. In the stage device 20G, the substrate P1 on the substrate holder 28G is shifted in the + X direction by the substrate carry-out and support device 183A.

When the external transport apparatus 300 moves in the-Z direction, the lower surface of the substrate P2 comes into contact with the substrate pickup hand 167K. The substrate pickup hand 167K suction-holds the lower surface of the substrate P2.

The substrate pickup hand 167K, which sucks and holds the lower surface of the substrate P2, is driven in the-X direction. Thereby, the substrate P2 on the external conveyance device 300 moves toward the substrate carry-in hand 161K. When the external transport apparatus 300 is driven to move the substrate P2 down and completely transfers it to the substrate carry-in hand 161K, it is driven in the + X direction and exits from the exposure apparatus 10L.

The beam unit 152 moves in the-Z direction and the-X direction toward the substrate transfer position of the stage device 20G.

The subsequent operation is basically the same as that of the second embodiment, and thus, a detailed description thereof will be omitted.

As described above, according to the fifth modification, the substrate loading hand 161K can receive the substrate P2 directly from the external transport apparatus 300 without passing through the port portion 150G when the substrate P2 is loaded. Thus, compared to the conventional two transfer operations of transferring the substrate P2 from the external transfer device 300 to the port 150G and transferring the substrate P2 from the port 150G to the substrate carry-in hand 161K, the transfer operation of transferring the substrate P2 from the external transfer device 300 to the substrate carry-in hand 161K is performed only once, and the number of times of transferring the substrate P2 is reduced, so that the time taken for transferring the substrate P2 can be shortened and damage to the substrate P2 and dust emission can be prevented.

In the fifth modification, as in the second embodiment, the substrate P1 is transferred from the beam unit 152 to the external conveyance device 300 in order to collect (carry) the substrate P1.

In the fifth modification, the beam 153 of the beam unit 152 and the finger 162K of the substrate loading hand 161K are arranged so as to overlap in a plan view so that the beam unit 152 and the finger of the robot of the external transfer device 300 do not overlap in a plan view, but the present invention is not limited thereto. The beam 153 of the beam unit 152 and the finger 162K of the substrate carry-in hand 161K may not overlap each other in a plan view. In this case, the beam unit 152 may also be formed to such an extent that it can be deviated from one finger portion 162K in the Y-axis direction. Thus, the substrate carried out from the substrate holder 28G to the port portion 150G can be scooped up by the substrate carrying-in hand again.

In order to prevent the beam 153 from overlapping the finger part 162K in a plan view when transferring the substrate, the beam unit 152 may be displaced in the Y-axis direction without displacing the external transfer device 300 in the Y-axis direction, or the substrate carrying-in hand 161K may be displaced in the Y-axis direction.

(sixth modification)

The sixth modification example changes the configuration of the substrate carrying-in hand.

Fig. 36 is a perspective view showing a substrate carry-in hand 161L according to a sixth modification. As shown in fig. 36, the substrate carry-in hand 161L includes a plate portion 263 having a triangular XZ cross section, and an arm portion 265 supporting the plate portion 263. The upper surface of the plate portion 263 is inclined with respect to the XY plane.

As shown in the sixth modification, the substrate carrying-in hand may not have the finger portion. That is, the substrate carry-in hand may not have a fork shape.

As shown in fig. 37 (a), the upper surface of the plate portion 263 of the substrate carrying-in hand 161L may be curved. By bending the upper surface (substrate holding surface) of the plate portion 263 in this manner, the cross-sectional coefficient of the substrate can be increased. That is, the same effect as that of actually several times to several hundred times larger in thickness of the substrate with respect to the deflection of the substrate can be obtained.

By setting as described above, even when the substrate P is placed on the substrate carry-in hand 161L with the-X end exposed as shown in fig. 37 (b), the-X end of the substrate P can be prevented from being bent (sagged). Further, since the occurrence of flexure (sagging) of the substrate P is suppressed, the substrate P can be brought into contact with the Y-axis direction central portion of the-X side when the substrate P is brought into contact with the substrate holder, and hence wrinkles are less likely to occur at the-X end portion of the substrate P.

As shown in fig. 38, the substrate transfer units 160A to 160L may be provided with a cover 199. By providing the cover 199, adhesion of dust on the substrate P can be prevented, and the temperature of the substrate P can be set constant.

In the second embodiment and its modified examples, the stage device 20A of the first embodiment may be used instead of the stage device 20G. The stage device 20G can be applied to the first embodiment and the modification thereof.

