CN110824620A - Multipoint dispensing process applied to optical isolator and optical isolator device - Google Patents
Multipoint dispensing process applied to optical isolator and optical isolator device Download PDFInfo
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- CN110824620A CN110824620A CN201911116984.9A CN201911116984A CN110824620A CN 110824620 A CN110824620 A CN 110824620A CN 201911116984 A CN201911116984 A CN 201911116984A CN 110824620 A CN110824620 A CN 110824620A
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- Prior art keywords
- optical isolator
- chip
- magnetic ring
- glue
- dispensing
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
Abstract
In the embodiment of the application, a be applied to optical isolator's multiple spot glue dispensing technology and optical isolator device is provided, at first, in the intra-annular preset position point of magnetic ring some glue, pack the chip into the magnetic ring again, the crest line department of chip does not have glue, at last through rotatory chip, make the crest line of chip respectively with the glue contact of preset position, toast solidification chip and magnetic ring, glue has been avoided remaining at the terminal surface of magnetic ring, make optical isolator's chip and magnetic ring assembly back, do not produce the cull at the surface of magnetic ring, the impurity of having avoided optical isolator to produce drops on the light tunnel in the use, influence the communication effect, the replacement rate of optical isolator has been reduced.
Description
Technical Field
The application relates to the technical field of optical isolator packaging, in particular to a multipoint dispensing process applied to an optical isolator and an optical isolator device.
Background
In the packaging process of the optical isolator, aiming at the dispensing assembly process of the chip and the magnetic ring of the optical isolator, the traditional mode is that the part of the chip of the optical isolator, which is about one third, is placed in the ring center of the magnetic ring of the optical isolator, then dispensing is carried out on four ridge lines of the chip, and finally the chip is completely pushed into the ring center of the magnetic ring. In the traditional dispensing assembly process, after the chip and the magnetic ring are fixed, partial glue can be remained on the outer surface of the magnetic ring, and even if the glue is hung and cleaned, a crack still remains in the glue. In the process of using the optical isolator, if the impurity that produces drops on the light channel through garrulous gap, will influence communication effect, the replacement rate of optical isolator increases.
Disclosure of Invention
The embodiment of the application provides a be applied to light isolator's multiple spot point and glue technology and light isolator device for light isolator's chip and magnetic ring assembly back do not produce the cull at the surface of magnetic ring, and the impurity of having avoided light isolator's in the use to produce drops on the light tunnel, influence communication effect, has reduced light isolator's replacement rate.
In view of the above, a first aspect of the present application provides a multi-point dispensing process applied to an optical isolator, including:
dispensing glue at preset positions in the inner wall of a magnetic ring of the optical isolator, wherein the number of the preset positions is the same as that of the ridge lines of the chips of the optical isolator;
the chip is arranged in the magnetic ring, and the ridge lines of the chip are not in contact with the glue at the preset position respectively;
rotating the chip in the magnetic ring until the ridge of the chip is respectively contacted with the glue at the preset position;
and heating, baking and curing the glue to finish the glue dispensing process.
Optionally, if the chip of the optical isolator is a chip with a rectangular cross section, dispensing is performed at four preset positions in the inner wall of the magnetic ring of the optical isolator.
Optionally, the four preset positions are four dispensing points on the inner wall of the magnetic ring respectively.
Optionally, the four preset positions are four dispensing lines on the inner wall of the magnetic ring respectively.
Optionally, if the chip of the optical isolator is a regular hexagon chip, dispensing is performed at six preset positions in the inner wall of the magnetic ring of the optical isolator.
Optionally, the six preset positions are six dispensing points on the inner wall of the magnetic ring respectively.
Optionally, the six preset positions are six dispensing lines on the inner wall of the magnetic ring respectively.
A second aspect of the present application provides an optical isolator device comprising a magnetic ring and a chip;
the magnetic ring with the chip through the application in the first aspect of any one the be applied to optical isolator's multiple spot gluing technology point glue assembly.
