CN111010821A - Manufacturing method of printed circuit board meeting high-precision requirement of pad position - Google Patents
Manufacturing method of printed circuit board meeting high-precision requirement of pad position Download PDFInfo
- Publication number
- CN111010821A CN111010821A CN201911424596.7A CN201911424596A CN111010821A CN 111010821 A CN111010821 A CN 111010821A CN 201911424596 A CN201911424596 A CN 201911424596A CN 111010821 A CN111010821 A CN 111010821A
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- China
- Prior art keywords
- printed circuit
- circuit board
- manufacturing
- precision requirement
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 52
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 34
- 238000007639 printing Methods 0.000 claims abstract description 27
- 238000007650 screen-printing Methods 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000001723 curing Methods 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a printed circuit board meeting the high-precision requirement of a pad position, which comprises the following steps of: (1) printing a bonding pad of a printed circuit board by adopting a screen printing method, and then carrying out UV curing treatment; (2) printing a circuit pattern on the printed circuit board obtained in the step (1) by adopting a screen printing method, and then carrying out UV curing treatment; (3) carrying out etching and ink stripping treatment on the printed circuit board obtained in the step (2); (4) and (4) printing solder resist ink on the surface of the printed circuit board obtained in the step (3) by adopting a screen printing method, and then carrying out UV curing treatment. By the mode, the high-precision requirement on the position of the bonding pad can be met; in addition, the manufacturing cost of the screen printing method is relatively low, and the manufacturing method is simple and easy to popularize and apply.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a printed circuit board meeting the high-precision requirement of a pad position.
Background
With the development of electronic technology, printed circuit boards are used more and more widely in the electronic field, wherein pads are important components of the printed circuit boards for mounting electronic components. In television backlight strip and other electronic products, high-precision requirements are placed on the mounting positions of LED and other electronic elements on a printed circuit board so as to meet the performance requirements of corresponding products, namely, the pad positions also meet the high-precision requirements.
In the traditional screen printing method, a circuit pattern is printed firstly, and then a bonding pad is exposed in a way of printing solder resist ink windowing, so that the printed circuit board prepared by the printing process cannot meet the high-precision requirement of the bonding pad position; in addition, the printed circuit board is manufactured by using an exposure technology in the prior art, the high-precision requirement of the position of the bonding pad can be met, but compared with a screen printing method, the method is complex in manufacturing process and high in cost.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a manufacturing method of a printed circuit board meeting the high-precision requirement of a bonding pad position, and the technical problem can be solved.
(II) technical scheme
In order to solve the above technical problems, the present invention provides the following technical solutions: a manufacturing method of a printed circuit board meeting the high-precision requirement of a pad position comprises the following steps:
(1) printing a bonding pad of a printed circuit board by adopting a screen printing method, and then carrying out UV curing treatment;
(2) printing a circuit pattern on the printed circuit board obtained in the step (1) by adopting a screen printing method, and then carrying out UV curing treatment;
(3) carrying out etching and ink stripping treatment on the printed circuit board obtained in the step (2);
(4) and (4) printing solder resist ink on the surface of the printed circuit board obtained in the step (3) by adopting a screen printing method, and then carrying out UV curing treatment.
Preferably, the step (1) is specifically: and grinding, cleaning and drying the copper-clad plate, then printing the pattern of the bonding pad on the copper-clad plate by using a composite stainless steel wire mesh, and then carrying out UV curing treatment.
Preferably, the mesh number of the composite stainless steel screen is 400 meshes.
Preferably, the ink for printing the bonding pad in the step (1) is a UV type white solder resist inkThe curing energy adopted in the step (1) is more than or equal to 1000mJ/cm2UV curing treatment is performed.
Preferably, the mesh number of the printed circuit pattern in the step (2) is 300 meshes.
Preferably, the ink for printing the circuit pattern in the step (2) is a UV curing ink, and the curing energy adopted in the step (2) is more than or equal to 700mJ/cm2UV curing treatment is performed.
Preferably, the etching in step (3) is specifically performed using (CuCl)2+HCL+H2O2) Carrying out acid etching treatment on the formed etching solution, wherein the etching speed is 7.5m/min, and the specific gravity of the etching solution is 1.253-1.258; specifically, the ink stripping treatment was performed using 3% NaOH.
Preferably, the mesh number of the solder resist ink printed in the step (4) is 250 meshes, the solder resist ink is UV curing ink, and the curing energy adopted in the step (4) is more than or equal to 1000mJ/cm2UV curing treatment is performed.
Preferably, step (5) is further included after step (4): and (4) carrying out character printing, detection and OSP processing procedures on the printed circuit board obtained in the step (4).
