CN110913653B

CN110913653B - Heating and radiating module

Info

Publication number: CN110913653B
Application number: CN201811084320.4A
Authority: CN
Inventors: 游志坚
Original assignee: Chicony Electronics Co Ltd
Current assignee: Chicony Electronics Co Ltd
Priority date: 2018-09-18
Filing date: 2018-09-18
Publication date: 2022-02-11
Anticipated expiration: 2038-09-18
Also published as: CN110913653A

Abstract

A heating and heat dissipation module is arranged on an electronic component. The heating and radiating module comprises a radiator, a first heat conduction layer, a heater and a second heat conduction layer. The heat sink is disposed on the electronic component. The first thermally conductive layer is disposed between the electronic component and the heat sink. The heater is arranged on the electronic component and is positioned on the same side of the electronic component as the radiator, and the heater and the radiator are separated from each other. The second thermally conductive layer is disposed between the electronic component and the heater and is spaced apart from the first thermally conductive layer.

Description

Heating and radiating module

[ technical field ] A method for producing a semiconductor device

The invention relates to a heating and radiating module.

[ background of the invention ]

In the consumer electronics market, portable devices and wearable devices have become increasingly important mainstream products in the market due to their convenience. In view of this, many consumer electronic products are also designed to be thinner and smaller in size. However, in addition to designing the electronic product to be thinner and smaller, consideration must be given to whether the design used will cause the internal components of the electronic product to fail to meet the operating conditions. Therefore, it is one of the important research and development issues to design electronic products to be thinner and smaller, and still make the internal components of the electronic products meet the operating conditions.

[ summary of the invention ]

The invention discloses a heating and radiating module. The heating and radiating module is arranged on the electronic component. The heating and radiating module comprises a radiator, a first heat conduction layer, a heater and a second heat conduction layer. The heat sink is disposed on the electronic component. The first thermally conductive layer is disposed between the electronic component and the heat sink. The heater is arranged on the electronic component and is positioned on the same side of the electronic component as the radiator, and the heater and the radiator are separated from each other. The second thermally conductive layer is disposed between the electronic component and the heater and is spaced apart from the first thermally conductive layer.

In some embodiments, the electronic component has a first upper surface facing the heat sink and the heater, and the first and second thermally conductive layers are in contact with the first upper surface.

In some embodiments, the heat sink has a second upper surface, the heater has a third upper surface, and the heating and heat dissipating module further includes a thermal insulation layer. The thermal insulation layer is disposed on the heater and in contact with the third upper surface, wherein the thermal insulation layer has a fourth upper surface, and a distance from the second upper surface of the heat sink to the first upper surface of the electronic component is equal to a distance from the fourth upper surface of the thermal insulation layer to the first upper surface of the electronic component.

In some embodiments, the heating and heat dissipating module further comprises a thermal insulation layer. The thermal insulation layer is disposed on the heater, wherein the heat sink extends upward from the first thermally conductive layer to above the thermal insulation layer and contacts the thermal insulation layer to sandwich the second thermally conductive layer, the heater, and the thermal insulation layer between the heat sink and the first upper surface.

In some embodiments, the heating and heat dissipating module further comprises a thermal insulation layer. The heat insulating layer is disposed on the heater, wherein the heat sink is plate-shaped and has a lower surface facing the first heat conducting layer and the heat insulating layer and in contact with the first heat conducting layer and the heat insulating layer.

In some embodiments, the heating and heat dissipating module further comprises a thermal insulation layer. The heat insulation layer is disposed on the heater, the second heat conduction layer and the heat insulation layer surround the first heat conduction layer, the second heat conduction layer and the heat insulation layer are clamped between the heat sink and the first upper surface together, and at least one gap exists between the heat sink and the first upper surface.

In some embodiments, at least the heat dissipating module further comprises a thermal insulation layer. At least the thermal insulation layer is disposed on at least the heater and forms an annular structure with at least the second thermally conductive layer, wherein the at least the first thermally conductive layer and the at least the heat sink are located within the at least annular structure.

In some embodiments, at least the first thermally conductive layer and at least the heat sink are separated from at least the loop structure by at least a gap.