According to the technical scheme, the embodiment of the application has the following advantages:
in the embodiment of the application, a be applied to light isolator's multiple spot glue dispensing technology is provided, at first, in the magnetic ring interior preset position point glue of predetermineeing, pack the chip into the magnetic ring again, the crest line department of chip does not have glue, last through rotatory chip, make the crest line of chip respectively with the glue contact of predetermineeing the position, toast solidification chip and magnetic ring, glue has been avoided and has been remained the terminal surface at the magnetic ring, make light isolator's chip and magnetic ring assembly back, surface at the magnetic ring does not produce the cull, the impurity of having avoided light isolator's in the use drops on the light channel, influence communication effect, the replacement rate of light isolator has been reduced.
Drawings
FIG. 1 is a flow chart of a first method for a multi-point dispensing process for an optical isolator in an embodiment of the present application;
FIG. 2 is a flow chart of a second method of a multi-point dispensing process for an optical isolator according to an embodiment of the present disclosure;
FIG. 3 is a flowchart illustrating a multi-point dispensing process applied to an optical isolator according to an embodiment of the present disclosure;
fig. 4 is a flowchart illustrating a third method of a multi-point dispensing process applied to an optical isolator in an embodiment of the present application.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The application has designed a process and optical isolator device are glued to multiple spot point for optical isolator's chip and magnetic ring assembly back do not produce the cull at the surface of magnetic ring, and the impurity of having avoided optical isolator to produce drops on the light tunnel in the use, influences the communication effect, has reduced optical isolator's change rate.
For convenience of understanding, referring to fig. 1, fig. 1 is a flowchart illustrating a first method of a multi-point dispensing process applied to an optical isolator according to an embodiment of the present application, as shown in fig. 1, specifically:
101. dispensing glue at preset positions in the inner wall of a magnetic ring of the optical isolator, wherein the number of the preset positions is the same as that of the ridge lines of the chips of the optical isolator;
102. the chip is arranged in the magnetic ring, and the edge lines of the chip are not in contact with the glue at the preset position respectively;
103. rotating the chip in the magnetic ring until the edge lines of the chip are respectively contacted with the glue at the preset positions;
104. and heating, baking and curing the glue to finish the glue dispensing process.
In the embodiment of the application, a be applied to light isolator's multiple spot glue dispensing technology is provided, at first, in the magnetic ring interior preset position point glue of predetermineeing, pack the chip into the magnetic ring again, the crest line department of chip does not have glue, last through rotatory chip, make the crest line of chip respectively with the glue contact of predetermineeing the position, toast solidification chip and magnetic ring, glue has been avoided and has been remained the terminal surface at the magnetic ring, make light isolator's chip and magnetic ring assembly back, surface at the magnetic ring does not produce the cull, the impurity of having avoided light isolator's in the use drops on the light channel, influence communication effect, the replacement rate of light isolator has been reduced.
Referring to fig. 2 and 3, fig. 2 is a flowchart illustrating a second method of a multi-point dispensing process applied to an optical isolator according to an embodiment of the present disclosure, and fig. 3 is a flowchart illustrating a multi-point dispensing process applied to an optical isolator according to an embodiment of the present disclosure, as shown in fig. 2 and 3, specifically:
201. dispensing glue at four preset positions in the inner wall of a magnetic ring of the optical isolator if the chip of the optical isolator is a chip with a rectangular cross section;
specifically, the method comprises the following steps:
the four preset positions are respectively four glue dispensing points on the inner wall of the magnetic ring.
Or
The four preset positions are respectively four glue dispensing lines on the inner wall of the magnetic ring.
202. The chip is arranged in the magnetic ring, and the edge lines of the chip are not in contact with the glue at the preset position respectively;
203. rotating the chip in the magnetic ring until the edge lines of the chip are respectively contacted with the glue at the preset positions;
204. and heating, baking and curing the glue to finish the glue dispensing process.
Referring to fig. 4, fig. 4 is a flow chart of a third method of a multi-point dispensing process applied to an optical isolator in an embodiment of the present application, as shown in fig. 4, specifically:
401. dispensing glue at six preset positions in the inner wall of a magnetic ring of the optical isolator if the chip of the optical isolator is a regular hexagon chip;
specifically, the method comprises the following steps:
the six preset positions are respectively six glue dispensing points on the inner wall of the magnetic ring.
Or
Six preset positions are respectively six glue dispensing lines on the inner wall of the magnetic ring.
402. The chip is arranged in the magnetic ring, and the edge lines of the chip are not in contact with the glue at the preset position respectively;
403. rotating the chip in the magnetic ring until the edge lines of the chip are respectively contacted with the glue at the preset positions;
404. and heating, baking and curing the glue to finish the glue dispensing process.
