CN111130600A - Wireless communication interconnection system - Google Patents
Wireless communication interconnection system Download PDFInfo
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- CN111130600A CN111130600A CN201811294352.7A CN201811294352A CN111130600A CN 111130600 A CN111130600 A CN 111130600A CN 201811294352 A CN201811294352 A CN 201811294352A CN 111130600 A CN111130600 A CN 111130600A
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- 238000004891 communication Methods 0.000 title claims abstract description 176
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 210000001503 joint Anatomy 0.000 claims abstract description 8
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 3
- 230000005389 magnetism Effects 0.000 claims 2
- 238000001179 sorption measurement Methods 0.000 claims 1
- 238000003032 molecular docking Methods 0.000 description 12
- 230000008054 signal transmission Effects 0.000 description 7
- 230000013011 mating Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
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Abstract
A wireless communication interconnection system comprises a first communication module and a second communication module which are mutually butted, wherein the first communication module comprises a wireless transmitting element and a first magnetic attraction element, the second communication module comprises a wireless receiving element which is butted with the wireless transmitting element to carry out signal wireless transmission and a second magnetic attraction element which is mutually attracted and matched with the first magnetic attraction element, and the second communication module can rotate to a first position and a second position and is in butt joint and matching with the first communication module at least at two different angles, so that multiple use modes of the wireless communication interconnection system are realized, and diversified matching requirements of the wireless communication interconnection system are met.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a wireless communication interconnection system, and more particularly, to a wireless communication interconnection system having a first communication module and a second communication module that are connected to each other.
[ background of the invention ]
At present, consumer electronic products on the market, such as displays, televisions and the like, are generally used as receiving terminals (Sink) to be connected with Source terminals (Source), such as computers, set top boxes and the like. The source end is provided with a first communication module for transmitting various signals including data, audio, video and the like and providing power supply, the receiving end is provided with a second communication module for receiving various signals transmitted by the first communication module of the source end and providing power, and the first communication module and the second communication module are often connected together through various cables to transmit various signals and power, so that a consumer electronic product serving as the receiving end can be fixed on a wall or a support only in a horizontal or vertical alternative mode.
Therefore, there is a need to provide an improved wireless communication interconnection system to solve the above problems.
[ summary of the invention ]
The invention mainly aims to provide a wireless communication interconnection system capable of realizing multiple use modes.
In order to achieve the purpose, the invention adopts the following technical scheme: a wireless communication interconnection system comprises a first communication module and a second communication module which are mutually butted, wherein the first communication module comprises a wireless transmitting element and a first magnetic attraction element, the second communication module comprises a wireless receiving element which is butted with the wireless transmitting element to carry out wireless signal transmission and a second magnetic attraction element which is mutually attracted and matched with the first magnetic attraction element, and the second communication module can rotate to a first position and a second position and is in butt joint and matching with the first communication module at least at two positions with different angles.
Furthermore, the first communication module comprises a first circuit board, and the second communication module comprises a second circuit board; the wireless transmitting element comprises a plurality of transmitting wafer modules which are arranged on the first circuit board and used for converting the electric signals of the first circuit board into electromagnetic signals to transmit the signals; the wireless receiving element comprises a plurality of receiving chip modules which are arranged on the second circuit board and used for converting the received electromagnetic signals into electric signals so as to transmit the received signals to the second circuit board; when the transmitting wafer module is aligned with the receiving wafer module, the wireless transmission of point-to-point extremely high frequency signals can be realized.
Furthermore, the first magnetic element comprises two groups of first magnets surrounding the first circuit board, the second magnetic element comprises one group of second magnets surrounding the second circuit board, and the second communication module is magnetically matched with one group of the two groups of corresponding first magnets at the first position and the second position respectively through the group of second magnets so as to realize mutual fixation with the first communication module.
Furthermore, when the first communication module and the second communication module are mutually matched at the first position and the second position, the magnetic attraction matching is generated corresponding to the opposite polarities of the first magnet and the second magnet; when the second communication module rotates to a position between the first position and the second position, the polarities corresponding to the first magnet and the second magnet are the same so as to repel each other and further separate the first communication module from the second communication module.
Furthermore, one of the two groups of first magnets is positioned at the left side and the right side of the first circuit board, the other group of first magnets is positioned at the upper side and the lower side of the first circuit board, and the second magnets is positioned at the left side and the right side of the second circuit board.
