CN111103521A - Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device - Google Patents
Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device Download PDFInfo
- Publication number
- CN111103521A CN111103521A CN201911381685.8A CN201911381685A CN111103521A CN 111103521 A CN111103521 A CN 111103521A CN 201911381685 A CN201911381685 A CN 201911381685A CN 111103521 A CN111103521 A CN 111103521A
- Authority
- CN
- China
- Prior art keywords
- conductive base
- semiconductor device
- groove
- thermal resistance
- smd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000012360 testing method Methods 0.000 title claims abstract description 37
- 210000004907 gland Anatomy 0.000 claims abstract description 28
- 230000006835 compression Effects 0.000 claims description 30
- 238000007906 compression Methods 0.000 claims description 30
- 239000000523 sample Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2637—Circuits therefor for testing other individual devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a thermal resistance test fixture for a SMD packaged semiconductor device bonded to a shell, which belongs to the technical field of thermal resistance test devices for SMD packaged semiconductor devices and comprises a conductive base, a gland, an electrode holder and a pressing assembly, wherein the lower surface of the conductive base is attached to the upper surface of a temperature control platform, and the upper surface is provided with a first accommodating groove for accommodating a device to be tested; the bottom wall of the first accommodating groove is electrically connected with a first electrode of the device to be tested; the lower surface of the gland is attached to the upper surface of the conductive base; the electrode seat is electrically connected with a second electrode of the device to be tested; the pressing assembly is arranged between the pressing cover and the device to be tested. The SMD packaging semiconductor device junction-to-shell thermal resistance test fixture provided by the invention avoids short circuit and ensures the safety of the test process.
Description
Technical Field
The invention belongs to the technical field of thermal resistance testing devices of SMD packaged semiconductor devices, and particularly relates to a clamp for testing thermal resistance of a junction-to-shell of an SMD packaged semiconductor device.
Background
The thermal characteristics of semiconductor devices are one of the important matters in the design of reliability. In order to ensure the reliability of the device during use, the heat dissipation characteristic of the device is considered in the structural design of the device, and the quantitative calculation of the heat dissipation of the device is required according to the thermal resistance parameter of the device. The thermal resistance of a semiconductor device is therefore an important parameter reflecting the thermal characteristics of the device.
The resistance that the heat meets on the heat conduction path is the thermal resistance. Which is defined as the ratio of the temperature difference over the heat conduction path to the power dissipated. The thermal resistance of the device from the junction to the shell is the thermal resistance between the heat source junction of the chip and the packaging shell, namely:
the junction temperature T of the device during operation can be obtained by a thermal resistance testerJWhen the junction-to-shell thermal resistance test is carried out according to the test method specified by the test standard, the temperature of the packaging shell (namely the shell temperature) of the device is controlled to be a certain fixed temperature through the temperature control platform, namely TCOr T can be obtained directly by thermocouple directly measuring the temperature of the housing during power-up operation of the deviceCThus, the junction-to-case thermal resistance of the device can be obtained.
For the SMD (Surface Mounted Devices) packaged semiconductor device, three electrodes are all located on the bottom Surface of the device and on the same plane, because the part with higher temperature of the shell is the bottom Surface of the leading-out electrode during the operation, when the temperature of the shell is controlled, the electrode Surface needs to be close to the temperature control platform and the thermocouple probe, but the temperature control platform is made of metal, if the device is directly attached to the temperature control platform, the testing cannot be carried out necessarily due to the short circuit of the electrodes.
Disclosure of Invention
The invention aims to provide a clamp for testing the junction-to-shell thermal resistance of an SMD packaged semiconductor device, and aims to solve the problem in the thermal resistance test of the junction-to-shell of the SMD packaged semiconductor device.
In order to achieve the purpose, the invention adopts the technical scheme that: there is provided an SMD package semiconductor device junction-to-case thermal resistance test jig including:
the lower surface of the conductive base is used for being attached to the upper surface of the temperature control platform, and the upper surface of the conductive base is provided with a first accommodating groove for accommodating a device to be tested; the first accommodating groove penetrates through one side face of the conductive base; the bottom wall of the first accommodating groove is used for being electrically connected with a first electrode of the device to be tested;
the gland is buckled on the conductive base, is used for pressing the conductive base and is movably connected with the temperature control platform;
the electrode seat is arranged on one side surface, provided with the first accommodating groove, of the conductive base, is in insulated connection with the conductive base and is used for being electrically connected with a second electrode of the device to be tested;
and the compressing assembly is arranged between the gland and the first accommodating groove and used for fixing the device to be tested in the first accommodating groove.