In some embodiments, the heating and heat dissipating module further comprises a thermal insulation layer. The thermal insulation layer is disposed on the heater and forms a ring structure with the second thermally conductive layer, wherein the first thermally conductive layer and the ring structure are sandwiched between the heat sink and the electronic component.

In some embodiments, the heating and heat dissipating module further comprises a thermal insulation layer. The heat insulation layer is arranged on the second heat conduction layer so as to wrap the heater between the heat insulation layer and the second heat conduction layer.

In some embodiments, the second thermally conductive layer and the first thermally conductive layer are separated from each other by at least one gap, and the gap forms an interface with at least the first thermally conductive layer, the second thermally conductive layer, and the heat sink.

In some embodiments, the heating and heat dissipating module further comprises at least a gas phase insulating material filled in the gap.

In some embodiments, at least the first thermally conductive layer and at least the heat sink together form an annular structure, and at least the heater and at least the second thermally conductive layer are located within the at least annular structure.

[ description of the drawings ]

Fig. 1A is a schematic top view of a heating and heat dissipating module according to a first embodiment of the present disclosure.

FIG. 1B is a schematic cross-sectional view taken along line 1B-1B of FIG. 1A.

Fig. 2A is a schematic top view of a heating and heat dissipating module according to a second embodiment of the present disclosure.

Fig. 2B is a schematic cross-sectional view taken along line 2B-2B of fig. 2A.

Fig. 3A is a schematic top view of a heating and heat dissipating module according to a third embodiment of the present disclosure.

FIG. 3B is a cross-sectional view taken along line 3B-3B of FIG. 3A.

Fig. 4A is a schematic top view of a heating and heat dissipating module according to a fourth embodiment of the present disclosure.

Fig. 4B is a schematic cross-sectional view taken along line 4B-4B of fig. 4A.

Fig. 5 is a schematic top view of a heating and radiating module according to a fifth embodiment of the present disclosure.

Fig. 6 is a schematic top view of a heating and heat dissipating module according to a sixth embodiment of the present disclosure.

Fig. 7A is a schematic top view of a heating and heat dissipating module according to a seventh embodiment of the present disclosure.

Fig. 7B is a schematic cross-sectional view taken along line 7B-7B of fig. 7A.

[ detailed description ] embodiments

Various embodiments of the present disclosure will now be described with reference to the drawings, and for the purposes of clarity, numerous implementation details will be set forth in the following description. It should be understood, however, that these implementation details should not be used in a limiting sense to the present disclosure. That is, in some embodiments of the disclosure, such practical details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or like components.

The use of the terms first, second, third, etc. herein to describe various elements, components, regions, layers is understood. These elements, components, regions, layers should not be limited by these terms. These terms are only used to distinguish one element, component, region or layer from another. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure.

Referring to fig. 1A and 1B, fig. 1A is a schematic top view illustrating a heating and heat dissipating module 100A according to a first embodiment of the disclosure, and fig. 1B is a schematic cross-sectional view along line 1B-1B of fig. 1A. The heating and heat dissipating module 100A is disposed on the electronic component 110. The heating and heat dissipating module 100A includes a heat sink 120, a first heat conducting layer 130, a heater 140, a second heat conducting layer 150 and a heat insulating layer 160, wherein the electronic component 110 may be a battery, a processor or the like that generates heat energy during operation, and the electronic component 110 has a first upper surface S1.

The heat sink 120 is disposed on the first upper surface S1 of the electronic component 110, and the first thermally conductive layer 130 is disposed between the electronic component 110 and the heat sink 120. The first thermally conductive layer 130 is in contact with the first upper surface S1 of the electronic component 110 and the lower surface of the heat sink 120, wherein the lower surface of the heat sink 120 faces the electronic component 110.

The heat sink 120 may exchange heat with the electronic component 110 through the first thermally conductive layer 130. For example, when the electronic component 110 is operated and generates heat energy to increase the temperature, the heat energy generated by the electronic component 110 can be conducted to the heat sink 120 through the first heat conducting layer 130 as indicated by arrow a 1. The heat sink 120 can further transmit the thermal energy to the outside through the second upper surface S2, wherein the second upper surface S2 of the heat sink 120 faces away from the electronic component 110, i.e., the second upper surface S2 of the heat sink 120 is the side of the heat sink 120 away from the electronic component 110.