Furthermore, the first communication module further comprises a spring thimble positioned at the center of the first circuit board, and the transmitting wafer module is positioned outside the spring thimble; the second communication module further comprises a butt-joint terminal positioned in the center of the second circuit board, and the receiving wafer module is positioned outside the butt-joint terminal; the butt joint terminal is matched with the spring thimble in a compression joint mode so as to achieve transmission of a power supply and a low-speed signal.
Furthermore, the first communication module comprises at least two groups of transmitting wafer modules and at least two groups of spring thimbles; the second communication module comprises a group of receiving wafer modules and a group of butt-joint terminals; the group of receiving wafer modules are respectively aligned with one of the two corresponding transmitting wafer modules at the first position and the second position to carry out point-to-point wireless transmission of the extremely high frequency signals; and the pair of butt-joint terminals are respectively matched with one of the two groups of spring thimbles at the first position and the second position in a compression joint mode so as to transmit a power supply and a low-speed signal.
Furthermore, the first circuit board and the second circuit board are both arranged annularly; the first communication module further comprises a first sub-board assembled in the center of the first circuit board, the second communication module further comprises a second sub-board assembled in the center of the second circuit board, the spring ejector pin is fixedly installed on the first sub-board, and the butt terminal is fixedly installed on the second sub-board.
Furthermore, the first communication module further comprises at least two groups of Hall sensors mounted to the first circuit board and a router for controlling signal transmission of the transmitting wafer module, and the second communication module further comprises a group of magnet units mounted to the second circuit board; the group of magnet units are respectively in induction fit with one of the two groups of corresponding Hall sensors at the first position and the second position so as to be detected by the router and further control the corresponding transmitting wafer module and the corresponding receiving wafer module to transmit signals.
Further, the following steps: be 90 degrees settings between first position and the second position, just first position is the level setting, the second position is vertical setting.
Compared with the prior art, the second communication module can rotate to the first position and the second position at least at two different angles to be in butt joint with the first communication module, so that multiple use modes of the wireless communication interconnection system are realized, and diversified cooperation requirements of the wireless communication interconnection system are met.
[ description of the drawings ]
Fig. 1 is a perspective view of a wireless communication interconnect system according to the present invention after a first communication module is installed.
Fig. 2 is a partially exploded schematic view of the first communication module of fig. 1.
Fig. 3 is a perspective view of the wireless communication interconnection system according to the present invention after the second communication module is mounted to an electronic product.
Fig. 4 is a partially exploded schematic view of fig. 3.
Fig. 5 is a schematic perspective view of the electronic product of fig. 3 after being rotated counterclockwise by 90 degrees.
Fig. 6 is a schematic plan view of the first communication module and the second communication module of the present invention when they are mated in the first position.
Fig. 7 is a schematic plan view of the first communication module and the second communication module of the present invention when they are mated in the second position.
[ description of main element symbols ]
Wireless communication interconnect system 500 first communication module 100
The first magnetic attraction element 12 of the transmitting chip module 110
The wireless receiving device 21 receives the chip module 210
Second magnetically attracted element 22 second magnet 220
The second sub-board 23 is butted against the terminal 231
Support 400 electronic product 600
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
Referring to fig. 1-5, the wireless communication interconnection system 500 of the present invention includes a first communication module 100 and a second communication module 200 that are connected to each other, wherein the first communication module 100 can be installed and fixed on a support 400 such as a wall or a bracket, and the second communication module 200 can be installed and fixed on an electronic product 600 such as a television or a computer display, and various power supplies and signal transmissions of the electronic product can be realized by connecting the first and second communication modules 100 and 200.
Referring to fig. 4-7, the second communication module 200 of the present invention can be rotated to two different angles, i.e. the first position and the second position, to be mated with the first communication module 100, so as to implement multiple usage modes of the wireless communication interconnection system 500, and meet the diversified mating requirements of the wireless communication interconnection system 500. In this embodiment, the first position and the second position are 90 degrees, the first position is horizontal, and the second position is vertical, so that the electronic product having the second communication module 200 can be installed on the support having the first communication module 100 in two horizontal or vertical ways, thereby realizing diversification of installation and use of the electronic product. In other embodiments, three or more positions with different angles may be provided, and the first position, the second position and the angle therebetween may be provided in different positions according to specific requirements of the electronic product.