The application also provides an optical isolator device which comprises a magnetic ring and a chip;
the magnetic ring and the chip are dispensed and assembled through a multi-point dispensing process applied to the optical isolator as in any one of the first to the third embodiments.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
The terms "first," "second," "third," "fourth," and the like in the description of the application and the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be understood that in the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" for describing an association relationship of associated objects, indicating that there may be three relationships, e.g., "a and/or B" may indicate: only A, only B and both A and B are present, wherein A and B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single item(s) or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (8)
1. The utility model provides a be applied to light isolator's multiple spot glue dispensing technology which characterized in that includes:
dispensing glue at preset positions in the inner wall of a magnetic ring of the optical isolator, wherein the number of the preset positions is the same as that of the ridge lines of the chips of the optical isolator;
the chip is arranged in the magnetic ring, and the ridge lines of the chip are not in contact with the glue at the preset position respectively;
rotating the chip in the magnetic ring until the ridge of the chip is respectively contacted with the glue at the preset position;
and heating, baking and curing the glue to finish the glue dispensing process.
2. The multi-point dispensing process applied to the optical isolator as claimed in claim 1, wherein if the chip of the optical isolator is a chip with a rectangular cross section, the light is dispensed at four predetermined positions in the inner wall of the magnetic ring of the optical isolator.
3. The multi-point dispensing process applied to an optical isolator as claimed in claim 2, wherein the four predetermined positions are four dispensing points on the inner wall of the magnetic ring.
4. The multi-point dispensing process applied to the optical isolator as claimed in claim 2, wherein the four predetermined positions are four dispensing lines on the inner wall of the magnetic ring.
5. The multi-point dispensing process applied to the optical isolator as claimed in claim 1, wherein if the chip of the optical isolator is a regular hexagon chip, six predetermined positions are dispensed in the inner wall of the magnetic ring of the optical isolator.
6. The multi-point dispensing process applied to an optical isolator as claimed in claim 5, wherein the six predetermined positions are six dispensing points on the inner wall of the magnetic ring.
7. The multi-point dispensing process applied to an optical isolator as claimed in claim 5, wherein the six preset positions are six dispensing lines on the inner wall of the magnetic ring respectively.
8. An optical isolator device is characterized by comprising a magnetic ring and a chip;
the magnetic ring and the chip are assembled by the multi-point dispensing process applied to the optical isolator as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911116984.9A CN110824620A (en) | 2019-11-15 | 2019-11-15 | Multipoint dispensing process applied to optical isolator and optical isolator device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911116984.9A CN110824620A (en) | 2019-11-15 | 2019-11-15 | Multipoint dispensing process applied to optical isolator and optical isolator device |
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|---|---|
| CN110824620A true CN110824620A (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911116984.9A Pending CN110824620A (en) | 2019-11-15 | 2019-11-15 | Multipoint dispensing process applied to optical isolator and optical isolator device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020186915A1 (en) * | 2001-06-08 | 2002-12-12 | Tai-Cheng Yu | Optical isolator |
| CN203133426U (en) * | 2013-03-06 | 2013-08-14 | 昂纳信息技术（深圳）有限公司 | Novel optical isolator |
| CN105137622A (en) * | 2015-10-19 | 2015-12-09 | 无限光通讯(深圳)有限公司 | Angle fixing method for internal optical chip of free space isolator |
| CN205027990U (en) * | 2015-08-14 | 2016-02-10 | 无限光通讯(深圳)有限公司 | Free space isolator |
-
2019
- 2019-11-15 CN CN201911116984.9A patent/CN110824620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020186915A1 (en) * | 2001-06-08 | 2002-12-12 | Tai-Cheng Yu | Optical isolator |
| CN203133426U (en) * | 2013-03-06 | 2013-08-14 | 昂纳信息技术（深圳）有限公司 | Novel optical isolator |
| CN205027990U (en) * | 2015-08-14 | 2016-02-10 | 无限光通讯(深圳)有限公司 | Free space isolator |
| CN105137622A (en) * | 2015-10-19 | 2015-12-09 | 无限光通讯(深圳)有限公司 | Angle fixing method for internal optical chip of free space isolator |
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