The heat sink 120 may have a thermal conductivity greater than that of the first heat conducting layer 130. In some embodiments, the heat sink 120 may include a metal material, such as an alloy of copper, iron, aluminum, magnesium, zinc, and the like. Alternatively, in other embodiments, the heat sink 120 may also include a non-metal material, such as a plastic material, for example, ABS resin (ABS), Polymethyl Methacrylate (PMMA), Polycarbonate (PC), or Polylactic Acid (PLA). In addition, the heat sink 120 may be designed in a pattern similar to a heat dissipating fin. The first thermal conductive layer 130 may be a Thermal Interface Material (TIM), such as a thermal adhesive, a thermal encapsulant, a thermal paste, a thermal tape, or the like. In some embodiments, the material of the first thermal conductive layer 130 may include both silicon-containing and silicon-free products, such as thermal pads (thermal gap filters), phase change thermal sheets (phase change materials), thermal tapes (thermal tapes), thermal pastes (thermal grease), and thermal gels (thermal gel).

The first thermal conductive layer 130 may be used to reduce thermal resistance between the heat sink 120 and the electronic component 110, so as to improve thermal conduction efficiency between the heat sink 120 and the electronic component 110. In addition, when the first thermal conductive layer 130 is made of glue and has adhesiveness, the heat sink 120 can also be fixed on the electronic component 110 through the first thermal conductive layer 130.

The heater 140 is disposed on the electronic component 110, wherein the heat sink 120 and the heater 140 may be located on the same side of the electronic component 110. For example, the heater 140 and the heat sink 120 in fig. 1B are both located on the upper side of the electronic component 110, i.e., the first upper surface S1 of the electronic component 110 faces the heater 140 and the heat sink 120, and the heater 140 and the heat sink 120 are located on the first upper surface S1 of the electronic component 110. In addition, the heat sink 120 and the heater 140 are separated from each other, that is, a gap 170 is formed between the heat sink 120 and the heater 140, and the two are not in direct contact. The second thermally conductive layer 150 is disposed between the electronic component 110 and the heater 140 and contacts the first upper surface S1 of the electronic component 110 and the lower surface of the heater 140, wherein the lower surface of the heater 140 faces the electronic component 110.

The thermal insulation layer 160 is disposed on the heater 140 and contacts the third upper surface S3 of the heater 140, wherein the third upper surface S3 of the heater 140 faces away from the electronic component 110 (i.e., the third upper surface S3 of the heater 140 is the side of the heater 140 away from the electronic component 110), and the second thermal conductive layer 150 can be separated from the thermal insulation layer 160 by the heater 140. The areas of the second thermally conductive layer 150, the heater 140, and the thermally insulating layer 160 in a top view (i.e., the view of fig. 1A) may be substantially the same.

The heater 140 may be in thermal communication with the electronic component 110 through the second thermally conductive layer 150. For example, when the temperature of the electronic component 110 is to be raised so that the electronic component 110 can meet its operating condition, as indicated by arrow a2, the heater 140 may heat the electronic component 110 by conducting heat energy through the second thermally conductive layer 150 to the electronic component 110 to heat the electronic component 110. In addition, in the case that the heater 140 conducts the heat energy to the electronic component 110 through the second heat conducting layer 150, the heat insulating layer 160 can prevent the heat energy provided by the heater 140 from being dissipated to the external environment, thereby improving the temperature rising effect of the heater 140 on the electronic component 110.