Referring to fig. 1-5, the first communication module 100 includes a first circuit board 10, a wireless transmitting element 11 and a first magnetic element 12, the wireless transmitting element 11 includes a plurality of transmitting chip modules 110 mounted on the first circuit board 10 for converting an electrical signal of the first circuit board 10 into an electromagnetic signal for transmitting the signal, and in order to simplify the structure of the figure, only 2 transmitting chip modules 110 are drawn on the figure for illustration. The second communication module 200 includes a second circuit board 20, a wireless receiving element 21 connected to the wireless transmitting element 11 for wireless signal transmission, and a second magnetic element 22 connected to the first magnetic element 2 in an attracting and matching manner, wherein the wireless receiving element 21 includes a plurality of receiving chip modules 210 mounted on the second circuit board 20 for converting the received electromagnetic signals into electrical signals and transmitting the received signals to the second circuit board 20, and for simplifying the structure of the figure, only 1 receiving chip module 210 is drawn on the figure for illustration. The transmitting wafer module and the receiving wafer module are in signal transmission in a non-contact close-distance alignment mode, point-to-point wireless transmission of extremely high frequency signals can be realized during alignment, the Extremely High Frequency (EHF) signals referred to by the invention are electromagnetic wave signals with the wavelength shorter than ultra high frequency (SHF), and the wavelength range is 1mm to 10 mm.
The first magnetic component 12 includes two sets of first magnets 120 surrounding the first circuit board 10, the second magnetic component 22 includes one set of second magnets 220 surrounding the second circuit board 20, and the second communication module 200 is magnetically coupled to one of the two sets of first magnets 120 at a first position and a second position respectively through the set of second magnets 220 to fix the first communication module 100. The wireless communication interconnection system 500 does not need to perform mechanical plugging and pulling matching on the first communication module 100 and the second communication module 200, so that the appearance structures of the first communication module 100 and the second communication module 200 are not abraded, the service life of the wireless communication interconnection system is prolonged, and the structure is simple and the combination is reliable by selecting a mode of matching one group of second magnets 220 and two groups of first magnets 120 which are skillfully arranged.
The two groups of first magnets 120 are arranged in two circles on the periphery of the first circuit board 10, wherein one group is 7 first magnets 120, 6 first magnets 120 respectively surround the left side and the right side of the first circuit board 10 to form a first circle, the 3 first magnets 120 on the left side are sequentially an S pole, an N pole and an S pole from top to bottom, the 3 first magnets 120 on the right side are sequentially an N pole, an S pole and an N pole from top to bottom, and the other 1 first magnet 120 is arranged in a second circle on the periphery of the first circle and is arranged at the uppermost part of the first circuit board 10; the other of the two groups of first magnets 120 is 6 first magnets 120, wherein 5 first magnets 120 and the 6 magnets located on the left and right sides form a first ring together, the upper side forms 3 first magnets 120 which are sequentially an S pole, an N pole and an S pole from left to right, the lower side forms 2 first magnets 120 which are sequentially an N pole and an N pole from left to right, a gap (not shown) is formed in the middle of the 2 first magnets 120 on the lower side, the gap corresponds to the first magnet 120 with the N pole in the middle of the upper side in the up-down direction, the gap can provide arrangement space for the entry and exit of various cables, and the other 1 first magnet 120 is located in a second ring on the periphery of the first ring and on the rightmost side of the first circuit board 10.
In this embodiment, the number of the second magnets 220 is 7, and two circles are commonly arranged on the periphery of the second circuit board 20, wherein 6 second magnets 220 respectively surround the left and right sides of the second circuit board 20 to form a first circle, the left 3 second magnets 220 are sequentially an S pole, an N pole, and an S pole from top to bottom, the right 3 second magnets 220 are sequentially an N pole, an S pole, and an N pole from top to bottom, and another 1 second magnet 120 is located in the second circle on the periphery of the first circle and located at the uppermost of the second circuit board 20.