As another embodiment of this application, electrically conductive base on in the below of first holding tank be equipped with the exploration hole of first holding tank intercommunication, the exploration hole is used for holding thermocouple probe.
As another embodiment of the present application, the electrode holder includes:
the insulating shell is arranged on one side face, provided with the first accommodating groove, of the conductive base, an opening is formed in the upper surface of the insulating shell, and the upper surface of the insulating shell is coplanar with the bottom wall of the first accommodating groove;
and the conducting strip is arranged in the insulating shell, one end of the conducting strip is used for being electrically connected with the second electrode of the device to be tested, and the other end of the conducting strip is used for being electrically connected with the lead.
As another embodiment of the present application, an elastic pad is disposed between the bottom surface of the insulating case and the conductive sheet.
As another embodiment of the present application, the compressing assembly includes:
the positioning block is arranged inside the first accommodating groove, and the side wall of the positioning block is attached to the side wall of the first accommodating groove; the lower surface of the positioning block is provided with a fixing groove for accommodating the device to be tested, and the depth of the fixing groove is smaller than the thickness of the device to be tested;
and the lower end of the first compression screw penetrates through the gland and is connected with the positioning block.
As another embodiment of the present application, a pressing block is disposed between the first compression screw and the positioning block, and the positioning block is connected to the first compression screw through the pressing block; and the upper surface of the pressing block is provided with a screw hole groove matched with the lower end part of the first compression screw.
As another embodiment of the present application, a lower surface of the conductive base is provided with a wire groove for accommodating a thermocouple wire.
As another embodiment of the present application, a groove communicated with the wire groove is formed in the lower surface of the conductive base, and a pressing piece for fixing the thermocouple wire is arranged in the groove.
As another embodiment of this application, the lower surface of gland is equipped with and is used for holding the second holding tank of electrically conductive base, the degree of depth of second holding tank with electrically conductive base's height is the same.
As another embodiment of the application, a plurality of second compression screws are arranged in the gland at intervals, and the lower parts of the second compression screws penetrate through the gland and are abutted to the upper surface of the conductive base.
According to the SMD packaging semiconductor device junction-to-shell thermal resistance test fixture provided by the invention, the first electrode of the SMD packaging semiconductor device is electrically connected with the bottom surface of the first accommodating groove formed in the conductive base, the second electrode of the SMD packaging semiconductor device is electrically connected with the electrode holder, and the electrode holder is in insulated connection with the conductive base, so that short circuit in thermal resistance test of the SMD packaging semiconductor device is avoided.
Compared with the prior art, the SMD packaging semiconductor device junction-to-case thermal resistance test fixture avoids short circuit and ensures the safety of the test process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a SMD-packaged semiconductor device junction-to-case thermal resistance test fixture according to an embodiment of the present invention;
FIG. 2 is a view taken along the line A in FIG. 1;
fig. 3 is an exploded view of a SMD package semiconductor device junction-to-case thermal resistance test fixture according to an embodiment of the present invention;
FIG. 4 is a view taken along line B of FIG. 3;
FIG. 5 is a schematic perspective view of a conductive base according to an embodiment of the present invention;
FIG. 6 is a view taken along line C of FIG. 5;
FIG. 7 is a schematic perspective view of a gland used in an embodiment of the present invention;
FIG. 8 is a schematic perspective view of an insulating housing used in an embodiment of the present invention;