On the other hand, the thermal insulation layer 160 may provide a buffer height difference purpose. For example, there is a height difference between the second top surface S2 of the heat sink 120 and the third top surface S3 of the heater 140, i.e., the distance from the first top surface S1 to the second top surface S2 is greater than the distance from the first top surface S1 to the third top surface S3. By disposing the thermal insulation layer 160 on the heater 140 and contacting the third top surface S3, the thermal insulation layer 160 can buffer the height difference, so that the sum of the heights of the first heat conduction layer 130 and the heat sink 120 is substantially equal to the sum of the heights of the second heat conduction layer 150, the heater 140 and the thermal insulation layer 160. In other words, the second top surface S2 of the heat sink 120 and the fourth top surface S4 of the thermal insulation layer 160 may be substantially coplanar (i.e., located at the same horizontal position), and the distance from the second top surface S2 of the heat sink 120 to the first top surface S1 of the electronic component 110 is substantially equal to the distance from the fourth top surface S4 of the thermal insulation layer 160 to the first top surface S of the electronic component 110, so as to facilitate stacking other components on the heating and heat dissipating module 100A, wherein the fourth top surface S4 of the thermal insulation layer 160 faces away from the electronic component 110 (i.e., the fourth top surface S4 of the thermal insulation layer 160 is the side of the thermal insulation layer 160 away from the electronic component 110).

In some embodiments, the heater 140 may be an electric heating sheet or an electric heating component, such as a ptc (positive Temperature coefficient) heating sheet, a mica electric heating sheet, a ceramic heating sheet, a transparent electric heating sheet, a flexible ultrathin electric heating sheet, or the like. The second thermally conductive layer 150 may be a thermal interface material having the same or similar properties as the first thermally conductive layer 130 and will not be described further herein. In some embodiments, the thermal insulation layer 160 may include a material having a thermal conductivity of less than 0.2W/(m · K), such as foam (sponge or poron), rubber (rubber), PU and PE foam (Styrofoam or foam), glass wool, and the like.

In addition, the second thermally conductive layer 150, the heater 140 and the thermal insulation layer 160 may together form a ring structure R on the first upper surface S1 of the electronic component 110, as shown in fig. 1A. The annular structure R surrounds and surrounds the first heat conduction layer 130 and the heat sink 120, i.e. the first heat conduction layer 130 and the heat sink 120 may be located in the annular structure R. In the present embodiment, the annular structure R is completely surrounded around the first heat conducting layer 130 and the heat sink 120. Specifically, the second heat conducting layer 150 may have a first side wall SW1 and a second side wall SW2, wherein the first side wall SW1 and the second side wall SW2 are respectively facing different directions, for example, the first side wall SW1 is facing to the right in fig. 1B, the second side wall SW2 is facing to the left in fig. 1B, and the first side wall SW1 and the second side wall SW2 both face the first heat conducting layer 130. In addition, although the annular structure R shown in fig. 1A is rectangular, the disclosure is not limited thereto, and in other embodiments, the annular structure R may also be other shapes, such as a circle, an ellipse, a triangle, or other polygons.

The first heat conducting layer 130 and the heat sink 120 in the annular structure R may be separated from the annular structure R by at least one gap 170, wherein the gap 170 may be an air gap by filling with a gas phase insulating material. In this regard, since the gap 170 may be located around the first heat conducting layer 130 and the heat sink 120, the gap 170 may increase the thermal resistance between the first heat conducting layer 130 and the ring structure R and the thermal resistance between the heat sink 120 and the ring structure R. Further, the first heat conducting layer 130 can be separated from the second heat conducting layer 150 by a gap 170, the heat sink 120 can be separated from the heater 140 and the thermal insulation layer 160 by the gap 170, and the gap 170 forms an interface with at least the first heat conducting layer 130, the heat sink 120 and the second heat conducting layer 150, so as to prevent the heat dissipation path from the electronic component 110 to the heat sink 120 and the heating path from the heater 140 to the electronic component 110 from affecting each other.

With the above configuration, the heat sink 120, the heater 140 and the heat conducting layer can be integrated on the same side of the electronic component 110 while preventing the heat dissipation path and the heating path from affecting each other, for example, the heat sink 120, the heater 140 and the heat conducting layer are integrated on the first upper surface S1 of the electronic component 110, so as to increase the space utilization rate of the heating and heat dissipation module 100A. Further, the heating and heat dissipating module 100A can be suitable for a slim and small-sized design by integrating the heat sink 120, the heater 140 and the heat conducting layer on the same side of the electronic component 110. In addition, although the thermal resistance between the first heat conduction layer 130 and the annular structure R and the thermal resistance between the heat sink 120 and the annular structure R are increased by the gap 170 in the present embodiment, in other embodiments, a dielectric material with a low thermal conductivity may be used instead of the gap 170 to increase the thermal resistance. For example, a solid dielectric material may be filled between the first heat conducting layer 130 and the ring structure R and between the heat sink 120 and the ring structure R to correspondingly increase the thermal resistance.