In order to solve the above technical problem, the present invention further provides another technical solution as follows: a printed circuit board meeting the high-precision requirement of a bonding pad position is manufactured by the manufacturing method.
(III) advantageous effects
Compared with the prior art, the invention provides the manufacturing method of the printed circuit board meeting the high-precision requirement of the pad position, and the manufacturing method has the following beneficial effects: the pad of the printed circuit board is firstly printed by adopting a screen printing method, and a circuit pattern is not arranged on the printed circuit board before the pad is printed, so that the position of the pad is better positioned, and the high-precision requirement on the position of the pad can be met; in addition, the manufacturing cost of the screen printing method is relatively low, and the manufacturing method is simple and easy to popularize and apply.
Drawings
FIG. 1 is a diagram of steps of a method for manufacturing a printed circuit board that meets the requirement of high precision of pad placement in accordance with the present invention;
FIG. 2 is a first structural diagram of a printed circuit board according to the present invention that meets the high precision requirement for pad placement;
FIG. 3 is a second block diagram of a printed circuit board of the present invention that meets the high precision requirement for pad placement;
FIG. 4 is a third structural diagram of a printed circuit board according to the present invention that meets the high precision requirement for pad placement;
fig. 5 is a fourth structural diagram of the printed circuit board meeting the requirement of high precision of the position of the bonding pad according to the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the method for manufacturing a printed circuit board meeting the requirement of high precision of a pad position according to the present invention includes the following steps:
step (1): and printing the welding pad of the printed circuit board by adopting a screen printing method, and then carrying out UV curing treatment.
Referring to fig. 2, a bonding pad 1 is printed on a copper-clad plate, which also includes a substrate 3 and a copper foil 2 disposed on the substrate 3. The step (1) is specifically as follows: and grinding, cleaning and drying the copper-clad plate, then printing the pattern of the bonding pad 1 on the copper-clad plate by using a composite stainless steel wire mesh, and then carrying out UV curing treatment. UV curing is also known as ultraviolet curing.
Preferably, the mesh number of the composite stainless steel mesh in the step (1) can be 400 meshes. The ink used for printing the bonding pad 1 in the step (1) can be UV type white solder resist ink, and the curing energy adopted in the step (1) is more than or equal to 1000mJ/cm2Carrying out UV curing treatment on the ultraviolet light; of course, in other embodiments, other values of curing energy may be used to perform the UV curing process as desired.
Step (2): and (2) printing a circuit pattern on the printed circuit board obtained in the step (1) by adopting a screen printing method, and then carrying out UV curing treatment.
Referring to fig. 3, a line pattern 4 is printed on the printed circuit board obtained in step (1) by a screen printing method, and then UV curing treatment is performed. Wherein, the mesh number of the printed circuit pattern 4 in the step (2) can be 300 meshes; of course, other mesh sizes may be used as desired. The ink used for printing the circuit pattern 4 in the step (2) is specifically UV curing ink, and the curing energy used in the step (2) is more than or equal to 700mJ/cm2UV curing treatment is performed.
And (3): and (3) carrying out etching and ink stripping treatment on the printed circuit board obtained in the step (2).
Referring to fig. 4, the printed circuit board obtained in step (2) is subjected to etching and ink stripping treatment. Wherein, the etching in step (3) can specifically adopt (CuCl)2+HCL+H2O2) Carrying out acid etching treatment on the formed etching solution, wherein the etching speed is 7.5m/min, and the specific gravity of the etching solution is 1.253-1.258; specifically, the ink stripping treatment was performed using 3% NaOH.
And (4): and (4) printing solder resist ink on the surface of the printed circuit board obtained in the step (3) by adopting a screen printing method, and then carrying out UV curing treatment.
Referring to fig. 5, solder resist ink 5 is printed on the surface of the printed circuit board obtained in step (3) by screen printing, and then UV curing treatment is performed. Preferably, the mesh number of the solder resist ink 5 printed in the step (4) is 250 meshes, the solder resist ink 5 is UV curing ink, and the curing energy adopted in the step (4) is more than or equal to 1000mJ/cm2UV curing treatment is performed.
In addition, in other embodiments, step (5) is further included after step (4): and (3) carrying out character printing, detection and OSP treatment processes on the printed circuit board obtained in the step (4), wherein the OSP is a process for treating the surface of the copper foil of the printed circuit board and accords with RoHS instruction, and the OSP is short for Organic solder resist Preservatives and is translated into an Organic solder mask which is also called a copper protecting agent.
The starting materials employed in the present invention are all available from conventional commercial sources. In addition, the invention also provides a printed circuit board meeting the high-precision requirement of the position of the bonding pad, and the printed circuit board is manufactured by the manufacturing method.