Referring to fig. 5-6, when the first communication module 100 and the second communication module 200 are engaged with each other at the first position and the second position, the polarities of the first magnet 120 and the second magnet 220 are opposite to each other to generate magnetic attraction, so that the second communication module 200 is well fixed on the first communication module 100, and the first magnet 120 and the second magnet 220 form two circles of magnets for mutual attraction, thereby increasing the fixing strength of the first communication module 100 and the second communication module 200, ensuring the reliable docking performance of the first communication module 100 and the second communication module 200, and when the first communication module 100 and the second communication module 200 are engaged with each other at the opposite direction to the first position, the first magnet 120 and the second magnet 220 of the first communication module 100 and the second communication module 200 have the same polarity and repel each other, so that the effect of preventing reverse insertion can be achieved. When the second communication module 200 is separated from the first communication module 100, the second communication module 200 is rotated to a position between the first position and the second position, and the polarities of the corresponding first and second magnets 120, 220 are the same to repel each other, so as to separate the first communication module 100 from the second communication module 200, thereby facilitating the separation of the wireless communication interconnection system 500 of the present invention.
The first circuit board 10 and the second circuit board 20 are both arranged annularly. The first communication module 100 further includes a first sub-board 13 assembled at the center of the first circuit board 10, and a pogo pin 131 fixedly mounted on the first sub-board 13, the center of the first circuit board 10 forms a polygonal hole 17, the first sub-board 13 is polygonal and assembled in the polygonal hole 17, and the transmitting die set 110 is mounted on the first circuit board 10 so as to be located outside the pogo pin 131. The second communication module 200 further includes a second sub-board 23 assembled at the center of the second circuit board 20, and a docking terminal 231 fixedly mounted on the second sub-board 23, wherein the center of the second circuit board 20 forms a polygonal groove 27, the second sub-board 23 has a polygonal shape and is assembled in the polygonal groove 27, and the receiving die set 210 is located outside the docking terminal 231. The spring ejector pins 131 and the butt terminals 231 are respectively arranged in the circular areas of the corresponding first sub-board 13 and the second sub-board 23, and the butt terminals 231 and the spring ejector pins 131 are in press fit to realize transmission of power and low-speed signals. Therefore, the layout of the wireless communication interconnection system 500 of the present invention from inside to outside along the radial direction is sequentially the pogo pin 131 and the docking terminal 231 for transmitting power and low-speed signals; the transmitting and receiving wafer modules 110 and 210 for transmitting the extremely high frequency signals, and the first and second magnets 120 and 220 which are mutually attracted and matched make full use of the structural space of the wireless communication interconnection system 500, and the layout is reasonable.
The first communication module 100 comprises two sets of the transmitting die sets 110 and at least two sets of the pogo pins 131; the second communication module 200 comprises a set of the receiving die module 210 and a set of the docking terminals 231; the receiving die sets 210 are aligned with one of the transmitting die sets 110 at the first and second positions respectively for point-to-point wireless transmission of the vhf signals; the pair of mating terminals 231 is respectively press-connected to one of the two corresponding pogo pins 131 at the first position and the second position for power and low-speed signal transmission. The wireless communication interconnection system 500 of the present invention has two sets of the first magnets 120, two sets of the transmitting die sets 110, and two sets of the pogo pins 131 on the first communication module 100, and only one set of the second magnets 220, one set of the receiving die sets 210, and one set of the docking terminals 231 on the second communication module 200, so as to realize docking cooperation at different positions, thereby not only ensuring reliable docking of the first and second communication modules 100 and 200 at the first and second positions, but also reducing the circuit layout of the second communication module 200 and saving the space of the second communication module 200.
The first communication module 100 further includes at least two sets of hall sensors 15 mounted to the first circuit board 10 and a router 16 controlling signal transmission of the transmitting die module 110. The second communication module 200 also includes a set of magnet units 25 mounted to the second circuit board 20. The magnet units 25 are respectively in induction fit with one of the two corresponding groups of hall sensors 25 at the first position and the second position for the router 16 to detect and further control the corresponding transmitting wafer module 110 and receiving wafer module 210 to transmit signals, the connecting lines of the magnet units 25 form an equilateral triangle, and the connecting lines of the hall sensors 15 form two equilateral triangles at different positions. The wireless communication interconnection system 500 can reasonably detect and control the wireless transmission of the extremely high frequency signal through the arrangement of the Hall sensor 15, the magnet unit 25 and the router 16, and ensures the stable transmission performance of the wireless communication interconnection system 500.