in the figure: 1. a conductive base; 11. a first accommodating groove; 12. a detection hole; 13. a wire slot; 14. a groove; 15. a second threaded hole; 16. a compaction groove; 2. a gland; 21. a second accommodating groove; 22. a third accommodating groove; 23. a third threaded hole; 24; a second fixing hole; 25. a first threaded hole; 3. an electrode holder; 31. an insulating case; 311. a conductive sheet accommodating groove; 312. an elastic gasket receiving groove; 32. a conductive sheet; 33. an elastic pad; 4. SMD packaging the semiconductor device; 41. a first electrode; 42. a second electrode; 5. a compression assembly; 51. a first compression screw; 52. positioning blocks; 53. briquetting; 6. tabletting; 61. a first fixing hole; 7. a second compression screw; 8. and (5) fastening the screw.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 4 together, the SMD packaged semiconductor device 4 junction to case thermal resistance test jig according to the present invention will now be described. SMD encapsulates semiconductor device 4 and ties shell thermal resistance test fixture, including electrically conductive base 1, gland 2, electrode holder 3 and compress tightly subassembly 5, electrically conductive base 1 is placed on accuse temperature platform to the lower surface of electrically conductive base 1 and the upper surface laminating of accuse temperature platform guarantee that the heat conduction is good between electrically conductive base 1 and the accuse temperature platform. The upper surface of electrically conductive base 1 is provided with first holding tank 11, and first holding tank 11 sets up the edge at the upper surface of electrically conductive base 1, and first holding tank 11 runs through one of them side of electrically conductive base 1. The first receiving groove 11 is used for receiving an SMD packaged semiconductor device 4 (device under test), two electrodes of the SMD packaged semiconductor device 4 are disposed on the bottom surface, the electrode with a larger area is referred to as a first electrode 41, the electrode with a smaller area is referred to as a second electrode 42, the first electrode 41 is a main heat source and a heat dissipating surface of the SMD packaged semiconductor device 4, and the case temperature of the SMD packaged semiconductor device 4 can be obtained by measuring the temperature of the first electrode 41.
After the SMD packaged semiconductor device 4 is placed in the first receiving groove 11, the first electrode 41 of the bottom surface is attached to the bottom wall of the first receiving groove 11 to realize electrical connection, and the second electrode 42 of the bottom surface extends out of the first receiving groove 11 from the opening side of the first receiving groove 11.
The electrode holder 3 sets up in the one side that is provided with first holding tank 11 of electrically conductive base 1 to insulating between electrode holder 3 and the electrically conductive base 1, being equipped with conductive element in the electrode holder 3, electrode holder 3 installs the back, just in time lies in the second electrode 42 that stretches out first holding tank 11 of SMD encapsulation semiconductor device 4 under, and conductive element in the electrode holder 3 can contact with second electrode 42, realizes the electricity and connects.
Compress tightly subassembly 5 and set up between gland 2 and electrically conductive base 1 to be located first holding tank 11 directly over, gland 2 presses and keeps fixed behind the top of electrically conductive base 1, compresses tightly subassembly 5 through the adjustment, compresses tightly SMD encapsulation semiconductor device 4 in first holding tank 11, guarantees the first electrode 41 and the electrically conductive base 1 zonulae occludens of SMD encapsulation semiconductor device 4 bottom surface.
Compared with the prior art, the SMD packaging semiconductor device 4 junction-to-shell thermal resistance test fixture provided by the invention avoids short circuit and ensures the safety of the test process.
The conductive base 1 is made of an oxygen-free copper material, has high thermal conductivity and oxidation resistance, and is plated with gold on the surface to enhance the conductivity.
And heat-conducting silicone grease is coated on the lower surface of the electric conduction base 1 to enhance the heat conductivity.
The test method used above is a double interface method, and the temperature of the first electrode 41 of the SMD packaged semiconductor device 4 is controlled to a certain fixed temperature by the temperature control stage. The test can also be carried out by the thermocouple method.
A detection hole 12 for accommodating a thermocouple probe is formed in the conductive base 1, the specific position of the detection hole 12 is arranged between the bottom surface of the first accommodating groove 11 and the bottom surface of the conductive base 1, and the bottom surface of the first accommodating groove 11 is communicated with the bottom surface of the conductive base 1 through the detection hole 12. The thermocouple probe is disposed in the probe hole 12 directly below the first electrode 41 of the SMD packaged semiconductor device 4, and the end of the thermocouple probe abuts against the surface of the first electrode 41, so that the temperature of the first electrode 41 can be accurately measured.
Referring to fig. 3 to 6 and 8, as an embodiment of the SMD package semiconductor device 4 junction-to-case thermal resistance testing jig of the present invention, the electrode holder 3 includes an insulating case 31 and a conductive plate 32, the insulating case 31 is fixed to one side of the conductive base 1 where the first receiving groove 11 is disposed by a screw, the insulating case 31 is located below the first receiving groove 11, and an upper surface of the insulating case 31 is coplanar with a bottom surface of the first receiving groove 11.