Referring to fig. 2A and fig. 2B, fig. 2A is a schematic top view of a heating and heat dissipating module 100B according to a second embodiment of the disclosure, and fig. 2B is a schematic cross-sectional view taken along line 2B-2B of fig. 2A. At least one difference between the present embodiment and the first embodiment is that the area of the heater 140 of the present embodiment in a top view (i.e., the view angle of fig. 2A) is smaller than the area of the second heat conduction layer 150 and the heat insulation layer 160 in a top view (i.e., the view angle of fig. 2A). With this arrangement, the heater 140 can be wrapped between the thermal insulation layer 160 and the second heat conduction layer 150 to prevent the heater 140 from falling off between the thermal insulation layer 160 and the second heat conduction layer 150, thereby improving the structural strength of the heating and heat dissipating module 100B. The heating effect of the heater 140 on the electronic component 110 can be further enhanced, and the heat energy provided by the heater 140 is prevented from being dissipated to the external environment. Although not shown in fig. 2A and 2B, the heater 140 may be connected to an external circuit through a trace.

Referring to fig. 3A and 3B again, fig. 3A is a schematic top view of a heating and heat dissipating module 100C according to a third embodiment of the disclosure, and fig. 3B is a schematic cross-sectional view taken along line 3B-3B of fig. 3A. At least one difference between the present embodiment and the first embodiment is that the heat sink 120 of the present embodiment extends from inside the annular structure R to outside the annular structure R.

Specifically, when the thickness of the first heat conducting layer 130 is smaller than the sum of the thicknesses of the second heat conducting layer 150 and the thermal insulation layer 160, the heat sink 120 may extend upward from the first heat conducting layer 130 to the fourth upper surface S4 of the thermal insulation layer 160 and contact the fourth upper surface S4 of the thermal insulation layer 160, and sandwich the first heat conducting layer 130, the second heat conducting layer 150, the heater 140 and the thermal insulation layer 160 between the heat sink 120 and the first upper surface S1 of the electronic component 110, wherein the heat sink 120 and the first upper surface S1 of the electronic component 110 are located on the upper side and the lower side of the gap 170, and the heat sink 120 covers the gap 170. Similarly, the gap 170 can prevent the heat dissipation path from the electronic component 110 to the heat sink 120 and the heating path from the heater 140 to the electronic component 110 from affecting each other. In addition, the thermal insulation layer 160 may also prevent the heater 140 from conducting thermal energy to the heat sink 120.

On the other hand, by sandwiching the first heat conduction layer 130, the second heat conduction layer 150, the heater 140 and the thermal insulation layer 160 between the heat sink 120 and the first upper surface S1 of the electronic component 110, the first heat conduction layer 130, the second heat conduction layer 150, the heater 140 and the thermal insulation layer 160 can be prevented from falling off from between the heat sink 120 and the electronic component 110, thereby stabilizing the structural strength of the heating and heat dissipation module 100C.

Referring to fig. 4A and 4B again, fig. 4A is a schematic top view of a heating and heat dissipating module 100D according to a fourth embodiment of the disclosure, and fig. 4B is a schematic cross-sectional view taken along line 4B-4B of fig. 4A. At least one difference between the present embodiment and the first embodiment is that the heat sink 120 of the present embodiment is a plate-shaped structure and covers the annular structure R formed by the second heat conduction layer 150, the heater 140 and the thermal insulation layer 160, wherein the lower surface of the heat sink 120 faces the thermal insulation layer 160 and contacts the fourth upper surface S4 of the thermal insulation layer 160 to sandwich the annular structure R between the heat sink 120 and the electronic component 110.