The wireless communication interconnection system of the invention has the following beneficial effects:
(1) the second communication module 200 of the present invention can be rotated to at least two different angles of the first position and the second position to be mated with the first communication module 100, so as to realize multiple usage modes of the wireless communication interconnection system 500 and meet the diversified mating requirements of the wireless communication interconnection system.
(2) The first magnetic component 12 of the present invention includes two sets of first magnets 120 surrounding the first circuit board 10, the second magnetic component 22 includes one set of second magnets 220 surrounding the second circuit board 20, and the second communication module 200 is magnetically coupled to one set of the two sets of first magnets 120 at the first position and the second position respectively through the set of second magnets 220 to achieve mutual fixation with the first communication module 100, so that the wireless communication interconnection system 500 of the present invention will not wear the appearance structure when used in cooperation, the service life of the wireless communication interconnection system is increased, and the structure is simple and reliable in combination through the way of selecting one set of second magnets 220 to cooperate with the two sets of first magnets 120.
(3) When the second communication module 200 of the present invention is separated from the first communication module 100, the second communication module 200 is rotated to a position between the first position and the second position, and the polarities of the first and second magnets 120 and 220 are the same to repel each other, so as to separate the first communication module 100 from the second communication module 200, thereby facilitating the separation of the wireless communication interconnection system 500 of the present invention.
(4) The layout of the wireless communication interconnection system 500 of the present invention from inside to outside along the radial direction is sequentially the pogo pin 131 and the docking terminal 231 for transmitting power and low-speed signals; the transmitting and receiving wafer modules 110 and 210 for transmitting the extremely high frequency signals, and the first and second magnets 120 and 220 which are mutually attracted and matched make full use of the structural space of the wireless communication interconnection system 500, and the layout is reasonable.
(5) The wireless communication interconnection system 500 of the present invention has two sets of the first magnets 120, two sets of the transmitting die sets 110, and two sets of the pogo pins 131 on the first communication module 100, and only one set of the second magnets 220, one set of the receiving die sets 210, and one set of the docking terminals 231 on the second communication module 200, so as to realize docking cooperation at different positions, thereby not only ensuring reliable docking of the first and second communication modules 100 and 200 at the first and second positions, but also reducing the circuit layout of the second communication module 200 and saving the space of the second communication module 200.
(6) The wireless communication interconnection system 500 can reasonably detect and control the wireless transmission of the extremely high frequency signal through the arrangement of the Hall sensor 15, the magnet unit 25 and the router 16, and ensures the stable transmission performance of the wireless communication interconnection system 500.
The above description is only for the preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention. All such modifications and variations are intended to be included herein within the scope of this disclosure and the present invention and protected by the following claims.
Claims (10)
1. The utility model provides a wireless communication interconnected system, includes first communication module and the second communication module of mutual butt joint, first communication module includes that wireless transmitting element and first magnetism inhale the component, the second communication module include with wireless transmitting element butt joint is in order to carry out signal wireless transmission's wireless receiving element and inhale the component with first magnetism and inhale the component with the second of the component mutual adsorption complex of inhaling, its characterized in that: the second communication module can rotate to a first position and a second position at least at two positions with different angles to be in butt joint with the first communication module.
2. The wireless communication interconnect system of claim 1, wherein: the first communication module comprises a first circuit board, and the second communication module comprises a second circuit board; the wireless transmitting element comprises a plurality of transmitting wafer modules which are arranged on the first circuit board and used for converting the electric signals of the first circuit board into electromagnetic signals to transmit the signals; the wireless receiving element comprises a plurality of receiving chip modules which are arranged on the second circuit board and used for converting the received electromagnetic signals into electric signals so as to transmit the received signals to the second circuit board; when the transmitting wafer module is aligned with the receiving wafer module, the wireless transmission of point-to-point extremely high frequency signals can be realized.
3. The wireless communication interconnect system of claim 2, wherein: the first magnetic attraction element comprises two groups of first magnets surrounding the outside of the first circuit board, the second magnetic attraction element comprises one group of second magnets surrounding the outside of the second circuit board, and the second communication module is respectively matched with one group of the two groups of corresponding first magnets in a magnetic attraction mode at a first position and a second position through the group of second magnets so as to achieve mutual fixation with the first communication module.