Open-top of insulating casing 31, inside is equipped with the cavity, be equipped with in the cavity and be equipped with conducting strip 32 holding tank 311 who holds conducting strip 32, place conducting strip 32 level behind conducting strip 32 holding tank 311, the upper surface of conducting strip 32 and the bottom surface coplane of first holding tank 11 to the second electrode 42 of the bottom surface of SMD encapsulation semiconductor device 4 just in time presses the one end at conducting strip 32, is connected with conducting strip 32 electricity, and the other end and the wire electricity of conducting strip 32 are connected, connects power supply unit through the wire.
Insulating casing 31 chooses the polytetrafluoroethylene material for use, and conducting strip 32 chooses the brass gold-plating material for use, and conducting strip 32 sets up in the inside of insulating casing 31, and electrically conducts base 1 insulation partition, and SMD encapsulates semiconductor device 4's first electrode 41 and electrically conducts base 1 and is connected, and second electrode 42 is connected with conducting strip 32 electricity, on the electrically conductive basis of not influencing, has avoided appearing the condition of short circuit between first electrode 41 and the second electrode 42.
In the present embodiment, the bottom surface of the SMD package semiconductor device 4 is provided with one first electrode 41 and two second electrodes 42, the first electrode 41 is electrically connected to the bottom surface of the first receiving groove 11, the two second electrodes 42 are symmetrically disposed, and both the two second electrodes 42 protrude from the first receiving groove 11. Two conducting strip 32 containing grooves 311 are arranged in the insulating groove, the two conducting strip 32 containing grooves 311 are respectively opposite to the two second electrodes 42, and the two conducting strip 32 containing grooves 311 are respectively provided with a conducting strip 32, so that the two second electrodes 42 are electrically connected.
Preferably, the connection between the second electrode 42 of the SMD packaged semiconductor device 4 and the conductive sheet 32 is rigid, and when the electrode holder 3 or the SMD packaged semiconductor device 4 is displaced, poor contact between the second electrode 42 and the conductive sheet 32 due to the displacement is likely to occur. In order to solve this problem, an elastic pad 33 is disposed between the bottom surface of the insulating case 31 and the conductive plate 32, one end of the conductive plate 32 is fixed in the receiving groove 311 of the conductive plate 32 by a screw, and the other end is raised by the elastic pad 33. The second electrode 42 of the SMD packaged semiconductor device 4 is connected to the end of the conductive plate 32 that is raised by the elastic pad 33, after the second electrode 42 presses the conductive plate 32, the elastic pad 33 is compressed, the second electrode 42 is in close contact with the conductive plate 32, and when the electrode holder 3 or the SMD packaged semiconductor device 4 is displaced, the second electrode 42 and the conductive plate 32 are always kept in close connection under the elastic force of the elastic pad 33.
The end of the conductive sheet 32 accommodating groove 311, which is provided with the elastic pad 33, is provided with an elastic pad 33 accommodating groove 312, which plays a role of fixing the elastic pad 33, and the depth of the elastic pad 33 accommodating groove 312 is smaller than the thickness of the elastic pad 33, so as to ensure that the elastic pad 33 can be compressed when the second electrode 42 compresses the conductive sheet 32.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 1 to 4, the pressing assembly 5 includes a positioning block 52 and a first pressing screw 51.
The positioning block 52 is disposed inside the first receiving groove 11, a side wall of the positioning block 52 is attached to a side wall of the first receiving groove 11, that is, a cross section of the positioning block 52 has the same shape and size as those of the first receiving groove 11, and the positioning block 52 just fills the first receiving groove 11. The lower surface of the positioning block 52 is provided with a fixing groove, the side wall of the fixing groove is attached to the side wall of the SMD packaged semiconductor device 4, that is, the shape and size of the cross section of the fixing groove are the same as those of the SMD packaged semiconductor device 4, and the SMD packaged semiconductor device 4 is clamped in the fixing groove. The depth of the fixing groove is smaller than the thickness of the SMD packaged semiconductor device 4, and the SMD packaged semiconductor device 4 can be pressed when the positioning block 52 is pressed down.
The SMD-packaged semiconductor device 4 is clamped in the fixing groove of the positioning block 52, the positioning block 52 is clamped in the first accommodating groove 11, and the SMD-packaged semiconductor device 4 cannot transversely shake.