On the other hand, the thickness of the first heat conduction layer 130 is correspondingly increased and extends from the first upper surface S1 of the electronic component 110 to the heat sink 120 to contact with the lower surface of the heat sink 120, so as to maintain the heat transfer path from the electronic component 110 to the heat sink 120. Specifically, the interface of the heat sink 120 and the first thermally conductive layer 130 is a first distance D1 from the first top surface S1 of the electronic component 110, the interface of the thermally insulating layer 160 and the heater 140 is a second distance D2 from the first top surface S1 of the electronic component 110, and the first distance D1 is greater than the second distance D2. The distance between the fourth top surface S4 of the thermal insulation layer 160 and the first top surface S1 of the electronic component 110 is approximately equal to the first distance D1. Further, in the present embodiment, the gap 170 may exist between the first heat conductive layer 130 and the annular structure R and between the heat sink 120 and the first upper surface S1 of the electronic component 110, and be covered by the heat sink 120. In the present embodiment, the heat sink 120 is designed to have a plate-like structure, so that the heat dissipation module 100D can be easily assembled.

Referring to fig. 5 again, fig. 5 is a schematic top view of a heating and heat dissipating module 100E according to a fifth embodiment of the disclosure. At least one difference between the present embodiment and the first embodiment is that the annular structure R of the present embodiment is partially enclosed around the first heat conducting layer (e.g., the first heat conducting layer 130 in fig. 1B) and the heat sink 120, i.e., the annular structure R has a notch 180. Specifically, the ring structure R of fig. 5 is a C-shaped structure. However, the disclosure is not limited thereto, and in other embodiments, the annular structure R with the gap 180 may have other shapes. In addition, the heat sink 120 is still separated from the ring structure R with the gap 180 by the gap 170.

Referring to fig. 6 again, fig. 6 is a schematic top view of a heating and heat dissipating module 100F according to a sixth embodiment of the disclosure. At least one difference between the present embodiment and the first embodiment is that the annular structure R of the first embodiment can be transformed into a multi-segment structure, as shown in fig. 6 as an example, the heating structure formed by the second heat conducting layer (e.g. the second heat conducting layer 150 of fig. 1B), the heater (e.g. the heater 140 of fig. 1B) and the heat insulating layer 160 can be divided into a first segment R1 and a second segment R2, and the heat sink 120 and the first heat conducting layer (e.g. the first heat conducting layer 130 of fig. 1B) thereunder are located between the first segment R1 and the second segment R2. In addition, the heat sink 120 is still separated from the first segment R1 and the second segment R2 by the gap 170.

Referring to fig. 7A and 7B, fig. 7A is a schematic top view of a heating and heat dissipating module 100G according to a seventh embodiment of the disclosure. Fig. 7B is a schematic cross-sectional view taken along line 7B-7B of fig. 7A. At least one difference between the present embodiment and the first embodiment is that the arrangement positions of the heat dissipation path and the heating structure of the present embodiment are interchanged.

Specifically, in the present embodiment, the heat sink 120 and the first heat conducting layer 130 form a ring structure R ', and the heater 140, the second heat conducting layer 150 and the heat insulating layer 160 can be surrounded by the ring structure R'. The first heat conducting layer 130 may have a third side wall SW3 and a fourth side wall SW4, wherein the third side wall SW3 and the fourth side wall SW4 are respectively oriented in different directions, for example, the third side wall SW3 is oriented to the right in fig. 7B, the fourth side wall SW4 is oriented to the left in fig. 7B, and the third side wall SW3 and the fourth side wall SW4 both face the second heat conducting layer 150. In addition, the annular structure R' formed by the heat sink 120 and the first heat conduction layer 130 is still separated from the heater 140, the second heat conduction layer 150 and the heat insulation layer 160 by the gap 170, and the heat sink 120, the first heat conduction layer 130, the heater 140, the second heat conduction layer 150 and the heat insulation layer 160 are still located on the same side of the first upper surface S1 of the electronic component 110.

In summary, the heating and heat dissipating module of the present disclosure is disposed on the electronic component, and the heating and heat dissipating module includes a T-shaped heat sink, a first heat conducting layer, a heater, and a second heat conducting layer. The heat sink and the heater are disposed on the same side of the electronic component, and the heater and the heat sink are separated from each other. The first thermally conductive layer is disposed between the electronic component and the heat sink. The second thermally conductive layer is disposed between the electronic component and the heater and is spaced apart from the first thermally conductive layer. Through the configuration, the heat dissipation path from the electronic component to the radiator and the heating path from the heater to the electronic component can be integrated on the same side of the electronic component, so that the space utilization rate of the heating and heat dissipation module is increased. In addition, the heat dissipation path from the electronic component to the heat sink and the heating path from the heater to the electronic component can be separated by a gap, so as to prevent the heat dissipation path and the heating path from influencing each other.