The manufacturing method of the printed circuit board meeting the high-precision requirement of the pad position has the following beneficial effects that: the pad of the printed circuit board is firstly printed by adopting a screen printing method, and a circuit pattern is not arranged on the printed circuit board before the pad is printed, so that the position of the pad is better positioned, and the high-precision requirement on the position of the pad can be met; in addition, the manufacturing cost of the screen printing method is relatively low, and the manufacturing method is simple and easy to popularize and apply.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A manufacturing method of a printed circuit board meeting the high-precision requirement of a pad position is characterized by comprising the following steps:
(1) printing a bonding pad of a printed circuit board by adopting a screen printing method, and then carrying out UV curing treatment;
(2) printing a circuit pattern on the printed circuit board obtained in the step (1) by adopting a screen printing method, and then carrying out UV curing treatment;
(3) carrying out etching and ink stripping treatment on the printed circuit board obtained in the step (2);
(4) and (4) printing solder resist ink on the surface of the printed circuit board obtained in the step (3) by adopting a screen printing method, and then carrying out UV curing treatment.
2. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the step (1) is specifically as follows: and grinding, cleaning and drying the copper-clad plate, then printing the pattern of the bonding pad on the copper-clad plate by using a composite stainless steel wire mesh, and then carrying out UV curing treatment.
3. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 2, wherein the method comprises the following steps: the mesh number of the composite stainless steel wire mesh is 400 meshes.
4. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the ink for printing the bonding pad in the step (1) is UV type white solder resist ink, and the curing energy adopted in the step (1) is more than or equal to 1000mJ/cm2UV curing treatment is performed.
5. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the number of the screen meshes for printing the circuit pattern in the step (2) is specifically 300 meshes.
6. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the ink for printing the circuit pattern in the step (2) is UV curing ink, and the curing energy adopted in the step (2) is more than or equal to 700mJ/cm2UV curing treatment is performed.
7. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the etching in the step (3) is specifically (CuCl)2+HCL+H2O2) Carrying out acid etching treatment on the formed etching solution, wherein the etching speed is 7.5m/min, and the specific gravity of the etching solution is 1.253-1.258; the ink stripping treatment specifically adopts 3% NaOH for stripping.
8. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the number of the screen meshes of the solder resist ink printed in the step (4) is specifically 250 meshes, the solder resist ink is specifically UV curing ink, and the curing energy adopted in the step (4) is more than or equal to 1000mJ/cm2UV curing treatment is performed.
9. The method for manufacturing a printed circuit board meeting the high precision requirement of the pad position according to claim 1, wherein the method comprises the following steps: the step (4) is followed by a step (5): and (4) carrying out character printing, detection and OSP processing procedures on the printed circuit board obtained in the step (4).
10. The utility model provides a satisfy printed circuit board of pad position high accuracy requirement which characterized in that: the product of the method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911424596.7A CN111010821A (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of printed circuit board meeting high-precision requirement of pad position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911424596.7A CN111010821A (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of printed circuit board meeting high-precision requirement of pad position |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111010821A true CN111010821A (en) | 2020-04-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911424596.7A Pending CN111010821A (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of printed circuit board meeting high-precision requirement of pad position |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111010821A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110154661A1 (en) * | 2009-12-30 | 2011-06-30 | Samsung Electronics Co., Ltd. | Method of fabricating printed circuit board assembly |
| CN102883543A (en) * | 2012-10-08 | 2013-01-16 | 复旦大学 | Method for manufacturing conducting circuit by additive process |
| CN106028661A (en) * | 2016-07-29 | 2016-10-12 | 佛山市国立光电科技有限公司 | Production process of printed circuit board |
| CN106211597A (en) * | 2016-07-21 | 2016-12-07 | 佛山市国立光电科技有限公司 | A kind of production method of LED circuit board |
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
-
2019
- 2019-12-31 CN CN201911424596.7A patent/CN111010821A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110154661A1 (en) * | 2009-12-30 | 2011-06-30 | Samsung Electronics Co., Ltd. | Method of fabricating printed circuit board assembly |
| CN102883543A (en) * | 2012-10-08 | 2013-01-16 | 复旦大学 | Method for manufacturing conducting circuit by additive process |
| CN106211597A (en) * | 2016-07-21 | 2016-12-07 | 佛山市国立光电科技有限公司 | A kind of production method of LED circuit board |
| CN106028661A (en) * | 2016-07-29 | 2016-10-12 | 佛山市国立光电科技有限公司 | Production process of printed circuit board |
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
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Application publication date: 20200414 |