The first screw is perpendicular to the upper surface of the gland 2, a first threaded hole 25 is formed in the gland 2 at a position right above the positioning block 52, and the first threaded hole 25 penetrates through the gland 2. The internal thread of the first threaded hole 25 is matched with the external thread of the first compression screw 51, the first compression screw 51 is screwed into the first threaded hole 25 and penetrates through the first threaded hole 25, the end part of the first compression screw 51 abuts against the upper surface of the positioning block 52, the first compression screw 51 is screwed downwards continuously, the first compression screw 51 compresses the positioning block 52, and the SMD packaged semiconductor device 4 is compressed in the first accommodating groove 11.
Preferably, a pressing block 52 is arranged between the first compression screw 51 and the positioning block 52, a screw hole groove matched with the first compression screw 51 is formed in the upper surface of the pressing block 52, the diameter of the screw hole groove is slightly larger than that of the first compression screw 51, the pressing block 52 is placed above the positioning block 52, the end of the first compression screw 51 enters the screw hole groove after passing through the first screw hole 25, and when the first compression screw 51 is screwed downwards continuously, the pressing block 52 is driven to move downwards, and the pressing block 52 presses the positioning block 52. Because the contact area between the lower surface of the pressing block 52 and the positioning block 52 is large, the end of the first compression screw 51 is prevented from scratching the positioning block 52 after the positioning block 52 is arranged.
Specifically, first holding tank 11 sets up to the rectangular channel, and locating piece 52 sets up to the rectangular block, and briquetting 52 sets up to cylindrically, and columniform bottom surface diameter is less than the length of side of the bottom surface minor face of rectangular channel, drives briquetting 52 and rotates when first housing pin 51 precession, rotates the in-process and can not receive blockking of first holding tank 11.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 2, fig. 4 and fig. 6 together, the thermocouple probe is disposed in the detection hole 12, and needs to transmit a detection signal through a thermocouple wire, the thermocouple wire is wired from the bottom of the conductive base 1, in order to ensure the adhesion between the lower surface of the conductive base 1 and the upper surface of the temperature control platform, a wire slot 13 is formed in the lower surface of the conductive base 1, the depth of the wire slot 13 is greater than the diameter of the thermocouple wire, and the thermocouple wire is wired in the wire slot 13.
Preferably, in order to fix the thermocouple wire, two pressing sheets 6 are arranged on the lower surface of the conductive base 1 at intervals along the arrangement direction of the thermocouple wire, first fixing holes 61 are formed in two ends of each pressing sheet 6, two grooves 14 are formed in the positions, corresponding to the two pressing sheets 6, of the lower surface of the conductive base 1, the pressing sheets 6 are arranged in the grooves 14, second threaded holes 15 are formed in the positions, corresponding to the two first fixing holes 61, of the inner portions of the grooves 14, after the first fixing holes 61 and the second threaded holes 15 are aligned, screws are screwed into the second threaded holes 15 after penetrating through the first fixing holes 61, the pressing sheets 6 are fixed in the grooves 14, and the thermocouple wire is compressed.
Referring to fig. 7, a second receiving groove 21 for receiving the conductive base 1 is formed in a lower surface of the pressing cover 2, a depth of the second receiving groove 21 is the same as a height of the conductive base 1, the pressing cover 2 is fastened above the conductive base 1, and the conductive base 1 is embedded in the second receiving groove 21. Set up four second fixed orificess 24 along the border interval of gland 2, the upper surface of accuse temperature platform all sets up the screw hole to the position that corresponds four second fixed orificess 24, passes second fixed orifices 24 back screw in threaded hole respectively with fastening screw 8, fixes gland 2 on accuse temperature platform.