4. The wireless communication interconnect system of claim 3, wherein: when the first communication module and the second communication module are mutually matched at the first position and the second position, the magnetic attraction matching is generated corresponding to the opposite polarities of the first magnet and the second magnet; when the second communication module rotates to a position between the first position and the second position, the polarities corresponding to the first magnet and the second magnet are the same so as to repel each other and further separate the first communication module from the second communication module.
5. The wireless communication interconnect system of claim 3, wherein: one of the two groups of first magnets is positioned at the left side and the right side of the first circuit board, the other group of first magnets is positioned at the upper side and the lower side of the first circuit board, and the second magnets are positioned at the left side and the right side of the second circuit board.
6. The wireless communication interconnect system of claim 3, wherein: the first communication module further comprises a spring thimble positioned at the center of the first circuit board, and the transmitting wafer module is positioned outside the spring thimble; the second communication module further comprises a butt-joint terminal positioned in the center of the second circuit board, and the receiving wafer module is positioned outside the butt-joint terminal; the butt joint terminal is matched with the spring thimble in a compression joint mode so as to achieve transmission of a power supply and a low-speed signal.
7. The wireless communication interconnect system of claim 6, wherein: the first communication module comprises at least two groups of transmitting wafer modules and at least two groups of spring thimbles; the second communication module comprises a group of receiving wafer modules and a group of butt-joint terminals; the group of receiving wafer modules are respectively aligned with one of the two corresponding transmitting wafer modules at the first position and the second position to carry out point-to-point wireless transmission of the extremely high frequency signals; and the pair of butt-joint terminals are respectively matched with one of the two groups of spring thimbles at the first position and the second position in a compression joint mode so as to transmit a power supply and a low-speed signal.
8. The wireless communication interconnect system of claim 7, wherein: the first circuit board and the second circuit board are both arranged annularly; the first communication module further comprises a first sub-board assembled in the center of the first circuit board, the second communication module further comprises a second sub-board assembled in the center of the second circuit board, the spring ejector pin is fixedly installed on the first sub-board, and the butt terminal is fixedly installed on the second sub-board.
9. The wireless communication interconnect system of claim 2, wherein: the first communication module further comprises at least two groups of Hall sensors mounted to the first circuit board and a router controlling transmission of the transmitting wafer module signal, and the second communication module further comprises a group of magnet units mounted to the second circuit board; the group of magnet units are respectively in induction fit with one of the two groups of corresponding Hall sensors at the first position and the second position so as to be detected by the router and further control the corresponding transmitting wafer module and the corresponding receiving wafer module to transmit signals.
10. The wireless communication interconnect system of any of claims 1-9, wherein: be 90 degrees settings between first position and the second position, just first position is the level setting, the second position is vertical setting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811294352.7A CN111130600A (en) | 2018-11-01 | 2018-11-01 | Wireless communication interconnection system |
| TW108139022A TWI827716B (en) | 2018-11-01 | 2019-10-29 | Wireless communication interconnection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811294352.7A CN111130600A (en) | 2018-11-01 | 2018-11-01 | Wireless communication interconnection system |
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| Publication Number | Publication Date |
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| CN111130600A true CN111130600A (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811294352.7A Pending CN111130600A (en) | 2018-11-01 | 2018-11-01 | Wireless communication interconnection system |
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|---|---|
| CN (1) | CN111130600A (en) |
| TW (1) | TWI827716B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115113344A (en) * | 2021-03-18 | 2022-09-27 | 富士康(昆山)电脑接插件有限公司 | Contactless connector and assembly thereof |
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- 2018-11-01 CN CN201811294352.7A patent/CN111130600A/en active Pending
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- 2019-10-29 TW TW108139022A patent/TWI827716B/en active
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| CN203313551U (en) * | 2013-05-23 | 2013-11-27 | 秀越实业股份有限公司 | Positioning assembly for electronic apparatus |
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| CN115113344A (en) * | 2021-03-18 | 2022-09-27 | 富士康(昆山)电脑接插件有限公司 | Contactless connector and assembly thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI827716B (en) | 2024-01-01 |
| TW202027432A (en) | 2020-07-16 |
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