In the first and second embodiments and the modification thereof, as shown in fig. 39, the vicinity of the + X-side end of the surface plate 30 called the upper column that supports the projection optical system 16, the mask stage 14, and the like can be partially chamfered 30a so as not to interfere with the substrate carrying-in hand. Fig. 39 shows a case where the substrate carry-in hand is the substrate carry-in hand 161G according to the second embodiment. Thus, the height of the entire exposure apparatus can be reduced.

In the first and second embodiments and the modifications thereof, as shown in fig. 40 (a) and 40 (b), the stage Device 20A and the stage Device 20G include a Charge-Coupled Device (CCD) camera 31x and a CCD camera 31y (image processing edge detection) for detecting the edge of the substrate P as the substrate position measuring Device described above. The CCD cameras 31X are arranged so as to be able to observe two-X sides of the substrate P placed in front of the

substrate holders

28A and 28G. The CCD camera 31Y is disposed so that one position on the-Y side (or + Y side) of the substrate P can be observed from below. This makes it possible to obtain the X position, Y position, and θ z position of the substrate P with respect to the

stage devices

20A and 20G. These pieces of information can be used for stage control as position information of the substrate P2 before being placed or the substrate P2 after being placed. Instead of the CCD camera 31x and the CCD camera 31y for detecting the edge of the substrate P, for example, a known edge sensor including a light source and a light receiving unit may be used. The light source is arranged at the same position as the CCD camera 31x and the CCD camera 31y, and the light receiving part is arranged to face the light source with the substrate P interposed therebetween. The cross section orthogonal to the optical axis of the measurement light irradiated from the light source is linear, and the light receiving unit receives the measurement light to detect the end of the substrate P. In this manner, the X position, the Y position, and the θ z position of the substrate P with respect to the stage device 20A and the stage device 20G can be detected based on the detection results of the X-axis direction end portion and the Y-axis direction end portion of the substrate P.

In the first and second embodiments and the modifications thereof, the stage device 20M shown in fig. 41 (a) to 41 (c) may be used.

In the stage device 20M, as shown in fig. 41 (a), two substrate carry-in holders 182M are provided at the-X-side end of the substrate holder 28M. As shown in fig. 41 (b), the substrate carrying-in supporting apparatus 182M is set as follows: in a state where a part thereof is accommodated in the notch 28a formed in the-X-side end portion of the substrate holder 28M, the height of the upper surface of the holding pad 184a is substantially the same as the height of the upper surface of the substrate holder 28M. Therefore, even after the substrate P2 is placed, the holding pad 184a can be retracted from the substrate holder 28M without moving in the-X direction.

As shown in fig. 41 (c), the substrate carrying-in support device 182M can be tilted so that the back surface of the substrate P2 carried in obliquely can be reliably attracted and fixed. The substrate carrying-in support device 182M is movable in the horizontal direction (X-axis direction or X-axis and Y-axis directions) so that the relative position of the substrate P2 with respect to the substrate holder 28M can be adjusted (aligned).

According to the stage device 20M, since the holding pad 184a can be inclined, the back surface of the substrate P2 can be reliably sucked and fixed.

In the first and second embodiments and the modifications thereof, the stage device 20N shown in fig. 42 (a) and 42 (b) may be used.

The stage device 20N does not include the substrate loading and holding device described in the first and second embodiments that move independently. In the stage device 20N, a suction region (receiving region) 187 for sucking and holding the leading end portion of the carried-in substrate is provided at one or more positions in the vicinity of the-X-side end surface of the substrate holder, so that a part of the upper surface of the substrate holder 28N also functions as a holding pad 184a for sucking and holding the leading end portion of the carried-in substrate.

Further, the stage device 20N does not have a substrate carry-in supporting device that moves independently, and therefore, the relative position adjustment (alignment) of the carried-in substrate P with respect to the substrate holder 28N cannot be performed by the substrate carry-in supporting device, but for example, the position adjustment of the substrate P may be performed on the substrate carry-in hand by using a pair of substrate carry-out hands before the substrate is adsorbed by the supporting region 187. In addition, when the relative position of the substrate P with respect to the substrate holder 28N is to be adjusted (aligned) after the substrate P is placed on the substrate holder 28N, the substrate removal/support device 183A may be used.

In addition, when the stage device does not include a substrate carrying-in holding device that moves independently, as shown in fig. 43 (a) to 43 (c), for example, the substrate carrying-in hand 161A is retracted from between the substrate P and the substrate holder 28N, and when the substrate P2 is placed on the substrate holder 28N, the substrate P2 is sucked to the holder substrate holding surface by sucking air into the substrate holder 28N, whereby the substrate P2 can be stably carried in.

In the first and second embodiments and the modifications thereof, the support pads on the finger portions of the substrate carry-in hand may be omitted.

In the above embodiments, the projection optical system 16 is an equal magnification system, but is not limited thereto, and a reduction system or an enlargement system may be used.