If the height of the pressing component 5 is higher than the upper surface of the conductive base 1, a third receiving groove 22 is formed on the bottom surface of the second receiving groove 21 for receiving the pressing component 5.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 1 to 4, four third threaded holes 23 are disposed between the bottom surface of the second receiving groove 21 and the upper surface of the gland 2 at intervals, a second pressing screw 7 is disposed in the third threaded hole 23, and a pressing groove 16 is disposed at a position corresponding to the four third threaded holes 23 on the upper surface of the conductive base 1. After the second compression screw 7 is screwed into the third threaded hole 23 and penetrates through the third threaded hole 23, the end part of the second compression screw 7 is embedded into the compression groove 16, the second compression screw 7 is screwed in continuously, and the conductive base 1 is compressed on the temperature control platform.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
- SMD packaged semiconductor device junction-to-case thermal resistance test fixture, comprising:the lower surface of the conductive base is used for being attached to the upper surface of the temperature control platform, and the upper surface of the conductive base is provided with a first accommodating groove for accommodating a device to be tested; the first accommodating groove penetrates through one side face of the conductive base; the bottom wall of the first accommodating groove is used for being electrically connected with a first electrode of the device to be tested;the gland is buckled on the conductive base, is used for pressing the conductive base and is movably connected with the temperature control platform;the electrode seat is arranged on one side surface, provided with the first accommodating groove, of the conductive base, is in insulated connection with the conductive base and is used for being electrically connected with a second electrode of the device to be tested;and the compressing assembly is arranged between the gland and the first accommodating groove and used for fixing the device to be tested in the first accommodating groove.
- 2. The SMD package semiconductor device junction-to-case thermal resistance test jig of claim 1, wherein a probe hole communicating with the first receiving groove is formed in the conductive base below the first receiving groove, the probe hole receiving a thermocouple probe.
- 3. The SMD package semiconductor device junction-to-case thermal resistance test jig of claim 1 or 2, wherein said electrode holder includes:the insulating shell is arranged on one side face, provided with the first accommodating groove, of the conductive base, an opening is formed in the upper surface of the insulating shell, and the upper surface of the insulating shell is coplanar with the bottom wall of the first accommodating groove;and the conducting strip is arranged in the insulating shell, one end of the conducting strip is used for being electrically connected with the second electrode of the device to be tested, and the other end of the conducting strip is used for being electrically connected with the lead.
- 4. The SMD package semiconductor device junction-to-case thermal resistance test jig of claim 3, wherein an elastic washer is provided between a bottom surface of the insulating case and the conductive sheet.
- 5. The SMD package semiconductor device junction-to-case thermal resistance test fixture of claim 1, 2 or 4, wherein said hold down assembly includes:the positioning block is arranged inside the first accommodating groove, and the side wall of the positioning block is attached to the side wall of the first accommodating groove; the lower surface of the positioning block is provided with a fixing groove for accommodating the device to be tested, and the depth of the fixing groove is smaller than the thickness of the device to be tested;and the lower end of the first compression screw penetrates through the gland and is connected with the positioning block.
- 6. The SMD-packaged semiconductor device junction-to-case thermal resistance test fixture according to claim 5, wherein a pressing block is provided between said first compression screw and said positioning block, and said positioning block is connected with said first compression screw through said pressing block; and the upper surface of the pressing block is provided with a screw hole groove matched with the lower end part of the first compression screw.
- 7. The SMD packaged semiconductor device junction-to-case thermal resistance test fixture of claim 2, 4 or 6, wherein said conductive base has a lower surface provided with a wire groove for receiving a thermocouple wire.
- 8. The SMD package semiconductor device junction-to-case thermal resistance test jig of claim 7, wherein a groove communicating with the wire groove is formed on a lower surface of the conductive base, and a pressing piece for fixing the thermocouple wire is provided in the groove.
- 9. The SMD package semiconductor device junction-to-case thermal resistance test jig of claim 1 or 2, wherein a lower surface of the pressing cover is provided with a second receiving groove for receiving the conductive base, the second receiving groove having a depth identical to a height of the conductive base.