While the invention has been described with respect to various embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention, and therefore, the scope of the invention is to be defined by the appended claims.

[ notation ] to show

100A, 100B, 100C, 100D, 100E, 100F, 100G heating and radiating module

110 electronic assembly

120 radiator

130 first heat conducting layer

140 heating device

150 second heat conducting layer

160 thermal insulation layer

170 gap

180 gap

1B-1B, 2B-2B, 3B-3B, 4B-4B, 7B-7B line segment

Arrows A1 and A2

R, R' ring structure

First stage of R1

Second segment of R2

S1 first upper surface

S2 second upper surface

S3 third Upper surface

S4 fourth upper surface

SW1 first side wall

SW2 second side wall

SW3 third side wall

SW4 fourth side wall

Claims

1. A heating and heat dissipating module, wherein the heating and heat dissipating module is disposed on an electronic component, the heating and heat dissipating module comprising:

a heat sink disposed on the electronic component;

a first thermally conductive layer disposed between and in contact with the electronic component and the heat sink;

a heater disposed on the electronic component and located on the same side of the electronic component as the heat sink, the heater being spaced apart from the heat sink;

a thermal insulation layer disposed on the heater and on the same side of the electronic component as the heater, the thermal insulation layer being spaced apart from the heat sink; and

a second thermally conductive layer disposed between the electronic component and the heater and spaced apart from the first thermally conductive layer.

2. The module of claim 1, wherein the electronic component has a first upper surface facing the heat sink and the heater, and the first thermally conductive layer and the second thermally conductive layer are in contact with the first upper surface.

3. The module of claim 2, wherein the heat sink has a second upper surface, the heater has a third upper surface, and the thermally insulating layer is in contact with the third upper surface, wherein the thermally insulating layer has a fourth upper surface, and the distance from the second upper surface of the heat sink to the first upper surface of the electronic component is equal to the distance from the fourth upper surface of the thermally insulating layer to the first upper surface of the electronic component.

4. The module of claim 2, wherein the heat sink extends upwardly from the first thermally conductive layer over and in contact with the thermally insulating layer to sandwich the second thermally conductive layer, the heater, and the thermally insulating layer between the heat sink and the first upper surface.

5. The module of claim 2, wherein the heat sink is plate-shaped and has a lower surface facing and contacting the first thermally conductive layer and the thermally insulating layer.

6. The module of claim 2, wherein the second thermally conductive layer and the thermally insulating layer surround the first thermally conductive layer, and the first thermally conductive layer, the second thermally conductive layer and the thermally insulating layer are sandwiched together between the heat sink and the first upper surface, wherein there is at least a gap between the heat sink and the first upper surface.

7. The module of claim 1, wherein the thermally insulating layer and the second thermally conductive layer together form an annular structure, wherein the first thermally conductive layer and the heat sink are positioned within the annular structure.

8. The module of claim 7, wherein the first thermally conductive layer and the heat sink are separated from the annular structure by at least one gap.

9. The module of claim 1, wherein the thermally insulating layer and the second thermally conductive layer together form an annular structure, wherein the first thermally conductive layer and the annular structure are together sandwiched between the heat sink and the electronic component.

10. The module of claim 1, wherein the thermal insulation layer is disposed on the second thermally conductive layer to encapsulate the heater between the thermal insulation layer and the second thermally conductive layer.

11. The heating and heat dissipation module of claim 1, wherein the second thermally conductive layer is separated from the first thermally conductive layer by at least one gap, and wherein the gap interfaces with at least the first thermally conductive layer, the second thermally conductive layer, and the heat sink.

12. The module according to claim 11, further comprising at least a vapor phase insulating material filled in the gap.

13. The heating and heat dissipating module of claim 1, wherein the first thermally conductive layer and the heat sink together form a loop structure, the heater and the second thermally conductive layer being located within the loop structure.