The use of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers a liquid crystal display device pattern onto a square glass plate, and for example, the exposure apparatus can be widely used for manufacturing an exposure apparatus for manufacturing an organic-Electroluminescence (EL) panel, an exposure apparatus for manufacturing a semiconductor, a thin film magnetic head, a micromachine, a Deoxyribonucleic acid (DNA) chip (chip), and the like. In addition, the present invention is applicable not only to microdevices such as semiconductor devices but also to exposure apparatuses in which a circuit pattern is transferred onto a glass substrate, a silicon dioxide wafer, or the like in order to manufacture a mask or a photomask used in a light exposure apparatus, an Extreme Ultraviolet (EUV) exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, or the like.

The substrate to be exposed is not limited to a glass plate, and may be, for example, a wafer, a ceramic substrate, a film member, or another object such as a mask blanks. In the case where the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film shape (sheet-like member having flexibility). The exposure apparatus of the present embodiment is particularly effective when a substrate having a length of one side or a diagonal length of 500mm or more is an object to be exposed. In the case where the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed into a roll.

Method for manufacturing device

Next, a method for manufacturing a microdevice in which the exposure apparatus 10A to the exposure apparatus 10L of each of the above embodiments are used in a photolithography step will be described. By forming predetermined patterns (circuit patterns, electrode patterns, and the like) on a substrate using the exposure apparatuses 10A to 10L of the above embodiments, a liquid crystal display device as a micro element can be obtained.

< Pattern Forming step >

First, a so-called photolithography step of forming a pattern image on a photosensitive substrate (a resist-coated glass substrate or the like) using the exposure apparatus according to each of the above embodiments is performed. Through the photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate. Then, the exposed substrate is subjected to various steps such as a developing step, an etching step, and a resist stripping step, thereby forming a predetermined pattern on the substrate.

< step of Forming color Filter >

Then, color filters were formed in which a plurality of three dot groups corresponding to R (red), G (green), and B (blue) were arranged in a matrix, or a plurality of R, G, B color filter groups of 3 stripes were arranged in the horizontal scanning line direction.

< cell Assembly step >

Then, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like. For example, a liquid crystal panel (liquid crystal cell) is manufactured by injecting liquid crystal between a substrate having a predetermined pattern obtained in the pattern forming step and a color filter obtained in the color filter forming step.

< Module Assembly step >

Thereafter, the assembled liquid crystal panel (liquid crystal cell) is mounted with various components such as a circuit for performing a display operation and a backlight, thereby completing a liquid crystal display device.

In this case, in the pattern forming step, the exposure of the substrate is performed with high yield and high accuracy using the exposure apparatus of each of the embodiments, so that as a result, the productivity of the liquid crystal display device can be improved.

The described embodiments are preferred embodiments of the invention. However, the present invention is not limited to this, and various modifications can be made without departing from the scope of the present invention.

Claims

1. A substrate transfer apparatus that transfers a substrate to a holding surface of a holding device capable of holding the substrate, comprising:

a first holding portion that holds a part of the substrate at a first position above the holding device;

a second holding portion that holds the other portion of the substrate held by the first holding portion at a second position higher than the holding surface and lower than the first position in the vertical direction; and

and a driving unit configured to move the holding device and the second holding unit relative to the first holding unit while the second holding unit holds the other portion of the substrate, such that the first holding unit is retracted from above the holding device.

2. The substrate transport apparatus according to claim 1, wherein the drive portion moves the first holding portion above the second holding portion and the holding device in an up-down direction.

3. The substrate transport apparatus according to claim 1 or 2, wherein the drive unit moves the first holding unit in a direction away from the second holding unit.

4. The substrate handling apparatus according to claim 1 or 2, wherein the holding device holds the substrates in order from the other portion side to the one portion side of the substrate.

5. The substrate transport apparatus according to claim 1 or 2, wherein the second holding portion adjusts a position of the substrate with respect to the holding device in a state where the other portion of the substrate is held.

6. The substrate transport apparatus according to claim 5, wherein the second holding portion is provided on the holding surface.

7. The substrate transport apparatus according to claim 5, wherein the second holding portion is provided above the holding surface.

8. The substrate transport apparatus according to claim 7, wherein the second holding portion is provided movably along a rear surface of the substrate, and holds the other portion of the substrate which is a partial region of the rear surface.

9. The substrate transport apparatus according to claim 1 or 2, wherein the first holding portion holds the substrate in a state where a distance between the other portion of the substrate and the holding surface is shorter than a distance between the one portion of the substrate and the holding surface.

10. The substrate handling apparatus according to claim 1 or 2, wherein the first holding portion is provided obliquely with respect to the holding surface.

11. The substrate transport apparatus according to claim 10, wherein the first holding portion holds the part of the substrate and is provided obliquely with respect to the holding surface; the second holding portion holds the other portion of the substrate and is provided in parallel with the holding surface.

12. The substrate transport apparatus according to claim 11, comprising a drive unit configured to drive the first holding unit so as to be inclined with respect to the holding surface.

13. The substrate transport apparatus according to claim 1 or 2, wherein the drive portion moves the first holding portion along the holding surface.

14. The substrate transport apparatus according to claim 1 or 2, comprising a carry-out device for carrying out another substrate different from the substrate from the holding device,

the carrying-out device carries out the other substrate in the relative movement of the holding device and the second holding portion with respect to the first holding portion by the driving portion.

15. The substrate transport apparatus according to claim 14, wherein the carry-out apparatus moves the other substrate in a vertical direction between the first holding portion and the holding apparatus.

16. The substrate transport apparatus according to claim 14, wherein the carry-out device is provided in the first holding portion,

the drive unit moves the first holding unit relative to the second holding unit and the holding device, and moves the carry-out device.

17. The substrate transport apparatus according to claim 14, wherein the holding device has a suction hole that supplies a gas that floats the other substrate,

the carrying-out device moves the other substrate floated on the holding device along the holding surface of the holding device.

18. An exposure apparatus comprising:

the substrate handling apparatus of any of claims 1 to 17; and

and an optical system configured to irradiate the substrate transferred to the holding device with an energy beam and expose the substrate.

19. The exposure apparatus according to claim 18, wherein at least one side or a diagonal length of the substrate is 500mm or more and is used for a flat panel display.

20. A flat panel display manufacturing method, comprising:

exposing a substrate using the exposure apparatus according to claim 19; and

and developing the exposed substrate.

21. A component manufacturing method comprising:

exposing a substrate using the exposure apparatus according to claim 18 or 19; and

and developing the exposed substrate.

22. A substrate transfer method for transferring a substrate to a holding surface of a holding device capable of holding the substrate, the method comprising:

holding the substrate by a first holding portion and a second holding portion above the holding device; and

and relatively moving the holding device and the second holding portion with respect to the first holding portion in a state where the second holding portion holds another portion of the substrate, in which the second holding portion is higher than the holding surface in the vertical direction and lower than a first position at which the first holding portion holds a portion of the substrate, so that the first holding portion is retracted from above the holding device, and the other portion of the substrate held by the first holding portion is held.

23. The substrate transport method according to claim 22, wherein the first holding portion is moved above the second holding portion and the holding device in a vertical direction by the relative movement.

24. The substrate conveying method according to claim 22 or 23, wherein the first holding portion is moved in a direction away from the second holding portion by the relative movement.

25. The substrate conveying method according to claim 22 or 23, wherein the substrates are held by the holding device in order from the other portion side to the one portion side of the substrate.

26. The substrate conveying method according to claim 22 or 23, wherein a position of the substrate with respect to the holding device is adjusted in a state where the second holding portion holds the other portion of the substrate.

27. The substrate conveying method according to claim 22 or 23, wherein the substrate is held by the second holding portion in a state in which a distance between the other portion of the substrate and the holding surface is shorter than a distance between the one portion of the substrate and the holding surface by the holding.

28. The substrate transport method according to claim 27, wherein the substrate is held by the first holding portion provided obliquely with respect to the holding surface by the holding.

29. The substrate conveying method according to claim 22 or 23, wherein the first holding portion is moved along the holding surface by the relative movement.

30. The substrate conveying method according to claim 22 or 23, comprising carrying out another substrate different from the substrate from the holding device,

and carrying out the other substrate by the carrying out while the holding device and the second holding portion are moving relative to the first holding portion.

31. The substrate transport method according to claim 30, wherein the other substrate is moved in a vertical direction between the first holding portion and the holding device by the carry-out.

32. The substrate transport method according to claim 30, wherein the relative movement causes the first holding portion to move relative to the second holding portion and the holding device, and the other substrate is carried out.

33. The substrate transport method according to claim 30, wherein the other substrate floated on the holding device is moved along the holding surface of the holding device by the carry-out.

34. An exposure method comprising:

the substrate handling method according to any one of claims 22 to 33; and

and an optical system configured to irradiate the substrate transported to the holding device with an energy beam and expose the substrate.

35. The exposure method according to claim 34, wherein the substrate has at least one side or diagonal length of 500mm or more and is used for a flat panel display.

36. A flat panel display manufacturing method, comprising:

exposing a substrate using the exposure method according to claim 35; and

and developing the exposed substrate.

37. A component manufacturing method comprising:

exposing the substrate using the exposure method according to claim 34 or 35; and

and developing the exposed substrate.