- 10. The SMD package semiconductor device junction-to-case thermal resistance test jig of claim 9, wherein a plurality of second compression screws are provided at intervals in the pressing cover, lower portions of the second compression screws passing through the pressing cover and abutting against the upper surface of the conductive base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911381685.8A CN111103521B (en) | 2019-12-27 | 2019-12-27 | SMD packaged semiconductor device junction-to-shell thermal resistance test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911381685.8A CN111103521B (en) | 2019-12-27 | 2019-12-27 | SMD packaged semiconductor device junction-to-shell thermal resistance test fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111103521A true CN111103521A (en) | 2020-05-05 |
| CN111103521B CN111103521B (en) | 2024-06-21 |
Family
ID=70424692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911381685.8A Active CN111103521B (en) | 2019-12-27 | 2019-12-27 | SMD packaged semiconductor device junction-to-shell thermal resistance test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111103521B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112198189A (en) * | 2020-08-26 | 2021-01-08 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
| CN112782215A (en) * | 2020-12-28 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Novel thermal resistance test fixture for electronic element |
| CN112782217A (en) * | 2020-12-29 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Thermal resistance test fixture for flip chip |
| CN113791242A (en) * | 2021-07-23 | 2021-12-14 | 中国电子技术标准化研究院 | SMD surface mount device testing clamp |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040033341A (en) * | 2002-10-14 | 2004-04-28 | 주식회사 오킨스전자 | Socket for Quad Flat Type Package |
| CN103884876A (en) * | 2014-03-31 | 2014-06-25 | 工业和信息化部电子第五研究所 | Electronic element thermal resistance measurement clamp |
| CN104730295A (en) * | 2015-04-02 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Clamp for thermal resistance test of SMD packaged semiconductor device |
| CN110231498A (en) * | 2019-07-17 | 2019-09-13 | 安徽三优光电科技有限公司 | A kind of SMD encapsulation semiconductor devices thermo-resistance measurement fixture |
| CN211653054U (en) * | 2019-12-27 | 2020-10-09 | 中国电子科技集团公司第十三研究所 | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device |
-
2019
- 2019-12-27 CN CN201911381685.8A patent/CN111103521B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040033341A (en) * | 2002-10-14 | 2004-04-28 | 주식회사 오킨스전자 | Socket for Quad Flat Type Package |
| CN103884876A (en) * | 2014-03-31 | 2014-06-25 | 工业和信息化部电子第五研究所 | Electronic element thermal resistance measurement clamp |
| CN104730295A (en) * | 2015-04-02 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Clamp for thermal resistance test of SMD packaged semiconductor device |
| CN110231498A (en) * | 2019-07-17 | 2019-09-13 | 安徽三优光电科技有限公司 | A kind of SMD encapsulation semiconductor devices thermo-resistance measurement fixture |
| CN211653054U (en) * | 2019-12-27 | 2020-10-09 | 中国电子科技集团公司第十三研究所 | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112198189A (en) * | 2020-08-26 | 2021-01-08 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
| CN112198189B (en) * | 2020-08-26 | 2024-05-14 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
| CN112782215A (en) * | 2020-12-28 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Novel thermal resistance test fixture for electronic element |
| CN112782217A (en) * | 2020-12-29 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Thermal resistance test fixture for flip chip |
| CN113791242A (en) * | 2021-07-23 | 2021-12-14 | 中国电子技术标准化研究院 | SMD surface mount device testing clamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111103521B (en) | 2024-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111103521A (en) | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device | |
| US7663388B2 (en) | Active thermal control unit for maintaining the set point temperature of a DUT | |
| CN104730295A (en) | Clamp for thermal resistance test of SMD packaged semiconductor device | |
| CN204422736U (en) | A kind of LED proving installation | |
| CN217546598U (en) | BGA chip testing device | |
| CN211653054U (en) | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device | |
| CN204479621U (en) | A kind of SMD encapsulated semiconductor device thermo-resistance measurement fixture | |
| TW400666B (en) | IC socket | |
| EP2058860A3 (en) | Fully testable surface mount die package configured for two-sided cooling | |
| CN117991025A (en) | Laser device assembly level live aging device | |
| JP2012181218A (en) | Socket for inspecting semiconductor chip | |
| US11567103B2 (en) | Testing device | |
| CN217879335U (en) | Aging test fixture for high-power TO packaging laser | |
| CN111337810A (en) | Thermal resistance testing device for SMD-3 packaged power device | |
| CN113225858A (en) | Heat source simulation structure | |
| TWM361771U (en) | Sensor connector assembly | |
| CN218213088U (en) | Chip positioning test structure | |
| TWI771889B (en) | Heat source simulation structure | |
| CN216718644U (en) | Micro-space connector testing device | |
| CN220019636U (en) | Thermal testing tool | |
| CN217467786U (en) | Simple fire alarm detector | |
| US11733107B2 (en) | Thermistor sensor arrangement for measuring chipset temperature | |
| CN113791242B (en) | SMD surface-mounted packaging device test fixture | |
| CN115825677A (en) | Structure and method for testing junction-shell thermal resistance of surface-mounted package device | |
| CN111505479B (en) | Low-temperature superconducting chip packaging testing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |